Advanced VLSI Design - Washington State University

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EE 587

SoC Design & Test

Partha Pande

School of EECS

Washington State University pande@eecs.wsu.edu

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Final Exam Review

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System Level Design Issues

• SoC Interconnection Architectures

– Drawback of bus-based systems in terms of timing, power and other relevant parameters

• Role of parallelism

• Problem with long wires

– Buffer Insertion

– Problems with classical buffer insertion

– How to deal with that

• Multi-processor SoC (MP-SoC) platform design

3

Signal Integrity

• Crosstalk Avoidance

– Comparative study of different CAC schemes

– How to cascade multiple CAC blocks for a wide bus so that there is no crosstalk between two sub blocks

• Except coding what are the different methods of reducing coupling

• Effect of inductance on buffer insertion

• Effect of inductance on propagation delay

• Electromigration

• L di/dt noise

• Decoupling capacitance

• IR drop in power lines

4

Clock & Power Routing

• How to control IR drop and L di/dt noise

• What is the advantage of interleaved power & ground routing

• Different ways of reducing power in clocking

• Different clock routing mechanisms

• Advantages Tapered H-tree

• Configuration of gated clock

5

SoC Testing

• What are the principal challenges in SoC testing

• Design of scan flip-flop

• How can you modify a pass transistor-based latch to make it scanable

• JTAG instructions

• LFSR pattern generation

• Given a polynomial you need to derive the LFSR configuration

• How you can modify a BILBO for different modes of operations

6

IDDQ Testing

• What is bridging fault and how you can detect it

• Applicability of IDDQ test in SoCs, what is the challenge?

• How to switch off static current dissipating components for IDDQ testing. You need to explain with the help of proper circuit level design details

• Relation between JTAG and IDDQ testing

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Iddq Testing in SoC

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Methods of Reducing Power

• Architectural Decisions – has the highest impact (parallelism, pipelining, low activity designs, lower frequency operation )

• Circuit Techniques – gated clocks, low glitch circuits, reduce capacitances, reduce activity

• Recent developments – Vdd scaling, VT adjustments

• Software – low power instructions, algorithms

• CAD tools to implement low-power techniques

9

Circuit Design Styles

• Nonclocked Logic

– CMOS, Pseudo-NMOS, Differential Cascade Voltage Switch

(DCVS), Pass-Transistor

• Clocked Logic

– Domino, Differential Current Switch Logic (DCSL)

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Circuit Design Styles

• Advantages of DCSL gates

• Principle of skewed CMOS

• Dependence of short circuit current & leakage current on the skew ratio

• Role of Vdd and Vt scaling

• Principle of MTCMOS

• Difference between logic and memory circuits in terms of Vdd and Vt scaling

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MTCMOS

In active mode, low-

VT MOSFET’s achieve high speed.

In standby mode when St'by signal is high, high-

VT MOSFET’s in series to normal logic circuits cut off leakage current.

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Issues in MTCMOS

• Virtual ground not actual ground (lose some noise margin)

• Can increase width of sleep transistor to reduce voltage at virtual ground but it will also increase subthreshold leakage and area of sleep transistor

13

Variable Threshold-CMOS

Threshold voltage of both devices are increased by adjusting the body-bias voltage in order to reduce subthreshold leakage current in standby mode

Requires twin-tub technology so that substrates of individual devices can be adjusted

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Low Swing Interconnects

• Dynamically Enabled Drivers

• Low Swing Bus

• Different level converter circuits

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Dynamic Power Management

• Dynamically reconfigures an electronic system to provide the requested services and performance levels with a minimum number of active components or a minimum load on such components

• Selectively turns off or reduce the performance of idle or partially unexploited components

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DPM Techniques

• Predictive Technique

• Static Technique

• Adaptive Technique

• Clock gating

• Supply shut down

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Low Power SRAM Design

• Banked Organization

• Divided Word Line

• Pulsed Word line

• Bit Line Isolation

• Suppressing leakage in SRAM

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Power & BIST

• Modern design and package technologies make external testing increasingly difficult, and BIST has emerged as a promising solution to the VLSI testing problem

• BIST is a DFT methodology aimed at detecting faulty components in a system by incorporating test logic on chip.

• In BIST, an LFSR generates test pattern

• LFSR-generated tests tend to take longer to reach acceptable levels of fault coverage, which increases the total energy consumption

• Test vectors applied at nominal operating frequency will have a higher average power dissipation than normal mode. This is because in normal mode, successive functional input vectors applied to a given circuit have significant correlation; the consecutive vectors of an LFSR generated test sequence have a lower correlation.

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Final Exam

• 6-7 questions

• Wire Engineering, SoC Design & Test, Low Power Design

– These broad topics will be equally represented

• Try to answer as much as you can

• I will be testing you on whatever I have taught

• Class Notes are very important

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