High Speed Interconnect Solutions
IT3 series
High-speed mezzanine
Connector System
March, 2010
HIROSE ELECTRIC CO., LTD.
© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved.
Rev RSM – April, 2010
Page 1
IT3 Series Design Overview
A New Standard Mezzanine for Flexibility and Performance
High Speed Interconnect Solutions
Flexibility:
Hirose’s IT3 mezzanine connector system is
as comfortable in today’s data rates of
PCIE and XAUI as it is in tomorrow’s 20+
Gbps systems.
With the ability to transmit differential,
single-ended, and power through one
package and being stackable from 15 – 40
mm, IT3 can solve your interface needs for
both current and future generations.
Detachable
(Mating) Side
Mating / Unmating
Features:
•Unique 3-piece structure for excellent
reflow solderability
•Differential, single-ended, and power
•Low mating/extracting forces
•Wide misalignment tolerances
•Stacking heights from 15 to 40mm
•Both SnPb and Pb-free are available
•Staggered 1.5mm x 1.75mm BGA
Flexible 3-piece design has many advantages
© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved.
Rev RSM – April, 2010
Page 2
Hirose IT3 vs. Competition
High Speed Interconnect Solutions
Hirose IT3
Amphenol NexLev
FCI GigArray
Pin counts :
Stack heights :
Signal density :
100/200/300
10mm to 40mm
73 diff pairs/inch
100/200/300
10mm to 33mm
73 diff pairs/inch
200/296
15mm to 40mm
66 diff pairs/inch
Sales channel :
Direct / Disty
Direct only
Direct / Disty
2nd Source :
Tyco
None
None
High ASP = $ 50 + per mated connector
© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved.
Rev RSM – April, 2010
Page 3
High Speed Interconnect Solutions
High Speed “Terms” to Know: Mechanical
•
•
•
•
BGA: Ball grid array interconnect system using reflow solder balls
Ground: An electrical connection between a circuit and the earth
Power: The rate of generation, transferring or using energy, measured in watts
Stack Height: Vertical distance measured in mm between PCB & connector
© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved.
Rev RSM – April, 2010
Page 4
High Speed Interconnect Solutions
Application Examples
Servers/
Storage
Base
Transceiver
Station
© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved.
Internet Routers
&Switches
Rev RSM – April, 2010
Page 5
Currently Available Variations
100 signals
200 signals
300 signals
10 x 10
20 x 10
30 x 10
Pb Mounting
In production
In production
In production
Pb Mating
In production
In production
In production
Pb-free Mounting
In production
In production
In production
Pb-free Mating
In production
In production
In production
12 mm
Under planning
Under planning
Under planning
14 mm
Under planning
Under planning
In production
15 mm
Under Development
In production
In production
17 mm
Currently no plan
In production
In production
20 mm
In production
In production
In production
22 mm
Currently no plan
In production
In production
25 mm
In production
In production
In production
26 mm
In production
In production
In production
28 mm
In production
In production
In production
30 mm
Currently no plan
In production
In production
32 mm
Currently no plan
In production
In production
35 mm
Under planning
Under planning
Under planning
38 mm
In production
In production
In production
40 mm
Under Development
In production
In production
Sockets
Interposers
High Speed Interconnect Solutions
Stacking Height
© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved.
Rev RSM – April, 2010
Page 6
Available Sales tools
High Speed Interconnect Solutions
2D Mechanical
Drawings
3D STEP
Files
Product
Brochure
Assembly and
Design Notes
SI Data
- General Presentation
- Modeling
- Detailed Test Reports
(Available by Stack Height)
- Test/Demo Board
Mechanical
Show & Tell
Samples
Sample Display
Cases
Coming
May 2010
Qualification Data
- L1 Environmental
Qualification Test Report
- L2 Long-term BGA
Reliability Test Report
- L3 Manufacturing Yield
Test Report
© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved.
Rev RSM – April, 2010
Page 7
High Speed Interconnect Solutions
Available Sales tools
Technical
Data
Technical
Document
No
Item
Format
File name (Ex.)
1
Simplified 3D model
STEP (SAT &IGES
are also available)
IT3M-300S-BGA.stp
2
Footprint data
Allegro
IT3M-300S-BGA.brd
3
Spice models
Spice
IT3-**H.sp
4
Touchstone model
Touchstone
IT3-300-**H.s60p
No
Item
Format
File name (Ex.)
or Document number
1
2D drawing
PDF
IT3M-300S-BGA.pdf
2
Spec sheets
PDF
IT3M-300S-BGA.pdf
3
Contact reliability report
PDF
TR0636E-10018
4
Eutectic thermal cycling test report
PDF
TR0636E-10026
5
Lead free thermal cycling test report
PDF
TR0636E-20128
6
Temperature rise report
PDF
TR0636E-20041
7
SI report
PDF
IT3-**H.pdf
8
Assembly note
PDF
ETAD-F0457
9
Design note
PDF
ETAD-F0347
10
Customer demo board test report
PDF
IT3_demo_board_v2.pdf
11
Characterization board test report
PDF
IT3_Characterization_Board_v09.pdf
From Assembly Notes and Design Notes; documents 3 through 6 are based on EIA spec.
© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved.
Rev RSM – April, 2010
Page 8
High Speed “Terms” to Know: SI
• Differential Signaling: Digital signals transmitted as the difference in voltage
High Speed Interconnect Solutions
of a pair of signal lines
• Gbps: = Gigabits per second; a unit data transfer rate/speed = 1k megabits per
second
• S. Parameter: Plots attenuation vs. frequency used to document connector
performance and is also known as insertion loss
• SI: = Signal Integrity; Process of analyzing and making appropriate system
design decisions
• Signal Ended Signaling: Signals transmitted over one wire using common
ground return
• Spice Model: Simulated program with integrated circuit emphasis
• Touchstone File: Also known as SnP file; intended for use with documents
and specifications for parameter data of active or passive interconnect network
© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved.
Rev RSM – April, 2010
Page 9
IT3 3-Piece Design Features & Benefits
Assembly friendly unique 3-piece
High Speed Interconnect Solutions
IT3 series mounting & mating procedure
“Mounting receptacle”
“Interposer”
“Mating receptacle”
Reflow-mounted on PCB
Installed onto “Mounting
receptacle” after reflow
Mated with “Interposer”
X-ray Inspection Friendly
X-ray inspection from bottom side
Low Thermal Mass
for Reflow process
No need
to reflow
For any stacking height combination,
receptacle is always same and its
height is 6mm only.
Small size of receptacle has wide
process window for reflow profile.
Lead-Free applications benefit from
our easy reflow process design.
Reflow receptacle only
1. Significantly reduces
frequency of false calls
2. Simple receptacle design
gives clear vision for X-ray
inspection.
© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved.
Rev RSM – April, 2010
Page 10
IT3 3-Piece Design Features & Benefits
Industry standard footprint
High reliable
BGA connection
*Patent Pending
0.75 mm
High Speed Interconnect Solutions
0.875 mm
IT3D/M -***S - BGA
Signal BGA
Ground BGA
IT3’s unique 3 piece design and construction gives industry
leading BGA reliability, while still providing the density of
73 differential pares per linear inch.
Drop-in replacement for NexLev
The IT3’s divided receptacle structure
reduces thermal stress and ensures longterm reliability of the BGA ball connection
with the PWB
Mating / Un-mating operation
HRS IT3 Series
Competitors’
: 10˚ acceptable
: Not acceptable
HRS IT3 Series
Competitors’
© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved.
: 3˚ acceptable
: Not acceptable
Rev RSM – April, 2010
Page 11
Lower force
Housing design
prevents pin stubbing
Insertion and Extraction
Pre-load structure
Contact normal force
Contact force (N)
High Speed Interconnect Solutions
IT3 3-Piece Design Features & Benefits
Spring workload
is decreased.
0
Displacement of spring
(mm)
IT3
IT3
Series
Supplier A
Appx. 200 pos.
90 N
145 N
Appx. 300 pos.
135 N
218 N
Existing
solution
Exposed contacts
© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved.
Rev RSM – April, 2010
Page 12
3-Piece Connector Assembly Benefit
19.7mm
High Speed Interconnect Solutions
PCB
6mm
2nd Reflow soldering compatible
IT3 connectors
IT3 series for 30mm (or any) stacking
height application
Other supplier for 30mm height application
May not suitable for 2nd
Reflow soldering due to
the weight.
Already confirmed that there
are no issues to mount Hirose
IT3 series connectors on the
bottom side of PCB for 2nd
reflow soldering by major CEMs.
© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved.
Rev RSM – April, 2010
Page 13
Solutions
Interconnect
Speed
High
Solutions
Interconnect
Speed
High
Robust and Reliable Solder Ball Attachment
Hirose IT3 series
Other connector & silicon device package
As a contact lead is positioned
into a solder ball, it prevents the
ball from pealing off during
severe shock &vibration test.
Uncontrolled co-planarity brings the migration of
solder ball from low to high temperature side
during reflow, which causes the soldering failure.
The countermeasures are to improve the excess
co-planarity or to implement the thicker metal
mask to cover such co-planarity.
Not to scale
After reflow soldering
Since the receptacle’s contact resides in the BGA ball,
the IT3 is very strong for shock and vibration.
(Patent Pending)
© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved.
Rev RSM – April, 2010
Page 14
High Speed Interconnect Solutions
Unique Interposer Design for Signal Integrity
Interposer
wafer
• Micro strip line structure
• Up to 6.25G bps with fully populated
pin assignment
• Over 10G bps with skipped pin
assignment for differential pairs
• Also can be used for power lines
Interposer wafer structure
Signal
Ground
Signal / Ground configuration
© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved.
Rev RSM – April, 2010
Page 15
High Speed Interconnect Solutions
IT3 vs. IT2
BGA grid
0.7 x 0.875 (mm)
1.0 x 1.0 (mm)
# of balls
Signal: 300
Ground: 270
Signal : 180
Ground : 200
56 x 19.2 x 6 (mm)
48.2 x 22.6 x 5.25 (mm)
Receptacle size
* Because of connector structure, IT2 cannot have pins skipped for
faster data transfer requirement.
© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved.
Rev RSM – April, 2010
Page 16
Hybrid (Selectively Loaded) Type Available
High Speed Interconnect Solutions
• IT3HY (85&100Ω) mating / internal structure
IT3D-100S-BGA
IT3HY-100P-38H
(schematic only)
85Ω QPI wafer
(typical for new Server applications)
Existing 100Ωwafer
(typical for Telecom applications)
IT3M-100S-BGA
© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved.
Rev RSM – April, 2010
Page 17
IT5 vs. IT3
High Speed Interconnect Solutions
• IT5 has improved ICR (with 8-aggressor FEXT) for 25 Gbps data
rate with plenty of margins.
12.5 GHz
Via stub
IT3
IT5
© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved.
Rev RSM – April, 2010
Page 18