職場經驗分享
Sharing the Working
Experience
ASIC • IP • AND BEYOND
March 2005
Frank Cheng
鄭順發
International Business Operations /
Field Marketing Development
frankcheng@faraday-tech.com
Contents
 Self Introduction
 Sharing in Working Experience
 Job Opportunities
 Open Discussion
2
Contents
 Self Introduction
 Sharing in Working Experience
 Job Opportunities
 Open Discussion
3
Self Introduction - I
 Graduated from 電子資訊研究所
- 甲組
in 1996
 Live in HsinChu
 Married with 2 sons
 Career history
 1st job in SRRC
同步輻射研究中心 (1996/7-1997/7) - 1yr
 2nd job in ITRI’s 量測中心
(1997/7-1999/6) - 2yrs
 3rd job in AMIC
(1999/6-2000/2) -.75yr
聯笙電子
 4th job in Faraday 智原科技
(2000/2 ~
)
- 5yr
4
Self Introduction - II
 SRRC 同步輻射研究中心 (1996/7~1997/7)
 Division: 注射器組
 Maintained the Booster(加速環) 設備
 Power system
 Electronic controlling system
 Maintain Work Station and Setup Website
 Why did I work for SRRC???
 Higher salary $$$$$
 A stabile job
 To be a civil servant
 Why did I quit this job???
 Radiation
 A bit too stable
????
$$$$$
lost ~1/3
5
Self Introduction - III
 ITRI 量測中心 (1997/7 ~1999/6)
 Division: 超音波部
 Digital system designer for Ultrasonic Diagnostic System
 Developed the controller of whole system and system platform
 Built up the FPGA design flow (Actel) and Interfaced the ASIC house.
 Developed the Nebulizer（霧化器) product
 Why did I work for ITRI???
 Trend in biological medicinal engineering
 A good opportunity because the whole division would be spun off
from ITRI.
 A good training environment, Graduate student alike
 Why did I quit this job???
 Manager did not want to spin off
 Get back to IC design field
6
Self Introduction - IV
 AMIC (1999/6 ~2000/2)
 Division: Consumer Product
 Developed the 8 bit uP based audio decompression chip
 Why did I work for AMIC???
 IC design trend for acoustic recognition
 Recall the IC design capability
 Economic Issues
 Why did I quit this job???
 主管操守有問題……..
7
Self Introduction - V
About Faraday
 Core Technology Division
 Responsible for MIPS-clone CPU implementation and migration
in different process.
 Companion IP designer
 SIS – ARM Service Center
 Transferring ARM’s framework of SoC technology to Faraday
 Built up the ARM developing flow in Faraday
 Customer service and promotion for ARM core based ASIC
8
Self Introduction - V
 IP Service Development
 Post-Sales for 8bit uP (80xx), 32bit processor core such as ARM
core, MIPS-clone core and Companion IP
 Pre-Sales for SoC based IP and Related Platform
 OBD (Overseas Business Department)
 Responsible for Overseas ASIC/IP project
 Responsible for the development of SoCreative! Platform
9
Self Introduction - V
 IBO國際營運中心 – Field Marketing Development
 Research in Strategy Marketing
 Come out the new product plan and then
 Research in specific topic for subsidiary company
 Technical supporting for Faraday’s customer in Europe, Japan
and USA
 SoC based ASIC project cooking
 Product Promotion
 Resource backup
10
Contents
 Self Introduction
 Sharing in Working Experience
 Job Opportunities
 Open Discussion
11
My Personal Opinions – I
 Job Position
現在
未來
＝
立志：我要做RD
..我真的是RD ..我還是RD
工作資歷的累積
- 影響未來
滾石不生苔 –頻換工作
專業設計能力
RD
? Years
Project
Leader
? Years
Project
Manager
CTO
? Years
12
My Personal Opinions – II
 Job Position
現在
＝
立志：我要做RD
RD
未來
我還是RD????
FAE
Promotion
Marketing
(Post-Sales) (Pre-Sales)
Digital
Design
$$$$
13
My Personal Opinions – III
 Job Outlook
- Your Target $$$$$
VS.
工作
不要幻想在科學園區就能賺大錢
不是每一個人都在 聯發科技
工作靠實力,賺錢靠運氣
能力好
能力不好
能力好
能力不好
＋公司營運好 ＝＄＄＄＄＄＄＄（機會＋運氣）
＋公司營運好 ＝＄＄＄＄＄＄ （運氣）
＋公司營運不好＝＄＄
（找機會）
＋公司營運不好＝＄
(????, 向上努力吧!)
14
My Personal Opinions – IV
 你即使離職了，公司………還是活得好好的………
^_^
 拋開本位主義
RD/Project Leader
Marketing/Sales
1. 為何Sales老是接一些奇怪的案子?
1. 公司業績不好, 老板催訂單
2. Sales 只出一張嘴？
2. 接案子
- 沒問題
Design 有 Bug
- 沒關係
Bug 無解,Re-design- 沒辦法
3. 產品Delay一下有啥關係?
3. Schedule Delay
錢收了, Time-to-Market (?)
15
My Personal Opinions – V
 坐這山  望那山
 他都沒做什麼事?
 Sales
– 尊嚴, 客戶財務結構, 業績……
 Designer
– 研發, Schedule 壓力
 Ｍarketing – 市場分析, 產品決策
 Service 人員沒啥技術能力?
 罰站, 被罵, 向客戶賠不是……
 總機小姐甜美的聲音……….客戶也會時常問候 ……… ^.^
公司會賺錢 : 研發,銷售, 客服
大家努力而成，絕非個人
16
Suggestions
 肯定自我/他人工作價值
 積極主動
 廣結善緣
 溝通能力
 語文能力
–
–
–
–
–
工作愉快，相處融洽
多做未必是錯，機會在將來
圈子很小，到處是熟人
各式各樣職務
Global Company
(D-Link, BenQ, Acer, Foxconn, TSMC, UMC, ..) => CEO is Italian.
 國際觀
 Customer from Great China, Europe, Korea, Japan, USA
 Competitor in WW
 Business in WW
 No Time Lag for Internal Business
EUP <- TWN -> USA
01:00
09:00
17:00
17
Contents
 Self Introduction
 Sharing Working Experience
 Job Opportunities
 Open Discussion
18
Job Opportunities
 Head Count : 2 for Field Marketing
 Strategize, Conceive, Research RISC CPU and SOC Related
Product Plan
 Technical promotion, support on platform-based SoC design
 Needed Background
 Major in EE or Computer Engineering
 Experience in IC/SOC Integration, IP Technology or Chip-Set
Design (at least 4 years)
Frank Cheng 鄭順發, 03-5787888 ext. 8606
frankcheng@faraday-tech.com
19
Q&A
Thank You!
20
Faraday: at a Glance
 Spun off from UMC in 1993
 UMC owns 20%+ of Faraday
 UMC & Faraday still share same chairman
 Strategic IP partnership
 Fabless ASIC and IP provider
 Solid business model of 45% GM, 25% net, 30%+ CAGR
 Diversified customers & markets
 Listed in Taiwan exchange in 1999
 Today’s operation
 500+ employees worldwide, 330+ in R&D
21
Contact Faraday
www.faraday-tech.com
Faraday USA
Faraday Netherlands
Faraday Japan
Faraday China
Faraday Taiwan (HQ)
Sunnyvale, CA
Amsterdam
TEL: + 31.23.56.20496
Tokyo
TEL: + 81.3.5214.0070
Shanghai
TEL: + 86.21.6406.7523
Hsinchu & Taipei
TEL: + 886.3.5787888
sales@faraday-tech.com
sales@faraday-tech.com.cn
sales@faraday-tech.com
TEL: +1. 408.522.8888
sales@faraday-tech.com eusales@faraday-tech.com
22
Financial Achievements
2004 revenue:
$155M
35%+ CAGR since
‘97
4,000
3,500
110.8 Million USD
CAGR = 37.68%
Million NTD
3,000
2,500
2,000
1,500
1,000
500
0
1997
1998
1999
2000
2001
2002
2003
23
Faraday Offers
ASIC Design Services, SoC Design Services, Proven IP
Solutions
IP
Libraries / Memories
ASIC Front-End
ASIC Back-End
Architecture Specifications
Mask Tooling
Behavior Modeling
Wafer Manufacturing Services
RTL Code Generation
Microprocessors
Synthesis
Gate Level Verification
Digital / Analog
Circuit Probing & Final Testing
Test Pattern Generation
Physical Implementation
Platform
IC Packaging Services
Post Layout Verification
Reliability Test Services
Product Engineering
System-on-a-Chip
24
ASIC Infrastructure & Expertise
 More than 100 people in ASIC Technology
 ASIC implementation, testing, yield, and FA (70)
 Design methodology & integration (35)
 Production planning, logistic, and quality (25)
 10 years of experience on average
 More than $50M invested in infrastructure
 eRD, ERP, Testers, ESD machine, die/wafer bank
 Complete integration of R&D, FIN, customer project, and production
shipment
 More than 200 project tape-outs in ’04 alone
 40% test chips
 10% in 0.13um, including four customer ASICs
25
2003 Sales Breakdown (2-1)
By application
Image Others
5.1% 2.1%
Video/Display
10.0%
Peripheral
31.2%
Consumer
13.8%
Communication
11.0%
Storage
26.8%
PS: Ex-IP sales revenue
26
2003 Sales Breakdown (2-2)
By customer type
Foundry
6.8%
System House
33.9%
IDM
Others
2.3%
1.4%
By geography
Europe
0.9% Korea
China
0.8%
Japan2.6%
4.1%
Design House
55.6%
USA
26.3%
Taiwan
65.3%
`
`
27
Technology
Roadmaps
ASIC • IP • AND BEYOND
Cell Library Roadmap
＊
65nm
65nm SP
＊
＊
90nm LL-Rvt / Low-K
90nm
＊
＊
90nm SP-Rvt / Low-K
＊
＊
90nm LL-Hvt / Low-K
＊
130nm
0.15µm
130nm L130E SP / FSG
0.15µm SP＊
2004-07
10
2005-01
＊
4
7
10
2006-01
Legend Description：Rvt： Regular Threshold Voltage
Hvt： High Threshold Voltage
SP ： Standard Performance
LL ： Low Leakage
4
7
10
2007-01
Note: The right edge of each block denotes
the IP’s formal release date. For more details,
please visit our website at:
www. faraday-tech. com
29
Memory Compiler Roadmap
65nm SP＊
65nm
＊
＊
90nm LL-Rvt / Low-K
＊
90nm SP-Svt / FSG
90nm
＊
90nm SP-Svt / Low-K
＊
＊
90nm SP-Hvt / Low-K
＊
130nm
130m L130E HS / FSG
130nm L130E Fusion / FSG
＊
130nm L130E SP / FSG
＊
130nm L130E LL / FSG
0.15µm
0.15µm SP＊
2004-07
10
＊
2005-01
4
7
10
Legend Description：Rvt：Regular Threshold Voltage
HS： High Speed
Hvt：High Threshold Voltage
SP ：Standard Performance
LL：Low Leakage
2006-01
4
7
10
2007-01
Note: The right edge of each block
denotes the IP’s formal release date. For
more details, please visit our website at:
www. faraday-tech. com
30
Analog Essential IP Roadmap
＊
90nmSP / FSG 1GHz PLL
＊
130nm HS / FSG 400MHz PLL
＊
90nm SP / FSG 2GHz PLL
130nm
130nm HS＊/ FSG 1GHz PLL
＊
PLL
REG
POR / BG
0.18µm
130nm HS / FSG MiniPLL
0.18µm GII MiniPLL
0.18µm REG
0.18µm GII POR
0.15µm REG
130nm BG
0.25µm
90nm REG
130nm REG
0.15µm POR
90nm BG
90nm SP / FSG 800Mb/s DLL
130nm HS / FSG 533Mb/s DLL
＊
0.35µm
＊
＊
DLL
0.15µm
130nm HS / FSG 1.6GHz PLL
0.15µm 1.5V 300MHz PLL
＊
90nm
＊
130nm HS / FSG 400Mb/s DLL
130nm HS / FSG Wide Range DLL
0.15µm 1.5V 400Mb/s DLL
PWM
RC-OSC
VDT
0.18µm GII > 50mA PWM
0.18µm GII RC-OSC
0.18µm GII VDT
2004-07
10
2005-01
＊
＊
＊
130nm HS
> 50mA PWM
＊
130nm RC-OSC
90nm SP / FSG RC-OSC
＊
130nm HS VDT
4
7
10
2006-01
Legend Description：HS： High Speed
SP ： Standard Performance
90nm SP PWM
90nm VDT
4
2006-07
10
2007-01
Note: The right edge of each block
denotes the IP’s formal release date. For
more details, please visit our website at:
www. faraday-tech. com
31
Analog Data Conversion &
Serial Link IP Roadmaps
130nm 10-bit 80MHz ADC
130nm 8-bit 125MHz ADC
90nm
0.25µm 6-bit 44MHz
ADC
130nm
0.18µm 10-bit 80MHz ADC
0.15µm
130nm 12-bit 100MSPS DAC
DAC
3-channel
DAC
0.18µm 8-bit 44MSPS DAC
0.18µm
0.25µm 10-bit 150MSPS
3-channel DAC
0.25µm
0.18µm 10-bit 150MSPS 3-channel DAC
0.35µm
130nm 10-bit 150MSPS 3-chanel DAC
0.25µm 16-bit
Audio Codec
Sigma-Delta
Codec
0.25µm 18-bit
Audio Codec
0.18µm 16-bit Audio Codec
130nm 16-bit Audio Codec
RSDS TX
0.35µm RSDS
0.25µm RSDS
130nm LVDS
0.18µm LVDS
LVDS
TX / RX
0.35µm LVDS
2004-07
10
0.25µm LVDS
2005-01
4
0.25µm mini
LVDS
7
10
0.18µm 1.8V
LVDS
2006-01
4
7
10
7
10
2007-01
Note: The right edge of each block denotes the IP’s formal release date. For more details, please
visit our website at: www.faraday-tech.com
32
USB IP Roadmap
90nm
130nm
USB 2.0 OTG PIE
USB2.0
2-port PHY
0.15µm
FPGA USB2.0 Host PIE
FUSBH200
0.25µm
0.35µm
FPGA USB2.0 OTG PIE
FOTG200
FPGA
130nm USB 2.0 2-port PHY
USB 2.0
Device PHY
USB 2.0 OTG PHY
0.18µm
FPGA USB2.0 2-port
Host PIE FUSBH210
0.18µm USB 2.0 Device PHY v36
0.25µm USB2.0
OTG PHY
90nm USB 2.0 OTG PHY
130nm USB2.0 OTG PHY SP＊
130nm USB2.0 OTG
PHY HS＊
2004-7
10
2005-01
＊
USB 2.0 Host PIE
4
7
10
Legend Description： HS：High Speed
SP：Standard Performance
2006-01
4
7
10
Note: The right edge of each block
denotes the IP’s formal release date. For
more details, please visit our website at:
www. faraday-tech. com
33
Serial-ATA IP Roadmap
90nm
130nm
0.15µm
Serial-ATA
PHY
0.18µm
130nm 3Gbps SATA PHY
0.25µm
130nm Multi-Port SATA PHY
0.35µm
FPGA
Serial-ATA
Controller
FPGA Serial-ATA Controller
With AHB I/F
2004-7
10
2005-01
4
7
10
2006-01
4
7
10
Note: The right edge of each block denotes the IP’s formal release date. For more details, please
visit our website at: www.faraday-tech.com
34
PCI Express IP Roadmap
90nm
130nm
PCI Express
PHY
0.18µm Single lane PHY x 1 lane
0.15µm
0.18µm
0.25µm
130nm Single-lane PHY x 1 lane
0.35µm
FPGA
130nm Multi-lane PHY x 4 lane
PCI Express
Controller
FPGA PCI-Express Controller
End-point (PIPE)
2004-7
10
2005-01
4
7
10
2006-01
4
7
10
Note: The right edge of each block denotes the IP’s formal release date. For more details, please
visit our website at: www.faraday-tech.com
35
Ethernet Roadmap
90nm
10/100
Ethernet
PHY
0.25µm
10/100
Ethernet PHY
130nm
0.15µm
0.18µm 10/100 4- port
Ethernet PHY
0.18µm
0.25µm
＊
130nm HS 10/100 Ethernet PHY
2004-7
10
2005-01
＊
4
0.35µm
7
10
Legend Description：HS：High Speed
2006-01
4
7
10
Note: The right edge of each block
denotes the IP’s formal release date. For
more details, please visit our website at:
www. faraday-tech. com
36
Digital IP Roadmap
Wireless LAN 802.11a / b / g
MAC / BBP
Communication
10 / 100 MAC
Gigabit MAC
DES / 3DES Security Engine
Multimedia
MPEG4 Encoder / Decoder
TV Encoder
LCD Controller
Peripheral
MS Pro Card Controller
DDRII Controller
DDRI Controller
2003-01
4
7
10
2004-01
4
7
10
2005-01
Note: The right edge of each block denotes the IP’s formal release date. For more details, please
visit our website at: www.faraday-tech.com
37
Faraday CPU Roadmap
90nm
Clock (MHz)
130nm
＊
800
90nm HS FA626
0.15µm
0.18µm
0.25µm
500
0.35µm
＊
130nm HS FA626
FPGA
400
300
＊
130nm LL FA526L
＊
130nm HS FA526 HS
130nm FA501
200
0.18µm FA526
0.18µm FA510
2004-7
10
2005-01
4
7
10
＊ Legend Description：HS：High Speed
LL：Low Leakage
2006-01
4
7
10
Note: Left and right edges indicate Tape
out and Silicon proven schedule
respectively. For more details please visit
our website at: www. faraday-tech. com
38
Faraday StarCell™ IP
Faraday provides a comprehensive portfolio of Peripheral IPs , as the
following list ,which are available right now：

DMA Controller

Static Memory Controller

SDRAM Controller

UART

Timer

Watchdog Timer

Real Time Clock

Interrupt Controller

SD Host Controller

KBD / Mouse Controller

Synchronous Serial Port

Fast IrDA Controller

CF Host Controller

Memory Stick Host Controller

GPIO

10 / 100M Ethernet MAC / PHY

PCI 33 / 66

USB 1.1 Device Controller / PHY

USB 2.0 Device Controller / PHY

Smart Media Host Controller

USB 1.1 FS / LS OTG

DDR Memory Controller

LCD Controller

TV Encoder
39
DSP Roadmap
90nm
130nm Fusion
FD216
130nm
130nm Fusion
FD230-24
130nm
0.15µm
0.18µm
0.25µm
0.35µm
FPGA
0.18µm
0.18µm FD216_HA0A
Hardcore
(w/ mailbox)
0.18µm
Co-Processor
0.25µm
FD216_H90A
Hardcore
2004-7
10
2005-01
4
7
10
2006-01
4
7
10
2007-01
Note: The right edge of each block denotes the IP’s formal release date. For more details, please
visit our website at: www.faraday-tech.com
40
Networking Platform Roadmap
NetComposer-II:
• 600MHz 32-bit CPU
(FA626, 130nm, 1.08V, 125°C)
• 8 Programmable Serdes
• GMAC (*2)
• Switch Fabric
• Coherence Engine
• MPCA (Customer Engine)
• PCI-X 133MHz
• DDR-400 Controller with ECC
NetComposer-I:
• 500MHz 32-bit CPU
(FA626, 130nm, 1.08V, 125°C)
• GMAC (*2)
• Switch Fabric
• Coherence Engine
• MPCA (Customer Engine)
• PCI-X 133MHz
• DDR-333 Controller
NetComposer-II
(NC-II)
NetComposer-I
(NC-I)
2004
Q4
2005
Q1
Q2
Q3
Q4
2006
Note: The right edge of each block denotes the IP’s formal release date. For more details, please
visit our website at: www.faraday-tech.com
41
Multimedia Platform Roadmap
FIE8200:
FIE8150:
• FA526 Cache 16K/16K
• MPEG4 Codec CIF~D1 @ 30fps
• JPEG standard Codec
• TFT LCD, PCI, USB 2.0 OTG, IDE
• 10/100 Ethernet
• WLAN802.11a/b/g
• 300K MPCA (Metal Programmable
Cell Array)
FIE8100:
• FA526 Cache 16K/16K
• MPEG4 Codec CIF~D1 @ 36fps
• JPEG standard Codec
• USB 2.0 Device
• TFT LCD controller
• TV encoder
• FA526 Cache 16K/16K
• MPEG4 Codec CIF~D1 @ 30fps
• JPEG standard Codec
• ISP, 2D/3D Graphic Engine
• 300K MPCA (Metal Programmable
Cell Array)
FIE8200
FIE8150
FIE8100
Q3
Q4
2005
Q1
Q2
Q3
Q4
Note: The right edge of each block denotes the IP’s formal release date. For more details, please
visit our website at: www.faraday-tech.com
42
IA Platform Roadmap
UWB
Wireless
USB
FIE7200
• 0.13µm process
• UWB MAC+BBP+RF
WLAN +
VoIP
Wi-Fi Phone
•
•
•
•
PAP
2005
•
•
•
•
•
0.18µm process
FA526, FD230-16
WLAN 802.11g,
LCD controller
USB OTG
•
•
•
•
•
Ultra Low Power
Wi-Fi Phone
FIE7100
Ultra Low Power
PAP
FIE7000
•
•
•
•
•
0.18µm process
FA526, USB OTG
Audio Codec,
LCD controller,
IDE/CFII
Q1
Q2
Q3
FIE7110
0.13µm process
FA501, USB OTG
WLAN 802.11g,
Audio/Video Codec,
LCD controller, TV encoder
FIE7010
0.13µm process
FA501, USB OTG
20-bit Audio DAC,
LCD controller,
TV encoder, IDE/CFII
Q4
2006
Q1
Note: The right edge of each block denotes the IP’s formal release date. For more details, please
visit our website at: www.faraday-tech.com
43
Structured ASIC Family Roadmap
＊
＊
90nm SP-Hvt MPCA Library
90nm
＊
＊
＊
＊
＊
90nm SP-Hvt MPIO
130nm
＊
＊
HS MPCA
130nm
＊
90nm LL-Hvt MPIO
0.18µm
130nm
＊
＊
LL
MPIO
130nm
＊ MPCA
LL
130nm TEMPLATE MP-Ware
130nm ＊
SP MPIO
0.15µm＊
SP MPCA
0.15µm
＊
＊
SP MPIO
0.18µm ＊
GII MPCA
0.18µm＊
＊
LL MPCA
130nm
0.15µm
0.35µm
FPGA
130nm TEMPLATE Producer II
130nm TEMPLATE FIT9500 130nm TEMPLATE FIT9600
＊
0.18µm
＊
90nm
130nm
＊
HS MPIO＊
130nm
＊
＊
SP MPCA
0.15µm
＊
＊
90nm LL-Hvt MPCA Library
130nm TEMPLATE FIT9700
130nm TEMPLATE FIT9800
0.18µm ＊
GII MPIO
0.25/0.22µm
＊
MPIO
2004-07
10
2005-01
4
7
10
＊ Legend Description: Hvt： High Threshold Voltage
2006-01
SP ： Standard Performance
LL ：Low Leakage
MPCA：Metal Programmable Cell Array
MPIO：Metal Programmable IO
HS：High Speed
4
7
10
2007-01
Note: The right edge of each block
denotes the IP’s formal release date. For
more details, please visit our website at:
www.faraday-tech.com
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