IEEE Transactions On Industry Applications Special Issue

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IEEE Transactions On Industry Applications
Special Issue on Grounding Systems, 2015
Grounding Electrode Systems are of paramount importance, as components of electrical systems must
be connected to earth, either for safety purposes, or for their proper functioning. The purpose of this
special issue is to provide a forum for researchers and practitioners to discuss the analysis and the
proper design, as well as safety related issues, of grounding systems.
Prospective authors are invited to submit original contributions, or survey papers or tutorials, for
review for publication in this special issue on Grounding Systems. Topics of interest include, but are
not limited to:
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Analysis and design of grounding grids in lightning conditions
Electromagnetic grid-to-grid and grid-to-equipment interferences
Field measurement techniques of significant parameters related to grounding grids
Technical Standards
Steady state and transient analysis of grounding grids
Computational methods for grounding grid parameters extraction
Case studies
Electrical Safety
Protection and coordination of protective devices under ground-fault conditions
Teaching the theory of ground electrode systems
Stray currents and corrosion
Bonding and earthing
High resistance grounding
Authors who wish to submit a paper for consideration must submit an abstract (1 page, free format) to
the Guest Co-Editors identified below. Authors who submit an accepted abstract will receive a formal
invitation with detailed instructions for submission of the complete manuscript to the IAS ScholarOne
Manuscripts site. Refer to http://www.ias.org for general information about electronic submission
through ScholarOne Manuscripts. Submit manuscripts to the Guest Co-Editors:
Guest Co-Editor: Prof. Fabio Freschi, Politecnico di Torino, Italy, (fabio.freschi@polito.it)
Guest Co-Editor: Dr. Massimo Mitolo, Eaton Corp., USA (mitolo@ieee.org)
Manuscripts will be reviewed and handled by the Guest Editorial Board noted below.
Guest Editorial Board:
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Rob Hoerauf, Hoerauf Consulting Inc., USA
Wei-Jen Lee, The University of Texas at Arlington, USA
Haijun Liu, ETAP, USA
Sergio Panetta, I-Gard Corp., Canada
Giuseppe Parise, La Sapienza University of Roma, Italy
Kent Sayler, P2S Engineering, USA
Timeline
Call for Papers
Submission of one-page abstract
Submission of manuscripts for review in S1M
Final Decision
Submission of final files for approved papers
Publication of Special Issue of IAS Transactions
September 1st 2014
November 15th 2014
January 1st 2015
August 15th 2015
September 15th, 2015
November/December 2015
All interested parties are kindly requested to disseminate this call for papers.
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