Plasma Ruggedized Solutions
Company Descriptive
Plasma Ruggedized Solutions
COMPANY OVERVIEW
Plasma Ruggedized Solutions, Inc. (‘Plasma’ or the ‘Company’) is an engineering
services partner to OEM’s that designs, tests, and applies chemical and
mechanical agents/devices to ruggedize and encrypt (mechanically) odd
geometry/asymmetric PCB’s and electronic assemblies.
Summary
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Founded in 1990.
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California subchapter ‘S’ Corporation.
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Shareholders are Institutional Capital and Management.
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Headquartered in San Jose California with a 2nd facility in Huntington Beach comprising a total of
approximately 55,000 sq. ft. with 105 employees.
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Over 2000 customers in current operating base covering 16 industries with 400-600 active during any
particular month. The largest representing less than 12% of sales.
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Rapid historical growth facilitated by compliance with newly implemented environmental regulations (RoHS)
and industry trend toward ruggedization.
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Multi-industry orientation with primary applications in A&D, Medical, Automotive, Robotics and
Communications sectors.
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Products & Applications
Conformal Coating and Potting Represent 90% of Plasma Revenues
Conformal Coating Introduction
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Improves and extends the working life and reliability of electronic components.
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Conformal Coats are thin layers of synthetic resins or organic polymers
applied to electronic assemblies. Coating protects against environmental,
mechanical, thermal, electrical, vibration and chemical challenges.
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Mitigates manufacturing issues related to RoHS mandated removal of lead from
printed circuit board fabrication and printed circuit assembly operations. Coatings
are thin and conform to the irregular shape of the boards and their components.
Potting Introduction

The encapsulating and casting of an electronic device is also a method of coating
or sealing circuit board assemblies, cables and harnesses. Unlike Conformal
Coating potting does not conform to irregular shapes of components.
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Potting provides all of the same environmental protection and electrical
performance stabilization as coating, but it also provides a security function for
protecting a classified device or prevention of reverse engineering attempts.
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The Potting method uses a custom formed “Pot” or case/shell to put the entire
device into, the compound is then introduced and the device sealed.
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Competitive Differentiation
Short Lead-Time Customer Requirements
Customer production schedule demands are typically < 50 hours and usually require
intensive engineering and “First Article” testing and or Qualification of engineering
production processes.
Physical proximity is important
High-Barrier Technical Problem-Solving Orientation
Customer engineering needs usually demand “face to face” conferences and technical
interactions to assure and address engineering changes and concerns.
Plasma is considered a “Last Stop” for resolution of hard to apply/engineered Coatings and
Potting materials.
Plasma provides repair and overhaul of other supplier and customer rejected hardware featuring
IP equipment and Plasma Etch technology of our own design.
Complex Application Capabilities:
Plasma features a broad spectrum of highly engineered chemical and mechanical technologies
for asymmetric and complex PCB’s/electronic assemblies for ruggedization, security and
performance enhancement.
Customer designs may feature somewhat fluid technical baselines or require rapid rework to
effect desired performance.
Structural Inhibitors to Offshore Sourcing
Product restrictions on offshore sourcing for military and medical applications
ITAR (International Traffic and Arms Regulations) and State Department Regulations on
technology control and transfer limit the supply chain to domestic sources and manufacturing
agents. Medical assemblies are generally manufactured locally due to their unique technical
and performance requirements and small lot sizes.
Military and medical sectors
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Plasma Ruggedized Solutions
Fortification of Differentiators
Continuing evolution of Plasma’s competitive differentiation is a core-focus of management and a
primary component of the investment thesis:
PRS Augments Current Service Offerings with Complementary and High-Value Services
Environmental Stress Screening and Testing
Additional specialty engineering services/capabilities*
Clean room capabilities-10K PPM (Both facilities)
Specialty cleaning services for PCB’s and sensitive mechanical componentry
PCB Cross section evaluation, advanced microscopic review and X-Ray capabilities
Sub-assembly and System-level build and test
Deeper Penetration of Current Customers and Sector Differentiation
Migration toward higher-barrier-to-entry markets and sectors
Targeted market segment penetration by industry and geography
On-site customer support teams featuring Plasma engineering and senior management
Selected marketing forums where Plasma’s technical capability can be demonstrated
Position Plasma as a World-Class Engineering Services Provider
Mil-Spec certifications/ recently NASA certified (both facilities)
Complete ISO certification process
AS9100 program
‘Scaled’ six sigma program
More effectively manage and monetize accumulated intellectual property
*Including but not limited to providing PRS engineering resources to participate with OEM’s in original design process for complex systems
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INDUSTRIES SERVED
Plasma Ruggedized Solutions offers solutions which have been successfully deployed across
many industries . Our extensive knowledge in the protection of circuit board assemblies allows us
to protect circuitry to the Federal Information Processing Standards (FIPS). Following are
examples of the industries we serve.
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Aerospace & Defense
Alternative Energy
Automotive
Banking
Intelligence & Reconnaissance
Law Enforcement
LED
Medical
Oil and Gas
Robotics & Electromechanical Systems
Smart Grid
Sports & Recreation
Telecommunications
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Plasma Ruggedized Solutions
CORE BUSINESS
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PLASMA ETCHBACK DESMEAR
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CONFORMAL COATING
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PARYLENE COATING
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POTTING AND ENCAPSULATING
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BGA UNDERFILL
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FORM-IN-PLACE (FIP)
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PRIVATE LABEL MATERIALS
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TESTING, LABORATORY and ENGINEERING
SERVICES
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FIPS 140-2 & 140-3 Capabilities
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Plasma Ruggedized Solutions
CONFORMAL COATING
Commonly Used Conformal Coatings Include
Acrylic
(AR)
Polyurethane
(UR)
Epoxy
(ER)
Silicone
(SR)
Parylene
(XY)
Nano
Coatings
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Plasma Ruggedized Solutions
QUALITY CERTIFICATIONS
AS9100
ISO 9001:2008
ITAR
Registered
IPC
Registered
RoHS
Complaint
COMSEC
Registered
NASA
8739.1A Certified
Locations
Plasma Ruggedized Solutions - Northern CA
2284 Ringwood Ave Suite A
San Jose, CA 95131
Plasma Ruggedized Solutions - Southern CA
5452 Business Drive
Huntington Beach, CA 92649
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NASA 8739.1A Certified
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Plasma Ruggedized Solutions
Six Sigma Award
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Plasma Ruggedized Solutions
Aviation Week Award
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Plasma Ruggedized Solutions
Northrop Grumman Letter
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Plasma Ruggedized Solutions
Tin Whisker Mitigation and Layered
Coating Solutions
Tin whiskers are not a new phenomenon. Tin whiskers
have been noted as early as the 1950s. Tin is only one
of several metals that are known to be capable of
growing whiskers. Other examples of metals that may
form whiskers include Zinc, Cadmium, Indium and
Antimony.
Tin whiskers are believed to grow in order to relieve
mechanical stresses acting within the tin layer.
Whiskers grow at a rate of 3-7 angstroms per second
and can see an annual growth of 9-10 mm per year.
Tin whiskers, as the name
implies, are hair-like
growths of near perfect
single crystalline structures
of tin that grow from some
electroplated tin surfaces.
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Plasma Ruggedized Solutions
Tin Whisker Mitigation and Layered
Coating Solutions
The “Layered Approach” combines multiple, established
conformal coating processes, with innovative surface treatments
in specific sequences to strengthen the barrier against tin whisker
growth.
Potting &/or Encapsulation methods using a
layered approach provide a solid barrier than
can retard growth as well as contain a whisker
preventing migration.
An extremely clean surface,
properly prepared with multiple
layers of Parylene (XY) and
urethane (UR) coatings can
provide excellent resistance to
whisker growth.
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Plasma Ruggedized Solutions
AWARDS & PROGRAMS
UNDER SEA ROBOTICS
Ruggedized Electronics for
submersion in seawater and depths
exceeding 6000m.
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Plasma Ruggedized Solutions
AWARDS & PROGRAMS
FA-18 SUPER HORNET
Electronics conformally coated for
protection against corrosion, dirt &
debris. Ruggedized to withstand
extreme forces, including frequent
high G loads.
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Plasma Ruggedized Solutions
External Lighting /Shipboard / Blimp
PCBA’s ruggedized to perform
outside in all weather conditions.
Ruggedized for flexibility on nonrigid surfaces.
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Plasma Ruggedized Solutions
Corrosion Resistance- EMI / RFI
Protection
Metalized coatings,
shielding, coated
enclosures
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Plasma Ruggedized Solutions
Potting & Encapsulation
Potting / Encapsulation is the process used to protect
“ruggedize” electronics. Potting provides protection from
extreme environments, against shock and vibration, ensures
security of sensitive designs, as well as creates a barrier against
moisture, fungus, dust, and corrosion.
Potting can also enhance circuit reliability by reducing leakage
from high voltage circuits, protecting against voltage arcs and
short circuits and by preventing the formation of “tin whiskers.”
Potting or Encapsulating a circuit can make it Federal
Information Processing Standards (FIPS) compliant. Because
Potting and Encapsulating encloses the entire assembly, the
assembly is protected from unauthorized entry, modification and
reverse engineering.
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Security Programs FIPS Compliant
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Plasma Ruggedized Solutions
Private Label Material Development
The KRYPTOS™ product line is highly adaptable of which KRYPTOS-17 is a filled,
RoHS compliant, medium viscosity, self-extinguishing flame retardant, low stress,
thermally conductive epoxy casting resin system. As tested by an independent
party (UL 94V0), it passes the criteria for a vertical burn rating of 94V-0 at 3mm and
6mm thickness.
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Plasma Ruggedized Solutions
Private Label Material Development Cont.
THIS SYSTEM WAS DESIGNED TO MEET THE PHYSICAL SECURITY
REQUIREMENTS OF FIPS 140-2, AND FIPS 140-3 FOR ENCAPSULATING
MATERIALS. KRYPTOS INHERENT NATURE OFFERS GOOD TIN-WHISKER
MITIGATION PROPERTIES.
It provides superior resistance to water, salt spray, inorganic acids and bases and
most organic solvents. The material is intended for use in outdoor environments
(pending UL 746). It cures at room temperature to a tough, semi-rigid polymer; it
exhibits good wetting and adhesion to most surfaces and is free flowing to
penetrate voids and provide good air release.
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Plasma Ruggedized Solutions
R&O (Repair & Overhaul) Capability
Capabilities to repair and overhaul
electronics, vacuum pumps, RF generator
equipment.
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