Foundry Service Request Form
0.18 μm ADDENDUM
This document must be provided in addition to the Foundry Service Request Form ENG-21,
whenever a layout database in 0.18μm process is supplied for Foundry services at ams AG.
Seven Digit Document: ENG-21A
Revision No. 7.1, Feb 2013
Page 1 of 3
C18 Form
Device No
Design Kit
ams AG / Version:
IBM / Version:
Pad Count
IP included
Number of Metals
Choose one
Specify if other:
Note: For MPW service only 6 metal layers possible.
Process Options
Comment
Available
for MPW
Service
2 additional masks
Yes
3 additional masks
5 additional masks
1 additional mask
1 additional mask (1 mask shared
with option 2)
2 additional masks (2 masks
shared with option 2)
1 additional mask
2 additional masks
1 additional mask
1 additional mask
No
Yes
No
2 additional masks
No
2 additional mask
1 additional mask
1 additional mask
1 additional mask
2 mask replacement
No
Yes
Yes
Yes
No
1 additional mask (shared with
option 12)
No
18) 19)
-
No
Yes
No
22)
-
Yes
21)
-
No
Exclusions
1) 1.8V High-Threshold Voltage (High-Vt) NFET and
PFET
2) 2.5V/3.3V NFET and PFET
3) 5V NFET and PFET
4) Triple Well NFET
Checkbox
3)
2)
5) 1.8V Zero Vt NFET
6) 3.3V Zero Vt NFET
7)
8)
9)
10)
11)
12)
13)
14)
15)
16)
17)
18)
19)
20)
21)
22)
MIM Capacitors: 2.05 fF/µm²
Dual MIM Capacitors: 4.10 fF/µm² (includes MIM)
High K dielectric MIM Capacitors: 4.10 fF/µm²
High Density MIM Capacitors: 2.7 fF/µm²
High Density Dual MIM Capacitor: 5.4 fF/µm²
(includes High Density MIM – do not select both)
Hyperabrupt Varactor (HA)
High Res Polysilicon (RR) Resistor 1600 Ω/sqr
Precision Polysilicon (RP) Resistor 165 Ω/sqr
BEOL Metal Level Resistor (K1) 61 Ω/sqr
Dense SRAM
Schottky Barrier Diode: Vf (5x5 µm²)= 335
mV@10 µA
ML last Metal
AM last Metal
MA last Metal (Dual Copper Metal)
DV Passivation (Wirebond) with Polyimide
Coating
DV Passivation (Wirebond) without Polyimide
Coating
U.S. Import/Export Control
8) 9) 10) 11)
7) 9) 10) 11)
7) 8) 10) 11)
7) 8) 9) 11)
7) 8) 9) 10)
19) 20)
18) 20)
No
No
Yes
Yes
No
No
Important note: ams AG must provide the following information for every design fabricated at IBM,
respectively also every design that is entered at ams AG through our MPW partners Mosis, Fraunhofer
IIS, CMP or Europractice.
Does this product fall under the International Traffic in Arms Regulations (ITAR)?
Choose one
Important note: ams AG does not manufacture products which are covered by ITAR.
Does this product endanger human life in case of non-functionality (Hazardous Use)?
Choose one
Important note: If this question is answered with "Yes", it has to be approved by ams AG.
Does this product contain cryptographic function (i. e. information security) beyond password authentication or
digital signature?
Choose one
Export Control Classification Number (ECCN)
This ECCN code must reflect the basic electronic chip function and intended application for which chip is used. The ECCN codes are derived by using documentation from
the Export Administration Regulations Database
Description of the basic electronic chip function
ECCN:
Application for which chip is used
ECCN:
The following ECCNs are not acceptable:
(3A001.a.3.b, a.4, a.10, a.11) or
(3A991.f, .n)
Intended Disposition
BIS 711 Export Trade Form supplied
In case your device is processed through our Foundry Partner MOSIS, this form must be filled in for each project. Please contact ams Foundry for
further details or check here: http://www.bis.doc.gov/licensing/bis711.pdf
Rev: 7.1, Feb 2013
Choose one
Choose one
Page 2 of 3
Copyright © 2013 ams AG. Trademarks registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the
copyright owner. To the best of its knowledge, ams asserts that the information contained in this publication is accurate and correct.
H18 Form
Device No
Design Kit
ams AG / Version:
IBM / Version:
Pad Count
IP included
Choose one
Number of Metals
Specify if other:
Note: For MPW service only 6 metal layers possible.
Process Options
Comment
Available
for MPW
Service
2 additional masks
Yes
3 additional masks
5 additional masks
(3 masks shared with option 2)
3 additional masks
(2 masks shared with option 2)
Yes
1 additional mask
2 additional masks
1 additional mask
Yes
Yes
No
2 additional masks
No
1 additional mask
1 additional mask
1 additional mask
2 mask replacement
Yes
Yes
Yes
No
14)
-
Yes
13)
-
No
Exclusions
Checkbox
1) 1.8V High-Threshold Voltage (High-Vt)
substrate based and isolated NFET and PFET
2) 5V isolated NFET and PFET
3) 5V substrate based NFET and PFET
4) 20V Gate oxide module for all 20V gate oxide
NFETs and PFETs
5) MIM Capacitors: 2.05 fF/µm²
6) Dual MIM Capacitors: 4.10 fF/µm² (incl. MIM)
7) High Density MIM Capacitors: 2.7 fF/µm²
8) High Density Dual MIM Capacitor: 5.4 fF/µm²
(includes High Density MIM – do not select
both)
9) High Res Polysilicon (RR) Resistor 1600 Ω/sqr
10) Precision Polysilicon (RP) Resistor 165 Ω/sqr
11) BEOL Metal Level Resistor (K1) 61 Ω/sqr
12) Dense SRAM
13) DV Passivation (Wirebond) with Polyimide
Coating
14) DV Passivation (Wirebond) without Polyimide
Coating
U.S. Import/Export Control
6) 7) 8)
5) 7) 8)
5) 6) 8)
5) 6) 7)
Yes
Yes
Important note: ams AG must provide the following information for every design fabricated at IBM,
respectively also every design that is entered at ams AG through our MPW partners Mosis, Fraunhofer
IIS, CMP or Europractice.
Does this product fall under the International Traffic in Arms Regulations (ITAR)?
Choose one
Important note: ams AG does not manufacture products which are covered by ITAR.
Does this product endanger human life in case of non-functionality (Hazardous Use)?
Choose one
Important note: If this question is answered with "Yes", it has to be approved by ams AG.
Does this product contain cryptographic function (i. e. information security) beyond password authentication or
digital signature?
Choose one
Export Control Classification Number (ECCN)
This ECCN code must reflect the basic electronic chip function and intended application for which chip is used. The ECCN codes are derived by using documentation from
the Export Administration Regulations Database
Description of the basic electronic chip function
ECCN:
Application for which chip is used
ECCN:
The following ECCNs are not acceptable:
(3A001.a.3.b, a.4, a.10, a.11) or
(3A991.f, .n)
Intended Disposition
BIS 711 Export Trade Form supplied
In case your device is processed through our Foundry Partner MOSIS, this form must be filled in for each project. Please contact ams Foundry for
further details or check here: http://www.bis.doc.gov/licensing/bis711.pdf
Rev: 7.1, Feb 2013
Choose one
Choose one
Page 3 of 3
Copyright © 2013 ams AG. Trademarks registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the
copyright owner. To the best of its knowledge, ams asserts that the information contained in this publication is accurate and correct.