F R A U N H O F E R R esear c h I nstitution for M i c ros y stems an d S o l i d S tate T e c hno l o g ies E M F T
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1 Qualification test with the
M-CDM ESD test system developed
at Fraunhofer EMFT
2 M-CDM test head including the
ground plane and cameras
Modular ESD-Tester for
the Charged Device Model
M-CDM
Future trends
Advantages
Upcoming mega trends to be considered
Modular system setup
for CDM testing are:
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Measurement of discharge currents
ber (e.g. Cascade PA 200 with 200 mm
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Extremely small size pads and balls
chuck), single shot GHz-oscilloscope
even for 3D-stacked circuits
and high voltage source are robust off-
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Solid State Technologies EMFT
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Hansastrasse 27 d
Increasing GHz-frequencies prohibiting
the-shelf components controlled via an
larger protection
Agilent VEE program that is customized
Increasing package sizes with imped-
High positioning accuracy (wafer prober)
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Complex pin layouts and test plans
Phone: +49 89 54 75 90
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Fully automated handling and assembly
E-Mail: contact@emft.fraunhofer.de
to the needs of the test lab
ance controlled interconnects
80686 München
Fax: +49 89 54 75 95 50
All key components such as wafer pro-
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Fraunhofer Research Institution
for Microsystems and
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Deployment of a standard wafer prober
provides a high positioning accuracy
systems
required for small size pads and balls
These trends require precise CDM test sys-
Individual adaption to customer needs
tems providing maximum testing flexibility.
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The program interfaces to descriptions
Building on 20 years of experience of
of device layouts and test plans in a
Project Manager:
Fraunhofer EMFT with CDM tester develop-
Microsoft Excel® spread sheet. The
Dr. Heinrich Wolf
ment, analytical CDM test and CDM pro-
program interface can be adapted to
heinrich.wolf@emft.fraunhofer.de
tection development for many industrial cli-
individual needs
ents, the modular M-CDM is flexibly tackling Large field charge plate
www.emft.fraunhofer.de
the demands and complexity of today’s and
tomorrow’s CDM test.
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Allows testing of larger devices (also
Charged Board Model)
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Arbitrary charging and discharging
System Description
Technical Data
sequences (timing, sequence)
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Allows testing of complex pin layouts
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M-CDM control unit which contains a commercial high voltage (HV) source
Max. CDM
User specific, automated data
FUG HCP 14-3500, a HV switch which
voltage
acquisition and evaluation of stress
enables and disables the HV during
parameters
operation, and relay switch matrix for
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controlling an optional, electrically
Supported
ANSI/ESD-
switchable attenuator
standards
STM5.3.1-2009;
Field Charge Plate FCP, which is
(adaptable):
JEDEC JESD22-
and test plans
All discharge currents are automatically measured and stored. The relevant
stress parameters are summarized in a
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prober and which connects to the HV
up for tests during maintenance
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C101F 2013
mounted on the chuck of the wafer
suitable output file
Fraunhofer EMFT lab serves as a back-
output of the control unit
Two ground planes (GP) which are
Size of the
CDM testing services for its customers,
compliant with the standards ANSI/ESD-
Field Charge Plate
a continuous test flow even during the
S5.3.1-2009 and JEDEC JESD22-C101D
Since Fraunhofer EMFT provides also
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Further advantages of the M-CDM system
are the flexible use of the wafer prober for
19 cm x 22 cm
2008
maintenance of your M-CDM system
is ensured
3.0 kV
Two USB cameras for convenient device
Precision of
+/- 2µm (wafer
outline definition and monitoring of the
positioning
prober PA200)
discharge pin during the test
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System controller (Win7 PC including
other test set-ups like TLP and vf-TLP or
17’’16:9 flat screen) with the M-CDM
pad probing for checking leakage criteria.
controller SW
Service
It can also be easily upgraded to a spark
free contact mode method such as Capa-
Support can be tailored to your require-
citive Coupled TLP (CC-TLP). Existing equip-
ments. From on-demand maintenance
ment can be integrated into the system.
to an “all inclusive” package with preventive maintenance including CDM
The adaption and integration into a CE-
testing services during the maintenance
compliant test system will be done within
of the tester.
an individual R&D project by Fraunhofer
EMFT.
3 Capacitive Coupled TLP probe
for BGA and Wafer Test level
4 M-CDM screenshot with discharge pulse (4GHz-Oscilloscope)