<Hiigh Voltag ge Insulate ed Gate Biipolar Tran nsistor:HV VIGBT > CM100 00HG-130X XA HIGH POWER SWITHCHIN S G USE INSU ULATED TY YPE 5th-Version n HVIGBT (H High Voltage Insulated Ga ate Bipolar Transistor) T Modules CM M1000HG-1 130XA IC ························································· VCES C ··················································· 1--element in pack High Insulate ed type CS STBTTM(III) / RFC Diod de AllSiC baseplate 100 00 A 650 00 V APPLICATIO ON Traction drive es, High Re eliability Co onverters / Inverters, DC chopp pers OU UTLINE DRAW WING & CIRCUIT DIAGRAM M Dimension ns in mm Publication Date : No ovember 2015 (HVM-1072-B) 1 < High Voltage Insulated Gate Bipolar Transistor:HVIGBT > CM1000HG-130XA HIGH POWER SWITHCHING USE INSULATED TYPE 5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules MAXIMUM RATINGS Symbol Item VCES Collector-emitter voltage VGES IC ICRM IE IERM Ptot Viso Ve Tj Tjop Tstg Gate-emitter voltage Collector current Emitter current (Note 2) Maximum power dissipation (Note 3) Isolation voltage Partial discharge extinction voltage Junction temperature Operating junction temperature Storage temperature Conditions VGE = 0 V, Tj = +150 °C VGE = 0 V, Tj =25 °C VCE = 0 V, Tj = −50 °C VCE = 0 V, Tj = 25 °C DC, TC = 100 °C (Note 1) Pulse DC, TC = 85 °C (Note 1) Pulse Tc = 25 °C, IGBT part RMS, sinusoidal, f = 60 Hz, t = 1 min. RMS, sinusoidal, f = 60 Hz, QPD ≤ 10 pC Ratings 6500 6300 5700 ± 20 1000 2000 1000 2000 11300 10200 5100 −50 ~ +150 −50 ~ +150 −55 ~ +150 Unit V V A A A A W V V °C °C °C ELECTRICAL CHARACTERISTICS Symbol Item Tj = 25 °C Tj = 125 °C Tj = 150 °C Tj = 25 °C Tj = 125 °C Tj = 150 °C Tj = 25 °C Tj = 125 °C Tj = 150 °C Tj = 25 °C Tj = 125 °C Tj = 150 °C Tj = 25 °C Tj = 125 °C Tj = 150 °C Tj = 25 °C Tj = 125 °C Tj = 150 °C Tj = 25 °C Tj = 125 °C Tj = 150 °C Tj = 25 °C Tj = 125 °C Tj = 150 °C Tj = 25 °C Min — — — 5.70 -0.5 — — — — — — — — — — — — — — — — — — — — — — — — — — — — — Limits Typ — 5.0 30.0 6.50 — 216 7.2 0.81 16.5 2.60 3.40 3.60 — 1.70 1.70 — 0.30 0.30 — 7.00 7.50 — 7.40 7.90 — 10.0 10.0 — 0.6 0.7 — 6.40 6.80 — Max 5.0 — — 7.30 0.5 — — — — — 4.30 — — — 2.60 — — 0.60 — — — — — — — — 15.0 — — 1.4 — — — — Tj = 125 °C — 6.80 — Tj = 150 °C — 7.30 — Conditions Tj = 25 °C Tj = 125 °C Tj = 150 °C ICES Collector cutoff current VCE = VCES, VGE = 0 V VGE(th) IGES Cies Coes Cres QG Gate-emitter threshold voltage Gate leakage current Input capacitance Output capacitance Reverse transfer capacitance Total gate charge VCE = 10 V, IC =100 mA, Tj = 25 °C VGE = VGES, VCE = 0V, Tj = 25 °C VCEsat Collector-emitter saturation voltage td(on) Turn-on delay time tr Turn-on rise time Eon(10%) Turn-on switching energy (Note 5) Eon Turn-on switching energy (Note 6) td(off) Turn-off delay time tf Turn-off fall time Eoff(10%) Turn-off switching energy (Note 5) Eoff Turn-off switching energy (Note 6) VCE = 10 V, VGE = 0 V, f = 100 kHz Tj = 25 °C VCC = 3600 V, IC = 1000 A, VGE = ±15 V IC =1000 A VGE = 15 V (Note 4) VCC = 3600 V IC = 1000 A VGE = ±15 V RG(on) = 1.8 Ω Ls = 150 nH Inductive load VCC = 3600 V IC = 1000 A VGE = ±15 V RG(off) = 30 Ω Ls = 150 nH Inductive load Publication Date : November 2015 2 Unit mA V µA nF nF nF µC V µs µs J J µs µs J J < High Voltage Insulated Gate Bipolar Transistor:HVIGBT > CM1000HG-130XA HIGH POWER SWITHCHING USE INSULATED TYPE 5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules ELECTRICAL CHARACTERISTICS (continuation) Symbol (Note 2) Tj = 25 °C Tj = 125 °C Tj = 150 °C Tj = 25 °C Tj = 125 °C Tj = 150 °C Tj = 25 °C Tj = 125 °C Tj = 150 °C Tj = 25 °C Tj = 125 °C Tj = 150 °C Tj = 25 °C Tj = 125 °C Tj = 150 °C Tj = 25 °C Min — — — — — — — — — — — — — — — — Limits Typ 2.70 3.00 3.05 — 2.10 2.20 — 900 940 — 1810 2070 — 4.00 4.60 — Max — 3.70 — — — — — — — — — — — — — — (Note 6) Tj = 125 °C — 4.10 — Tj = 150 °C — 4.70 — Junction to Case, IGBT part Junction to Case, FWDi part Case to heat sink, grease = 1W/m·k, D(c-s) = 100m Min — — — Limits Typ — — 6.0 Max 11.0 17.0 — Min 7.0 3.0 1.0 — 600 26.0 56.0 — — — Limits Typ — — — 1.4 — — — 15.0 0.18 2.6 Max 22.0 6.0 3.0 — — — — — — — Item Conditions (Note 2) VEC Emitter-collector voltage trr Reverse recovery time Irr Reverse recovery current (Note 2) Qrr Reverse recovery charge (Note 2) Reverse recovery energy (Note 2) Erec(10%) Erec IE = 1000 A VGE = 0 V (Note 4) (Note 2) VCC = 3600 V IC = 1000 A VGE = ±15 V RG(on) = 1.8 Ω Ls = 150 nH Inductive load (Note 5) Reverse recovery energy Unit V µs A µC J J THERMAL CHARACTERISTICS Symbol Rth(j-c)Q Rth(j-c)D Rth(c-s) Item Thermal resistance Contact thermal resistance Conditions Unit K/kW K/kW K/kW MECHANICAL CHARACTERISTICS Symbol Mt Ms Mt m CTI da ds LP CE RCC’+EE’ rg Item Mounting torque Mass Comparative tracking index Clearance Creepage distance Parasitic stray inductance Internal lead resistance Internal gate resistance Conditions M8 : Main terminals screw M6 : Mounting screw M4 : Auxiliary terminals screw TC = 25 °C TC = 25 °C Note1. Pulse width and repetition rate should be such that junction temperature (Tj) does not exceed Tjopmax rating. 2. The symbols represent characteristics of the anti-parallel, emitter to collector free-wheel diode (FWDi). 3. Junction temperature (Tj) should not exceed Tjmax rating (150°C). 4. Pulse width and repetition rate should be such as to cause negligible temperature rise. 5. Eon(10%) / Eoff(10%) / Erec(10%) are the integral of 0.1VCE x 0.1IC x dt. 6. Definition of all items is according to IEC 60747, unless otherwise specified. Publication Date : November 2015 3 Unit N·m N·m N·m kg — mm mm nH mΩ Ω < High Voltage Insulated Gate Bipolar Transistor:HVIGBT > CM1000HG-130XA HIGH POWER SWITHCHING USE INSULATED TYPE 5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules PERFORMANCE CURVES TRANSFER CHARACTERISTICS (TYPICAL) OUTPUT CHARACTERISTICS (TYPICAL) 2000 2000 VCE = VGE Tj = 150 ºC VGE = 19 V 1500 VGE = 15 V Collector Current [A] Collector Current [A] 1500 VGE = 11 V VGE = 13 V 1000 500 VGE = 9 V 500 1000 Tj =150 ºC Tj = 25 ºC 0 0 0 1 2 3 4 5 0 6 2 4 6 8 10 12 14 16 Gate - Emitter Voltage [V] Collector - Emitter Voltage [V] FREE-WHEEL DIODE FORWARD CHARACTERISTICS (TYPICAL) COLLECTOR-EMITTER SATURATION VOLTAGE CHARACTERISTICS (TYPICAL) 2000 2000 VGE = 15V Tj = 25°C Tj = 25°C 1500 Tj = 125°C Tj = 125 °C Emitter Current [A] Collector Current [A] 1500 Tj = 150°C 1000 Tj = 150°C 1000 500 500 0 0 0 1 2 3 4 5 6 0 Collector-Emitter Saturation Voltage [V] 1 2 3 4 5 Emitter-Collector Voltage [V] Publication Date : November 2015 4 6 < High Voltage Insulated Gate Bipolar Transistor:HVIGBT > CM1000HG-130XA HIGH POWER SWITHCHING USE INSULATED TYPE 5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules PERFORMANCE CURVES CAPACITANCE CHARACTERISTICS (TYPICAL) GATE CHARGE CHARACTERISTICS (TYPICAL) 20 1000 VCE = 3600 V, IC = 1000 A Tj = 25 ºC 15 Capacitance [nF] Gate-Emitter Voltage [V] Cies 100 10 Coes 1 10 5 0 -5 -10 VGE = 0 V, Tj = 25 ºC f = 100 kHz Cres -15 0 0.1 1 10 0 100 5 15 20 Gate Charge [µC] Collector-Emitter Voltage [V] HALF-BRIDGE SWITCHING ENERGY CHARACTERISTICS (TYPICAL) HALF-BRIDGE SWITCHING ENERGY CHARACTERISTICS (TYPICAL) 14 14 VCC = 3600 V, VGE = +/-15 V RG(on) = 1.8 Ω, RG(off) = 30 Ω LS = 150 nH, Tj = 125 ºC Inductive load 12 Eoff 10 Eon 8 Erec 6 4 Eon 8 6 0 0 1000 1500 Erec 4 2 500 0 2000 Eoff 10 2 0 VCC = 3600 V, VGE = +/-15 V RG(on) = 1.8 Ω, RG(off) = 30 Ω LS = 150nH, Tj = 150 ºC Inductive load 12 Switching Energies [J] Switching Energies [J] 10 500 1000 1500 Collector Current [A] Collector Current [A] Publication Date : November 2015 5 2000 < High Voltage Insulated Gate Bipolar Transistor:HVIGBT > CM1000HG-130XA HIGH POWER SWITHCHING USE INSULATED TYPE 5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules PERFORMANCE CURVES HALF-BRIDGE SWITCHING ENERGY CHARACTERISTICS (TYPICAL) HALF-BRIDGE SWITCHING ENERGY CHARACTERISTICS (TYPICAL) 16 16 VCC = 3600 V, IC = 1000 A VGE = +/-15 V, LS = 150 nH Tj = 125 ºC, Inductive load Switching Energies [J] Switching Energies [J] VCC = 3600 V, IC = 1000 A VGE = +/-15 V, LS = 150 nH Tj = 125 ºC, Inductive load 12 Eon 8 12 Eoff 8 Erec 4 4 0 0 0 1 2 3 4 5 0 6 10 30 40 50 60 70 Gate resistor [Ohm] Gate resistor [Ohm] HALF-BRIDGE SWITCHING ENERGY CHARACTERISTICS (TYPICAL) HALF-BRIDGE SWITCHING ENERGY CHARACTERISTICS (TYPICAL) 16 16 VCC = 3600 V, IC = 1000 A VGE = +/-15 V, LS = 150 nH Tj = 150 ºC, Inductive load Switching Energies [J] VCC = 3600 V, IC = 1000 A VGE = +/-15 V, LS = 150 nH Tj = 150 ºC, Inductive load Switching Energies [J] 20 12 Eon 8 Erec 12 Eoff 8 4 4 0 0 0 1 2 3 4 5 0 6 10 20 30 40 50 Gate resistor [Ohm] Gate resistor [Ohm] Publication Date : November 2015 6 60 70 < High Voltage Insulated Gate Bipolar Transistor:HVIGBT > CM1000HG-130XA HIGH POWER SWITHCHING USE INSULATED TYPE 5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules PERFORMANCE CURVES HALF-BRIDGE SWITCHING TIME CHARACTERISTICS (TYPICAL) HALF-BRIDGE SWITCHING TIME CHARACTERISTICS (TYPICAL) 100 100 V = 3600 V, VGE = +/-15 V VCC CC = 3600V, VGE = ±15V RG(on) = 1.8 Ω, RG(off) = 30 Ω R G(on) = 1.8Ω, RG(off) = 30Ω LS = = 150nH, 150 nH,TTj==150°C 150 °C, Inductive load L VCC = 3600 V, VGE = +/-15 V RG(on) = 1.8 Ω, RG(off) = 30 Ω LS = 150 nH, Tj = 125 °C, Inductive load td(on) 1 tf td(off) td(on) 1 tf 0.1 0.1 tr tr 0.01 0.01 1000 10000 100 Collector Current [A] FREE-WHEEL DIODE REVERSE RECOVERY CHARACTERISTICS (TYPICAL) 100 10000 10000 VCC = 3600 V, VGE = +/-15 V RG(on) = 1.8 Ω, LS = 150 nH Tj = 150 °C, Inductive load 1000 trr 0.1 100 Reverse Recovery Time [µs] Irr 10 Reverse Recovery Current [A] VCC = 3600 V, VGE = +/-15 V RG(on) = 1.8 Ω, LS = 150 nH Tj = 125 °C, Inductive load 1 1000 Irr 10 1000 1 trr 0.1 10 100 10000 Collector Current [A] FREE-WHEEL DIODE REVERSE RECOVERY CHARACTERISTICS (TYPICAL) 100 1000 10 100 10000 1000 Emitter Current [A] Emitter Current [A] Publication Date : November 2015 7 100 10000 Reverse Recovery Current [A] 100 Reverse Recovery Time [µs] j 10 td(off) Switching Times [µs] Switching Times [µs] 10 S < High Voltage Insulated Gate Bipolar Transistor:HVIGBT > CM1000HG-130XA HIGH POWER SWITHCHING USE INSULATED TYPE 5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules PERFORMANCE CURVES TRANSIENT THERMAL IMPEDANCE CHARACTERISTICS Normalized Transient Thermal impedance 1.2 Rth(j-c)Q = 11.0 K/kW Rth(j-c)R = 17.5 K/kW 1 0.8 Z (t ) th( j c ) 0.6 0.4 0.2 0 0.001 0.01 0.1 1 10 Time [s] Publication Date : November 2015 8 n i t i R 1exp i 1 Ri [K/kW] : 1 0.0055 2 0.2360 3 0.4680 4 0.2905 ti [sec] : 0.0001 0.0131 0.0878 0.6247 < High Voltage Insulated Gate Bipolar Transistor:HVIGBT > CM1000HG-130XA HIGH POWER SWITHCHING USE INSULATED TYPE 5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules PERFORMANCE CURVES SHORT CIRCUIT SAFE OPERATING AREA (SCSOA) REVERSE BIAS SAFE OPERATING AREA (RBSOA) 2500 10 VCC 4500 V, VGE = +/-15 V RG(off) = 30 Ω Tj = 150 °C, LS ≤ 150 nH VCC 4500 V, VGE = +/-15 V RG(on) = 1.8 Ω, RG(off) = 30 Ω Tj = 150°C, LS ≤ 150 nH, tpsc ≤ 10 μs 8 Collector Current [kA] Collector Current [A] 2000 1500 1000 500 4 2 0 0 0 2000 4000 6000 8000 0 Collector-Emitter Voltage [V] 3000 VCC 4500 V, VGE = +/- 15V RG(on) = 1.8Ω Tj = 150 °C , LS ≤ 150 nH 2500 2000 1500 1000 500 0 0 2000 4000 6000 2000 4000 6000 Collector-Emitter Voltage [V] FREE-WHEEL DIODE REVERSE RECOVERY SAFE OPERATING AREA (RRSOA) Reverse Recovery Current [A] 6 8000 Emitter-Collector Voltage [V] Publication Date : November 2015 9 8000 < High Voltage Insulated Gate Bipolar Transistor:HVIGBT > CM1000HG-130XA HIGH POWER SWITHCHING USE INSULATED TYPE 5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules Keep safety first in your circuit designs! Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials •These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer’s application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party. •Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party’s rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. •All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page (http://www.MitsubishiElectric.com/). •When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. •Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. •The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials. •If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or re-export contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. •Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein. © 2014 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED. Publication Date : November 2015 10