Micro-Masonry (for Multi Small Volume Rapid Fabrication)
Seok Kim
Mechanical Science and Engineering, University of Illinois at Urbana-Champaign
Abstract
The speaker presents a new micro/nano-manufacturing route, termed ‘micro-masonry’
for multi small volume rapid fabrication of MEMS/NEMS structures and devices. This
approach involves a transfer printing-based assembly of micro/nanoscale materials,
optionally, in conjunction with material bonding techniques relying on rapid thermal
annealing. The talk starts with the current state-of-the-art of transfer printing for the
purpose of microassembly via advanced polymer stamps which exhibit exceptional
reversible dry adhesion. Subsequently, the procedures of the preparation, assembly,
and bonding of three major materials in MEMS/NEMS such as silicon, silicon dioxide,
and gold are introduced. Finally, several system level applications including imbricate
photonic scales, vertical hidden comb drives, MEMS scanners, and MEMS resonators
built by micro-masonry are demonstrated. The strategies shown in the presented work
will elevate the manufacture of micro/nano-systems towards 3D, flexible, and rapid
production.
Biography
Dr. Seok Kim received B.S. and M.S. degrees from Pohang
University of Science and Technology, Pohang, South
Korea and University of California at Los Angeles, CA,
USA in 2000 and 2005, respectively. He completed a Ph.D.
degree from Carnegie Mellon University, Pittsburgh, PA,
USA in 2009. After two year postdoc career at University of
Illinois at Urbana-Champaign (UIUC), IL, USA, he joined
the Department of Mechanical Science and Engineering at
UIUC as an Assistant Professor in 2011. His current
research interests encompass biomimetic engineered
surfaces
for
dry
adhesion
and
wetting,
transfer
printing-based
micro/nanomanufacturing, and MEMS/NEMS. He is a recipient of National Science
Foundation CAREER Award.
11
Seminar type: ME Fall 2014 seminar series
Where: Livermore 101, When: 11/24/14, 2:00 PM