ME 482 – Final Exam

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ME 482 – Final Exam

Dec. 17, 2008

Name_________________________

Problems

(20) 1. Consider the technical papers, videos, and PPT presentations in class to arrive at the T/F answer for the following: a.

DIP stands for dual in-line process. (package!) b.

Surface mounted components are glued before passing through a wave solder.

T__ F_X_

T_X_ F___ c.

Surface mounted circuit boards use vision system calibration of the template and board before solder paste is applied. T_X_ F___ d.

Via holes are used to pass thru-hole component leads through a board. T___ F_X_ e.

Every via hole must pass all the way through between the top and bottom board layers. T___ F_X_ f.

Machining tolerances typically improve as the part size increases. T___ F_X_ g.

The extended bottleneck model assumes that there are always a minimum number of parts in the FMS. h.

In conventional machining most of the cutting energy is converted to thermal energy. i.

A perfect just-in-time system with no delays between stations will have WIP. j.

A Kanban system is a push-pull system of inventory control. k.

Diamond is harder than Tungsten Carbide inserts. l.

Inkjet printing techniques can be used to develop electronic circuits on small special purpose circuit boards.

T_X_ F_X_

T_X_ F___

T_X_ F__

T__ F_X_

T_X_ F___

T_X_ F_X_ m.

As friction increases in rolling the maximum pressure point moves towards the entrance. T_X_ F___ n.

A technical paper showed that electronic assembly is comprised of 4 major operations:

1) thru-hole component insertion, 2) wave soldering, 3) testing, and 4) packaging. o.

In thru-hole IC assembly a screening process deposits the paste on the board. p.

In milling the surface feed-rate is limited by the feed per tooth and the spindle rpm.

T___ F_X_

T___ F_X_

T_X_ F___ q.

Direct extrusion consumes more power than indirect extrusion. r.

All metal parts stressed in the plastic region at any non-melting temperature have strain springback at a slope equal to Young’s modulus when stress is released. s.

Thru-hole component insertion is accomplished by crimping the leads before they pass through the board. t.

The rake angle of a tool used in turning must always be greater than zero degrees.

T_X_ F___

T___ F_X_

T__ F_X_

T___ F_X_

2

(20) 2. A single crystal boule of silicon is grown by the Czochralski process to an average diameter of 110 mm with length = 1200 mm. The seed and tang ends are removed, which reduces the length to 950 mm. The diameter is ground to 100 mm. A 30 mm wide flat is ground on the surface which extends from one end to the other. The ingot is then sliced into wafers of thickness = 0.50 mm, using an abrasive saw blade whose thickness = 0.33 mm. Assuming that the seed and tang portions cut off the ends of the starting boule are conical in shape, determine: (a) the original volume of the boule, mm 3 ; (b) how many wafers are cut from it, assuming the entire 950 mm length can be sliced; and (c) what is the volumetric proportion of silicon in the starting boule that is wasted during processing?

Solution :

(a) Total volume V = V

1

V

1

= V

3

(tang) + V

2

(cylinder) + V

= 0.333

(55) 2 (125) = 395,972 mm 3

V

2

=

R 2 L =

(55) 2 (950) = 9,028,152 mm 3

3

(seed)

= (cone in which h = 0.5(1200-950) = 125, D = 110, R = 55) =

R 2 h/3

Total V = 2(395,972) + 9,028,152 = 9,820,095 mm 3

(b) Number of wafers = 950/(0.50 + 0.33) = 1144.6



1144 wafers

(c) Area of one wafer A w

= A c

- A s

, where A c

= area of the circle of radius R = 50 mm, and

A

A c s

= the area of the segment A s

created by the flat ground on the cylindrical surface.

=

R 2 =

(50) 2 = 7854.0 mm 2

The area of a segment of the circle created by the 30 mm chord As =

R 2

/360 - 0.5R

2 sin

, where

 is the angle formed by two radii of the circle and the chord.

0.5



= sin 1(15/50) = 17.46

which gives



= 34.92

.

A s

=

(50) 2 (34.92)/360 - 0.5(50) 2 sin 34.92 = 761.8 - 715.5 = 46.3 mm 2

A w

= A c

- A s

= 7854.0 - 46.3 = 7807.7 mm

Volume of one wafer V w

= A w

2 t = 7807.7(0.5) = 3903.8 mm

Volume of 1144 wafers = 1144(3903.8) = 4,465,994 mm 3

3

Grading of 2:

1. Correct volume calc

2. Number wafers

3. Remove chord area

4. Proportion wasted

Volume wasted = 9,820,095 - 4,465,994 = 5,354,101 mm 3

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Proportion wasted = 5,354,101/9,820,095 = 54.52%.

(20) 3. A 2 inch thick slab is 10 inches wide and 12 ft long. Thickness is to be reduced in three steps in a hot rolling operation. Each step will reduce the slab to 75% of its previous thickness. The slab will widen by

3% in each rolling step. If the entry speed is 40ft/min and the roll speed is the same for all three steps, determine: a) length and b) exit velocity of the plate after the final reduction.

Solution: a) After three passes, t f

= (0.75)(0.75)(0.75)(2.0) = 0.844 in. w f

= (1.03)(1.03)(1.03)(10.0) = 10.927 in.

Using the constant volume assumption: t o w o

L o

= t f

(2.0)(10.0)(12 x 12) = (0.844)(10.927)L f w f

L f

Grading of 3:

1. Const volume assumption

2. Final length

3. Volume rate eqn

4. Exit velocity

L f

= (2.0)(10.0)(12 x 12)/(0.844)(10.927) = 312.3 in. = 26.025 ft b) Given that roll speed is the same at all three stands and that t o w o v o

= t f w f v f

(volume rate eqn)

Note that because the roll speed is the same the entry speed will be 40 ft/min at each stage.

Step 3: v f

= (0.75 x 0.75 x 2.0)(1.03 x 1.03 x 10.0)(40)/(0.844)(10.927) =

51.77 ft/min.

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3

(20) 4. You worked 21.1 in your HW. Now suppose that the rake angle is changed to  = 0 deg. Assuming that the friction angle remains the same, determine (a) the shear plane angle, (b) chip thickness, and (c) the shear strain for the operation.

Solution :

From Problem 21.1,



= 15

 and



= 26.85

. Using the Merchant Equation, Eq. (21.16):

  

= 45 +

/2 -

/2; rearranging,



= 2(45) +



- 2



  

= 90 + 15 – 2(26.85) = 51.3



Now, with



= 0 and

 remaining the same at 51.3

,



= 45 + 0/2 – 51.3/2 = 19.35°

(b) Chip thickness at



= 0: t c

= t o

/tan



= 0.30/tan 19.35 = 0.854 mm

(c) Shear strain



= cot 19.35 + tan (19.35 - 0) = 2.848 + 0.351 = 3.199

Grading of 4:

1. 21.1 answers

2. Apply correct eqns

3. Chip thickness

4. Shear strain

(20) 5. In a production turning operation, the workpart is 125 mm in diameter and 300 mm long. A feed of 0.225

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5 pts mm/rev is used in the operation. If cutting speed = 3.0 m/s, the tool must be changed every 5 work parts; but if cutting speed = 2.0 m/s, the tool can be used to produce 25 pieces between tool changes. Determine the Taylor tool life equation for this job.

Solution :

(1) T m

=

(125 mm)(0.3 m)/(3.0 m/s)(0.225 mm) = 174.53 s = 2.909 min.

T = 5(2.909) = 14.54 min.

(2) T m

=

(125 mm)(0.3 m)/(2.0 m/s)(0.225 mm) = 261.80 s = 4.363 min.

T = 25(4.363) = 109.08 min.

(1) v = 3 m/s = 180 m/min.

(2) v = 2 m/s = 120 m/min.

(1) 180(14.54) n = C

(2) 120(109.08) n = C

180(14.54) n = 120(109.08) n ln 180 + n ln(14.54) = ln 120 + n ln(109.08)

5.1929 + 2.677 n = 4.7875 + 4.692 n

5.1929 - 4.7875 = (4.692 - 2.677) n

0.4054 = 2.0151 n

C = 180 (14.54) 0.2012

n = 0.2012

C = 308.43

Grading of 5:

1. Machining time calculations

2. Setup 2 Taylor’s eqns

3. Correct n

4. Correct C

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