ELMO - Miniaturising Electronics
ELMO
The objective of the ELMO Programme is to build a widely
applicable knowledge base for the coming years so that the
focus is on the core competence of the electronics sector.
The criteria set for the central themes of the programme,
in other words, for the development trends, are miniaturisation,
integration, and cost-efficiency.
 Duration: 2002-2005
 Estimated volume: 100 million euros,
of which Tekes accounts for approximately
50 million euros
 Programme Manager: D.Sc. Pentti Koskinen,
Tietoneuvos Oy
 Further information:
www.tekes.fi/english/programmes/ELMO
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Vision-oriented objectives
ELMO
 To promote the technological leadership of
Finland in the sub-areas that are critical from
the point of view of the electronics sector
 To create basis for new business
opportunities
 To accumulate high technology knowledge by
encouraging research institutes and enterprises to participate in long-term research
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Vision-oriented objectives
ELMO
 To develop the innovation environment by
enhancing interaction between universities,
research institutes and companies
 To develop co-operation networks and management
of the value chain
 To encourage small and medium-sized enterprises
to renew their operations
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Scenario-oriented results
ELMO
 Intelligent systems
 take into consideration the
development trends
 miniaturisation
 integration
 cost-efficiency
 Optoelectronics and its opportunities
 new business area
 Efficient design processes
 take into consideration the
core electronics’ value chain
 Cost-effective productivity
 takes into consideration the
core electronics’ value chain
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Example of a smart system
ELMO
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Key ELMO technologies
ELMO
 Micro-electronics and its materials
 especially the research on silicon, compound semiconductors and optical materials, substrates, and
packaging, together with the related processes,
analyses and characteristics
 Manufacturing, production, and testing
 module precision mechanics and manufacturing
 mechatronics and product processes
 Integrated systems resulting in a tested prototype
 System on Chip
 System on Package
 MEMS ...
 Future technologies
 includes long term research projects and preliminary
surveys that are used to steer the ELMO Programme to
new innovative directions
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Generic technologies supporting the value chain
ELMO
 Embedded software and generic
middleware, software platforms
 Tools and methods
 Integrated design
 Modelling and simulation
 Reliability
 Reliability and environment
 Tools
 Methods
 Impact of environmental
requirements on reliability
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Clusters and project examples
Situation in 2002
ELMO
 Future technology
 Printing optoelectronics
 Ultrafast optical
telecommunications
 DSP Systems and
Wireless sensors
 Molecular electronics and
fotonics
 Micromaterials & Processes
 Package and integration
 Production
 Passive and active
components
 Wires, …
 Intelligent systems
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SoP
MEMS
ASIC+RF
Ubi
Optical systems
Sensors
Receivers and
Transmitters
 Low power and low
voltage system
 Distributed power systems,
...
 Tools
 Life long testability
 Environmental factors, …Docs 39889
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List of research projects
ELMO
Technical Research Centre of Finland (VTT),Espoo
- ElectroMechanical Microcomponents for Precision Applications
University of Jyväskylä
- Miniatyrizing Sensors
University of Oulu
- Distributed Power Supply Dynamics
Tampere University of Technology
- Component integration
Tampere University of Technology
- Use of flip-chip techniques in industrial applications
Helsinki University of Technology
- Implications of IPP and EU environmental directives on future activities of electrical and electronics enterprises
Technical Research Centre of Finland (VTT),Espoo
- Removal of heavy organic compounds with aqueous ozone processes
Technical Research Centre of Finland (VTT)
- Monolithic integration of SOI micromechanics and electronics
Technical Research Centre of Finland (VTT)
- Chemical-mechanical planarisation of silicon wafers
Tampere University of Technology, Optoelectronics Research Centre, ORC
- Towards Lighter Technologies
Tampere University of Technology
- Lead free components, their connections and mechanical testing
University of Oulu
- Testability development of integrated mixed-signal circuits
List of research projects
ELMO
University of Oulu
- LP/LV CMOS circuit block development for sensor micromodules
University of Oulu
- Additive precise circuit patterns
Helsinki University of Technology
- Integration of Radiocommunication Circuits (RADINT)
Helsinki University of Technology
- Self-organized molecular electronics and photonics (SOMEP)
Technical Research Centre of Finland (VTT),Oulu
- Optics on future printed circuit board in high speed data transmission applications
Tampere University of Technology
- Flexible Design Methods for DSP Systems
Technical Research Centre of Finland (VTT),Oulu
- Printing optoelectronics
Helsinki University of Technology
- Impact of Miniaturization on Manufacturing and Reliability of Electronics
Technical Research Centre of Finland (VTT)
- New technologies for passive integration and ALCVD dielectics for mircoelectronics
Helsinki University of Technology, Electronic Circuit Design Laboratory
- Information Processing via Nonlinear Dynamics and Bifurcation Theory
Helsinki University of Technology
- Environmental and life cycle issues in design and R&D activities of electrical and electronics enterprises
Kajaani Polytechnics
- Feasibility study on introduction and testing new
electronics manufacturing technologies in Kajaani region
Technical Research Centre of Finland (VTT),Tampere
- Intelligent tyre development