Lecture 7.1 Device Physics – Transistor Integrated Circuit Base Transistor Collector Bipolar Transistor – Discrete device – On Chip Field Effect Transistor (FET) – On Chip Emitter Uses Amplify a signal – Operational Amplifier Switch – On/Off • Process and store binary data Switch Source Closed Gate Reservoir Water Drain Channel Sink Gate Source Open Gate Reservoir Water External Energy (voltage) Drain Gate Sink Bipolar Transistor Combination of two back-to-back p-n junctions P-N-P or N-P-N Bipolar Transistor Circuit Configurations Single PN Junction -Constant Gate Voltage Base Amplify Input Voltage Signal Collector Gain Emitter Amplifier Gain Common-base configuration current gain – =1-(Wb/Lp)2/2 ~ 1 (slightly less than 1.0) • Wb = width of base minus depletion regions • Lp = diffusion length of holes in the base. Voltage Gain – ce= /(1- ) (values from 400 to 600) FET- (Field Effect Transistor) MOSFET – Metal oxide semiconductor field effect transistor – Metal-insulatorsemiconductor FET IGFET NMOS or PMOS MOST – Metal-oxide semiconductor transistor – Insulated-gate FET MISFET JFET – Junction FET MOSFET in Memory Chip Source Gate Drain Field Effect Transistor (FET) Voltage Controlled Resistor Inversion Zone - Poisson’s Eq. 2U = -/( o ) –Metal on • N Zone P Zone n= - e Nd -p=+ e Na – Boundary Conditions • U=Uo at x=0 • U=0 V at x= Inversion Layer Electron Tunneling Electron Transmission, T, through thickness, δ. T e 2 8 me U E 2 h 2 U=Potential Energy of Barrier E=Total Energy of Electron Integrated Circuits CPU or Memory – First Layer • • • • Transistors Capacitors Diode Resistors – Multi-layer • Wiring – Interconnects – Bonding Pads • Dielectric • Capacitors • Heterostructures Transistor Switching Speed PNP vs NPN N channel is Faster - NPN – Mobility of n (electron is faster than hole) Much Lower Switching Power Complementary MOS – N channel connected to P channel – 106 less power for switching • 1 pnp acts as amplifier • 2nd npn does the switching VT IS LESS for Complementary Transistor Integrated Circuit Good for the next 20 years! (Gordon E.) Moore’s Law, 1965 – Doubling of transistor density every year! – Doubling of computer speed in 18 months – Doubling of computer size in 18 months – Substantial decrease in price with time By 2012 1 Billon Transistors/die 10 Ghz! Limitations by 2017 (gate Thickness) • Price of transistor is 10-6 of original price http://developer.intel.com/update/archive/issue2/focus.htm Size of Transistor $1B/acre 5 layers of Metalization Scaling Parameter = S >1 Linear Dimension L1L1/S – Reduce all linear dimenstions by 1/S Reduce voltage by 1/S Increase doping Concentrations by S Decrease time for electron to cross gate – t = L1/Vdrift t/S, Vdrift= eE/me , =relaxation time Power Dissipated per transistor – P = I V (I/S)(V/S) P/S2 100 Circuit Speed 10 Computer Speed t1( S) 1 1 GHz t2( S) 0.1 1 GHz 0.01 1 10 3 1 10 4 1 10 100 1 10 3 S Switching Time – Time to take an electron across a gate – t = L/Vdrift • Vdrift= eE/me , =relaxation time – t t/S RC delay time of Interconnects – Resistance • R= L/A • R= L*S/A/S2 RS3 – Capacitance • C=oA/d • C =o(A/S2)/(d/S) C/S – RC RCS2 Copper Wiring/Low K dielectric Pentium IV – S < 0.18 μm – Clocks @ >2.0 Ghz What a Memory Chip Looks Like DRAM memory Array Memory Chip –First Layer •Transistors –Multi-layer •Wiring –Interconnects –Bonding Pads •Dielectric •Capacitors •Dielectric Reading and Writing Columns Think of a memory chip as a grid or array of capacitors located at specific rows and columns. If we choose to read the memory cell located at row 3, column 5, we will retrieve information from a specific capacitor. Every time we go to row 3, column 5, we will access or address the same capacitor and obtain the same result (1) until the capacitive charge is changed by a write process. Rows 1 2 3 4 5 6 7 1 1 0 0 1 0 1 1 2 0 0 1 1 1 0 1 3 0 1 1 0 1 1 0 4 1 1 0 0 0 1 1 5 1 0 41 0 0 1 0 6 1 1 1 0 1 0 0 7 0 1 0 1 1 0 1 DRAM Memory Cell 1 Bit Column Line Capacitor Gate or Row Line READ WRITE