[Date]
To:
[Supervisor’s name]
From:
[Your name]
Re:
Request to attend 2011 International Wafer-Level Packaging Conference
The 2011 International Wafer-Level Packaging Conference and Tabletop Exhibition is the most costeffective professional development choice available to me this year. The IWLPC offers 40+ technical paper
presentations, panel discussions covering supply and demand in WLP and technology, market trends, and
infrastructure, eight tutorials covering advanced packaging technologies, MEMS, advanced flip chip
technology and more. A Proceedings CD-ROM (valued at $150) including all the technical papers
presented, is free for all conference registrants and can be shared with my colleagues who may not be able
to attend the event. In addition, the Tabletop Exhibition features the products and services of close to 50
companies.
Conference:
Date:
Location:
Technical
Conference Fee:
International Wafer-Level Packaging Conference & Tabletop Exhibition
October 3-6, 2011
Santa Clara Marriott, Santa Clara, California
Earlybird fee is $550.00 (Rate will increase to $650 after Sept. 2nd)
Early Bird registration is available if I register before September 2nd. Several Conference Packages are also
provided so we get the most value for our training dollars! One package allows four of us from our company to
attend for the price of three! The Technical Conference Registration fee is $550 until September 2nd.
Accommodations at the Santa Clara Marriott are $169 per night. More program details and information about
conference registration and lodging are available at www.iwlpc.com.
Attending this conference will not only provide the knowledge that I need to keep pace with rapidly changing
technology, identify innovative solutions, and to discuss the latest research and trends with respected
colleagues, it will also increase visibility for our company. Industry leaders and international experts from 17
countries and 40 states attend IWLPC, the leading wafer-level packaging conference in the industry.
These sessions are of particular relevance to [insert your company] or [insert your current project]:
 [[insert sessions, courses, exhibitors from the conference brochure or SMTA website]
 [[insert sessions, courses, exhibitors]
 [[insert sessions, courses, exhibitors]
My attendance at this conference will also give [company name] direct access to presentations and exhibits
from many other organizations within the wafer-level and advanced packaging industry, allowing us to gain
valuable information about what other firms are doing and where they are focusing their efforts. This is
especially important given our company’s current focus on [insert relevant areas] and our interest to develop
new applications in this area.
Thank you for considering this request for me or my colleagues to attend IWLPC. Please let me know if you
need any additional information that may influence your decision to approve funding.