NJL5501R
COBP PHOTO REFLECTOR with RED & IR LED
GENERAL DISCRIPTION
The NJL5501R is the compact surface mount type photo reflector, which is built in a RED LED, Infrared LED and a high
sensitive detector. This product is suit for the application for Bio monitor as pulse rate, SpO2.
FEATURES
• Peak wavelength : λP 660±3nm (RED) , 940±10nm (Infrared)
• High output current : 1000 to 4300µA typ (RED), 145 to 580µA typ (Infrared）
• Miniature, thin package: 1.9x2.6x0.8mm
APPLICATION
• Bio monitor as pulse rate, SpO2
ABSOLUTE MAXIMUM RATINGS (Ta=25°C)
PARAMETER
Emitter
Forward Current (Continuous)
Reverse Voltage (Continuous)
Power Dissipation *1
Detector
Collector-Emitter Voltage
Emitter-Collector Voltage
Collector Current
Collector Power Dissipation
SYMBOL
RATINGS
UNIT
IF RED
IF IR
VR RED
VR IR
PD
30
30
5
5
65
mA
mA
V
V
mW
VCEO
VECO
IC
PC
16
6
10
25
V
V
mA
mW
Ptot
Topr
Tstg
Tsol
85
-20 to +85
-30 to +85
260 peak
mW
°C
°C
°C
Coupled
Total Power Dissipation
Operating Temperature
Storage Temperature
Reflow Soldering Temperature
*1 Prohibits that "RED LED" and "IR LED" turn on at the same time.
ELECTRO-OPTICAL CHARACTERISTICS (Ta=25°C)
PARAMETER
Emitter
Forward Voltage
Reverse Current
Peak Wavelength *1
Detector
Dark Current
Collector-Emitter Voltage
Coupled
Output Current *2
Operating Dark Current *3
Response Time(Rise/Fall)
SYMBOL
TEST CONDITION
MIN
TYP
MAX
UNIT
VF RED
VF IR
IR RED
IR IR
λP RED
λP IR
IF=4mA
IF=4mA
VR=5V
VR=5V
IＦ=20mA
IＦ=20mA
1.7
1.0
―
―
657
930
―
―
―
―
660
940
2.1
1.35
5
5
663
950
V
V
µA
µA
nm
nm
ICEO
VCEO
VCE=10V
IC=100µA
―
16
―
―
0.2
―
µA
V
1000
145
―
―
―
―
―
―
―
20
4300
580
5
1
―
µA
µA
µA
µA
µs
IO RED
IO IR
IF=4mA,VCE=2V,d=0.7mm
IF=4mA,VCE=2V,d=0.7mm
ICEOD RED IF=4mA,VCE=2V
ICEOD IR IF=4mA,VCE=2V
Tr,Tf
IO=100µA, VCE=2V,d=0.7mm,RL=1kΩ
*1 This is represented as Emission wavelength range of LED. The emission wavelength verification test has not confirmed in
the manufacturing process.
*2 Please refer to “Output Current Test Condition”.
*3 ICEOD may increase according to the periphery situation of the surface mounted condition.
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NJL5501R
OUTLINE unit:mm
1.
2.
3.
4.
5.
6.
Cathode for RED LED
Collector
Anode for Infrared LED
Cathode for Infrared LED
Emitter
Anode for RED LED
Unspecified tolerance : ±0.1mm
Dimensions in parenthesis are shown for reference.
Example of solder pads dimensions
BLOCK DIAGRAM
(RED LED)
1
(IR LED)
6 2
5 3
1. Cathode for RED LED
6. Anode for RED LED
2. Collector
5. Emitter
3. Anode for Infrared LED
4. Cathode for Infrared LED
4
OUTPUT CURRENT TEST CONDITION
DARK CURRENT TEST CONDITION
The signal from LED is reflected at the aluminum surface.
(0.8mm)
Aluminum
Evapolation
Surface
1.5mm
Light Sealed Dark Box
IF
ICEOD
IF
VCE
IF
Io
IF
VCE
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NJL5501R
RESPONSE TIME TEST CONDITION
Al evaporation surface
INPUT
Vcc
50%
RD
INPUT
OUTPUT
90%
OUTPUT
10%
RL
td
ts
tr
tf
EDGE RESPONSE TEST CONDITION
Direction X1
Direction X2
l=0mm
l=0mm
0.7mm
0.7mm
Aluminum
Aluminum
Evaporation
Evaporation
Surface
Surface
Direction Y1
Direction Y2
l=0mm
l=0mm
0.7mm
0.7mm
Aluminum
Aluminum
Evaporation
Evaporation
Surface
Surface
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NJL5501R
Forward Current vs. Temperature
RED LED & IR LED
100
50
90
45
80
40
Forward Current IF(mA)
Power Dissipation P(mW)
Power Dissipation vs. Temperature
70
Total Power
Dissipation
60
50
40
30
20
35
IR LED / RED LED
30
25
20
15
10
Collector Power
Dissipation
10
5
0
0
0
20
40
60
80
100
0
20
Ambient Temperature Ta(°C)
40
60
80
100
Ambient Temperature Ta(°C)
TYPICAL CHARACTERISTICS
Forward Voltage vs. Forward Current
RED LED & IR LED
Forward Voltage vs. Temperature
RED LED & IR LED
2.6
1000
2.4
RED LED,IF=30mA
Forward Voltage VF(V)
Forward Current IF(mA)
2.2
100
IR LED
RED LED
10
Pulse Operation
IF=30 to 300mA
Pulse w idth:10µs
Duty:0.01
DC Operation
IF=1 to 30mA
2
1.8
RED LED,IF=4mA
1.6
1.4
IR LED,IF=30mA
1.2
1
IR LED,IF=4m A
0.8
1
0
1
2
3
-40
4
-20
Forward Voltage VF(V)
0
20
40
60
80
100
Ambient Temperature Ta(°C)
Dark Current vs. Temperature
Operating Dark Current vs. Temperature
RED LED & IR LED
10000
10
Operating Dark Current Iceod(µA)
1000
Dark Current Iceo(nA)
100
10
1
0.1
VCE=10V
0.01
1
RED LED
IF=4mA,VCE=2V
0.1
IR LED
IF=4mA,VCE=2V
0.001
0.01
0.0001
-40
-20
0
20
40
60
80
Ambient Temperature Ta(°C)
21.Nov.2013
100
-40
-20
0
20
40
60
80
100
Ambient Temperature Ta(°C)
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NJL5501R
Output Current vs. Forward Current
RED LED (Ta=25°C)
Output Current vs. Forward Current
IR LED (Ta=25°C)
6000
800
5000
Output Current Io(µA)
Output Current Io(µA)
600
4000
3000
2000
400
200
VCE=2V, d=0.7mm
VCE=2V, d=0.7mm
1000
0
0
0
2
4
6
8
10
0
2
4
8
10
Forward Current IF(mA)
Forward Current IF(mA)
Output Current vs. Temperature
RED LED
Output Current vs. Temperature
IR LED
120
120
100
100
Relative Output Current Io/Io(25°C)(%)
Relative Output Current Io/Io(25°C)(%)
6
80
60
40
20
80
60
40
20
0
0
-40
-20
0
20
40
60
80
-40
100
-20
0
20
40
60
80
100
Ambient Temperature Ta(°C)
Ambient Temperature Ta(°C)
Output Characteristics (Ta=25°C)
RED LED
Output Characteristics (Ta=25°C)
IR LED
10
1000
9
900
8
800
IF=10mA
IF=10mA
700
6
Output Current Io(µA)
Output Current Io(mA)
7
IF=8mA
5
IF=6mA
4
IF=4mA
3
IF=8mA
500
IF=6mA
400
300
IF=4mA
200
2
IF=2mA
IF=2mA
100
1
0
0
0
1
2
3
4
Collector-Emitter Voltage Vce(V)
21.Nov.2013
600
5
0
1
2
3
4
5
Collector-Emitter Voltage Vce(V)
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NJL5501R
Vce Saturation (Ta=25°C)
IR LED
5
0.5
4
0.4
3
2
Io=4mA
1
Io=3mA
Collector-Emitter Voltage Vce(V)
Collector-Emitter Voltage Vce(V)
Vce Saturation (Ta=25°C)
RED LED
Io=500µA
Io=400µA
0.3
Io=300µA
Io=200µA
0.2
Io=100µA
0.1
Io=2mA
Io=1mA
0
0
0.1
1
10
0.1
1
Forward Current IF(mA)
Forward Current IF(mA)
Output Current vs. Edge Distance
RED LED(Ta=25°C)
Output Current vs. Edge Distance
IR LED(Ta=25°C)
120
120
IF=4mA,VCE=2V, d=0.7mm
IF=4mA,VCE=2V, d=0.7mm
100
Relative Output Current Io/Io(max.)(%)
Relative Output Current Io/Io(max.)(%)
10
Direction X2
80
60
40
20
100
Direction X1
80
60
40
20
Direction X2
Direction X1
0
0
0
0.5
1
1.5
2
2.5
0
Edge Distance l(mm)
0.5
1
2.5
Output Current vs. Edge Distance
IR LED(Ta=25°C)
120
120
IF=4mA,VCE=2V, d=0.7mm
IF=4mA,VCE=2V, d=0.7mm
100
Relative Output Current Io/Io(max.)(%)
Relative Output Current Io/Io(max.)(%)
2
Edge Distance l(mm)
Output Current vs. Edge Distance
RED LED(Ta=25°C)
Direction Y2
80
Direction Y1
60
40
20
0
100
Direction Y2
80
Direction Y1
60
40
20
0
0
0.5
1
1.5
Edge Distance l(mm)
21.Nov.2013
1.5
2
2.5
0
0.5
1
1.5
2
2.5
Edge Distance l(mm)
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NJL5501R
Output Current vs. Distance
IR LED(Ta=25°C)
120
120
100
100
Relative Output Current Io/Io(max.)(%)
Relative Output Current Io/Io(max.)(%)
Output Current vs. Distance
RED LED(Ta=25°C)
IF=4mA, VCE=2V
80
60
40
20
IF=4mA, VCE=2V
80
60
40
20
0
0
0
1
2
3
4
5
0
1
2
Reflector Distance d(mm)
-20°
-10°
0°
0°
10°
-20°
-30°
30°
40°
-50°
20°
30°
-40°
40°
-50°
50°
-60°
70°
-
50°
-60°
60°
-70°
80°
60°
-70°
70°
-80°
80°
20%
40%
30%
60%
100
IF=4mA
Relative Response (%)
IF=4mA
Relative Response (%)
PTx
120
100
80
60
40
20
80
60
40
20
600
650
Wavelength λ(nm)
21.Nov.2013
RED LED
IR LED
Spectral Response (Ta=25°C)
Emitter IR LED
120
0
550
50%
80%
Spectral Response (Ta=25°C)
Emitter RED LED
70%
PTx
90°
90%
20%
30%
40%
60%
50%
80%
70%
90%
RED LED
IR LED
100%
90° -90°
-90°
100%
-10°
NJL5501R Directivity
Direction Y
20°
-40°
5
Directivity at Package direction Y
10°
-30°
4
Reflector Distance d(mm)
Directivity at Package direction X
NJL5501R Directivity
Direction X
3
700
750
0
800
900
1000
1100
Wavelength λ(nm)
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NJL5501R
Switching Time vs. Load Resistance
(Ta=25°C)
1000
Switching Time t(µs)
tf
100
tr
td
10
ts
1
0.1
1
10
Load Resistance RL(k Ω )
Remark: Please be aware that all data in the graph are only reference and are not any guarantee.
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NJL5501R
■ MOUNTING METHOD
NOTE
Mounting was evaluated with the following profiles in our company, so there was no problem.
However, confirm mounting by the condition of your company beforehand.
Mounting:
Twice soldering is allowed.
■ INFRARED REFLOW SOLDERING METHOD
Recommended reflow soldering procedure
f
260°C
e
230°C
220°C
d
180°C
150°C
a : Temperature ramping rate
b : Pre-heating temperature
time
c : Temperature ramping rate
d : 220°C or higher time
e : 230°C or higher time
f : Peak temperature
: 1 to 4°C/s
: 150 to 180°C
: 60 to 120s
: 1 to 4°C /s
: Shorter than 60s
: Shorter than 40s
g : Temperature ramping rate
: 1 to 6°C /s
: Lower than 260°C
The temperature of the surface of mold package
Room
Temp.
a
b
c
g
(NOTE1) Using reflow furnace with short wave infrared radiation heater such as halogen lamp
Regarding temperature profile, please refer to those fo reflow furnace.
In this case the resin surface temperature may become higher than lead terminals due to endothermic ally of black
colored mold resin. Therefore, please avoid from direct exposure to mold resin.
(NOTE2) Other method
Such other methods of soldering as dipping the device into melted solder and vapor phase method (VPS) are not
appropriate because the body of device will be heated rapidly. Therefore, these are not recommended to apply.
(NOTE3) The resin gets softened right after soldering, so, the following care has to be taken
Not to contact the lens surface to anything.
Not to dip the device into water or any solvents.
■ FLOW SOLDERING METHOD
Flow soldering is not possible.
■ IRON SOLDERING METHOD
Iron soldering is not possible.
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NJL5501R
■ CLEANING
Avid washing the device after soldering by reflow method.
■ IC STORAGE CONDITIONS AND ITS DURATION
(1) Temperature and humidity ranges
Pack Sealing
Temperature:
Humidity:
Pack Opening
Temperature:
Humidity:
5 to 40 [°C]
40 to 80 [%]
5 to 30 [°C]
40 to 70 [%]
After opening the bag, solder products within 48h.
Avoid a dry environment below 40% because the products are is easily damageable by the electrical discharge.
Store the products in the place where it does not create dew with the products due to a sudden change in temperature.
(2) When baking, place the reel vertically to avoid load to the side.
(3) Do not store the devices in corrosive-gas atmosphere.
(4) Do not store the devices in a dusty place.
(5) Do not expose the devices to direct rays of the sun.
(6) Do not allow external forces or loads to be applied to IC’s.
(7) BE careful because affixed label on the reel might be peeled off when baking.
■ BAKING
In case of keeping expect above condition be sure to apply baking. (Heat-resistant tape)
Baking method:
Ta=60°C, 48 to 72h, Three times baking is allowed
■ STORAGE DURATION
Within a year after delivering this device.
For the products stored longer than a year, confirm their terminals and solderability before they are used.
■ APPLICATION NOTES
(1) Attention in handling
Treat not to touch the light receiving and light emitting part.
Avoid to adhering the dust and any other foreign materials on the light receiving and light emitting part when using.
Never apply reverse voltage (VEC) of over 6V to the photo transistor when measuring the characteristics or adjusting
the system. If applied, it causes to lower the sensitivity.
When LED has operated by voltage, it should be connected the resistor of current adjustment. Avoid to applying direct
voltage to LED, because there is possibility that LED is destroyed.
When mounting, special care has to be taken on the mounting position and tilting of the device because it is very
important to place the device to the optimum position to the object.
(2) Attention in designing
Avoid the entering ambient light into light receiving part for avoid the malfunction by ambient light. Furthermore, there is
possibility of malfunction when there are the other mounted parts by near this product peripheral.
There will be changing characteristics by detection object. Refer to this datasheet and evaluate by actual detection
object.
When LED has been applied continuous power on long period of time, the output current is dropped. If it uses by always
applying power to LED, have to consider the circuit designing of including output current decrease.
21.Nov.2013
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NJL5501R
■ PACKING SPECIFICATION
PACKING DIMENTIONS
UNIT : mm
Drawing direction
P2
Insert direction
D0
P0
T0
W0
B
(TE1)
W1
F
E
1PIN
P1
A
SYMBOL
DIMENSION
REMARKS
A
B
D0
2.15 ±0.10
2.85 ±0.10
+0.1
1.50 - 0
BOTTOM DIMENSION
D1
E
F
P0
P1
P2
T0
T1
W0
W1
1.00
1.75
3.50
4.00
4.00
2.00
0.25
1.05
8.00
5.40
BOTTOM DIMENSION
+0.2
-0
±0.10
±0.05
±0.10
±0.10
±0.05
±0.10
±0.10
±0.10
±0.10
THICKNESS 0.1MAX
T1
D1
* Carrier tape material : Polycarbonate(antistatic)
Cover tape material : Polyester(antistatic)
■ Taping Strength
Pull up the cover tape from the carrier tape, and when the opening angle comes around 10 to 15 , and the peeling-off
strength is to be within the power of 20 to 70g.
■ Packaging
1) The taped products are to be rolled up on the taping reel as on the drawing.
2) Rolling up specification
2-1) Start rolling : Carrier tape open space more than 20 Pieces.
2-2) End of rolling : Carrier tape open space more than 20 Pieces, and 2 round of reel space at the cover tape only.
3) Taping quantity
: 2,000 Pieces
4) Seal off after putting each reels in a damp proof bag with silica gel.
E
D
C
SYMBOL
A
B
A
B
C
D
E
DIMENSION
φ180 ±1.0
φ60 ±1.0
φ13 ±0.2
φ21 ±0.8
2.0 ±0.5
W0
9.5 ±1.0
W1
13.1 ±1.0
W0
W1
*Material : PPE(antistatic)
[CAUTION]
The specifications on this databook are only
given for information , without any guarantee
as regards either mistakes or omissions. The
application circuits in this databook are
described only to show representative usages
of the product and not intended for the
guarantee or permission of any right including
the industrial rights.
21.Nov.2013
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