ECE 477 Design Review
Group 14  Spring 2005
Paste a photo of team members here,
annotated with names of team members.
Outline
•
•
•
•
•
•
•
•
•
•
Project overview
Project-specific success criteria
Block diagram
Component selection rationale
Packaging design
Schematic and theory of operation
Preliminary PCB layout
Software design/development status
Project completion timeline
Questions / discussion
Project Overview
• State-of-the-art system allowing doctors to monitor patients
blood pressure, body temperature and heart beat (ECG).
– Device strapped to the patient. Heart beat and temperature
are measured by the sensors present in the device.
– Measured data sent to the Computer via RF.
– Doctors and nurses are warned by alarm system present in
the device through a speaker.
– Heart beat and body temperature are constantly displayed
on the LCD.
Project-Specific Success Criteria
• Ability to obtain body temperature, heart rate, and
blood pressure from sensors to the microcontroller
• Ability to send / receive / decode RF Signals
• Ability to display health information to the patient via
LCD
• Ability to alert Patient about an emergency through a
speaker
• Ability to identify emergency and send signals to the
doctors/nurses.
Block Diagram
1
Temperature
Sensor
DS 18S20
Blood pressure Sensor
Honeywell 26PC SMT
2
RF signal
1
Microcontroller
UART
RF transmitter
RF receiver
1
UART
1
10
Speaker
Crystalfontz
CFAG12232D-YYH-N
Computer
Component Selection Rationale
Microcontroller :
Selection - Freescale 68HCS12(MC9S12C32)
1) CodeWarrior reliable
2) 16 bit device
3) 80 general purpose I/O pins
Other choices – Rabbit RCM3000
1) Dynamic C buggy
2) 8 bit device
3) 52 general purpose I/O pins
Component Selection Rationale
LCD DISPLAY :
Selection - Crystalfontz CFAG12232D-YYH-N Graphic LCD
Module (Backlight)
Other Choices
• Crystalfontz CFAG12232D-NYG-N Graphic LCD Module
• Crystalfontz 632 Serial LCD Module
Disadvantages
1) Price too high for serial LCD module
2) Size comparatively larger of serial LCD(108mm*44mm
as compared to 59mm*29mm
Component Selection Rationale
RF:
Selection – LINX TX-LC(LINX Technologies)
1) 5000 Baud rate.
Other Choices
Bluetooth Technology-LMX9820 National
Semiconductor
Reasons:
1) Bluetooth Development Kit was very expensive and
not available
Component Selection Rationale
Heart Rate Monitor :
Selection - Salutron Model 3100 Handgrip Heart Rate
Monitor
Other choices - Polar F-1 Heart Rate Monitor
Disadvantages :
1) Hard to interface with the micro
2) Need to disassemble to get the receiver
3) Cost was much higher( USD100 as compared to
USD32)
Component Selection Rationale
Temperature Sensor :
Selection - DS18S20 High-Precision 1-Wire Digital
Thermometer
Other Choices - DS1620 Digital Thermometer and
Thermostat
Disadvantages
1) Greater number of pins(3) for DS1620.
Component Selection Rationale
Blood Pressure Sensor :
Selection – Honeywell 26PC SMT
Other Choices – N/A
Advantages:
1) Small in Size
2) Can be interfaced directly to the PCB
3) No stand-alone pressure sensors available in the market
Packaging Design-Front View
Packaging Design - Back View
Packaging Design – Side view
Packaging Design-Similar Products
CPOD NASA
LifeSync Wireless ECG
Schematic/Theory of Operation
V CC
D
V RH
V DDA
PA D07/A N07
PA D06/A N06
PA D05/A N05
PA D04/A N04
PA D03/A N03
PA D02/A N02
PA D01/A N01
PA D00/A N00
V SS2
V DD2
PA 7/A DDR15/DA TA 15
PA 6/A DDR14/DA TA 14
PA 5/A DDR13/DA TA 13
PA 4/A DDR12/DA TA 12
PA 3/A DDR11/DA TA 11
PA 2/A DDR10/DA TA 10
PA 1/A DDR9/DA TA 9
PA 0/A DDR8/DA TA 8
MC9S12C32
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
V RH
V DDA
A N07
A N06
A N05
A N04
A N03
A N02
A N01
A N00
V SS2
V DD2
PA 7
PA 6
PA 5
PA 4
PA 3
PA 2
PA 1
PA 0
C16
100n
D
V CC
C23
220nF
RESET*
SW2
ADDR5/DATA5/PB5
ADDR6/DATA6/PB6
ADDR7/DATA7/PB7
XCLKS*/NOACC/PE7
MODB/IPIPE1/PE6
MODA/IPIPE1/PE5
ECLK/PE4
VSSR
VDDR
RESET*
VDDPLL
XFC
VSSPLL
EXTAL
XTAL
TEST/VPP
LSTRB*/TAGLO*/PE3
R/W*/PE2
IRQ*/PE1
XIRQ*/PE0
Reset
V DDPLL
C12
33n
C13
100n
C9
330p
V CC
R2
39K
C14
100n
D
Y2
EXTAL
D
PW3/KWP3/PP3
PW2/KWP2/PP2
PW1/KWP1/PP1
PW0/KWP0/PP0
PW0/IOC0 /PT0
PW1/IOC1 /PT1
PW2/IOC2 /PT2
PW3/IOC3 /PT3
V DD1
V SS1
PW4/IOC4 /PT4
IOC5/PT5
IOC6/PT6
IOC7/PT7
MODC/TA GHI*/BKGD
A DDR0 /DA TA 0/PB0
A DDR1 /DA TA 1/PB1
A DDR2 /DA TA 2/PB2
A DDR3 /DA TA 3/PB3
A DDr4/DA TA 4/PB4
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
C15
470n
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
PB5
PB6
PB7
PE7
PE6
PE5
PE4
VSSR
VDDR
RESET*
VDDPLL
XFC
VSSPLL
EXTAL
XTAL
VPP
PE3
PE2
PE1
PE0
V CC
PP3
PP2
PP1
PP0
PT0
PT1
PT2
PT3
V DD1
V SS1
PT4
PT5
PT6
PT7
MODC
PB0
PB1
PB2
PB3
PB4
V CC
PP4/KWP4/PW4
PP5/KWP5/PW5
PP7/KWP7
VDDX
VSSX
PM0/RXCAN
PM1/TXCAN
PM2/MISO
PM3/SS*
PM4/MOSI
PM5/SCK
PJ6/KWJ6
PJ7/KWJ7
PP6/KWP6/ROMCTL
PS3
PS2
PS1/TXD
PS0/RXD
VSSA
VRL
U1
80 PP4
79 PP5
78 PP7
77 VDDX
76 VSSX
75 PM0
74 PM1
73 PM2
72 PM3
71 PM4
70 PM5
69 PJ6
68 PJ7
67 PP6
66 PS3
65 PS2
64 PS1
63 PS0
62 VSSA
61 VRL
C22
100n
8 MHz
ECLK
C10
22p
R3
10M
D
C11
22p
D
Schematic/Theory of Operation
V CC
V LED*
V SS
V DD
VO
AO
E1
E2
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
R/W*
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
R7
10k- 20k
V CC
R5
10K
V CC
A N01
RESET*
A N00
PA 7
PA 6
PA 5
PA 4
PA 3
PA 2
PA 1
PA 0
V CC
V CC
R4
47K
J1
D
2
4
6
BDM IN
CFA G1 2232D-Y Y H-N
1
3
5
MODC
Schematic/Theory of Operation
Linear
Regulator
Connector
V CC
R11
100k
MA X88 60
V CC
1
2
3
4
C20
2.2uF
OUT
IN
GND
OUT
FA ULT*
SHDN*
CC
SET
R9
2.2K
8
7
6
5
BT2
6V
C19
33nF
Voltage Doubler Connector
5
C17
10uF
3
1
C1+
IN
4
V CC
MAX16 82
C1GND
OUT
2
V Stepup
C18
10uF
R10
10K
C21
2.2uF
Schematic/Theory of Operation
VCC
PB6
Amplifier Circuit Connector
R12
150k
R13
C24
1uF
LM4670
PB5
1
2
3
4
SHUTDOWN* V02
-IN
VDD
+IN
GND
GND
V01
8
7
6
5
LS1
150K
SPEAKER
Schematic/Theory of Operation
VCC
LINX TX-LC
1
2
3
4
PS1
GND
DATAIN
GND
IADJ/GND
GND
VCC
GND
RFOUT
8
7
6
5
R8
430
RF Transmitter Connector
E1
ANTENNA
Schematic/Theory of Operation
V Stepup 1
A N07
2
V CC
OUT
GND
OUT
3
4
A N06
26 PC SMT
Pressure Sensor Connector
Schematic/Theory of Operation
Temperature Sensor Connector
V CC
V CC
R1
4.7k
PB7
NC
NC
V DD
DQ
1
2
3
4
DS1820
8
7
6
5
NC
NC
NC
GND
Preliminary PCB Layout
Software Design/Development Status
•
•
•
•
•
Temperature Sensor module
LCD module
Blood Pressure module
Bluetooth communication module
Heart beat (ECG) module
Project Completion Timeline
• 2nd week of March - PCB layout 100% routed
• 3rd week of March – Work on software
modules
• 4th week of March – Test Software modules
• 2nd week of April – Finish board assembly
and start testing and debugging
• 3rd week of April - Thorough testing done
• 4th week of April - Video Demo.
Questions / Discussion