VLSI Testing
Lecture 1: Introduction
Dr. Vishwani D. Agrawal
James J. Danaher Professor of Electrical and
Computer Engineering
Auburn University, Alabama 36849, USA
vagrawal@eng.auburn.edu
http://www.eng.auburn.edu/~vagrawal
IIT Delhi, Aug 17, 2013, 10:00-11:00AM
Copyright 2001, Agrawal & Bushnell
Lecture 1 Introduction
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Course Description
This course is designed for the MTech program
in VLSI at IIT, Delhi. It is patterned after a onesemester graduate-level course offered at
Auburn University. A set of 17 lectures that
include classroom exercises provide
understanding of theoretical and practical
aspects of VLSI testing. The course fulfills the
needs of today’s industrial design
environment, which demands knowledge of
testing concepts of digital, memory, analog
and radio frequency (RF) subsystems often
implemented on a system-on-chip (SoC).
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Outline
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Lecture 1:
Lecture 2:
Lecture 3:
Lecture 4:
Lecture 5:
Lecture 6:
Lecture 7:
Lecture 8:
Lecture 9:
Lecture 10:
Lecture 11:
Lecture 12:
Lecture 13:
Lecture 14:
Lecture 15:
Lecture 16:
Lecture 17:
Introduction (18*+2) * Number of slides
Yield and quality (16+3)
Fault modeling (20+2)
Testability analysis (27)
Logic simulation (15)
Fault simulation (19)
Combinational ATPG (24+3)
Sequential ATPG (19+2)
Delay test (26)
Memory test (26)
Analog test (27)
Model-Based and Alternate Test (15)
DFT and Scan (23+2)
BIST (29)
System diagnosis (21)
RF Testing: Introduction, Gain Measurement (39)
RF Testing: Intermodulation and Noise Measurements (34)
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Schedule
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Aug 17, 2013 – 10AM-12PM Lectures 1 and 2
Aug 19, 2013 – 2:30-4:30PM Lectures 3 and 4
Aug 20, 2013 – 2:30-4:30PM Lectures 5 and 6
Aug 21, 2013 – 2:30-4:30PM Lectures 7 and 8
Aug 23, 2013 – 2:30-4:30AM Lectures 9 and 10
Aug 24, 2013 – 10AM-12PM Lectures 11 and 12
Aug 24, 2013 – Take-Home Exam assigned
Aug 26, 2013 – 2:30-4:30PM Lectures 13 and 14
Aug 27, 2013 – 2:30-4:30PM Lectures 15 and 16
Aug 28, 2013 – 2:30-4:30PM Lectures 17
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Aug 28, 2013 –Take-Home Exam due 4:30PM
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Introduction
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VLSI realization process
Verification and test
Ideal and real tests
Costs of testing
Roles of testing
A modern VLSI device - system-on-a-chip
Testing
Digital
Memory
Analog
RF
Textbook
Problem to solve
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VLSI Realization Process
Customer’s need
Determine requirements
Write specifications
Design synthesis and Verification
Test development
Fabrication
Manufacturing test
Chips to customer
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Definitions
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Design synthesis: Given an I/O function, develop a
procedure to manufacture a device using known
materials and processes.
Verification: Predictive analysis to ensure that the
synthesized design, when manufactured, will perform
the given I/O function.
Test: A manufacturing step that ensures that the
physical device, manufactured from the synthesized
design, has no manufacturing defect.
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Verification vs. Test
Verification
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Test
Verifies correctness of
design.
Performed by simulation,
hardware emulation, or
formal methods.
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Performed once prior to
manufacturing.
Responsible for quality of
design.
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Verifies correctness of
manufactured hardware.
Two-part process:
1. Test generation: software
process executed once
during design
2. Test application: electrical
tests applied to hardware
Test application performed on
every manufactured device.
Responsible for quality of
devices.
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Problems of Ideal Tests
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Ideal tests detect all defects produced in the
manufacturing process.
Ideal tests pass all functionally good devices.
Very large numbers and varieties of possible
defects need to be tested.
Difficult to generate tests for some real defects.
Defect-oriented testing is an open problem.
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Real Tests
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Based on analyzable fault models, which may not
map on real defects.
Incomplete coverage of modeled faults due to
high complexity.
Some good chips are rejected. The fraction (or
percentage) of such chips is called the yield loss.
Some bad chips pass tests. The fraction (or
percentage) of bad chips among all passing chips
is called the defect level.
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Testing as Filter Process
Good chips
Prob(good) = y
Prob(pass test) = high
Tested
chips
Fabricated
chips
Defective chips
Prob(bad) = 1- y
Copyright 2001, Agrawal & Bushnell
Mostly
good
chips
Prob(fail test) = high
Lecture 1 Introduction
Mostly
bad
chips
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Costs of Testing
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Design for testability (DFT)
Chip area overhead and yield reduction
Performance overhead
Software processes of test
Test generation and fault simulation
Test programming and debugging
Manufacturing test
Automatic test equipment (ATE) capital cost
Test center operational cost
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Present and Future*
* SIA Roadmap from www.siaonline.org, July 23, 2012
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Design for Testability (DFT)
DFT refers to hardware design styles or added hardware
that reduces test generation complexity.
Motivation: Test generation complexity increases
exponentially with the size of the circuit.
Example: Test hardware applies tests to blocks A
and B and to internal bus; avoids test generation
for combined A and B blocks.
Int.
Primary
Primary
Logic
bus
Logic
outputs
inputs
block A
block B
(PO)
(PI)
Test
input
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Test
output
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Cost of Manufacturing
Test in 2000AD
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0.5-1.0GHz digital clock; analog instruments; 1,024
digital pins: ATE purchase price
= $1.2M + 1,024 x $3,000 = $4.272M
Annual running cost (five-year linear depreciation)
= Depreciation (20%) + Maintenance (2%) + Operation ($0.5M)
= $0.854M + $0.085M + $0.5M
= $1.439M/year
Test cost (24 hour ATE operation)
= $1.439M/(365 x 24 x 3,600)
= 4.5 cents/second
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Roles of Testing
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Detection: Determination whether or not the device
under test (DUT) has some fault.
Diagnosis: Identification of a specific fault that is
present on DUT.
Device characterization: Determination and
correction of errors in design and/or test
procedure.
Failure mode analysis (FMA): Determination of
manufacturing process errors that may have
caused defects on the DUT.
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A Modern VLSI Device
System-on-Chip (SOC)
Data
terminal
Copyright 2001, Agrawal & Bushnell
DSP
core
RAM
ROM
Interface
logic
Mixedsignal
Codec
Lecture 1 Introduction
Transmission
medium
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Textbooks
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Digital, memory and mixed-signal:
M. L. Bushnell and V. D. Agrawal, Essentials of Electronic
Testing for Digital, Memory and Mixed-Signal VLSI
Circuits, Springer, 2000.
http://www.eng.auburn.edu/~vagrawal/BOOK/books.html
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RF testing
J. Kelly and M. Engelhardt, Advanced Production Testing of RF,
SoC, and SiP Devices, Boston: Artech House, 2007.
B. Razavi, RF Microelectronics, Upper Saddle River, New Jersey:
Prentice Hall PTR, 1998.
K. B. Schaub and J. Kelly, Production Testing of RF and Systemon-a-chip Devices for Wireless Communications, Boston: Artech
House, 2004.
1.
2.
3.
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A Problem to Solve
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Using the testing cost obtained in Slide 15, determine what
is the component of test in the cost of a mixed-signal VLSI
chip for the following data:
Analog test time = 1.5 s
Digital test clock = 200MHz
Number of digital test vectors = 109
Chip yield = 70%
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Solution
Assuming that one vector is applied per clock cycle during a digital test, the rate
of test application is 200 million vectors per second. Therefore,
Digital test time = (1000 × 106)/(200× 106) = 5 seconds
Adding the analog test time, we get,
Total test time = 1.5 + 5.0 = 6.5 seconds
The testing cost for a 500 MHz, 1,024 pin tester was obtained as 4.56 cents in
Slide 15. Thus,
Cost of testing a chip = 6.5 × 4.56 = 29.64 cents
The cost of testing bad chips should also be recovered from the price of good
chips. Since the yield of good chips is 70%, we obtain
Test cost per good chip = 29.64/0.7 ≈ 42 cents
42 cents should be included as the cost of testing while figuring out the
price of chips.
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