Introduction to CMOS VLSI Design Lecture 19: Nonideal Transistors David Harris Harvey Mudd College Spring 2007 Outline Transistor I-V Review Nonideal Transistor Behavior – Velocity Saturation – Channel Length Modulation – Body Effect – Leakage – Temperature Sensitivity Process and Environmental Variations – Process Corners 19: Nonideal Transistors CMOS VLSI Design Slide 2 Ideal Transistor I-V Shockley 1st order transistor models 0 Vds I ds Vgs Vt 2 2 Vgs Vt 2 19: Nonideal Transistors Vgs Vt V V V ds ds dsat Vds Vdsat CMOS VLSI Design cutoff linear saturation Slide 3 Ideal vs. Simulated nMOS I-V Plot 180 nm TSMC process Ideal Models – = 155(W/L) mA/V2 – Vt = 0.4 V I (mA) – VDD = 1.8 V BSIM 3v3 SPICE models ds 400 Vgs = 1.8 300 Ids (mA) 250 Vgs = 1.5 200 0 200 Vgs = 1.5 150 Vgs = 1.2 100 Vgs = 1.8 Vgs = 1.2 100 Vgs = 0.9 Vgs = 0.9 Vgs = 0.6 0 0.3 0.6 0.9 1.2 50 1.5 1.8 Vds Vgs = 0.6 0 0 0.3 0.6 0.9 1.2 1.5 Vds 19: Nonideal Transistors CMOS VLSI Design Slide 4 Simulated nMOS I-V Plot 180 nm TSMC process BSIM 3v3 SPICE models I (mA) What differs? 250 – Less ON current 200 – No square law 150 – Current increases 100 in saturation ds Vgs = 1.8 Vgs = 1.5 Vgs = 1.2 Vgs = 0.9 50 Vgs = 0.6 0 0 0.3 0.6 0.9 1.2 1.5 Vds 19: Nonideal Transistors CMOS VLSI Design Slide 5 Velocity Saturation We assumed carrier velocity is proportional to E-field – v = mElat = mVds/L At high fields, this ceases to be true – Carriers scatter off atoms – Velocity reaches vsat • Electrons: 6-10 x 106 cm/s /2 • Holes: 4-8 x 106 cm/s – Better model slope = m sat sat μElat v vsat μEsat Elat 1 Esat 19: Nonideal Transistors CMOS VLSI Design 0 0 Esat 2Esat 3Esat Elat Slide 6 Vel Sat I-V Effects Ideal transistor ON current increases with VDD2 2 W Vgs Vt I ds mCox Vgs Vt L 2 2 2 Velocity-saturated ON current increases with VDD I ds CoxW Vgs Vt vmax Real transistors are partially velocity saturated – Approximate with a-power law model – Ids VDDa – 1 < a < 2 determined empirically 19: Nonideal Transistors CMOS VLSI Design Slide 7 a-Power Model 0 V I ds I dsat ds Vdsat I dsat Vgs Vt cutoff Vds Vdsat linear Vds Vdsat saturation I dsat Pc V 2 gs Vt a Vdsat Pv Vgs Vt a /2 Simulated a-law Shockley Ids (mA) 400 300 Vgs = 1.8 200 Vgs = 1.5 19: Nonideal Transistors 100 Vgs = 1.2 0 Vgs = 0.9 Vgs = 0.6 0 0.3 0.6 0.9 1.2 1.5 CMOS VLSI Design 1.8 V ds Slide 8 Channel Length Modulation Reverse-biased p-n junctions form a depletion region – Region between n and p with no carriers – Width of depletion Ld region grows with reverse bias V V GND Source Gate Drain – Leff = L – Ld Depletion Region Width: L Shorter Leff gives more current – Ids increases with Vds L n+ n+ L – Even in saturation p GND bulk Si DD DD d eff 19: Nonideal Transistors CMOS VLSI Design Slide 9 Chan Length Mod I-V I ds Ids (mA) V 2 gs Vt 1 lVds 2 400 Vgs = 1.8 300 Vgs = 1.5 200 Vgs = 1.2 100 0 0 Vgs = 0.9 Vgs = 0.6 0.3 0.6 0.9 1.2 1.5 1.8 Vds l = channel length modulation coefficient – not feature size – Empirically fit to I-V characteristics 19: Nonideal Transistors CMOS VLSI Design Slide 10 Body Effect Vt: gate voltage necessary to invert channel Increases if source voltage increases because source is connected to the channel Increase in Vt with Vs is called the body effect 19: Nonideal Transistors CMOS VLSI Design Slide 11 Body Effect Model Vt Vt 0 g fs Vsb fs fs = surface potential at threshold fs 2vT ln NA ni – Depends on doping level NA – And intrinsic carrier concentration ni g = body effect coefficient g tox ox 2q si N A 2q si N A Cox 19: Nonideal Transistors CMOS VLSI Design Slide 12 OFF Transistor Behavior What about current in cutoff? I Simulated results 1 mA What differs? Sub100 mA threshold – Current doesn’t go 10 mA Region 1 mA to 0 in cutoff 100 nA ds 10 nA Saturation Region Vds = 1.8 Subthreshold Slope 1 nA 100 pA 10 pA Vt 0 0.3 0.6 0.9 1.2 1.5 1.8 Vgs 19: Nonideal Transistors CMOS VLSI Design Slide 13 Leakage Sources Subthreshold conduction – Transistors can’t abruptly turn ON or OFF Junction leakage – Reverse-biased PN junction diode current Gate leakage – Tunneling through ultrathin gate dielectric Subthreshold leakage is the biggest source in modern transistors 19: Nonideal Transistors CMOS VLSI Design Slide 14 Subthreshold Leakage Subthreshold leakage exponential with Vgs Vgs Vt I ds I ds 0e nvT Vds v 1 e T I ds0 vT2e1.8 n is process dependent, typically 1.4-1.5 19: Nonideal Transistors CMOS VLSI Design Slide 15 DIBL Drain-Induced Barrier Lowering – Drain voltage also affect Vt Vt Vt Vds VVV ttds – High drain voltage causes subthreshold leakage to ________. 19: Nonideal Transistors CMOS VLSI Design Slide 16 DIBL Drain-Induced Barrier Lowering – Drain voltage also affect Vt Vt Vt Vds VVV ttds – High drain voltage causes subthreshold leakage to increase. 19: Nonideal Transistors CMOS VLSI Design Slide 17 Junction Leakage Reverse-biased p-n junctions have some leakage VvD T I D I S e 1 Is depends on doping levels – And area and perimeter of diffusion regions – Typically < 1 fA/mm2 p+ n+ n+ p+ p+ n+ n well p substrate 19: Nonideal Transistors CMOS VLSI Design Slide 18 Gate Leakage Carriers may tunnel thorough very thin gate oxides Predicted tunneling current (from [Song01]) 109 tox VD D trend 0.6 nm 0.8 nm 2 JG (A/cm ) 106 103 1.0 nm 1.2 nm 100 1.5 nm 1.9 nm 10-3 10-6 10-9 Negligible for older processes May soon be critically important 19: Nonideal Transistors CMOS VLSI Design 0 0.3 0.6 0.9 1.2 1.5 1.8 VD D Slide 19 Temperature Sensitivity Increasing temperature – Reduces mobility – Reduces Vt ION ___________ with temperature IOFF ___________ with temperature 19: Nonideal Transistors CMOS VLSI Design Slide 20 Temperature Sensitivity Increasing temperature – Reduces mobility – Reduces Vt ION decreases with temperature IOFF increases with temperature I ds increasing temperature Vgs 19: Nonideal Transistors CMOS VLSI Design Slide 21 So What? So what if transistors are not ideal? – They still behave like switches. But these effects matter for… – Supply voltage choice – Logical effort – Quiescent power consumption – Pass transistors – Temperature of operation 19: Nonideal Transistors CMOS VLSI Design Slide 22 Parameter Variation fast Transistors have uncertainty in parameters – Process: Leff, Vt, tox of nMOS and pMOS – Vary around typical (T) values Fast (F) – Leff: ______ – Vt: ______ – tox: ______ Slow (S): opposite nMOS Not all parameters are independent for nMOS and pMOS FF pMOS SF TT slow slow 19: Nonideal Transistors CMOS VLSI Design FS SS fast Slide 23 Parameter Variation fast Transistors have uncertainty in parameters – Process: Leff, Vt, tox of nMOS and pMOS – Vary around typical (T) values Fast (F) – Leff: short – Vt: low – tox: thin Slow (S): opposite nMOS Not all parameters are independent for nMOS and pMOS FF pMOS SF TT slow slow 19: Nonideal Transistors CMOS VLSI Design FS SS fast Slide 24 Environmental Variation VDD and T also vary in time and space Fast: – VDD: ____ – T: ____ Corner Voltage Temperature 1.8 70 C F T S 19: Nonideal Transistors CMOS VLSI Design Slide 25 Environmental Variation VDD and T also vary in time and space Fast: – VDD: high – T: low Corner Voltage Temperature F 1.98 0C T 1.8 70 C S 1.62 125 C 19: Nonideal Transistors CMOS VLSI Design Slide 26 Process Corners Process corners describe worst case variations – If a design works in all corners, it will probably work for any variation. Describe corner with four letters (T, F, S) – nMOS speed – pMOS speed – Voltage – Temperature 19: Nonideal Transistors CMOS VLSI Design Slide 27 Important Corners Some critical simulation corners include Purpose nMOS pMOS VDD Temp Cycle time Power Subthrehold leakage Pseudo-nMOS 19: Nonideal Transistors CMOS VLSI Design Slide 28 Important Corners Some critical simulation corners include Purpose nMOS pMOS VDD Temp Cycle time S S S S Power F F F F Subthrehold leakage F F F S Pseudo-nMOS S F ? ? 19: Nonideal Transistors CMOS VLSI Design Slide 29