Flexible Printed Circuit Assembly Capabilities

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Total Solutions for FPC’s, PCB’s and Custom Engineered Components and Assemblies
Flexible Printed Circuit Assembly Capabilities
Surface Mount Technology
Solder Stencil Printing:
Printing Stainless Steel or Ni. Chemical Etched, Electro Formed or Lasered.
Polished.
Component Placement:
Placement Capability to place >50,000/h. with Placement Accuracy +/- 35µm
(0.0015”). Vision recognition.
Reflow
Reflow: 8 Zone Convection Ovens with Independent Temperature Zone Control and
Upper and Lower Heater Adjustment.
Automatic Optical Inspection (AOI
(AOI)
OI): In-line and Initial Process Verification and Process
Control
X-ray:
ray Used to Establish Process Controls.
Chip
Chip Component
Component:
omponent: Down to 0.4 X 0.2mm (01005). Up to 32mm X 32mm
Ball Grid Array (BGA):
(BGA): Down to 0.4mm Pitch.
Solder:
Solder: Lead Free High Temp RoHS Compliant. Aqueous Based and No Clean Solder
Available.
Glue Dots
Dots: As Required by the Application.
Other Soldering
Soldering Techniques
Hot Bar:
Bar: Semi-Automatic
Through Hole:
Hole: Manual Insertion with Hand Solder or Reflow.
NonNon-solder Interconnection
Press Fit:
Fit: Manual Jig
Flip Chip:
Chip: Available
Wire Bonding:
Bonding Die Placement and Gold Ball Bonding & Aluminum Wedge Wire Bonding
Anisotropic Conductive Film/Adhesive (ACF/ACA):
(ACF/ACA) 0.4mm Pitch and Smaller
Domes:
Domes Individual and Dome Array
Couldn't find the capabilities you were looking for? No need to worry, PICA has the resources to help you meet
your electronic interconnect needs. Just call + 1 (603) 347 8707 or email at [email protected]
PICA Manufacturing Solutions
www.picasales.com
August 2013
Conformal Coating,
Coating, Adhesives and Encapsulant
Encapsulant Materials
Material
Material:: Per Customer Requirements
Application Processes:
Processes Manual and Automated Dispensing
Curing:
Curing: Conveyorized, Oven Batch and UV
Back
Backck-End Operations
Shear Cut:
Cut: Kiss Cut Using Etch Die and Blanking Die
Pre Bending – Folding:
Folding: With Fixture (R>1mm)
UnderUnder-fill
Material
Material:: Per Drawing Requirements, as Application Dictates
Dispensing:
Dispensing: Manual and Automated Equipment
InIn-Circuit Test (ICT)
(ICT) / Functional Test / Custom Testing
Testing
Per Customer’s Requirements.
Couldn't find the capabilities you were looking for? No need to worry, PICA has the resources to help you meet
your electronic interconnect needs. Just call + 1 (603) 347 8707 or email at [email protected]
PICA Manufacturing Solutions
www.picasales.com
August 2013
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