What's New in ANSYS Electronics 2021 R1 The What's New document for ANSYS Electronics provides release information for the following: l HFSS l HFSS 3D Layout l SIwave l Maxwell l Icepak l Mechanical l Q3D Extractor l Circuit l EMIT l Twin Builder General Electronics Desktop l Commercial release of Mechanical and EMIT design types l Ansys Cloud enhancements: l Multi-step job submission l Auto extraction of report data l Improved robustness and useability l Ability to edit design settings in the Properties window l Enhanced Minerva integration, including direct project access l Integration of optiSlang setup in Optimetrics (Beta, Windows only) l New 3D modeler orientation gadget l Support for Linux SLURM schedulers l Automatic use of loopback address to improve reliability when connecting and disconnecting with VPN l Ability to schedule, submit, and monitor jobs in standalone utility l New menu command to validate parametric setups before solving l Enhanced useability and workflows in Network Data Explorer l Proxy 3D Components (Beta) l Enhancements to object-oriented property scripting (Beta) 1 ANSYS Electronics 2021 R1 HFSS l l Performance improvements: l Improved iterative solver l Improved performance for designs with many sources l Ability to disable saving adaptive pass refinement files Improvements for SBR+ designs: l Ability to visualize link source geometry in the target design l Support for composite sources l Features for automotive radar: l Parametric antenna arrays l FMCW in Range-Doppler solutions l Enhancements to near field excitations and post-processing l Linked antenna array source blockage in hybrid simulations l FEM 3D components mesh assembly (Beta) l New automatic airbox region for 3D component arrays l Embedded element pattern export l Single-sided shell element field plotting l Azimuth, elevation, and slant angles for far fields l Finite Array Toolkit enhancements for amplitude tapering and sub-arrays l Support for dispersive ports in the hybrid transient solver l Option to prevent mesh-method fallback l Option to suppress gamma, Zo in automatic S Parameter export HFSS 3D Layout l Performance improvements: l Improved iterative solver l Improved performance for designs with many ports l Ability to disable saving adaptive pass refinement files l Support for encrypted 3D components l Q3D DC point for designs with 3D components l FEM 3D components mesh assembly l Improved dialog box for wirebond creation and editing l Improvements to IC-mode meshing l Support for package definitions and IDF l Support for unencrypted iRCX technology in GDS import 2 ANSYS Electronics 2021 R1 SIwave l Support for Granta material libraries l Improved SYZ solver performance for designs with a very large number of ports l New time-domain crosstalk scan for differential nets l New integrated DDR wizard (Beta) l Improved robustness of RLCG extraction l Improved handling of CPM and Voltus models l Option to visualize direction of incident waves l Ability to specify location of capacitor and IBIS library directories l Ability to run Icepak simulations from the Electronics installation Maxwell l Commercial release of new A-Phi transient solver l Commercial release of partial mesh and solution from full rotational model l Support for temperature-dependent core loss curves l Support for spatially-varying materials characteristics and temperatures from XYZ datasets l Extension of Litz wire modeling to RL matrix solutions l Ability to create field plots of average loss l Ability to parameterize adaptive frequency in eddy current solutions l Enhancements to electric machine toolkit workflows and performance l Ability to output transient electromagnetic forces to motion l Support for element-based volumetric harmonic force in eddy-current solutions l Support for GPU acceleration in 3D real matrix solutions l Ability to specify minimum and maximum nonlinear iterations l Support for time-dependent excitations and motion in system coupling l New 3D AC conduction solver (Beta) Motor-CAD l Export Maxwell (2D/3D) custom DXF geometry l Using Maxwell User-Defined Primitive for hairpin coil definition with parametrized elements l Optimization ratio-based geometry l Force analysis improvements l Use Maxwell solver as an electromagnetic option for driving cycle analysis l Thermal end-winding modeling improvement 3 ANSYS Electronics 2021 R1 Icepak l New ability to generate LTI ROM models in Twin Builder l New flow links and improved workflows for network schematics l Improved meshing automation and workflows l Enhancements to concurrent meshing of regions l Ability to import IDF data through PCB components l New fast Optimetrics option to copy meshes and solver inputs l Ability to scale EM losses l Ability to include dielectric loss in links from 3D Layout l New ability to export solver monitor and residual data l New dynamic thermal managements control (Beta) Mechanical l First commercial release in Electronics Desktop l Fully integrated workflows and solutions on Windows and Linux l Ability to set up and solve thermal and modal simulations l EM loss coupling with HFSS, Maxwell, and Q3D Extractor l Rotating fluid boundary for electric machines l Ability to link with heat transfer coefficient calculated in Icepak Q3D Extractor l Commercial release of Ansys PRIME mesh option for CG solver l Improved performance of CG direct solver l New uniform current circuit terminals for the AC-RL solver (Beta) Circuit l Integration of Power Module Characterization Tool in Circuit designs l Enhanced efficiency of dynamic links to field solvers l AMI model support for single-ended devices l Addition of parasitic elements to L and C models l New support for eye measurements in countour plots l Integration of SPISim SPro functionality into Network Data Explorer l Addition of Nexxim as default simulator for SPISim l New SPISim COM capabilities, including PowerSum, Effective Return Loss (ERL) l Improved DC passivity preservation in state-space fitting (Beta) 4 ANSYS Electronics 2021 R1 EMIT l First commercial release in Electronics Desktop l Improved coupling link with HFSS and HFSS 3D Layout l Enhancements to workflows and usability of schematic editor l Improved automation and scripting API l Support for import of projects from classic EMIT Twin Builder Modelica Workflow Enhancements l Support for Modelica package creation and library management l Support to extend existing Modelica model l Enhanced support for graphical annotation l Faster loading of Modelica libraries and numerous other Modelica usability enhancements Enhancements to ROMs and ROM Viewer l Support for Fields Visualization in Dynamic ROM Builder l Static ROM Builder supports geometrical parameter variation l New Response Surface ROM Toolkit l UI for Linear Parameter Varying (LPV) ROM l Enhancements to the Static ROM Viewer l Support for 3D Visualization during Simulation inside Twin Builder Battery and EV Verticalization l Toolkit to perform Failure Mode & Effect Analysis (FMEA) l Motor Equivalent Circuit Toolkit for FMU export l Battery Wizard improvement l New EV Powertrain Library l Toshiba component library as ACT extension Export, Deployment, and Digital Twins l l Support for Schematic authoring ,Python block, and simulation result explorer in Twin Deployer Export Twin project for sample deployment and DTDL for Microsoft Azure Digital Twin deployment l Enhanced interoperability with all-inclusive Tool-coupling FMU l Support for FMU (fixed step) export from Simulink for Twin Builder l Improved compilation of FMUs and Twin Builder Fluent component on Linux l Improved UI for adaptor for flsim in Fluent 5 ANSYS Electronics 2021 R1 Support for Enterprise Workflow l Ansys Minerva integration in Twin Builder l Ansys optiSLang integration in Twin Builder General l Numerous Useability and Performance Enhancements 6 ANSYS Electronics 2021 R1 Selected Defect Corrections Electronics Desktop l 269988 Root cause of the bug was the user using a model exported by SIwave many releases ago. SIwave model export has improved significantly and users will benefit from updating the suite of models they have exported from SIwave HFSS 3D Layout l 326179 Layer Stackup Wizard etching orientation support improvements HFSS l l l l l 285481 Active S-parameters are now reported correctly for 3D Component arrays with passive cells 292616 User now gets warning that only real part of the conductivity and permeability is used for a non-solve-inside object 302856 Project with SpaceClaim link now can be archived even if SpaceClaim installation is present 311009 Near field result is now correct when placing an analytical incident wave source inside solution region 314783 Fixed observed crashes for encrypted components with labels on Linux Icepak l l l l l 189896 HFSS Feedback in Icepak now provides accurate temperatures 224219 Fields Calculator now has an option to select both default and adjacent sides of a surface 278969 Time varying temperature boundary condition for a source BC now works correctly 297528 Primitive shape identification in Icepak for some inclined rectangles now works correctly 301201 Cell layers at the interface are now included for mesh import in AEDT Icepak Maxwell l l l l l l 280848 Auto HPC setting now allows any combinations of cores number and variations number 285823 DDM in magnetostatic solver is now able to support value boundary 298440 Fixed incorrect full model plots for 3D designs with odd symmetry boundary condition 298447 An excitation can now be defined on a conductor face touching other conducting bodies in 3D electrostatic solver 302856 Project with SpaceClaim link now can be archived even if SpaceClaim installation is present 307725 Maxwell 2D eddy current solver fixed an issue related to having more than 12 coils in a winding 7 ANSYS Electronics 2021 R1 l 314783 Fixed observed crashes for encrypted components with labels on Linux l 316897 Solved LS-DSO timing issue in Windows cluster Q3D Extractor l l l l 302856 Project with SpaceClaim link now can be archived even if SpaceClaim installation is present 314783 Fixed observed crashes for encrypted components with labels on Linux 333207 Q3D no longer incorrectly reporting that the interpolating sweep for CG didn't converge 337564 Frequency-dependent material definition of ferrite no longer failing design validation SIwave l 240506 SIwave AC SYZ solver can now handle 50k+ ports l 269878 Improved support for S-parameters with DC point option for PSI solver l 288617 PSI solver now produces correct inductances for ports defined on 2T and 3T capacitors l 289765 CPA solver extends support for inner DIE bondwires l 302089 IPC-2581 import robustness improvements l 304928 SIwave geometry connectivity extraction improvements l 323063 CPA solver can now successfully handle over 5,000 decaps l 326179 Layer Stackup Wizard etching orientation support improvements Twin Builder l l 295548 Twin Builder now extracts correct 2D Extractor RLGC State Space Length values 326303 Twin Builder no longer crashes when deleting certain Modelica component with connections 8 ANSYS Electronics 2021 R1 Known Issues and Limitations The following items describe specific issues known at the time of release. Workarounds for these items, if available, are included in the respective descriptions. Inclusion in this document does not imply the issues and limitations are applicable to future releases. Go to the ANSYS Customer Portal (https://support.ansys.com/portal/site/AnsysCustomerPortal) for information about service packs and any additional items not included in this document. General Electronics Desktop l 238762 Electronics Desktop cannot display ACT Extensions. HFSS l 359198 Modal impedances in terminal designs not displaying. Icepak l 348795 For metal fraction calculation when Icepak is run remotely via remote access software, GPU-based metal fraction calculation may not work correctly. Recommendation: Disable GPU-based metal fraction calculation in the Icepak preferences dialog box, or define an environment variable ICEPAK_USE_GRIDCUT_LEGACY and set its value to 1. Mechanical l 348795 Metal fraction calculation is not supported when Workbench is started via remote access software. SIwave l 332317 For metal fraction calculation when Icepak is run remotely via remote access software, GPU-based metal fraction calculation may not work correctly. Recommendation: Disable GPU-based metal fraction calculation method by defining the environment variable ICEPAK_USE_GRIDCUT_LEGACY and setting its value to 1. Twin Builder l l l 151406 Due to a known issue with the Nvidia graphics driver, simulation progress bar may hang while reports update live simulation data. Update to the latest version of Nvidia graphics drivers to fix this issue. 365560 Trans model CNodes have zero subnode size for Tool Coupling problems with state graph components. Workaround: Browse netlist or simulate once before creating Tool Coupling FMU for models having state graph components. Some dynamic ROM components with geometry, when exported to Twin Builder using the "split" option, are unable to automatically open the viewer session. Workaround: In Twin Builder, export the component in FMU format. Edit the modelDescription.xml file inside the FMU (zip files) and change RomType from "SVDdecompress" to "SVD". Save again and import the FMU back into Twin Builder as a component. 9
