Procedure – Wafer Identifier Scribing The intent is to provide an identifier scribe on the backside of a wafer to keep identity throughout the processing cycle in the clean room 1. Using a diamond scribe, located by the diamond dicing saw; scribe a small identifying mark on the backside of the wafer. 2. Keep the marks small and near the major flat of the wafer 3. Use a initials and a different number for each wafer of your group Diamond tip scribe Scribe a small set of letters and numbers to identify your wafer. Use a different number for each wafer in your group Procedure – Wafer Identifying Scribe 11-20-2012