Investigation on Instruments and Measurement Techniques for the
Thermoelectric Properties of Materials
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Dwencel John Mamayson1, Tony V. Varghese2a, Dr. Yanliang Zhang2b, Andrew Wilson2b, Dr. Don Plumlee2b, Jacob Davlin2b
1 Science, Math and Engineering, Cosumnes River College
2a Material Science Engineering, Boise State University
2b Mechanical & Biomedical Engineering, Boise State University
Objectives
 To study and be familiar about the operations of the
current instruments and measurement techniques for
measuring thermoelectric properties of materials.
Method of Measurements
Proposed Changes & Future Works
 For the Bulk-Pellet Sample Measurement Set-up:
 (Cross-Plane) Set-up for Bulk-Pellet Samples:
The order of set-up process:
• Place the sample between
the Indium contact
thermocouple for cold
temperature (negative
Seebeck voltage) on the
bottom and the Indium
contact thermocouple for hot
temperature (positive
Seebeck voltage) on the top.
• Place the heater on the top of
the hot temperature Indium
contact.
• Screw and tighten the plastic
insulator for pressure
application.
 To improve these current instruments and measurement
techniques for better measurements and results.
Background
 What is Thermoelectric Effect?
• Direct conversion of temperature
differences on a material’s two sides
into electricity is called the “Seebeck”
effect.
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• The installation of
Styrofoam to the
instrument:
 Minimized the heat
losses from convection
and radiation heat
transfer.
“Graphical Result of Ceramic Material Measurements”
 Set-up for Thick and Thin Film Samples:
and/or
• Direct conversion of electric current to
temperature difference on material’s
two sides is called the “Peltier” effect.
• N-type and P-type of
the same material are
connected electrically
in series and thermally
in parallel to form a
thermoelectric module.
 Application of Thermoelectric Effect:
• Thermoelectric generators, TEG
(also called “thermoelectric
modules”) are devices that use
the “Seebeck” effect to harvest
waste heat.
“Thermoelectric Generator for Efficient Automotive Waste
Heat Recovery”
TEMPLATE DESIGN © 2008
www.PosterPresentations.com
The order of set-up process:
• Place one side of the
glass with the sample on
the top of the heat sink
and the other on the (hot
side) module.
• Place the Indium contacts
for the cold and hot
temperature.
thermocouples on the
respective sides of the
sample.
• Place the plain insulator
piece on the top of the
Indium contacts.
• Place the Insulator with
screws on the top of the
plain insulator for
pressure application.
Improvements & Results
The overall results showed a significant difference between the thermal conductivity of
the Plain Low Temperature Co-fired Ceramic (LTCC) and the Silver Thermal Vias LTCC .
“Overall Ceramic Package TEG
Device Schematic with Thermal
Vias”
The figure shows the
Silver Thermal Vias LTCC
on the left and the Plain
LTCC on the right .
 For the Thick and Thin Film Sample Measurement
Set-up:
 In the Thick and Thin Film Measurement Set-up:
 In the Bulk-Pellet Sample Measurement Set-up:
• The application of high
thermal conductivity Silicone
thermal paste between the
sample and the instrument:
 Increased sample and
set-up thermal interface
conductance.
 Reduced measurement
error due to the thermal
contact resistances.
• The silicone thermal conductive paste can be replace by
an easier-to-clean, higher thermal conductive paste like
silver paste.
• The Styrofoam material cover can be replace by a better
foam-like material which has lower thermal conductivity.
• Fabrication of the design and then experimentation using
materials with reported literature thermal properties to
evaluate the accuracy.
• The alteration of the
insulators’ orientation and
addition of glass slide
(above the Indium contacts
an the sample) and (blue)
tape bundle to the set-up:
 Balanced the
insulators.
 Abled to apply
maximum pressure on
both sides.
 Minimized the
shattering of the
glass-sample holder.
• Build a design that has pressure variation only to the
sample.
• Initiate the thermal insulation idea using a foam-like
material with a very low thermal conductivity.
• Separate the heat sink from the module.
Acknowledgement
National Science Foundation; Office of Special Programs,
Division of Materials Research and Research Experience for
Undergraduates (REU) Program [DMR-1359344] at Boise
State University.