Wafer Level Packaging Market Expected to Reach $23.6 Billion
by 2030
“The wafer level packaging market in Asia-Pacific is expected to grow at the highest rate during the forecast
period, owing to rising adoption of smartphones, tablets and other electronic gadgets. Moreover, economically
developed nations tend to witness high penetration of wafer level packaging products in wearable devices
segment which is projected to significantly contribute toward growth of the market”
According to N N Kundan,
Semiconductor and Electronics
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KEY FINDINGS OF THE STUDY
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The fan in wafer level packaging segment is projected to be the major technology, followed by fan out
wafer level packaging.
Asia-Pacific and North America collectively accounted for more than 75% of the wafer level packaging
market share in 2020.
India is anticipated to witness highest growth rate during the forecast period.
U.S. was the major shareholder in the North America wafer level packaging market, accounting for
approximately 69% share in 2020.
Major key players profiled cover in Report:
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Applied Materials, Inc.
Lam Research Corporation
Fujitsu
Qualcomm Technologies, Inc.
ASML Holding N.V
Jiangsu Changjiang Electronics Technology Co. Ltd
Market dynamics
Drivers
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Increasing demand for compact and lightweight electronic devices is driving the growth of the Wafer
Level Packaging market.
Advancements in semiconductor technology, leading to higher integration levels, are fueling the
adoption of Wafer Level Packaging.
Restraints
• Limited thermal dissipation capabilities at wafer level may constrain the performance of high-power
integrated circuits.
• Challenges in achieving uniform wafer-level bonding and packaging processes can impede overall
production efficiency.
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The complexity and cost associated with developing advanced wafer-level packaging technologies may
act as a barrier for widespread adoption.
Opportunities
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Growing demand for compact and lightweight electronic devices drives the adoption of wafer-level
packaging for enhanced miniaturization.
Increasing use of advanced packaging technologies like fan-out wafer-level packaging (FOWLP) for
improved performance in semiconductor applications.
Rise in 5G deployment fuels opportunities for wafer-level packaging in high-frequency and highperformance integrated circuits.
⦁ Report Overview:
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Analyst Review:
The global wafer level packaging market is flourishing at a rapid pace. However, high initial investment is still a
concern for new entrants. Market players are generously investing in R&D activities to develop improved
solutions to reduce the overall cost of wafer level packaging products. In addition, according to industry
experts, it is essential to optimize affordable prices for wafer level packaging products for long-term growth.
In November 2021, Amkor Technology Inc. announced the business expansion of advanced packaging
technology capacity with a new factory setup in Bac Ninh, Vietnam. This is expected to provide a long-term
investment in geographical diversification and factory capacity expansion, supporting Amkor’s commitment to
reliable supply chain solutions for its customers.
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