BAT20J
®
HIGH EFFICIENCY SWITCHING AND
ULTRA LOW LEAKAGE CURRENT SCHOTTKY DIODE
MAIN PRODUCT CHARACTERISTICS
IF(AV)
1A
VRRM
23 V
IR 25°C(max) @ 15V
12 µA
Tj (max)
150 °C
A
FEATURES AND BENEFITS
Low conduction losses
Very low reverse current
Negligible switching losses
Low capacitance diode
Low forward and reverse recovery times
Extremely fast switching
Surface mount device
K
■
SOD-323
■
■
■
■
■
■
DESCRIPTION
The BAT20J is using 23V schottky barrier diode
encapsulated on a SOD-323 package. This is specially suited for switching mode in mobile phone
and PDA power management applications or LED
driver circuits (step up converters).
ABSOLUTE RATINGS (limiting values)
Symbol
* :
Parameter
VRRM
Repetitive peak reverse voltage
IF(RMS)
Repetitive peak forward current
Value
Unit
23
V
2
A
1
A
5
A
- 65 to +150
°C
δ = 0.38
IF(AV)
Average forward current
IFSM
Surge non repetitive forward current (tp=10ms sinusoidal)
Tstg
Maximum storage temperature range
Tj
Maximum operating junction temperature *
150
°C
TL
Maximum temperature for soldering during *
260
°C
dPtot
1
thermal runaway condition for a diode on its own heatsink
<
dTj
Rth( j − a )
Order code
Part Number
BAT20JFILM
April 2004 - Ed: 1
Marking
20
1/5
BAT20J
THERMAL RESISTANCE
Symbol
Rth (j-a)
Parameter
Junction to Ambient (*)
Value
Unit
600
°C/W
(*) Mounted on epoxy board without copper heat sink.
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Parameters
IR *
Reverse leakage current
(see note 1)
Tj = 25°C
IR *
Reverse leakage current
Forward voltage drop
VF **
Tests conditions
Min.
Typ.
Max.
Unit
VR = 5 V
VR = 8 V
VR = 15 V
0.65
0.88
3.00
2
3
12
µA
Tj = 85°C
VR = 5 V
VR = 8 V
VR = 15 V
55
70
120
120
150
250
Tj = 25°C
IF = 10 mA
IF = 100 mA
IF = 1 A
0.28
0.35
0.54
0.31
0.40
0.62
V
Typ.
Max.
Unit
20
30
pF
* Pulse test tp = 380 µs, δ < 2%
** Pulse test tp = 5 ms, δ < 2%
Note 1: IR at 23 V and Tj = 25°C is equal to 60 µA typ.
DYNAMIC ELECTRICAL CHARACTERISTICS
Symbol
Parameters
Cd
Diode capacitance
Tests conditions
VR = 5 V
F = 1 MHz
To evaluate the maximum conduction losses, use the following equations :
P = 0.32 x IF(AV) + 0.23 x IF2(RMS)
2/4
Min.
BAT20J
Fig. 1: Peak forward current versus ambient
temperature (δ = 0.11).
Fig. 2: Average forward current versus ambient
temperature ( δ = 0.5).
IF(AV)(A)
IP(A)
0.40
3.0
Printed circuit board FR4
SCU=2.25mm2
2.5
Printed circuit board FR4
SCU=2.25mm2
0.35
0.30
2.0
0.25
0.20
1.5
0.15
1.0
0.10
T
0.5
δ=tp/T
0.0
0
0.05
Tamb(°C)
tp
T
δ=tp/T
0.00
25
50
75
100
125
150
Fig. 3: Relative variation of thermal impedance
junction to ambient versus pulse duration .
0
Tamb(°C)
tp
25
50
75
100
125
150
Fig. 4: Reverse leakage currrent versus reverse
voltage applied (typical values).
IR(µA)
Zth(j-a)/Rth(j-a)
1.E+04
1.E+00
Tj=150°C
Single pulse
2
SCU=2.25mm
1.E+03
1.E-01
Tj=85°C
1.E+02
1.E+01
1.E-02
Tj=25°C
1.E+00
tp(s)
VR(V)
1.E-03
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Fig. 5: Relative variation of reverse leakage
currrent versus junction temperature (typical
values).
1.E-01
0
2
4
6
8
10
12
14
16
18
20
22
24
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).
IR(Tj) / IR(Tj=25°C)
C(pF)
1.E+04
100
F=1MHz
VOSC=30mVRMS
Tj=25°C
VR=5V
1.E+03
1.E+02
10
1.E+01
1.E+00
VR(V)
Tj(°C)
1
1.E-01
0
25
50
75
100
125
150
1
10
100
3/5
BAT20J
Fig. 7-1: Forward voltage drop versus forward
current (typical values, high level).
Fig. 7-2: Forward voltage drop versus forward
current (low level).
IFM(A)
IFM(A)
1.0
1.E+01
0.9
Tj=150°C
Tj=150°C
(typical values)
0.8
1.E+00
0.7
1.E-01
0.6
Tj=85°C
Tj=85°C
(typical values)
Tj=25°C
(typical values)
0.5
1.E-02
0.4
0.3
Tj=25°C
1.E-03
Tj=25°C
(maximum values)
0.2
0.1
VFM(V)
1.E-04
VFM(V)
0.0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
Fig. 8: Thermal resistance junction to ambient
versus copper surface under tab (epoxy
printed circuit board FR4, e CU =35µm, typical
values).
0.0
0.2
0.3
0.4
0.5
0.6
0.7
Fig. 9: Thermal resistance junction to ambient
versus power dissipation (epoxy printed circuit
board FR4, e CU =35µm, typical values).
Rth(j-a)(°C/W)
Rth(j-a)(°C/W)
600
700
550
650
SCU=2.25mm2
Tamb=25°C
600
500
550
450
500
400
450
350
400
300
350
250
300
250
200
200
150
150
100
100
50
SCu(mm²)
P(mW)
50
0
0
0
4/5
0.1
5
10
15
20
25
30
35
40
45
50
0
50
100
150
200
250
300
350
400
BAT20J
PACKAGE MECHANICAL DATA
SOD-323
DIMENSIONS
H
A1
REF.
b
Min.
A
E
A
D
c
Q1
L
■
Millimeters
Max.
Inches
Min.
1.13
Max.
0.045
A1
0
0.1
0
0.004
b
0.25
0.44
0.01
0.017
c
0.1
0.25
0.004
0.01
D
1.52
1.8
0.06
0.071
E
1.11
1.35
0.044
0.053
H
2.3
2.7
0.09
0.106
L
0.1
0.46
0.004
0.02
Q1
0.1
0.41
0.004
0.016
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
BAT20JFILM
20
SOD-323
0.005g
3000
Tape & reel
Epoxy meets UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners.
© 2004 STMicroelectronics - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain Sweden - Switzerland - United Kingdom - United States
www.st.com
5/5