CMD185 4-8 GHz Low Noise Amplifier Features Functional Block Diagram Vdd ► Ultra low noise figure ► High gain broadband performance ► Single supply voltage: +4.0 V @ 75 mA ► Small die size 2 Description The CMD185 is a broadband MMIC low noise amplifier ideally suited for EW and communications systems where small size and low power consumption are needed. The broadband device delivers greater than 15 dB of gain with a corresponding output 1 dB compression point of +15 dBm and a noise figure of 1.9 dB. The CMD185 is a 50 ohm matched design eliminating the need for external DC blocks and RF port matching. The CMD185 offers full passivation for increased reliability and moisture protection. RFIN RFOUT 1 3 Electrical Performance - Vdd = 4.0 V, TA = 25 oC, F = 6 GHz Parameter Min Typ Max Units Frequency Range 4-8 GHz Gain 15.5 dB Noise Figure 1.9 dB Input Return Loss 10 dB Output Return Loss 17 dB Output P1dB 15 dBm Supply Current 75 mA ver 1.0 0716 Custom MMIC 300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294 Visit us online at www.custommmic.com CMD185 4-8 GHz Low Noise Amplifier Specifications Absolute Maximum Ratings Parameter Recommended Operating Conditions Rating Parameter Min Typ Max Units 5V Vdd 2.0 4.0 5.0 V +20 dBm Idd Drain Voltage, Vdd RF Input Power Channel Temperature, Tch Power Dissipation, Pdiss Thermal Resistance 150 °C 75 mA Electrical performance is measured at specific test conditions. Electrical specifications are not guaranteed over all recommended operating conditions. 529 mW 123 °C/W Operating Temperature -40 to 85 °C Storage Temperature -55 to 150 °C Operation of this device outside the maximum ratings may cause permanent damage. Electrical Specifications - Vdd = 4.0 V, TA = 25 oC Parameter Min Frequency Range Gain Typ Max Min 4-6 13.5 Typ Max 6-8 GHz 15.5 17.5 Noise Figure 2 2.8 Input Return Loss 10 13 dB Output Return Loss 18 13 dB Output P1dB 14 16.5 dBm Output IP3 28 29.5 dBm Supply Current 53 75 97 13 Units 53 15 17.5 dB 1.5 2.7 dB 75 97 mA Gain Temperature Coefficient 0.009 0.009 dB/°C Noise Figure Temperature Coefficient 0.009 0.009 dB/°C ver 1.0 0716 Custom MMIC 300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294 Visit us online at www.custommmic.com CMD185 4-8 GHz Low Noise Amplifier Typical Performance Broadband Performance, Vdd = 4.0 V, Idd = 75 mA, TA = 25 oC 20 3.6 S11 S22 S21 NF 3.2 10 2.8 5 2.4 0 2 -5 1.6 -10 1.2 -15 0.8 -20 0.4 -25 Noise Figure/dB Response/dB 15 0 0 1 2 3 4 5 6 7 8 9 10 11 12 Frequency/GHz Narrow-band Performance, Vdd = 4.0 V, Idd = 75 mA, TA = 25 oC 20 3.6 15 3.2 S11 S22 S21 NF Response/dB 5 2.8 2.4 0 2 -5 1.6 -10 1.2 -15 0.8 -20 0.4 -25 Noise Figure/dB 10 0 4 4.5 5 5.5 6 6.5 7 7.5 8 Frequency/GHz Custom MMIC 300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294 Visit us online at www.custommmic.com ver 1.0 0716 CMD185 4-8 GHz Low Noise Amplifier Typical Performance Gain vs. Temperature, Vdd = 4.0 V 18 +25C +85C 17 -40C 16 15 Gain/dB 14 13 12 11 10 9 8 4 4.5 5 5.5 6 6.5 7 7.5 8 7.5 8 Frequency/GHz Noise Figure vs. Temperature, Vdd = 4.0 V 4 +25C 3.5 +85C -40C Noise Figure/dB 3 2.5 2 1.5 1 0.5 0 4 4.5 5 5.5 6 6.5 7 Frequency/GHz Custom MMIC 300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294 Visit us online at www.custommmic.com ver 1.0 0716 CMD185 4-8 GHz Low Noise Amplifier Typical Performance Noise Figure, Vdd = 3.3 V, 4.0V, 5.0V, TA = 25 oC 4 Vdd=3.3V Vdd=4.0V 3.5 Vdd=5.0V Noise Figure/dB 3 2.5 2 1.5 1 0.5 0 4 4.5 5 5.5 6 6.5 7 7.5 8 Frequency/GHz P1dB vs. Temperature, Vdd = 4.0 V 20 +25C +85C -40C 19 18 17 16 P1dB/dBm 15 14 13 12 11 10 9 8 7 6 5 4 5 6 7 8 Frequency/GHz Custom MMIC 300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294 Visit us online at www.custommmic.com ver 1.0 0716 CMD185 4-8 GHz Low Noise Amplifier Typical Performance P1dB, Vdd = 3.3 V, 4.0V, 5.0V, TA = 25 oC 20 19 18 17 16 P1dB/dBm 15 14 13 12 11 10 9 Vdd=3.3V 8 Vdd=4.0V 7 Vdd=5.0V 6 5 4 5 6 7 8 7 8 Frequency/GHz Output IP3, Vdd = 3.3V, 4.0V, 5.0V, TA = 25 oC 35 34 Vdd=3.3V 33 Vdd=4.0V 32 Vdd=5.0V 31 Output IP3/dBm 30 29 28 27 26 25 24 23 22 21 20 4 5 6 Frequency/GHz Custom MMIC 300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294 Visit us online at www.custommmic.com ver 1.0 0716 CMD185 4-8 GHz Low Noise Amplifier Mechanical Information Die Outline (all dimensions in microns) 1199.00 2 1350.00 1 3 1214.00 719.50 701.50 125.00 1350.00 Notes: 1. No connection required for unlabeled pads 2. Backside is RF and DC ground 3. Backside and bond pad metal: Gold 4. Die is 85 microns thick 5. DC bond pads are 100 microns square 6. RF bond pads are 100 microns x 150 microns ver 1.0 0716 Custom MMIC 300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294 Visit us online at www.custommmic.com CMD185 4-8 GHz Low Noise Amplifier Pad Description Pad Diagram 2 1 3 Functional Description Pin Function Description 1 RF in DC blocked and 50 ohm matched 2 Vdd Power supply voltage Decoupling and bypass caps required 3 RF out DC blocked and 50 ohm matched Schematic RF in Vdd RF out GND Backside Ground Connect to RF / DC ground ver 1.0 0716 Custom MMIC 300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294 Visit us online at www.custommmic.com CMD185 4-8 GHz Low Noise Amplifier Applications Information Assembly Guidelines The backside of the CMD185 is RF ground. Die attach may be accomplished with either electrically and thermally conductive epoxy or eutectic attach. Standard assembly procedures should be followed for high frequency devices. The top surface of the semiconductor should be made planar to the adjacent RF transmission lines, and the RF decoupling capacitors placed in close proximity to the DC connections on chip. RF connections should be made as short as possible to reduce the inductive effect of the bond wire. Use of a 0.8 mil thermosonic wedge bonding is highly recommended as the loop height will be minimized. The RF input and output require a single bond wire as shown. The semiconductor is 85 um thick and should be handled by the sides of the die or with a custom collet. Do not make contact directly with the die surface as this will damage the monolithic circuitry. Handle with care. Assembly Diagram to Vdd 100,000 pF CHIP CAP (example: Presidio part MVB4080X104ZGK5R3L) RF in RF out 100 pF CHIP CAP (example: Presidio part LSA1515B101M2H5R-L) Biasing and Operation The CMD185P3 is biased with a single 4.0 V positive drain supply. RF power can be applied at any time. GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. ver 1.0 0716 Custom MMIC 300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294 Visit us online at www.custommmic.com