XIAMEN G&P ELECTRONICS CO.,LTD.

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Company Profile
XIAMEN G&P ELECTRONICS CO., LTD.
Jiayi Industrial Park, Huli District
Xiamen, Fujian province, China 361006
TEL:+86-592-6110703
FAX:+86-592-5700318
E-mail: xmfpc@globalsources.com
http://www.globalsources.com/xmgp.co
Content of Profile
Company Information
Major Customer
MFG Process
MFG Capability
MFG & Test Equipment
Company Information
Xiamen G & P Electronics Co. Ltd specializing in the developing,
manufacturing and marketing of flexible PCB. With advanced
equipments and skilled workers, we produce 30,000 m2 FPC
monthly at our ISO 9001-certificated factory in Xiamen. Each of
our products is made of top-grade materials and compliant with
the RoHS directives. Some well-known buyers such as Amoi
Mobile and AOC source FPC from us because of our competitive
price, reliable quality and prompt delivery.
Our greatest advantage over our competitors is our engineers. All
of them is well trained and experienced. Currently they are
focusing on improving technology, reducing cost and defect rate
to meet a higher market standard. Just let our professional
engineers work on your OEM/ODM orders.
Company Information
: 5000 Square Meter
Factory area
: 375
Employees
R & D engineers : 20
2/month
:
20,000-30,000
m
Capacity
Product Introduction
Advantage
Application
 Note-Book
Small Size
 Digital Camera
 DVD / CD-ROM
Light Weight
Flex-for-Installation
Dynamic Flexibility
 HDD
 Printer
 Scanner
 PDA
 Cellular Phone
 LCD
 Auto-Mobile
Our Customers
Mobile
LCD OR LCM
MFG Process
Major Equipment(1)
NC Drilling
Exposuring Room
Major Equipment(2)
D.E.S.
Major Equipment(3)
CVL Lamination
Hole-Punching
Major Equipment(4)
Screen Printing
Elec.-test & Visual
Inspection
Major Equipment(5)
Blanking
Quality Assurance System
 Incoming QC
Strict quality control and inspection are done at each stage of producing
100% of In-process QC and Final inspection
Testing is carried out within three lab: chemical, physical and electric-test
Weekly quality report with statistical information
Prompt responses and feasible solution to customer‘s quality complaint.
MFG & Test Equipment(1)
2-D Measuremen System
Peel Strength Testing Machine
MFG & Test Equipment(2)
Swaying Test Machine
Micro Scope
MFG & Test Equipment(3)
Slice up Muller
X-ray Thickness Measurement
Process Capability
 General
 Number of layer: 1-6
 Copper Foil: 1/3, 1/2, 1.0, 2.0 oz
 Material: Polyimide (Kapton), PET, FR4
 Min. conductor width/spacing: 0.075 mm
 Min. hold diameter: Drilling:0.20 mm
Punching: 0.50 mm
 Special Material Available: Halogen Free
2 mil PI
 Tolerance
 Conductor width: + / - 0.03mm
 Hole diameter: + / - 0.05mm
 Accumulated pitch: + / - 0.05mm
 Outline dimension: + / - 0.05mm
 Surface Treatment
 Electrolytic Tin ( Lead free) Plating
 Hot Air Leveling
 Electrolytic Nickel and Gold Plating
 Eelectroless Nickel and Immersion
Gold Plating
Honor Certificate
(UL:E230743)
2002 passedISO9001:2000
RoHS Approval by SGS report
2002 passed UL
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