Analytical exercises, Circuits, Devices, Networks and MicroElectronics CDNuE FETs and FET circuits Physical constants: OX = .0345fF/m Version 3.19 11-4. Suppose that for each of the transistors of problem 11-1 its construct extends out on each side by 1.0 m so that it occupies a rectangular footprint of dimension W × (L + 2m). How large of a circuit (number of transistors) can be inscribed on the cross-section of a human hair of diameter 40m for each case? Do not include fractions of transistor footprint in your assessment. (see book example 11.5-2) 11-1. Determine intrinsic conduction coefficient K’ (in A/V2), conduction coefficient K, (in A/V2), and conduction coefficient , (in A/V2) for each of the following nMOS FETs. (a) tOX = 34.5nm, = 600 cm2/Vs, W/L = 10m/1.0m (b) tOX = 17.25 nm, = 400 cm2/Vs, W/L = 3.0m/0.6m (c) tOX = 6.9 nm, = 250 cm2/Vs, W/L = 1.5m/0.25m Hint: Area of ellipse = /4 × ab Answers: (a) 29 (c) 338 11-5. An nMOS Field-effect transistor has VTN = 0.6V , oxide thickness tOX = 12.5nm and intrinsic conduction coefficient K’ = 125A/V2. Determine: Note: Units conversion essential unless you know the quick trick. Answers: (a) 60A/V2, 300A/V2, 600A/V2 (b) 80A/V2, 200A/V2, 400A/V2 (a) Conduction coefficient KN if W/L = 2.0m/0.5m. (b) The level of current for the active mode if VGS = 2.2 V for (a) and the high-fields reduce current level by a factor of 5. (c) The minimum value of VDS (= VDSAT) for operation in the active mode for (b) (d) The value of V = VDS(min) (= VDSAT) if I = 160A for operation in the active mode. 11-2. For the T77X wafer test data located at MOSIS wafer tests for the ON semiconductor 0.50 micron (C5) process and a pMOS FET determine: (a) COX (b) Intrinsic conduction coefficient K’ for the process. (c) Conduction coefficient KP for a transistor that has W/L = 5m/1.0m. (d) Gate capacitance (Cgate) for the transistor of part (c). Answers: 250A/V2, 128A, 0.72V, 0.8 V 11-6. An nMOSFET has VTN = 0.5V , oxide thickness tOX = 12.5nm and intrinsic conduction coefficient 0COX = K’ = 125A/V2. Determine: 11-3. For the T68Z wafer test data located at MOSIS wafer tests for the TSMC 0.25 micron process and an nMOS transistor determine: (a) Capacitance/area in fF/m2 (b) mobility 0 in cm2/Vs (c) Width Wn necessary for KN = 300A/V2 for a 0.6m technology (i.e. Ln = 0.6m). (d) Gate capacitance for (c), in fF. (a) Conduction coefficient KN for a transistor that has W/L = 2m/0.5m. (b) Gate capacitance (Cgate) for the transistor of part (a). 1 Analytical exercises, Circuits, Devices, Networks and MicroElectronics 11-10. The pMOS transistor for the circuit of figure P5.6 has VTH = -0.8V and a 0COX = 40A/V2. It is fabricated under an L = 0.5 m technology. Find the value of R and W necessary to establish a drain current of 200 A and a voltage at VD = 7.2V. 11-7. An nMOSFET for which VTH = 0.8V and KN = 80A/V2 is in the active mode of operation. (a) If the drain current ID = 180A, what is VGS and what is the minimum VDS (= V) needed for the transistor to be in the active mode? (b) If the drain current ID = 720A, what is the VGS and what is the minimum VDS (= V) for the transistor to be in the active mode? Answers: 2.3V, 1.5V, 3.8V, 3.0V 11-8. In the saturation (active) mode the drain conductance gDS is a slope proportional to the current level. Therefore gDS = I, for which is a MOSFET parameter. The parameter also may be expressed as 1/VA, where VA is defined as the Early voltage (c.f. James Early, 1922-2004). For the output trace represented by figure pF-5 determine: Answers: 36k, 0.8m 11-11. The nMOS transistors for the circuit shown have VTH = 0.8V and 0COX = 40 A/V2. If they are fabricated under an L = 1.2m technology, find values of R and of gate widths W1 and W2 necessary to yield voltages and currents indicated. (a) gDS and rDS (= r0) (b) The value of VA for this technology 11-9. An nMOS transistor for which 0COX = 50A/V2 and VTH = 0.8V is used in a circuit for which VGS = VDS = 3.3V. If the transistor is fabricated under a 1.2m technology, what width W is required for a current of 500A? Assume current reduction factor 5 due to high fields. 2 Analytical exercises, Circuits, Devices, Networks and MicroElectronics 11-14. Determine the operating point for the nMOS 4-R bias frame (shown) for each of the following values of the conduction coefficient K. 11-12. Determine VG, ID, VS, VGS and VDS for the following bias network. (assume resistances in k unless indicated otherwise.) (a) (b) (c) (d) K = 1.0mA/V2 K = 5.0mA/V2 K = 20mA/V2 K = 100mA/V2 Answers: 2.0V, 0.134mA, 0.268V, 1.73V, 6.39V 11-13. Find (a) operating point {VGS, ID, VDS} and VS. (b) gm and gDS Answers: (a) {1.09V, 0.352mA, 5.07V} (b) {0.79V, 0.427mA, 4.02V} (c) {0.65V, 0.462mA, 3.53V} (d) {0.57V, 0.483mA, 3.24V} 11-15. What is the transconductance gm for each of the above cases of operating point? 11-16. If 0COX = 40 A/V2 is the intrinsic conduction coefficient K’ for each of the above transistors and they are realized under a 0.5um technology, what transistor width Wn is required for each case? 3 Analytical exercises, Circuits, Devices, Networks and MicroElectronics 11-17. Find (a) operating point (b) small-signal parameter gm (c) Rin,Rout,vL/vI (d) R3(MAX) 11-19. Find (a) operating point {VGS, ID, VDS} (b) gm and rDS (c) Rin , Rout, and vL/vI Answers: (a) {2.0V, 0.25mA, 7.0V}, (b) 0.5mA/V (c) 250k, 30k, -8.0 V/V (d) 52 k Answers: (a) {-2.0V, 0.5mA, -2.0V}, (b) 1.0mA/V, 200 k (c) 240 k, 11.32k, -9.52 V/V 11-20. Find (a) operating point {VGS, ID, VDS} (b) gm and rDS (c) Rin , Rout, and vL/vI . All resistances are in k unless otherwise indicated. 11-18. Find (a) operating point (b) small-signal parameter gm, r0, rout (c) Rin,Rout,vL/vI (d) R3(MAX). All resistances are in k unless otherwise indicated. Answers: (a) {-2.5V, 0.5mA, 1.5V}, (b) 2mA/V, 400 k (c) 300k, 9.52k, -7.5 V/V (d) 12 k 4 Analytical exercises, Circuits, Devices, Networks and MicroElectronics 11-23. Synthesize CMOS single-level realizations for each of the following logic functions. Show K-maps and (Boolean) algebraic form and synthesize with a minimum number of transistors. 11-21. Find (a) operating point (b) small-signal parameter gm , gD (c) Rin,Rout ,vL/vI . Resistances 5in k unless otherwise indicated. (a) F(A,B) = XNOR(A,B) (b) F(a,b,c,d) = ab ad bc (c) F(a,b,c,d) = m(0,1,4,5,6,10,11,12,14,15) (d) F(A,B,C,D) = m(2,3,7,8,9,13) (e) F(a,b,c,d) = m(0,2,3,4,6,8,10) (f) F(A,B,C) = Majority(A,B,C) (g) F(w,x,y,z) = m(0,1,2,6,8,10,14) 11-24. Assume a 2.5 volt technology (V+ = 2.5V) and determine VIT and IMAX for the following CMOS inverter transition characteristics as reduced by second-order effects Answers: (a) {-2.0V, 3.0mA, 6.0V}, (b) 10.9mA/V, 0.03 mA/V (c) 500k, 0.088k, 0.94 V/V (a) KN = KP = 20A/V2, VTN = -VTP = 0.7 (b) KN = 20A/V2, KP = 10A/V2, VTN = -VTP = 0.6V (c) KN = KP = 20A/V2, VTN =0.8V,VTP = -0.5V 11-22. Find (a) operating point (b) small-signal parameter gm , gD (c) Rin,Rout,vL/vI Answers: (a) 1.25V, 6.05uA (b) 1.14V, 5.8uA. 11-25. Determine the effect of V+ on CMOS dynamic power contributions PTRAN and PQ (in W) and dynamic currents ITRAN and IQ (in nA/MHz) for a CMOS technology for which VTN = -VTP = 0.6V and KN = KP = 25 A/V2 (as reduced by second-order effects) Assume average toggle frequency f = 400MHz, transition time t = 0.05ns and capacitance load CL = 5.0 fF. (a) V+ = 3.2V (b) V+ = 2.2V Answers: (a) 1.6W, 20.5W, 1.25nA/MHz, 16nA/MHz. 5 Analytical exercises, Circuits, Devices, Networks and MicroElectronics 11-27. Similar to the previous problem, assume that capacitance C1 is charged low and contains "bit" charge at 0.2V. It is used to toggle a CMOS inverter, (which will then execute other logic commands further down the line). 11-26. For most logic circuits, bit information is stored as charge and voltage on a capacitance as represented by figure C-7. Switch SW1 closure transfers charge to/from the input of the CMOS logic gate. Assume that the input capacitance Cin to the inverter, in this case, is 20 fF and is initially at VG = 2.7V, for which Vout = VOL = GND. After the switch SW1 closes, the charge on C1 and Cin will redistribute, a new voltage will appear at the gate, and Vout will rise. Assuming a 3V technology, (V+ = 3.0V) and thresholds, as indicated, determine: Assume Cbit = 36fF at Vbit = 3.0V and sum of gate capacitances = 9fF. Assume VG = 0.0V for which Vout = V+. After switch SW1 closes, the charge will redistribute, VG will increase and Vout will go to a lower value. (a) The value of VG due to charge redistribution that will result after the switch closes. (b) The initial pull-up current (due to pull-up transistor MP) at Vout when the voltage VG is suddenly applied to the gate and Vout is still lingering at GND. (c) The pull-up current Iup when Vout is increasing but is momentarily at Vout = 1.0V. This pull-up current = IP - IN. (d) The value of Vout at equilibrium (t = infinity) for which IN and IP balance out. Determine this level of current (for which I = IN = IP ). Assuming a (V+ = ) 3.6V technology determine: (a) The value of VG after SW1 closes. (b) The initial pull-down current (due to MN) at Vout when new VG is suddenly applied to the gate and Vout is still lingering at V+. (c) The pull-down current when Vout is decreasing but momentarily at 2.0V. This current is call I(pull-down) and IPD = IN - IP. (d) The value of Vout at equilibrium (for which IN = IP), and the value of this current. 6 Analytical exercises, Circuits, Devices, Networks and MicroElectronics 11-28 A 0.4m, 2.0V CMOS logic technology (i.e. gate length L = 0.4m and V+ = 2.0V) has tOX = 8.63nm. It is used in a logic gate for which the nMOS and pMOS transistors have WN = 1m and WP = 2m, respectively. The logic gates are toggled (on the average) at a frequency of 200MHz. Determine: (a) CL = (2/3) × sum of gate capacitances of the nMOS and pMOS transistors. (b) Dynamic power PQ (W) used by one gate. (c) If each gate takes up a footprint space of 6m × 4m, how many gates can be mounted on the cross-section of a human hair that is 40m in diameter? (d) If each hair uses (on average) 2 crosssections in which logic gates are inserted, then how much dynamic power is dissipated in each hair and how much current flows through each hair? (e) If each wig has 100,000 hairs, how much (dynamic) power is used by each wig? 7