Pioneers in Non-contact Measurement
MTI Instruments, Inc.
 Founded in 1961--now a
public company listed on
NASDAQ
 Designs, manufactures and
markets non-contact
measurement instruments and
systems for manufacturing
and laboratory applications
Company Profile
We apply our technical expertise in electronics,
optics and software to meet the precision
measurement needs of end-users and OEMs
 Key attributes of our products:
Non-contact
High resolution
Custom probe sizes
High frequency response
Accurate
Reliable
 Global sales, service and support network
 Total customer commitment
Company Profile
MTI Instruments, Inc.
PBS Group
Portable engine balancing
systems for the aircraft
industry
General Instruments
Group
Semiconductor
Products Group
Measurement probes and
electronics for laboratory
and industrial applications
Measurement systems
designed specifically for
the semiconductor
industry
Core Technologies
MTI Instruments employs three unique sensing
technologies to meet the diverse measurement needs of
our customers
 Accumeasure - Capacitance
Displacement
Thickness
Micro-positioning
 Microtrak - Laser triangulation
Robotic Control
Flatness
Dimensional Measurement
 Fotonic - Fiber Optic
Vibration
Positioning
Modal Analysis
Semiconductor Products Group
MTI Instruments offers a complete line of semiconductor
metrology systems to meet the stringent requirements
of the industry
 Proforma™ 300 - Manual wafer thickness measurement
 Proforma™ 300GR - Manual thickness and resistivity in
single compact design
 Proforma™ 200 SA - Semi-Automated wafer surface
mapping
 Proforma™ AutoScan 200 - Fully automated wafer
mapping system
PROFORMA Wafer Thickness
Measurement Systems
 Based on MTI’s proprietary Push-Pull capacitance
technology
 Ideal for both semiconducting and semi-insulating
materials
 Manual, semi-automated and fully-automated models for
laboratory and manufacturing process applications
Push-Pull Probes
 Single Sensing Face
 Constant current supply, linear
voltage change based on air gap
 Electrical grounding of target
required
 Dual Sensing Element
 No electrical grounding of target
required
 Ideal for highly resistive materials
Semiconductor
Applications
Wafer Specifications
 Material: Semiconducting and Semi-Insulating
 Diameter: 50 - 200 mm.
 Surface: As-Cut, Lapped, Etched, Polished, Patterned
 Flat/Notch: All SEMI standard Flat(s) or Notch
 Conductivity: P or N type
 Mounting: Bare Wafer, Sapphire/Quartz, Tape
Process Monitoring
 Slicing: Blade and wire guide degradation monitoring
 Lap/etch and Polishing Removal Rates
 Backgrinding
 Final Inspection
PROFORMA 300
 Manual, non-contact wafer
thickness gage
 Thickness, TTV, continuous
and 5-point measurement
 Measures diverse materials
without re-calibration
 Output data to any PC
 Portable, easy to set up and
operate—ideal for SPC
PROFORMA 300
Key Features
Teflon wafer stage for
easy non-abrasive
positioning
High-resolution
LCD display
Proprietary
Push-Pull™
probe
technology
Adjustable stage for
precise leveling
On-board microprocessor
for accurate, repeatable
measurement
Menu-driven for fast, easy setup
PROFORMA 200 SA
 Semi automated operation
 Windows® based control
interface
 Measures thickness, bow,
warp, global and site flatness,
TTV
 Complete wafer surface
mapping
 Multiple chucks for all wafer
sizes
 Economical alternative to
fully automated system
PROFORMA AUTOSCAN 200
 Fully automated wafer
measurement system for
semiconducting and semiinsulating materials
 Thickness, TTV, bow, warp,
resistivity, site and global
flatness
 Outstanding accuracy and
repeatability
 Integrated, modular design
PROFORMA AUTOSCAN 200
 Standard Windows NT user interface for easy set-up.
 Choose from standard or user-programmable wafer scan
patterns to mach your measurement needs.
PROFORMA AUTOSCAN 200
 Precise site flatness measurements are obtained
through programmable wafer and site geometries.
PROFORMA AUTOSCAN 200
 Automated, full surface scanning allows for
3-dimensional imaging of wafer profile.
PROFORMA AUTOSCAN 200
System Features
 Completely automated wafer handling and surface
scanning
 Measures all wafer materials --Si, Ge, GaAs, InP
 Full 1000 um thickness measurement range without recalibration
 Measures wafers from 75-200 mm. in diameter;
 100 wafer/hour throughput
 Universal robot end effector
 Automatic detection of wafer diameter
 Laser cassette scanning detects crossovers, empty slots,
broken wafers
PROFORMA AUTOSCAN 200
System Features (continued)
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SEMI compliant modular design
Integrated control system
Ethernet network interface
Customized data reporting
Enclosed environment for Class 10 compatibility
Optional laser OCR mark reading and resistivity modules
The new standard for measuring semiconducting
and semi-insulating wafers