Background Statement for SEMI Draft Document 5754
Reapproval of SEMI G77-0699 (Reapproved 0706) SPECIFICATION
FOR FRAME CASSETTE FOR 300 mm WAFERS
Notice: This background statement is not part of the balloted item. It is provided solely to assist the recipient in
reaching an informed decision based on the rationale of the activity that preceded the creation of this Document.
Notice: Recipients of this Document are invited to submit, with their comments, notification of any relevant
patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this
context, “patented technology” is defined as technology for which a patent has issued or has been applied for. In the
latter case, only publicly available information on the contents of the patent application is to be provided.
Background
SEMI G77 is due for 5-year review. At the meeting of the Japan Assembly & Packaging TC Chapter Meeting on
July 14, 2014, the committee agreed to ballot SEMI G77 for reapproval without changes.
This letter ballot contains only the Purpose, Scope, Referenced Standards and Documents and Terminology sections
of the Standard being proposed for approval. Full copy of this Standard is available upon request. Voter requests for
access to the full Standards must be made at least three business days before the voting deadline.
Review and Adjudication Information
Group:
Date:
Time & Timezone:
Location:
City, State/Country:
Leader(s)/Author(s):
Standards Staff:
Task Force Review
Packaging 5 Year Review Task Force
TBD
TBD
SEMI Japan
Tokyo, Japan
Yutaka Koma (Consultant)
ykoma@j08.itscom.net
Naoko Tejima (SEMI Japan)
81.3.3222.5804
ntejima@semi.org
Committee Adjudication
Japan Assembly & Packaging TC Chapter
2014/09/29
15:00-17:00
SEMI Japan
Tokyo, Japan
Kazunori Kato (AiT)
Masahiro Tsuriya (iNEMI)
Yutaka Koma (Consultant)
Naoko Tejima (SEMI Japan)
81.3.3222.5804
ntejima@semi.org
This meeting’s details are subject to change, and additional review sessions may be scheduled if necessary. Please
contact Standards staff (Naoko Tejima at ntejima@semi.org) for confirmation.
Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134-2127
Phone: 408.943.6900, Fax: 408.943.7943
DRAFT
SEMI Draft Document 5754
Reapproval of SEMI G77-0699 (Reapproved 0706) SPECIFICATION
FOR FRAME CASSETTE FOR 300 mm WAFERS
1 Purpose
1.1 The purpose of this document is to specify the mechanical features for a 300 mm wafer frame cassette used
between the wafer mounting process and the die-bonding process.
2 Scope
2.1 This standard is intended to set an appropriate level of specification that places minimal limits on innovation
while ensuring modularity and interchangeability at all mechanical interfaces.
2.2 Only the physical interfaces for the frame cassette are specified; no materials requirements or microcontamination limits are given. However, this specification was written to allow for both metal and plastic frame
cassette designs.
2.3 This specification defines a 300 mm wafer frame cassette that is intended for both manual and automated
transport. The frame cassette has the following components and sub-components (“” indicates an optional
component):
2.3.1 Top

-
robotic handling flange (optional)
top cover
2.3.2 Interior
-
frame supports for 13 or 25 tape frames
-
frame restraint
2.3.3 Sides

human handles (optional)
2.3.4 Rear
-
rear cover
2.3.5 Bottom
-
2 bottom conveyor rails running along the sides of the frame cassette

3 features that mate with kinematic coupling pins and provide a 10 mm lead-in (optional)

4 frame cassette sending pads (optional)
NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
3 Referenced Standards and Documents
3.1 SEMI Standards
SEMI E1.9  Provisional Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers
SEMI E15  Specification for Tool Load Port
SEMI E47.1  Provisional Mechanical Specification for Boxes and Pods Used to Transport and Store 300 mm
Wafers
SEMI E57  Provisional Mechanical Specification for Kinematic Couplings Used to Align and Support 300 mm
Wafer Carriers
SEMI G74  Specification for Tape Frame for 300 mm Wafers
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline.
Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document
development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.
Page 1
Doc. 5754  SEMI
LETTER (YELLOW) BALLOT
Document Number: 5754
Date: 3/12/2016
Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134-2127
Phone: 408.943.6900, Fax: 408.943.7943
DRAFT
SEMI S8  Safety Guidelines for Ergonomics/Human Factors Engineering of Semiconductor Manufacturing
Equipment
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
4 Terminology
4.1 bilaterial datum plane  a vertical plane that bisects the tape frames and that is perpendicular to both the
horizontal and facial datum planes (as defined in SEMI E57).
4.2 conveyor rails  parallel surfaces on the bottom of the cassette for supporting the cassette on roller conveyors.
4.3 facial datum plane  a vertical plane that bisects the tape frames and that is parallel to the front side of the
frame cassette (where tape frames are removed or inserted). On tool load ports, it is also parallel to the load face
plane specified in SEMI E15 on the side of the tool where the frame cassette is loaded and unloaded (as defined in
SEMI E57).
4.4 frame cassette  an open structure that holds one or more tape frames.
4.5 horizontal datum plane  a horizontal plane from which projects the kinematic coupling pins on which the
frame cassette sits. On tool load ports, it is at the load height specified in SEMI E15 and might not be physically
realized as a surface (as defined in SEMI E57).
4.6 robotic handling flange  horizontal projection on the top of the frame cassette for lifting and rotating the
frame cassette.
4.7 tape frame  the frame which applies the wafer tape to the wafer and retains the wafer.
4.8 wafer tape  an adhesive plastic tape which retains the wafer or diced chip. It is used between the mounting
process and die-bonding process.
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline.
Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document
development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.
Page 2
Doc. 5754  SEMI
LETTER (YELLOW) BALLOT
Document Number: 5754
Date: 3/12/2016