To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry
GET-BE-1002
Ver.5.0: May,2006
Lead (Pb)-free Semiconductor Products
NEC Electronics Corporation
Compound Semiconductor Devices Division
1
Lead (Pb)-free Policies
GET-BE-1002
Ver.5.0: May,2006
„Lead (Pb)-free Semiconductor Products of Opto-Electronics,
and RF and Microwave Devices
• As a so-called "green vendor", NEC Electronics contributes to global
environmental protection by actively promoting the introduction of Lead
(Pb)-free products as part of our ongoing efforts to develop and supply
environmentally sound products.
• We have completed development of Lead (Pb)-free technology for all of
our opto-electronics, RF, and microwave products*1 and are accepting
orders for Lead (Pb)-free products.
• MoreOver, our future products will all be Lead (Pb)-free.
• In consideration of the environment, we are aiming to completely
eliminate the use of lead*2 in all of our opto-electronics, RF, and
microwave products*1 by the end of September 2006 and have been
progressing with the gradual switchOver*3 since October 2005.
*1:Products made by the former NEC Compound Semiconductor Devices, Ltd.
*2:RoHS compliant (Some products will still have internal parts with material containing lead.) Contact a sales
representative for details.
*3:Except for maintenance products being phased out.
2
Measures for Lead (Pb)-free Implementation
GET-BE-1002
Ver.5.0: May,2006
1. Areas Requiring Lead (Pb)-freeMount materials such as soldering
paste and soft solder.
(Modules and some power devices)
Solder Plating of Outer Leads
(Plastic packages)
2. Method of Lead (Pb)-free Implementation
(1) Solder Plating for Outer Leads
C o n v e n t io n a l
P ro d u c t s
Sn-Pb
Au
Le a d ( P b ) - f re e
P ro d u c t s
Sn-Bi *
Au
*Solder Dip(radial transistors):
Sn-Ag-Cu Dip
(2) Pb reduction inside the packages such as the mount materials
has already met the RoHS Directive requirements. (The complete
Pb free technologies are currently under development. Its actual
implementation date is TBD).
3
Specification for Lead (Pb)-free
Package
Soldering of Outer Leads
Mount Materials
GET-BE-1002
Ver.5.0: May,2006
Pb Usage in Others
SOP Type
Sn-Bi Plating
Pb Not Used
Pb Not Used
DIP Type
Sn-Bi Plating
Pb Not Used
Pb Not Used
QFNType
Sn-Bi Plating
Pb Not Used
Pb Not Used
MM Type
Sn-Bi Plating
Pb Not Used
Pb Not Used
Power Mold
Sn-Bi Plating
Complied with the RoHS
Complete Lead (Pb)-free
Implementation underway
(Sn-Pb soft solder used )
Pb Not Used
Radial Type
(Transistor)
Sn-Ag-Cu Dip
Pb Not Used
Pb Not Used
Module Type
(MCM)
(Laser Di)
Au Plating
(Same as at present)
Sn-Ag-Cu Paste
Ceramic Type
Au Plating
(Same as at present)
Pb Not Used
Complied with the RoHS
Complete Lead (Pb)-free
Implementation underway
(Lead glass and Ceramic
Parts, etc.)
Pb Not Used
Soldering of outer leads became Lead (Pb)-free in October, 2001. The Pb contained inside the packages met the
RoHS Directive requirements in December, 2002.
4
Lead (Pb)-free plating comparison (1)
=Why Sn-Bi is the best solution=
GET-BE-1002
Ver.5.0: May,2006
Surface solder plating
Sn-Pb
(Conventional)
Sn-Bi
Sn-Ag
Sn-Cu
Matte-Sn
Ni/Pd/Au
Composition (wt%)
Pb:10
Bi:2
Ag:3.5
Cu:1.5
Sn:100
-
Solid-liquid
phase temperature
183-215
227-296
232
Soluble plating
Alloy
characteristics Melting point (˚C)
223-231
221(eutectic)
Wettability
Packaging
reliability
Soldering
temperature
Joint strength
Whisker resistance
Productivity
x
Cost
Cannot be
applied to the
lead frame
containing Fe.
Notes
Interferes with
resin adhesion.
Excellent
Good
Poor
x NG
5
Lead (Pb)-free plating comparison (2)
=Why Sn-Bi is the best solution=
GET-BE-1002
Ver.5.0: May,2006
Sn-Cu
Sn-Ag
1083
960.5
The solid phase (solidification) temperature of Sn-Bi solder
is influenced by the variation in composition, while the
variation in the liquid phase (melting) temperature remains
small. These characteristics are similar to those of Sn-Pb.
Liquidus
Liquidus
Liquid
↑
Liquid
↑
Sn-Pb
327
Liquidus
↓
Semi-solid
↑
Solidus 183
0
Pb
Sn-Bi
10Pb
Liquid
↑
61.9
↓
Solid
50
→ %Sn
2Bi
271
Liquidus
Liquid
↓
↑
Semi-solid
↑
Solidus 42
100 0
Sn Bi
3.5Ag
↓
1.5Cu
Semi-solid
↑
232
Solidus 221
96.5
↓
Solid
139
↓
Solid
50
→ %Sn
↓
Semi-solid
↑
Temperature→
Note: The figures shown are images and may be slightly different from
actual data.
100 0
Sn Ag
50
→ %Sn
100 0
Sn Cu
Solidus 227
↓
Solid
50
→ %Sn
99.3
100
Sn
6
Lead (Pb)-free plating comparison (3)
=Why Sn-Bi is the best solution=
GET-BE-1002
Ver.5.0: May,2006
Pb
There are few Bi to Sn, and Pb.
Mounting by Sn-Pb solder
paste is also possible.
0
20
40
Eutectic point:
About 100 degree C
Wt
%S
n
Over 200 degree
60
Sn-37Pb paste
(183 degree C : eutectic)
Low temperature zone
(Under 150 degree C)
Over 175 degree C
Sn-Bi plating on Sn-Pb Solder paste
80
Over 200 degree C
Over 200 degree C
100
100
Sn
Sn-2Bi plating
(Solid : 223 degree C
- Liquid : 231 degree C)
80
60
40
Wt%Sn
20
0
Bi
Sn-Pb-Bi Melting Characteristics(image)
7
Identification of Lead (Pb)-free Products*
GET-BE-1002
Ver.5.0: May,2006
Identification by “Marking on the Product”:
Lead (Pb)-free products will be marked with Dot-mark or
Alternative mark except for products using small packages such
as minimold package.
Dot-mark for Product
Identification by “Marking on the Package Label”
Package labels for all Lead (Pb)-free products will be marked with
either “Pb-Free T.”.
Taping reel label will also be marked in the same manner for
taping at shipment time.
*Note that this marking system applies only to products changed Over to Lead (Pb)-free.
Conventional products not containing Pb will not be marked.
8
Lead (Pb)-free Products Marking Method
GET-BE-1002
Ver.5.0: May,2006
= Compounds / Si Microwave Devices =
Marking on the Product
Package
SOP Type
SSOP Type*
QFNType
DIP Type
TSSOP/HTSSOP
TSON Type
Mini Mold Type
Power Mold
TO-92
Dot-mark
Dot-mark *
Underline
Marking on the Label
Lead (Pb)-free marking (Logo)
on the Label
(See the examples below.)
Dot-mark
No Marking
No Marking
No Marking
No Marking
No Marking
*No marking for 175mil 8p SSOP.
Example Marking
on the Product
Display surface is marked with Dot-mark or underline.
XXXX
CXXXX
Example Marking
on the Label
Packing label is
marked with logo.
“Pb-Free T.”
N
(Ex.) 8pSOP
(Ex.) QFN
For the details, please contact NEC Electronics Corporation.
9
Lead (Pb)-free Products Marking Method
GET-BE-1002
Ver.5.0: May,2006
= NEPOC Products (Photocouplers · OCMOS (Optical-coupled MOS)) =
Package
DIP (4,6,8 PIN)
SOP 4PIN
Marking on the Product
Internal Code
Laser Printing
Ink Printing
OC MOS SOP 8PIN
SSOP 4PIN
Laser Printing
SSOP
16PIN
Ink Printing
Flat Lead
Vertical Line
Italicized Product Name
Marking on the Label
Lead (Pb)-free marking
(Logo) on the inside label
and outside label.
Internal Code
Mark
“Pb-Free T.”
Internal Code
Italicized Product Name
Vertical Line
Example Marking on the Product
DIP (4,6,8PIN)
SOP (4pin:Laser Printing)
NEC
NEC
25XX
X XXX
27XX
X XXX
l
SSOP 4PIN
1
XXX
Specified by the English-letter indicator Marked with the vertical line
Stamped with
in the 2nd digit of the Internal Code.
on the bottom-right corner.
For the details, please contact NEC Electronics Corporation.
Mark.
10
GET-BE-1002
Ver.5.0: May,2006
Recommended Soldering Conditions of Lead (Pb)-free Products
1. Surface Mount Type (SMD)
•IR reflow with the peak temperature 260°C,
•Wave soldering with the molten solder in the 260°C
soldering bath and
•Partial lead heating through the 350°C solder iron tip
can be performed.
2. Through Hole Type (THD)
• Wave soldering with the molten solder in the 260°C
soldering bath and
• Partial lead heating through the 350°C solder iron tip
can be performed.
3. Hand Soldering Type
•Partial lead heating through the 350°C solder iron tip
can be performed.
- Specific conditions apply to some products. Please contact our sales representatives for details. 11
GET-BE-1002
Ver.5.0: May,2006
Recommended Soldering Conditions of Lead (Pb)-free Products
(IR Reflow)
Package Surface Temperature (ºC)
• Max. Temperature (Package Surface Temperature): 260°C
• Soldering Time at Max. Temperature : Within 10 seconds
• Soldering Time at Over 220°C
: Within 60 seconds
• Preheating Time at 120°C - 180°C
: 120 ± 30 seconds
• Max. number of Reflows
: 3 times
• Chlorine Composition of Rosin Flux (%) : 0.2% (wt.) or less
(Heating)
- 10s
260°C MAX.
220°C
180°C
120°C
- 60s
120 ± 30s
(Preheating)
Time (sec.)
- Specific conditions apply to some products. Please contact our sales representatives for details. 12
GET-BE-1002
Ver.5.0: May,2006
Recommended Soldering Conditions of Lead (Pb)-free Products
(Wave Soldering/Partial Lead Heating)
Wave Soldering
• Max. Temperature (Molten Solder Temperature): 260°C
• Flow Time
: Within 10 seconds
• Preheat Temperature (Package Surface Temperature):Below 120°C
• Number of Flows
: 1 time
• Chlorine Composition of Rosin Flux: 0.2% (wt.) or less
Partial Lead Heating (Hand Soldering)
• Max. Temperature (Outer Lead Temperature): 260°C
• Time (per side of a device* or per lead*) : Within 3 seconds
• Chlorine Composition of Rosin Flux
:0.2% (wt.) or less
(*:Time is defined per side for SMD and per lead for THD)
- Specific conditions apply to some products. Please contact our sales representatives for details. 13
GET-BE-1002
Ver.5.0: May,2006
Lead (Pb)-free Product Samples and Mass Production
We are already accepting orders for Lead (Pb)-free optical,
radio-frequency, and microwave products.
Please contact one of our sales representatives for samples,
products and the delivery date.
Samples for Evaluation are available as below:
Please contact our sales representatives for delivery date.
Package Samples
(Part number:
Not specified)
Product Samples
(Part number:
Specified)
14
Contact for Inquiries
GET-BE-1002
Ver.5.0: May,2006
NEC Electronics Corporation.
Compound Semiconductor Devices Division.
Home Page:
Please visit our web site for information of Compound Semiconductor Devices Division.
URL (Address) http://www.ncsd.necel.com/
Request for Documents/Brochures:
Sales Planning Group of Sales Division or our exclusive distributors
Business Information:
Sales Planning Group of Sales Division
Tel : 044-435-1838
E-mail : csd_salesinfo@ml.necel.com
15
GET-BE-1002
Ver.5.0: May,2006
Reference
16
Plating Wettability Test Results
GET-BE-1002
Ver.5.0: May,2006
= Mini Mold Package =
Test Method: Meniscograph
Test Method: ≤M3eniscograph
Standard:
sec
Standard:
≤ 3 sec
Zero-cross Time (Sec)
3
Lead (Pb)-free (Sn-Bi) plating
exhibits wettability equivalent to
the current Sn-Pb plating.
2
Inner
Plating
Composition of Evaluated
Solder Material in the Bath
Sn-2.5Bi
Sn-2.5Bi
Sn-Pb
Sn-Pb
Sn-Pb
Sn-3Ag-0.5Cu
Sn-Pb
Sn-3Ag-0.5Cu
Terminal material: Cu
Disposal pre-conditions :150deg C HT 48H
1
R-Type Flux
RMA-Type Flux
0
210
215
220
225
230
235
240
245
250
Evaluation Bath Temperature (deg C)
17
GET-BE-1002
Ver.5.0: May,2006
Lead (Pb)-free Plating Solder Joint Strength Evaluation Results
Mini
MiniMold
MoldPackage
Package Solder Mount Shear Strength
Sn - 40Pb
Mount Solder Paste
Outer Solder Plating
6pTSMM
(Cu)
6pTUSMM
(Cu)
3pTUSMM
(Cu)
3pL2MM
(Cu)
Vertical
Direction
Horizontal
Direction
Vertical
Direction
Horizontal
Direction
Vertical
Direction
Horizontal
Direction
Vertical
Direction
Horizontal
Direction
Sn-2.5Bi
Sn-10Pb
Standard: ≥ 5 N (unit : N)
Sn-3Ag-0.5Cu
Sn-10Pb
Sn-2.5Bi
19
37
28
33
13
19
35
31
31
14
21
37
32
41
15
18
35
33
39
14
16
9
17
9
19
9
20
9
12
10
11
13
Mount Condition : One-time IR Reflow (with a peak temperature of 260degC)
Vertical Direction
6pTSMM
Vertical Direction
Vertical
Direction
6pTUSMM
Horizontal
Direction
Horizontal
Horizontal
Direction
Horizontal
Direction
Vertical
Direction
Direction
3pTUSMM
3pL2MM
Equivalent Shear Strength of the Mount Solder Paste and the Outer
Solder Plating was Evaluated for Each of 4 Package Types
18
GET-BE-1002
Ver.5.0: May,2006
Solder Joint Strength
Photocouplers
Photocouplers
Solder Mount Pull Strength: Standard: ≥ 5 N
Sn - 40Pb
Mount Solder Paste
Outer Solder Plating
Sn-10Pb
4pin DIP
(Cu)
>100
4pin SOP
(42 Alloy)
4pin SSOP
(42 Alloy)
(unit : N)
Sn-3Ag-0.5Cu
Sn-2.5Bi
Sn-10Pb
Sn-2.5Bi
>100
>100
>100
27
28
28
28
27
28
28
28
Mount Condition : One-time IR Reflow with a peak temperature of 260 °C.
Number of samples: 3 packages each.
All combinations of solder paste and solder plating show
equivalent mount pull strength
19
GET-BE-1002
Ver.5.0: May,2006
Lead (Pb)-free Plating Whisker Test Results
Sn-Bi Plating
Outer Lead Solder
(-65to150C)
(-65to150C)
Storage at a
Constant
(85C,85%)
IR Reflow
Not Performed
IR Reflow
Performed
IR Reflow
Not Performed
2000 Cycle
2000 Cycle
Whisker
Not Occurred
Whisker
Not Occurred
Whisker
Not Occurred**
Whisker
Not Occurred
Whisker
Not Occurred
Whisker
Not Occurred**
Test Conditions Temperature CycleTemperature Cycle
L/F* Material
Cu L/F *
Fe-Ni L/F *
Fe L/F *
*L/F=Lead Frame
Judgment : ≤ 50 um
Sn-Ag-Cu Dip
(-65to150C)
Storage at a
Constant
(85C,85%)
IR Reflow
Performed
IR Reflow
Not Performed
IR Reflow
Not Performed
2000H
2000H
2000 Cycle
2000H
Whisker
Not Occurred
Whisker
Not Occurred
Whisker
Not Occurred
Whisker
Not Occurred
Whisker
Not Occurred
Whisker
Not Occurred
Whisker
Not Occurred
Whisker
Not Occurred
-
-
-
-
**(-55 to 150 degree C, 1000Cycle)
Storage at a
Constant
(85C,85%)
Temperature Cycle
Check
SEM:IR Reflow Not Performed
Fe-Ni L/F(225milSOP)
TC2000 Cycle
Cu L/F (Minimold)
TC2000 Cycle
Fe-Ni L/F (225milSOP)
HHT2000H*
Cu L/F (Minimold)
HHT2000H*
*:Rough surface is caused by metal rusts.
* No Problems were Observed During Long-Period Storage In Either
Case, Whether Thermal Stress to the Board Mount is Applied or Not
20
GET-BE-1002
Ver.5.0: May,2006
Results of Whisker Test (complied JEDEC standard)
Sn-BiPlating
Outer Lead Solder
Test Conditions
Temperature Cycle
Storage at a Constant Temperature & Humidity
(60 degree C,90%)
(-40 to 85 degree C)
IR Reflow Not Performed
L/F* Material
ck
Che
1000 Cycle
3000H
Whisker
Not Occurred
Cu L/F*
Fe-Ni L/F*
IR Reflow Not Performed
Whisker
Not Occurred
Whisker
Not Occurred
Fe L/F*
Whisker
Not Occurred
Whisker
Not Occurred
Whisker
Not Occurred
*L/F=Lead Frame
Judgment : ≤ 40 um (complied iNEMI)
* No Problems were Observed in JEDEC standerd condition too.
21