联合创新，赢得先机
半导体公司如何在新时代引领行业趋势
顾文杰，博通公司大中华区高级总监
10/23/2014
© 2014 Broadcom Corporation. All rights reserved.
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PROLOGUE
半导体行业机会
新兴战略产业框架
下一轮技术产业革命
技术浪潮的核心力量
改变硬件公司思维
看清方向来引导新应用、打造新市场，推动产业升级
后互联网及手机时代的创新前景
博通公司在中国成立的物联网联合创新中心正在探索一
条新的路线
© 2014 Broadcom Corporation. All rights reserved.
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新七领域之新兴信息产业之：物联网现状
Source: China RFID Alliance
© 2014 Broadcom Corporation. All rights reserved.
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互联网世界爆发式增长
489
6
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芯片公司机遇 – 物联网智能化需要高带宽网络
物联网的智能化将物联网应用推向一个新的高度，为用户感知、便捷性、实用性带来
质的变化。同时，也提出了高带宽网络条件的要求。
99.98% of All Data Traffic Crosses a Broadcom Chip
© 2014 Broadcom Corporation. All rights reserved.
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中国物联网行业简析
中国物联网产业成绩及问题：
1. 产业规模大，南水北调、
智能物流等大型项目及全
球最有潜力的互联网经济
2. 技术支撑力量不够，由于
核心环节关键技术比较欠
缺，即使传感器和芯片、
智能信息处理软件等依然
处于初级阶段。
核心技术：匮乏，拥有核心技术较
少.在关键芯片设计领域、生产工
艺方面，未有根本突破
企业规模：相对较弱，物联网工业
不够大，大规模成功应用的案例较
少。无线传感网络的应用仍待技术
突破。
产业基础: 相对较好，在自动化领
域、M2M通讯、RFID/传感器领域
等多方面，都有一定的发展基础和
应用
© 2014 Broadcom Corporation. All rights reserved.
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博通简介
© 2014 Broadcom Corporation. All rights reserved.
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ABOUT BROADCOM
BROADCOM AT A GLANCE
Fortune
One of the
300 Global
Largest
Volume
Leader in
Semiconductors
for Wired and
Wireless
Communications
Fabless
Semiconductor
Suppliers
One of the
Industry’s
Broadest IP
Portfolios with
>20,850
Top 5
Semiconductor
Companies by
Revenue*
U.S. and
Foreign
Patents and
Applications
Source: Gartner Top 10 Semiconductor Vendors by Revenue, Worldwide, 2013. Excluding memory companies.
© 2014 Broadcom Corporation. All rights reserved.
One of
HQ in Irvine,
Calif. With
Design
Centers
Around the
World
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LEVERAGING CONNECTIVITY TO LEAD IN IOT AND WEARABLES
Internet of Things
Everything
Connected
to the Network
Connectivity
Smart Devices
Wearables
Body-borne
Computing
and Sensors
Control and Analyze
© 2014 Broadcom Corporation. All rights reserved.
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COMPLETE HOME CONNECTIVITY SOLUTIONS
Providing the Industry’s
Strongest Mix of Media,
Interconnections and Standards
Media
Interconnect
Connectivity
Coax
Switching
MoCA 2.0
Air
Xtendnet®
Wi-Fi 802.11ac
CAT5
PQoS / WMM
Powerline
DLNA
Ethernet
(100/1000Base-T)
nVoy™
HomePlug
AV / IEEE 1901
HomePlug
Green PHY
© 2014 Broadcom Corporation. All rights reserved.
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SMART DRIVING
First to Support Beidou
Automotive Semi Demand
Estimated to Reach $39B
by 2018
2018年，车载半导体产品
需求预期将达到$390亿
Outdoor
Indoor
Context
Awareness
Sensors
+
–
5
L
Indoor
Positioning
Always on
Battery
Optimal
BCM47531
Location &
Sensor Hub
© 2014 Broadcom Corporation. All rights reserved.
Multi-constellation
Simultaneous
Support
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BROADCOM WIRELESS INTERNET CONNECTIVITY FOR
EMBEDDED DEVICES (WICED)嵌入式无线互联网解决方案
WICED™ WI-FI
WICED™ SMART
Always on Connection to the Home Network
实时连接家庭网络
Home
Appliances
家用电器
Home, Security
and Automation
家庭，安全，自动化
© 2014 Broadcom Corporation. All rights reserved.
Bluetooth Boost for Low-power Products
蓝牙推动低功耗产品开发
Health and
Wellness
医疗健康
Games and
Entertainment
游戏娱乐
Automotive
车载
Connecting
Everything,
Everyday
连接一切，每一天
Home, Security
and Automation
家庭，安全，自动化
Health and
Wellness
医疗健康
Sports and
Fitness
运动健身
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BUILDING MOMENTUM IN AUTOMOTIVE
High Performance
100 Mbps Ethernet Connectivity
200+ OPEN Members
Infotainment
360° Camera System
On-board Diagnostics
BMW X5 Currently in Production
© 2014 Broadcom Corporation. All rights reserved.
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联合创新中心介绍
© 2014 Broadcom Corporation. All rights reserved.
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MOU & OFFICIAL LAUNCH 联合创新中心备忘录及正式启动
 Part of BroadcomShanghaiTech-SIMIT alliance 三
方合作
 3/19/2014 Broadcom signs MOU
with SIMIT to jointly launch Joint
Innovation Center (JIC) 备忘录
 8/19/2014 Shanghai Official
Launch 正式启动
《媒体摘录》感知时代即将到来，新想法新产品不断涌现，但仍未形成产业集群和技术创新。政府、学界、产
业界需要通力合作，共创完善的物联网生态环境。8月20日，由中科院博通公司共同打造“物联网联合创新中
心”正式揭牌成立，旨在集结各方技术和产业实力，推进嘉定、上海及周边地区物联网水平的提高，推动可穿
戴、智能家居等物联网领域的平台建设和创意落地，共同推进中国可穿戴市场的发展和互联技术平台的搭建。
© 2014 Broadcom Corporation. All rights reserved.
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JIC OFFICE IN SHANGHAI IOT CENTER
 JIC based in Shanghai IOT Center 联合创新中心将位于上海市物联网中心
 Permanent demo room 物联网成果永久展示区
 Shanghai IOT window 成为上海物联网对外窗口
© 2014 Broadcom Corporation. All rights reserved.
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细化行业，精准计划

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
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




© 2014 Broadcom Corporation. All rights reserved.
运营商运营型
系统集成商主导型
软硬件集成商主导型
（“iPhone”模式）
软件内容集成商主导型
运营商合作推广型
公共事业型
用户主导型
合作运营型
移动金融型
广告平台型
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JIC STRUCTURE 联合创新中心架构
Broad
com
xxx
 Structure – covering whole value chain
覆盖全价值链
 Solution/chip makers led by BRCM
博通为代表的芯片厂商
 Gov’t institutions & carriers led by
SIMIT 运营商
 OEM/ODM/partners 厂商
 JIC IoT Committee play key role 执委会
起关键作用
 20 member companies as standing
member
 Open platform, welcome more to
join
Telec
om
xxx
xxx
Chip
makers
Unico
m
xxx
Steering
Committee &
.
Alternating
Chairperson
CMC
C
Gov’t &
carriers
xxx
OEM/O
DM
SIMIT
xxx
xxx
xxx
xxx
© 2014 Broadcom Corporation. All rights reserved.
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NEXT YEAR PLAN 计划
 Project Incubation – example in next slide
项目孵化 （下页举例）
 Steering meetings, e-comm
执委会定期会议交流市场趋势、计划、产品、行动方案，电子交流
 Annual IoT Summit in JIC Center
年度物联网峰会
 Alternating Chair
选举每年轮值主席
 Invite more players to join
邀请更多成员加入
 Expand influence, industrialization & monetization
扩大影响力，产品工业化市场化
 Support member initiatives
支持各家会员自发活动，推广各家的影响力
 Leveraging OIC
博通在全球联合30多家厂商成立了OIC（物联网设备互联互通组织）
© 2014 Broadcom Corporation. All rights reserved.
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JIC PROJECTS
Cloud-based
Smart Home Server
•
•
•
•
Health Monitor
BT 4.0 Sync
Finger Gesture
UV detector
© 2014 Broadcom Corporation. All rights reserved.
•
•
•
•
Smart Golf
Motion sensor
Visible analysis
Teaching
•
•
•
Textile Electrode
Heart rate,
respiration, body
temp
BCM20732 as
sensor hub and
wireless link
•
•
Full wirelesscontrolled
Enable users
retrieve info
remotely control
home
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THANK YOU
wenjie.gu@broadcom.com
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