MIO-2261 Sales kit
MI/O-Ultra (Pico-ITX SBC)
Intel ATOM N2600/N2800
Embedded Stackable Board Computer
PM Victor.Huang
Victor.huang@advantech.com.tw
May, 30, 2012
MIO-2261 Compelling Features
Intel® Atom N2600/N2800 Pico-ITX SBC with 18/24-bit LVDS/ VGA/ LAN/Halfsize Mini-PCIe/ 2COM/ 1 mSATA/ 4 USB2.0/MIOe
Intel N2600/N2800+ NM10, DDR3 1066 SO-DIMM
N2600 1.66G / N2800 1.86G DC
Dual Core Processor with All Fan-less Design
Smallest SBC w/ 100x72mm size (same as 2.5” HDD)
with MIOe extension flexibility
Low Power Consumption (Kit TDP: 5~8W)
DirectX 9, MPEG2 (H/W acceleration)
H.264/ VC1/ WMV9 (H/W Decode/Acceleration)
12V DC Power input ,Support DC power hot plug
15KV Air ESD protection COM port design
TVS design for power ESD/EFT protection
Power
connector
Lockable
DC Jack
1GbE-Intel LAN/ HD Audio
2 COM/ 4 USB2.0/ 1 mSATA/ 8-bit GPIO/ SMBus/I2C/
MIOe Extension / Half-size Mini PCIe
Support SUSI Access
Supports Embedded Software API and Utility
WinCE7.0, XP, XPE, Win7,WES7,QNX,Vxwork Support
2018/Q4 Longevity
MIO-2261 spec
MIO-2261 Block Diagram
Board Layout-Top
VGA
Power button
/HDD LED
/Power LED
HD Audio
(Line-in, Line-out)
18/24-bit
LVDS
2x RS-232
DDR3 SO-DIMM Socket
Board Layout-Bottom
VGA
2xUSB2.0
1 GbE LAN
12V DC input
SATA
LCD Power Selection
/Auto Power On
MIOe
(SMbus, 2 x USB2.0,
2 x PCIe, line-out,
LPC, 5Vsb/12Vsb)
mSATA
Inverter
2xUSB2.0 GPIO
SMBus
Half-size Mini PCIe
MIO-2261 MIOe supported interface
Considering most demands from customer and future chipset trends (~2013Y new platforms)
Interface
Number
MIO-2261
Supports
Display port
1
Yes
GP PCIE
4
Yes
(2 x PCIex1)
USB 3.0
USB 2.0
1
2
N/A
Yes
Super speed storage, capture card, HD Webcam & display
interface…
LPC
1
Yes
Legacy bus & Multi-UART, PS2 KB/MS, GPIO, FDD, IR, Parallel
port from LPC I/O…
HD Audio
(Line-Out)
1
Yes
Line out, keep flexibility with selected amplifier…
SMBus
1
Yes
Implementation for GPIO control, Smart battery/ Charger, W/R
EEPROM or System communication…
Power Control
3
Yes
Reserved
Functions can be
HDMI, LVDS, DVI, CRT or eDP display interface…
Gigabit Ethernet, USB 3.0, SATA/RAID, FPGA or PCI
expansion…
Yes
VCC
+12VSB
Yes
2A for MIOe module
VCC
+5VSB
Yes
3A for CPU board and MIOe module totally
GND
Yes
Order Information
Packing List
Embedded OS/API
Coast Line (Rear IO)
Model
Rear I/O
MIO-2261N-S6A1E LAN + 2USB + VGA
MIO-2261N-S8A1E
MIO-2261
(by request)
LAN+ 2USB + VGA + DC Power Jack
Photo
Thermal Solution
Standard Thermal Solution
Model
MIO-2261N-S6A1E / MIO-2261N-S8A1E
Photo
Description
CPU Heatsink Dimension: 99.5(L)* 70.5(W)*15.7(H)mm
Total height including CPU board + heatsink is 33.48(H)mm
Optional Thermal Solution
Model
Photo
Description
Heat Spreader Dimension: 99.5(L)* 70.5(W)*11.2(H)mm
Total height including CPU board + heat spreader is 29(H)mm
MIO-2261 Advanced Technology

Intel Atom Cedar Trail Ultra Low Power Solution
Ultra Low Power Consumption, all comes with Dual Core processors:
 N2600 1.66G Dual Core: TDP of Intel bundle kit is 5 Watts
 N2800 1.86G Dual Core: TDP of Intel bundle kit is 8 Watts
Fan-less Design:
 All Fan-less low profile heatsink design

Multiple Display Support & H/W Decode
Dual independent display : VGA + 18/24-bit LVDS
 Support additional 48-bit LVDS, HDMI , or DisplayPort through MIOe eDP
Graphic Engine and H/W Decode:
 DirectX 9 and OpenGL3.0 support
 Hardware decode H/W acceleration: MPEG2
 H/W Decode/Acceleration: H.264/ VC1/ WMV9


DC Power Hot Plug Protection Design



Good to protect board in case direct power in and damage the board and system.
COM Port 15KV ESD Protection Design
TVS (Transient Voltage Suppressor)design for power ESD/EFT
protection
Design for Ruggedize Solution
--- Advantech MIO-2261
• MIO-2261 is designed with 100% Solid Capacitors (固態電容)
 Higher tolerance for high frequencies & high temperature
 With better MTBF compared with Electrolytic Capacitors
 No more exploding capacitors
 More reliable solution if using Solid capacitors than Electrolytic capacitors
• High ESD Protection for RS-232 I/O Pins to ±15kV
 IEC61000-4-2 Air Gap Discharge: ±15kV
 IEC61000-4-2 Contact Discharge : ±8kV
 Human Body Model: ±15 kV
• Rugged Design on Selected Components
Wide temperature design and test criteria: Power/ Clock generator/ Sequence
PCB Type: TG-150 as PCB type, much reliable in high temperature environments.
Reliable Power Design


The power tolerance range is 12V +/-10%
MIO-2261 is designed with Power Hot Plug protection IC
design
–
To avoid pulse current to damage the board when DC power hotplug
directly
MIO-2261
DC Power adapter
Performance benchmark (CPU Arithmetic
Benchmark-ALU, FPU)
+ 16%
+ 104%
+ 96%
MIO-2261
(N2800 1.86GHz)
MIO-2261
(N2600 1.66GHz)
PCM-3362
(N450 1.6G)
Sliverthrone XL
(Z530 1.6G)
Intel Tunnel
(E660 1.3G)
Performance benchmark (Processor
MultiMedia - Integer, Float Point)
+ 17%
+ 102%
+ 94%
MIO-2261
(N2800 1.86GHz)
MIO-2261
(N2600 1.66GHz)
PCM-3362
(N450 1.6G)
Sliverthrone XL
(Z530 1.6G)
Intel Tunnel
(E660 1.3G)
Power consumption
12
10.32 Watts
9.6 Watts
10
8
9.12 Watts
7.68 Watts
5.5 Watts
Typical
(Win. Idle Mode)
6
4.2 Watts
4
2
0
MIO-2260
MIO-2260
(N4551.66GHz)
1.66GHz)
(N455
MIO-2261
MIO-2261
(N2800
1.86GHz)
(N2800 1.86GHz)
MIO-2261
MIO-2261
(N2600
1.66GHz)
(N2600 1.66GHz)
Max
(Test in HCT1.2)
Graphic Performance- 3DMark 2006
N455 to N2800
244% increase
N455 to N2600
130% increase
MIO-2261
(N2800 1.86GHz)
MIO-2261
(N2600 1.66GHz)
MIO-2260
(N455 1.66GHz)
Pico-ITX Competitor Comparison
MIO-Ultra Target Applications
HMI (Human Machine Interface)
Home Automation
Ultra Low Power Demand
POS/ KIOSK
Portable Device
Measurement Instrument
Machine Automation
Medical
New Form factor
MI/O-Ultra Introduction
Why a New Form Factor – MI/O Extension
- Takes New Position between SBC and COM
The SPEC on standard SBC
can’t be fulfilled if need
additional I/O change
The customer needs a board
easier for system integration
The customer hopes to keep
domain knowhow through
easier way
Time to Market
Time to Profit
 Resource: Need redesign PCB to fulfill the SPEC
requirement
 Options: Go ODM or SOM projects for
customized demand, need higher quantity & NRE.
 Less cabling: less problems and cost on assembling.
 Concentrated thermal design: make thermal design
be easier in customer’s system integration.
 Documentation: customer can keep domain
knowhow to design their own I/O module by
referring to Advantech design guide & SPEC.
Save development schedule and cost: Choose
one platform based on MI/O Extension structure,
just change I/O module can approach different
applications in a short time.
Positioning on Different Solutions
MI/O Extension
Single Board Computer
Computer On Module
Readiness
100%
(I/O module only by demand)
100%
60~80%
(Need bundle carrier board )
Flexibility
Middle
Low
High
Low ~ Middle
(design I/O module if needed)
Low
High
(design carrier board)
Middle
Middle
High
Short ~ Middle
Short
Long
146*102mm
100*72mm
146*102mm
Q7, ETX, COM-Express,
COM-Ultra...
Yes
(design I/O module)
No
Yes
(design carrier board)
 Only lack few I/O interfaces
 Sensitive on pricing
 Tight development schedule
 With RD ability who can
design I/O module.
Need single board solution
Need wide-range choices
Time to Market
 Complicated SPEC demand
RD Resource
Pricing
Develop
Schedule
Dimension
Keep domain
knowhow
Target
customer
 With exists COM carrier board
 With senior RD ability who
can design power sequence and
I/O functions.
MI/O Extension Features
Product Line Positioning
MI/O-Ultra Market Position
Smallest Size SBC with Maximum Flexibility
Ultra Small Size (100x72mm)
Flexibility from M/O Extension
Competitive price with simple I/O
Ultra Low Power (<8W)
Easy for System Integration
20% size reduction of PC/104
Portable Device
Small HMI/PPC
Embedded Instrument
In- vehicle
Home Automation
MI/O Extension-Ultra (Pico-ITX)
Heat Spreader
Easy system integration
RAM Module
Heat-generated parts
Right angle connector
Unified rear IO
MIOe extension
Ultra small from factor w/ 100x72mm size
Heat-generated
parts on TOP
Heat-generated
parts on TOP
Rear IOEasy
and connector
on BOT solution
to make thermal
Unified rear IO with less cabling
Optional heat
spreader
Install
Heat Spreader
conduct heat to chassis cover for
Right
angle connector
better thermal
solution
Easy system
and cabling
Installintegration
MIOe module
FlexibilityFlexibility
from MIOe
extension
and unified
multiple
interfaces
Secure core knowledge
on MIOe modules
MIOe extension design guide for reference
Unified multiple interfaces
Less design effort
,
Comparison with other SBCs
MI/O Extension-Ultra series
(PICO-ITX)
PC/104 Series
3.5" Small form factor
Items
Dimension
100*72mm
(20% reduction of PC/104 size)
96*90mm
146*102mm
Coast Line
Yes
No
Yes
System Integration
Simple
Complex
Medium
Pricing
Low
High
(PC/104 connectors are expensive)
Medium
Flexibility
High
Low
Medium
Anti-Vibration
Middle
High
(Good with salf-stacking long pin and
mounting holes)
Medium
Extended Temperature
No
Yes
Yes
Ruggedized Support
Low
High
Medium
Power Consumption
Ultra Low power (<8W)
Ultra Low power/ Low power (<10W)
Low power (<15W)
Expansion
MIOe
(PCIe,
DP,USB2.0/3.0,SMBus,LPC,Audio,
S3/S5, Power,reset)
Lagacy PC/104 or PCI-104
Lagacy PC/104, PCI-104, or
MIO/160(PCI/USB2.0/PCIe/LPC/SDVO/Smbus/Pow
er)
iManager Support
No
Lite version
Yes (support after PCM-9364 and 9389)
Power Type
AT 12V+/- 10%
AT 5V+/- 5%
AT 12V+/- 10% or 5V+/- 5%
Applications
Portable device
Small HMI/Instrument/PPC
Flight or car entertainment
Transportation
Factory Automation
Outdoor applications
Transportation
Factory Automation
Medical
Digital Signage/ PPC
Flexibility Possibilities
MI/O Extension SBC+ MIOe Expansion Module = Vertical Applications
MIOe Module A
MI/O A
MIOe Module B
MI/O B
MIOe Module C
Your own MIOe design !
Unified MIOe for MIO Extension SBC
Interfaces are considered including most demands from customer and future chipset trends
Interface
Number
Functions can be
DisplayPort
1
HDMI, LVDS, DVI, CRT or eDP display interface…
PCIe x 1
4
Gigabit Ethernet, USB 3.0, SATA/RAID, FPGA or PCI expansion…
USB 3.0
USB 2.0
1 or 0
1 2
Super speed storage, capture card, HD Webcam & display
interface…
LPC
1
Legacy bus & Multi-UART, PS2 KB/MS, GPIO, FDD, IR, Parallel port
from LPC I/O…
HD Audio (Line-Out)
1
Line out, keep flexibility with selected amplifier…
SMBus
1
Implementation for GPIO control, Smart battery/ Charger, W/R
EEPROM or System communication…
VCC (Power)
+12VSB
VCC (Power)
+5VSB
GND
MIO Positioning
Easy
System
Integration
Cost
Effective
Minimum
Design Effort
MIO
Secure
Core
Knowledge
Flexibility/
Vertical
Market
Compact
Chassis
Design
SUSIAccess
Smart Access To Embedded Devices
Integrated Device Monitoring, Configuration & System Recovery
1
Device
Monitoring
2
Remote
Configuration
3
System
Recovery
Core Features

Centralized Device Monitoring
–
–
–

Integrated Remote Configuration
–
–
–

Collects all embedded device data
Displays data in a customized dashboard
Auto notifies errors via warning popups and e-mail alerts
Remotely adjust embedded device settings
Transfer files to a remote device for firmware or application updates
Remote diagnostics via screen captures, hardware log analysis, and
windows XP event log files
One-Click System Recovery
–
–
–
Back-up complete system and files any time
Restore a system
Smart back-up saves images to offsite FTP
Centralized Device Monitoring

On CPU/SYS Temp, Fan Speed, Voltage & Modules
Integrated Remote Configuration

For Power On/Off, Display, Volume & File Transfer
Advantech Peripheral Modules Solution
Peripheral Highlights
SQFlash
•
•
•
PATA/SATA/USB
Full Range
Wide Temp.
SQRAM
•
•
•
•
Wide Temp.
30u Plating
Fix Die
Thermal Sensor
Wireless
•
•
7 years Longevity
Wide Temp.
Touch/Display
•
•
•
Wide Temp.
High Brightness
Various Interface
SQFlash – Smart & Quality Flash Module
Leading Technology
•
•
•
•
Fragment Writing – better endurance, performance
GuaranteedFlush – robust mDDR cache
Power Failure Protection
OS Mutual – High random access
Full Range Interface/Form Factor
•
•
•
•
PATA, SATA, CF, CFast, USB, mPCIe, SD
Wide Temp. modules for both SLC & MLC
Flexible firmware and software customization
Security features
SQRAM – Smart & Quality Memory Module
Rugged Specification
•
•
•
•
•
Fixed Die with Samsung memory chip
Extra-thick 30u" gold-plated contact pins
Stable operation in extreme temp. (-40° to 85ºC)
Industrial grade capacitors ensure voltage stability
Thermal Sensor & software package
Sorting Mechanism
•
•
•
•
•
10G vibration
Low temp. (-40 ℃) & high temp. (+85 ℃) burning
Thermal shock stress test
VDD, Frequency Margin test
Power Cycling, application test
Embedded Wireless Module
Industrial WiFi Module
•
•
•
•
•
•
•
7 years longevity
Stable operation in extreme temp. ( -40° to 85ºC)
Cisco CCX 4.0 certified
Seamless roaming between respective APs
Support Intel Active Management Technology 7.0
Industrial leading power consumption
Multiple OS support
Full Range Solution/ Interface/ Form Factor
•
•
•
•
•
Frequency band: 2.4GHz and 5/2.4GHz
Data Rates: 802.11n 1T1R, 2T2R and 3T3R
Form Factor: Full-size and Half-size mini PCIe, mini PCI and USB
Signal Protocol: PCIe, PCI and USB
Solution type: WiFi module and WiFi + Bluetooth module
Industrial Display add-in Touch Solution
Rugged Display Solution
• Full range of size support from 5.7” to 42”
• Wide operation temp from -20~ 70 degree C
• IP54 rating for water and dust proof (ITM series)
• Backlight MTBF support of 50K hours
Touch enhancement
• 5 years longevity
• Widely Input flexibility
• Various interface for each application
Thank You
Contact product manager for any further information
Victor.Huang@advantech.com.tw