Box Information
■
Tray MBB Small BOX Large BOX
■
Reel MBB Small BOX Large BOX

Box Information
■
Item
Small Box
Large Box
H
115
255
L
380
405
W
190
400
Unit : mm
Remark
■
Item
Small Box
Large Box
H
70
370
L
365
400
W
345
380
Unit : mm
Remark
L
H
W

Bar Code Label
- Inner Box - Outer Box

Bar Code Label
120 mm
⑧
12/01/01 12:40
⑨ 91706955 ⑩ P
①
DVC :
DV1CHIP
⑪
② LOT:
K1234 ③ 500 ④ 0423 ⑤ AY
⑥ ⑦
⑫ ASSEMBLED IN KOREA FROM DIE OF KOREA
① Device: SAMSUNG sales code (18)
② Lot: Assembly lot number (10)
③ Quantity: Inner box quantity (5)
④ Work Week: Week of device marking (YYWW) (4)
- If the W/W is mixed, the W/W of the larger quantity will be marked on the label.
⑤ Serial Number (2)
- A Inner Box Serial Number
- B Subcontractor Site Code
* Denotes Bar Code Readable (#)
Denotes # characters allowed
⑥ Option (4)
⑦ Part No (18)
⑧ Year/Month/Day/Time when label was printed (13)
⑨ ID number of packing employee (8)
⑩ Notation for partial box (1)
⑪ Eco logo
- RoHS Compliant or Hallogen Free logo
⑫ ASSEMBLED IN KOREA FROM DIE OF KOREA.

Bar Code Label
120 mm
①
③
⑦
DVC :
KA7812-AE
LOT :
FX1235KG ④ ⑤
⑫ 11/03/04
13:30
② Y
⑥ 05
⑨ ⑬ 2D Barcode
* Denotes Bar Code Readable (#)
Denotes # characters allowed
① Device: SAMSUNG sales code (18)
② Shipping site code (1)
③ Lot: Assembly lot number (10)
④ Serial number (2)
- A Inner box serial No
- B Subcontractor site code
⑤ Option (4)
⑥ Serial Number: Inner box serial no (2)
⑦ Quantity: Outer box quantity (6)
⑧ Customer Code
⑨ Outer Box Number (10)
- Site+Year/Month/Day+Outer box serial no
⑩ ID number of packing employee (8)
⑪ Work Week: Based on inner box W/W (YYWW) (5)
If the W/W is mixed, the W/W of the larger quantity will be marked on the label followed by the character “M”.
⑫ Year/Month/Day/Time when outer label was printed (13)
⑬ 2D Barcode

Tray Drawing for Reference
SEC Tray Drawing Concept

Tray Drawing for Reference
SEC Tray Drawing Concept

Thermal Resistance Information
1. In general, the thermal performance of an electronic package is represented by two kinds of thermal resistance, θ ja
and θ jc
.
2. The heat dissipation path in a package and the equivalent thermal resistance network are described by the following figures,
respectively.
3.
Junction-to-ambient thermal resistance, θ ja
is defined by:
θ ja
=
T j
- T
P d a
j
℃
a
T c
T j
T a
[ Heat Dissipation Path in TSOP ]
T b
T a
[θ ca
] rad
[θ ca
] conv
T c
θ jc
T j
θ jb
T b
θ ba
T a
[ Thermal Resistance Network ]

Thermal Resistance Information
1. JEDEC has developed industry-standard specifications for thermal testing to minimize the influence of environmental factor on the calculation of θ ja
.
2. Test Environments
1) Junction-to-Ambient Thermal Resistance, θ ja
- Natural Convection (using test chamber): JEDEC Standard JESD51-2
- Forced Convection (using wind tunnel): JEDEC Standard JESD51-6
2) Junction-to-Case Thermal Resistance, θ jc
- Cold Plate Method (using water cooling): SEMI G30-88
3. Device Calibration
1) Temperature Sensitive Parameter (TSP)
△ Tj = △ TSP x K
Where, △ TSP: Change in the TSP caused by the application of Pd
K: Constant defining the relationship between the junction
temperature change and TSP change ( ℃ /TSP)
4. Test Boards
1) Low/High Effective Thermal Conductivity Test Board: JESD51-3/7
Area Array Thermal Test Board: JESD51-9