DEVELOPMENT OF THE
CBM-MVD:
THE PROTOTYPE
Michal Koziel
on behalf of CBM-MVD collaboration
Michal.Koziel@Physik.uni-frankfurt.de
(+49) 069 / 798-47119
The MVD – required performances
See P.Senger
introduction
CBM-MVD will:
- improve secondary vertex resolution
- host highly granular silicon pixel sensors
featuring fast read-out, excellent spatial
resolution and robustness to radiation
environment.
Required performances (SIS-100)
Radiation
tolerance
> 1013neq/cm2 & >3 MRad
Read-out speed
> 30 kframes/s
Intrinsic
resolution
< 5 µm
Operation in vacuum
„Light” support
and cooling
Material budget ~ 0.3 % X0
Radiation
tolerance
Support
& cooling
M.Winter
Main challenges:
• Provide fast and radiation
tolerant sensor featuring low
material budget
• Develop sensor readout system
capable to handle high data
rates
• Provide cooling and support
with low material budget
Front-End
Electronics
J.Stroth
System integration
Sensor
development
Prototype
Demonstrator
4 sensors
½ of 1st station
Final
...will meet all
requirements
Sensor:
Sensor:
Sensor:
MIMOSA-20
~200 frames/s
few 1011 neq/cm2 &
~300 kRad
750µm thick
MIMOSA-26 AHR
~10 kframes/s
~1013 neq/cm2
& >300 kRad
50µm thick
MIMOSIS-1 (diff. geometry)
Readout
Readout
Serial/analog
CP/digital/high data rates
>1013 neq/cm2
& >3 MRad
Cooling & support:
Cooling & support:
TPG+RVC foam
CVD diamond
Material budget:
~ 2.45 % X0
Material budget:
~ 0.3 % X0
Readout speed
~30 kframes/s
Radiation tol.
MIMOSA-26 AHR
0.35µm process
High Resistivity (HR) EPI (400Ω·cm)
21.2 x 10.6 mm2
Main features:
18.4 µm pixel pitch
- in pixel amplification
- comparator for each column
- 0 suppression logic
- pitch: 18.4 μm∼ 0.7 million pixels
CMOS processes with
smaller feature size (0.18µm)
Radiation tolerance
Achieved performances
MIMOSA-26 AHR (2009) [1]
Design goals (SIS-100)
MIMOSIS-1 (~2015)
~1013neq/cm2 & >300 kRad
~1013neq/cm2 & >3 MRad
 CMOS~10
processes
kframes/swith
smaller feature size (0.18µm)
Intrinsic resolution
~3.5 µm
 Sensor geometry – column
Material budget
~ 0.05 % X0 (50µm Si)
length
Read-out speed
>30 kframes/s
< 5 µm
~ 0.05 % X0 (50µm Si)
Extensively studied at IKF:
[1] M.Deveaux „Radiation tolerance of a column parallel CMOS sensor with high resistivity epitaxial layer”,
accepted for publication in Journal Of Instrumentation 2011
Driver
board
Clk
Start
Reset
JTAG
CB
FEB
5 x 800MBit/s
multiwire
LVDS
Signal
distribution
Filtering
RCB
multiwire
5 x 1GBit/s
LVDS
Optical Fibers
Powering
Powering
LVDS drivers
Latchup
detection
Current&&
Current
temperature
temperature
monitoring
monitoring
LVDS to Optical
conversion
PEXOR
PC
PCI optical
receiver
15 optical
x 300MBit/s
link
Optical Fibers
CBM
DAQ
Data reduction
Time stamping
Slow control
Fast control
LVDSconcentrator
to Optical
Data
FEB – Front End Board // CB – Converter Board // RCB – Readout Controller Board
Main objectives:
 On-line current monitoring
 Latch-up detection & handling (based on
STAR solution)
 Possibility to use radiation tolerant
components (CERN)
Slow
control
Cooling
Cooling
& carrier
*
Heat Sink
Heat Sink
Carrier
* - @ +20C , >3000W/mK @-50C
Demonstrator
Sensor
Prototype
Flex Cable
Sensor
Flex Cable
R/O
TPG
RVC
TPG
Cu heat sink
750µm thick sensors
TPG - Thermal Pyrolitic Graphite
CVDD
300µm
R/O
Sensors thinned down to 50µm
R/O
Material budget ~2.45% X0
R/O
Cu heat sink
Material budget ~0.35% X0
RVC - Reticulated Vitreous Carbon
Flex Cable
Sensor
CVDD
300µm
R/O
Cu heat sink
R/O
SERWIETE (SEnsor Row Wrapped In an Extra Thin Envelope)
IMEC (Belgium) +
IKF Frankfurt +
IPHC Strasbourg (sensors)
Radiation tolerance ?
Reliability ?
Thermal cycles ?
Real material budget ?
Digital Microscope Keyence VHX-600
Thermal imaging system
(VarioCAM HiRes 640)
Probe Station PA200 (Suss-Microtec)
10-7 mBar vacuum chamber
1)
2)
3)
4)
5)
6)
The concept of the MVD read-out is defined
The hardware components for MVD prototye have been delivered to the IKF
Assembly and debugging in progress
Software development is ongoing
Lab tests to be performed
In parallel – software developments
Challanges:
1) Deliver MIMOSIS-1 – with required radiation tolerance & readout speed for MVD
2) Most optimum read-out
3) Connectivity
4) Second station – large area sensors…
CBM-MVD Collaboration members:
Samir Amar-Youcef, Norbert Bialas, Michael Deveaux, Dennis Doering, Melissa
Domachowski, Christina Dritsa, Horst Düring, Ingo Fröhling, Tetyana Galatyuk, Michal
Koziel, Jan Michel, Boris Milanovic, Christian Müntz, Bertram Neumann, Paul Scharrer,
Christoph Schrader, Selim Seddiki, Joachim Stroth, Tobias Tischler, Christian Trageser,
Bernhard Wiedemann
Jérome Baudot, Grégory Bertolone, Nathalie Chon-Sen, Gilles Claus, Claude Colledani,
Andrei Dorokhov, Wojchiech Dulinski, Marie Gelin-Galivel, Mathieu Goffe, Abdelkader
Himmi, Christine Hu-Guo, Kimmo Jaaskelainen, Frédéric Morel, Fouad Rami, Mathieu
Specht, Isabelle Valin, Marc Winter