NCCAVS
CMPUG-PAG-TFUG JOINT USERS GROUP MEETING
(www.avsusergroups.org)
FREE ADMISSION—No need to register, just show up!!
Topic: 3D Packaging
Meeting Date: June 10, 2015
Start Time: 12:30 – 4:45pm
Location: SEMI Global Headquarters
Seminar rooms 1 & 2
3081 Zanker Road
San Jose, CA 95134
**Park in front or behind the
vacant building across from SEMI**
Chairs: Hok-Kin Choi, Intel, Hokkin.choi@intel.com
Sing-Pin Tay, AVS, sing-pin_tay@avs.org
Kapila Wijekoon, AMAT, kapila_wijekoon@amat.com
Valeriy Sukharev, Mentor Graphics, Valeriy_sukharev@mentor.com
Lucia Feng, lmfeng@earthlink.net
AGENDA
Free Lunch Sponsored by Kurt J. Lesker Company
beginning at 12:30 PM; Talks beginning at 1:15 PM
1:15 - 1:20 Welcome
1:20 - 1:45 “The Business Aspect of WLP Polymers”, Chris Blatt, TECHCET CA, LLC.
The WLP industry has been stable over the last several years with PI being the dominate player and no
reason to change by the users. However, recent technology changes due to the internet of things and
wearable technology trends, have created the need for new materials for this market. The business
potential of this will be explored as well as projections for future growth.
1:45 – 2:35 “Enabling Multi-Die Integration Through Advanced Packaging”, Sesh Ramaswami,
Packaging Technologies, Advanced Product Technology Development, Silicon Systems Group, Applied
Materials Inc.
The industry is seeking to increasingly leverage packaging technologies to deliver system level benefits
(and hence differentiation) in performance, form factor, time to market and price. This talk will be
anchored on issues and solutions from a process integration and equipment perspective.
2:35 - 2:55 Break and Networking
2:55 - 3:45 “Electromigration Simulation Flow For Chip-Scale Parametric Failure Analysis”, JunHo Choy, Mentor Graphics Corp.
A novel methodology for 3D IC full-chip power and ground nets redundancy-aware EM assessment
based on IR-drop analysis was developed. Physics-based model for temperature- and residual stressaware void nucleation and growth was developed and implemented in the flow. A developed technique for
calculating the hydrostatic stress distribution inside a multi branch interconnect tree allows to avoid over
optimistic prediction of the time to failure made with the Blech-Black analysis of individual branches of
interconnect segment.
Jun-Ho Choy is an active R&D engineer of Mentor Graphics Corp., Fremont, CA. He received the B.S.
degree at Seoul National University, Korea, M.S. at Sung Kyun Kwan University, Korea, and Ph.D. at
Michigan Technological University, Houghton, MI, all in the field of Metallurgical & Materials Engineering.
In semiconductor industry, he held the position of Device Engineer in Memory R&D Division at LG
Semiconductor, Inc. Korea (later acquired by Hynix Semiconductor, Inc.), where he was actively engaged
in the process development that improves device reliability. He also worked for LSI Logic Corp, Milpitas,
CA, as a Principal Engineer developing physics-based electromigration simulator. Subsequently, he
joined Ponte Solutions, Inc.(later acquired by Mentor Graphics), and participated in the development of
physics-based plasma etching model. Jun-Ho’s research area also covers the modeling and simulation of
interface instabilities, and electromigration of IC metallization.
3:45 - 4:35 “The High Rise Chip: Monolithic 3D Integration of Logic and Memory", Max M.
Shulaker, Stanford University, CA
To meet the growing demand for improved information-technology (IT) systems, both the energy
efficiency and computing power of digital logic systems must be drastically improved. While advances
with conventional silicon CMOS continue to be made, alternative technologies are currently being
explored. One such promising emerging nanotechnology is carbon nanotube (CNT) field-effect
transistors (CNFETs); CNFET-based very-large-scale integrated (VLSI) digital systems are projected to
improve the energy-delay product (EDP), a metric of energy efficiency, by an order of magnitude vs.
silicon CMOS. Although such emerging nanotechnologies promise energy-efficient digital logic, it is
important to note that IT applications increasingly rely on big-data analytics performed on data with
massive volume and rate (i.e. abundant data applications). Therefore, solely increasing transistor
performance will not translate to the required increases in system and application performance, as the
latter will remain severely constrained by the growing memory-logic communication bottleneck. Rather,
these emerging devices must be used in tandem with revolutionary digital system architectures (with finegrained integration of logic circuits and massive amounts of memory) to meet the needs of future
abundant data applications. Specifically, monolithic three-dimensional (3D) integration, whereby logic and
memory layers are fabricated directly over previously fabricated layers on the same starting substrate,
can achieve such increased levels of integration. In today’s talk, I will discuss how monolithic 3D
integration is naturally enabled by emerging nanotechnologies for both logic and memory: particularly,
CNFETs for logic circuits, and emerging non-volatile memory (NVM) technologies such as Resistive RAM
(RRAM). Using such as integration scheme, I will demonstrate, for the first time, such monolithicallyintegrated 3D ICs, with arbitrary vertical interleaving layers of logic and memory.
Max Shulaker is a PhD candidate in Electrical Engineering at Stanford University, under the supervision
of Professor Subhasish Mitra. He received his B.S. from Stanford University in Electrical Engineering.
Max’s current research interests are in the broad area of nanosystems. His research results include the
demonstration of the first carbon nanotube computer (highlighted on the cover of Nature, Sept. 2013), the
first digital sub-systems built entirely using carbon nanotube FETs (awarded the ISSCC Jack Raper
Award for Outstanding Technology-Directions Paper, 2013), the first monolithically-integrated 3D
integrated circuits combining arbitrary vertical stacking of logic and memory (IEDM 2014), and the
highest-performance CNFETs to-date (IEDM 2014). He is a Fannie and John Hertz Fellow and a Stanford
Graduate Fellow.
All presentations will be requested to be posted on the PAG, TFUG and CMPUG Proceedings webpage.
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