Network and Systems Laboratory
nslab.ee.ntu.edu.tw
zzz
2011/12/16
Wireless Sensor Network And Labs fall 2011
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Network and Systems Laboratory
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Today’s Class
 Last week
 Introduction
 Create schematic library
 Capture schematic
 Create PCB library (footprint)
 Layout
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Through-hole Packages
 SIP: single in-line packages
Through-hole package are
old, their number decreased
in modern design
 DIP: dual in-line packages
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SMD Packages
 Chip resistors, capacitors, inductors
 0402, 0603, 0805, …


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Represent size of the chip
0805 means 0.08” x 0.05” rectangle
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SMD Packages
 SO: Small outline
 Usually refer to IC with two rows of leads
 QFP: Quad flat package
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SMD Packages
 QFN: Quad flat package, no-leads
 The packages we introduced just now are most
commonly used
 Device datasheet should include the package
information
 You will need it for PCB layout
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SMD Packages
 BGA: Ball Grid Array
These two are widely used
in high end processor.
They allow more pin-out
from a single package. We
seldom use ICs in these
package, it is too difficult
to solder by hand
 PGA: Pin Grid Array
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Why To Buy
 Various sources
 Online retailers


www.digikey.com
www.mouser.com
 Local distributors
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These are probably two of the world largest
online electronic components retailers. If
the component you need cannot buy from
these two sources, you might want to
consider the other component!
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Block Diagram
Connector
3-Pin
Infrared
Connector
3-Pin
Infrared
6V
Taroko
Location node
3.3V
Taroko
Control node
3.3V
Regulator
LM317L
Battery
4 AA
6V output
Connector
3-Pin
Motor
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Connector
3-Pin
Motor
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6V
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Components
 Battery connector: 2-pin,
 Regulator: LM317L, 8-pin SOIC
 Resistor, capacitor
 Taroko connector
 Location node: 2x5 pin, 2x3 pin
 Control node: 2x5 pin, 2x3 pin
 Infrared connector: 3 pin
 Motor connector: 3 pin
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PCB Layout
 Software
 We are using “Altium Design 6”
 There are many other software available
 Process
1. Initial setup
2. Create schematic library
3. Capture schematic
4. Create PCB library
5. PCB layout
6. Output
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PCB
copper
1-layer board
copper
copper
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2-layer board
Multi-layer board
(Taroko is 4-layer board)
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Terminologies
Top layer: copper on top
Top overlay: white marks on top layer
Top paste: paste mask on top layer
Top solder: solder mask on top layer
Keep out layer: defines the shape of
the board
pads: holds the IC leads
vias: holes
Bottom layer: copper on bottom
Bottom overlay: white marks on Bottom layer
Bottom paste: paste mask on Bottom layer
Bottom solder: solder mask on Bottom layer
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PCB Library
 Once you have every component you need on the
schematic library, you can start create PCB library
 PCB library defines the footprint of the component
AD7798
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LM317L
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What Is Footprint
A footprint created
in the software
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After finish the layout
and get the PCB board.
This is how it look like.
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AD7798 placed on the
board
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Dimension
The basic idea is the
footprint you defined can
fits the chip
6.4mm
extra space for
soldering
 Must follow the exact dimension
 Other wise the component cannot solder on the board
 Leave some extra space for soldering
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Simple Calculation
7.7mm
4mm
(0.3* 1.85) mm
These are pads, they use to
hold the lead of the IC. You
can define the length you
want. You must leave some
space for soldering
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The Footprint You Need
 LM317L Regurator
 SOIC 8 (Check datasheet)
 Power Connector (端子台)
 Pitch 5.08mm
 Infrared proximity connector
 Pitch 2.0 mm
 Connector: 2x5 pin, 2x3 pin, 3 pin
 Pitch 2.54mm
 Chip capacitor, resistor
 0805
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LM317L Physical Dimension
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Create Footprint – By Wizard
 By wizard (old version altium)
 Tool -> IPC Footprint Wizard
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Step 1
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Step 2
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Check datasheet
for correct
number
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Step 3 – No Need Thermal Pad
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Step 4 – Use Default
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Step 5 – Low Density
You can use large Toe Fillet,
hand soldering will be
easier
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Use Default
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Step 7 – Use Default
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Give It A Name
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SOIC-8 Footprint
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X,Y Coordinate
(0,5.2)
8
5
1
4
(0,0)
(1.27,0)
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(2.54,0)
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(3.81,0)
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Create Footprint
 Manual edit
 Place pads
 Place overlay

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The white mark
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Power Connector
 Create Footprint
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Infrared Connector
millimeter
s
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Copy Footprint
 Copy miscellaneous component’s footprints
 In you are using Win 7

Copy “Miscellaneous Connectors.IntLib” and “Miscellaneous
Devices.IntLib” to another directory
 In C:\Program Files\Altium Designer 6\Library
 Open and extract these two library
 Copy following footprint


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Miscellaneous Devices.PcbLib
 2012[0805]
Miscellaneous Connectors.PcbLib
 HDR1x2, HDR1x3, HDR2x3, HDR2x5
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The Footprint You Need
 LM317L Regurator
 SOIC 8 (Check datasheet)
 Create by wizard
 Power Connector (端子台)
 Pitch 5.08mm
 Manual create
 Infrared proximity connector
 Pitch 2.0 mm
 Manual create
 Connector: 2x5 pin, 2x3 pin, 3 pin
 Pitch 2.54mm
 Copy from miscellaneous component’s footprints
 Chip capacitor, resistor
 0805
 Copy from miscellaneous component’s footprints
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Link Schematic Library And PCB Library
 After create all the footprint need, linking with the
schematic library
 link schematic library and PCB library
 Update schematic
 Notes
 Pins on the schematic library must map to the pins on
PCB library, which is identical to real chip.
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Pin To Pin Mapping
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Pin To Pin Mapping
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Check Schematic And Choose Footprint
 Choose Footprint
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Is better to
follow this one
Normal Procedure
Procedure we took
Create component libraries in the
PCB software
1.
Normal procedure
Schematic library

Draw the circuit on the PCB
software

Create PCB library
3.
Make the hardware board
5.



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Layout
Export layout to manufacturer
output, send to PCB manufacturer
Home made PCB
Decide the shape of the board
Placing components
Make connections
1.
2.
3.
Decide the shape of the board
Placing components
Make connections
1.
2.
3.
Draw the circuit on the PCB
software
Choose footprint when you place
components

3.
Layout
4.
Capture schematic
2.
Link PCB and Schematic library
Update schematic
Choose footprint



Schematic library
PCB library
Link PCB and Schematic library



Capture schematic
2.
Create component libraries in the
PCB software
1.
Make the hardware board
4.


Wireless Sensor Network And Labs fall 2011
Export layout to manufacturer
output, send to PCB manufacturer
Home made PCB
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Now
 Create your footprint
 Choose correct footprint
 Check schematic
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Export to PCB
 Compile the schematic and export the components to
PCB design document
 Compile

Project -> Compile Document xxxxx.SchDoc
 Export the footprints to PCB

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Design -> Update PCB Document xxxxx.PcbDoc
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Environment And Keep-Out
 Setup the layout environment and defines the keep out
layer
 Environment (optional)

(Right click) Option -> Board Options
 Metric or Imperial
 Snap grid
 Define Keep-out

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Define the shape of your PCB board
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Component Placing
 Place the component 01 02
 Component placing is important
 Carefully place the component according to the signal
path
 Frequency used quick key


Dragging the component, press “space” to rotate
Dragging the component, press “l” to place at the other size
 Place the bypass capacitor as close to the power pin as
possible
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Design Rules
 Editing design rules
 It defines the rules that your PCB board must follow
 Frequently used rules



Clearance – minimum distance between traces
Routing Width – minimum and maximum allowable trace
width
Routing Vias – minimum and maximum via size (diameter
and hold size)
 At least you need to change “routing width”
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PCB Layout
 Routing 01 02 03 04
 My way



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Route the power line first, route them at the edge
 Make the track width wider for power line
Route the signal line on the top layer as much as you can
Make the bottom layer as a continuous ground plane
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Place Some Signature
 Just for fun
 You can put some text on the “Overlay layer”

Either “Top Overlay” or “Bottom Overlay”
 Text can be




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Team name
Members name
Date
Whatever you want
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Design Rules Check (DRC)
 This function check everything
 According to the rules you setup
 Run Design Rules Check (DRC)
 If errors found, must fix it
 Clearance Constraint
 Broken-Net Constraint
 Fix errors and run DRC again
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Ground (GND) Polygon Pour
 Polygon Pour is a large area of copper
 Usually use for GND
 Route signal on one side, place GND polygon pour on
the other side
 Connect every GND through a via to another side
 Place GND polygon pour
 And run DRC again
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Fabrication Outputs
 Export the layout to fabrication outputs
1. Export Gerber files
2. Export NCdrill file
3. Pack all files in project output directory
 Send these files to PCB manufacturer
 wait for about 1.5 weeks
 cost about NT4000 ~ NT6000
 you will get a professional PCB board
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Send Files
 Send me the whole project files
 Whole project directory
 One layout for each team
 Before next Friday (12/23)

2011/12/16
I will check the files and send to manufacturer by Wednesday
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Will it work?
We’ll see
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