QFN / DFN
i2a Technologies quad Flat No - Lead (QFN) and Dual Flat No-Lead (DFN) are lead-frame
based, plastic encapsulated, chip scale molded array format saw singulated packages.
These can be processed (mounted) by conventional SMT equipment, benefiting surface
mount operations downstream.
An exposed die pad coupled with extremely low RLC provides excellent electrical and
thermal performance enhancements which are ideal for high frequency and high power
applications, and are especially suited for wireless and handheld portable applications
such as cell phones and PDA's.
QFN / DFN packages are currently available in various body sizes and thicknesses,
offered in standard and green lead-free formats.
Features:
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Body sizes: 2.0 x 2.0 to 12 x 12mm
Lead pitch: 0.40, 0.50, 0.65 and 0.80mm
o Custom lead frame and pitch designs service
o Several package profile heights per JEDEC
Option for split die pad
Gold wire (0.8/0.9mil std; 4N, 2N) bond, or Flip Chip
Multi-die, stacked die versions available
QFN-leads on four sides, DFN-leads on two sides
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Green and lead free materials (PPF frame)
Excellent thermal and electrical performance
Wide range of open tool lead frame and die pad sizes available
Lead frame C 194 or Eftec 64T (8mils; 203micron thick); NiPdAu plated
Shipping method: Canister- std, tray, tape and reel are optional
Application:
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Power Management
Discretes
MEMS
Logic
Devices requiring enhanced electrical and thermal performance and reduced
package size, thickness and weight
Package Configurations
Package Size (mm)
1.0 x 1.3
2.0 x 2.0
2.0 x 3.0
3.0 x 3.0
4.0 x 4.0
5.0 x 5.0
6.0 x 5.0
6.0 x 6.0
7.0 x 7.0
8.0 x 8.0
9.0 x 9.0
10.0 x 10.0
11.0 x 11.0
12.0 x 12.0
Package Size (mm)
1.0 x 1.3
2.0 x 2.0
2.0 x 3.0
3.0 x 3.0
4.0 x 4.0
5.0 x 5.0
6.0 x 5.0
6.0 x 6.0
7.0 x 7.0
8.0 x 8.0
9.0 x 9.0
10.0 x 10.0
11.0 x 11.0
12.0 x 12.0
Package Size (mm)
1.0 x 1.3
2.0 x 2.0
2.0 x 3.0
3.0 x 3.0
4.0 x 4.0
5.0 x 5.0
6.0 x 5.0
6.0 x 6.0
7.0 x 7.0
8.0 x 8.0
9.0 x 9.0
10.0 x 10.0
11.0 x 11.0
12.0 x 12.0
Moisture Sensitivity:
IPC/JEDEC J - STD - 020A / J- STD-033
Level 1 (Reflow 240°C, 85°C/85% RH, 168 hrs
Level 2A (Reflow 240°C, 30°C/60% RH, 696 hrs)
Level 3 (Reflow 260°C, 30°C/60% RH, 192 hrs)
High Temp Storage, 150°C, 1000 hrs
Temp Cycle, -65°C to 150°C, 1000 hrs
Thermal Shock, -56°C to 150°C, 500 cycles
Autoclave, 121°C, 2atm, 168hrs
Temp/Humidity, 85°C/85% RH, 1000 hrs
Passed
Passed
Passed
Passed
Passed
Passed
Passed
Passed
Board Level Reliability:
IPC/JEDEC J - STD - 020A / J- STD-033
Temp Cycle, -40°C to 100°C, 1200 hrs
Package
DFN
DFN
QFN
QFN
QFN
QFN
Passed
Thermal Simulation/Modeling Test Results
Thermal Resistance
Junction to Air (°C/Watt)
Air Flow (Meters/Sec)
Size
Leads
Pad Size
Still
1
2
(mm)
3x3
6
0.8 x 2.35
178
174
173
3x3
6
1.25 x 2.35
175
171
171
4x4
16
2.25 x 2.25
93
87
86
4x4
24
2.30 x 2.30
89
83
82
5x5
32
3.55 x 3.55
64
58
57
7x7
46
5.55 x 5.55
41
36
36
i2a Technologies makes no guarantee or warranty of its accuracy, or that the use of such information will not infringe upon the
IP rights of third parties. i2a shall not be responsible for any loss or damage of whatever nature, resulting from the use of or
reliance upon this information and no patent or other license is implied. This document does not in any way extend or modify i2a
warranty on any product beyond that set forth in its standard terms and conditions of sale. i2a reserves the right to make
changes in its product and specifications at any time and without notice.