Wisconsin Center for Applied Microelectronics
1550 Engineering Drive
Madison, WI 53706
Phone: 608/262-6877
Fax: 608/265-2614
DENTON RF SPUTTERER
OPERATING PROCEDURE
Rev. 3/6/2016
Material Restrictions:
All materials allowed for use in this equipment are listed in PDF form on
the WCAM My Web Space. To view the listing following these steps:
A. Open the UW website https://mywebspace.wisc.edu for My
WebSpace.
B. Log on using your UW NetID and password.
C. Click on the star in the upper left corner.
D. Under Bookmarks click on Group Directories.
E. Scroll down the list of organizations to WCAM.
F. Click on WCAM.
G. Double click on the first file folder to open “Approved Materials.”
H. Double click on the WebsiteRpt to view the approved materials for
equipment.
I. Within the PDF you can perform a search.
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login screen
The Login Panel is used to Log In and Log Out of the system. The Login Panel is accessible through the Main or
LOGIN screen by clicking on the Login button at the bottom left of the screen.
login to system
To Log In, click the Login box at the left of the screen.
Enter User Name:
Enter Password:
oper
oper
The upper right corner will indicate who is logged (User ID) on and what the
user role is.
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overview screen
The Overview screen is used to display current system data and provide manual control of subsystems. The
system data and security access level are displayed across the top and down the left side of the screen. The current
state of the vacuum chamber and the pumping system are graphically displayed in the center of the screen.
Subsystem control boxes are accessible on the right side of the screen. Push buttons across the bottom are used to
switch to Login, Recipe, Alarm View, Open Datalog, PLC Racks, Tolerance Alarms and Trend screens.
Pushbuttons change color to indicate the state of the switch. Valves, pumps, and interlocks change color to
indicate current state. Graphic indicators are displayed on the vacuum system graphic when sputter sources,
heater, mass flow controllers or bias table are active.
All operations are familiar Windows operations. All graphics that are accessible to the operator will display a white
“lasso” when the cursor is near the graphic. The valves, pumps, timers, and individual control boxes are activated
by a single click on the mouse. Data is input into a data box by clicking on the data box, typing in the data, and
pressing the ENTER key.
1. Check the Pressure of the vacuum chamber to see if it is healthy. You will need to
pump down to less than 2E-6 torr before deposition can start for any recipe. If the
system is not below this pressure and it has been pumping for more than 2hrs
since the last time it was open to atmosphere there may be a problem. Contact
tool owner if needed.
2. Check the Cryo Pump temperature. It shoud be less than 20 deg. K. Contact tool
owner if it is not.
3. Check the tool logs to see if problems are noted. Check the Top Overview
Message Bar to see if there are errors that need to be addressed.
4. Log your Name, Date and Start Time on the Process Log.
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Top Overview Bar
The top bar in the Overview screen displays the following information:
User ID - ID of the person currently logged onto the tool
Role: The security role assigned to that User.
Alarm status with recent alarm activity.
The alarm Ack button.
Current time and date.
Please note that the ACK button will silence an active audible alarm, but the
audible alarm will reactivate in 60 seconds if the alarm condition is not corrected.
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Left Overview Screen
The left side of the Overview screen is used for System Control, Interlocks, and
subsystem controllers.
The System pushbuttons at the top select the mode of operation: Auto, Manual,
& Service. The current mode is indicated in green.
The currently running Recipe Name is displayed here (if processing in Auto
Mode), as well as the active Sequence Running, Current Step, Run Number,
Process Time and buttons to Start or Abort the recipe sequence. If in Manual or
Service mode, the last Recipe and Sequence ran will be listed.
Recipe Name - Active automatic process currently running or last run if
completed.
Current Step - # of active recipe step and total # of recipe steps.
Sequence Running - Name of active recipe step (or last step if process is
completed).
Process Time - Total process time from Start button until end of last recipe step.
Resets at next Start button.
Run Number - a sequential number applied to the Datalog file for identification.
Reset button resets the Run Number counter.
Operator ID – Indicates operator loading the current recipe.
Wafer ID – Lot designation assigned to current job.
Step Timer – Display of a countdown timer (visible only when active) during an
automatic process.
Start Button – Starts the active recipe.
Abort Button – Stops the active recipe.
Interlock status is displayed in this area of the Overview screen. Green =
Satisfied; Red = Open
Gas Names & Setup Target Names – Gas names and MFCs are setup here (in
Service Mode).
Gas Control – In Manual or Service allows gas flow control in Fixed flow or PID
control.
Interlocks
To the left of each item in the interlock listing is a rectangle that is either Green or Red, indicating whether that
particular interlock is met or not met, respectively. Sputter guns, ion source, and bias will not operate if any
interlock is open. These are hardwired interlocks.
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Auto Mode
This is the Mode that you as an operator will use the tool.
Auto mode is used to run automatic recipes. The Start, Abort, and Reset buttons are active in this Mode. The
current Recipe Running, Current Step, Sequence Running, and Total Process Time will advance as the automatic
recipe is running.
The Run Number is incremented every time the
button is pressed. This feature can be customized to
match customer run numbering. Contact Denton Vacuum for more information.
The
button selects a recipe and starts the Recipe that is selected. The
button stops the
automatic process immediately and sets the recipe back to the beginning and resets the Total Process Time.
All buttons change to green when active or ON.
Note: Access to all other on-screen controls is denied in the Auto mode. This
interlock is built in to avoid manual operation of a subsystem in the Auto Mode.
Auto Mode Process Data
In Auto Mode, the programmed setpoints for each process
step are displayed on the Overview screen. Each process
step is programmed through the Recipe screen. Complete
details on programming an Automatic deposition are
contained in the Recipe section of this manual.
As each step becomes active, the setpoints for the step will
be displayed on the upper left corner of the Overview
screen. This display id intended to provide information on
the exact position of the automatic sequence.
The setpoint data is displayed to provide a comparison
against the actual data displayed on the right side of the
Overview screen.
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Vent and Load
Venting
1. Vent – Push the Chamber Vent Button -
2. Once the venting is complete, the chamber door will slightly open.
3. Open the chamber door fully.
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Changing the 3-inch Sputtering Targets
The SiO2 Target is installed on cathode #1. It is not to be changed by any user.
If you need to change a target this can be done on Cathodes 2,3,or 4 only.
When the chamber door is open a set of buttons will become available for opening and closing
the shutter associated with each cathode.
The following instructions apply for all four interchangeable cathodes.
Metal material targets can be used on all four cathodes.
Note: Some targets should only be installed on Cathode #1 or #2, the RF power cathodes.
Targets available for Cathode #1 or #2—RF
power
Aluminum Oxide (Al2O3)
ITO (In2O3 + 10%SnO2)
Silicon Dioxide (SiO2)
Scandium Oxide (Sc2O3)
Titanium Dioxide (TiO2)
Zinc Oxide (ZnO)
Aluminum (Al)
Chromium (Cr)
Titanium (Ti)
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Targets available for Cathode # 1, #2, #3 & #4 – DC
Power
Nickle (Ni)
Tungsten (W)
Tantalum (Ta)
Copper (Cu)
Alumiumun (Al)
Chromium (Cr)
Titanium (Ti)
8
1. The chamber should be vented. Following venting procedures.
2. Parts needed for target change are located in Denton storage dry box:
a.
b.
c.
d.
3/32” Allen head wench
Target change tray
Ohm meter
Silver paste
3. Fully open the chamber door.
4. Place the target change tray inside the chamber beneath the desired cathode.
5. Click on the desired Cathode Shutter button to open the shutter.
The shutter will open and the button will turn
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6. Using the 3/32” Allen wench, reach into the chamber and loosen ONLY the 3 screws fastening the
cathode shield.
Do not remove the 3 screws.
7. The Shield has an L shaped slot. Rotate
the cathode shield and set it aside.
then Pull off
8. The target ring holds the target. Use 3/32” Allen wench to
remove the 6 target ring screws.
9. With the target ring removed, the ring and target will be off the cathode.
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10. Set the ring aside. Properly store the target in the target case located in the Denton storage box.
11. Prepare the desired target on a work surface:
a. Obtain target from Denton storage box
b. Use isopropanol and Texwipe to clean the backside of a target.
c. Apply thin film of silver paste to backside of target.
d. Place target inside target ring.
12. Position the target and ring on the cathode.
13. Use Allen wrench to insert and tighten the 6 target ring screws.
a. Loosely insert and tighten all 6 target ring screws.
b. After all screws have been inserted, slightly tighten all 6 target
ring screws.
14. Replace the cathode shield and tighten the 3 screws to hold the
shield in place.
15. Use the ohm meter leads to check the resistance of the target to the
cathode shield. It should read an open circuit – off scale.
To check the resistance of insulating materials,
apply the ohm meter leads to the target ring and
cathode shield.
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16. Remove tray from chamber and change the target card display.
17. Add your Target information to the Process Log
Display of
targets installed
18. Proceed to LOADING SUBSTRATES.
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Cards for targets
stored in dry box
Loading your substrates
1. Remove the metal palette from within the chamber.
2. Place your substrates onto the palette.
3. Place the palette back into the chamber.
4. Clean the door o-ring with isopropanol and wipes before closing.
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5. Close the chamber door.
CAUTION #1: Do not handle or strike the door sensor.
CAUTION #2: The door is able to rotate about its
center. Ensure the window is directly to the right of
the door hinge bar.
Line up the screw and black line.
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Pumping down the chamber
1. Method of pumping down
Auto Sequence button: Push the
button on the Overview Screen and hold the door closed
untill the pump has started to evacuate the chamber.
2. Log the Pump Start Time in the Log.
3. Remain with the tool and monitor it to see that the system is pumping properly. You will need to
stay until the system crosses over to using the Cryo Pump and you see that the pressure is going
down.
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Deposition:
RF / DC Sputtering Auto Operation
Vacuum should be at least 2.0e-6 torr

LOG in to CRESS if you have not already done so.

Go to the Overview screen.

Press the START button.

When the “Please Select
Master
Recipe”
screen
appears, open the drop
down screen under “Select
Master Recipe File”.

Highlight the desired recipe
by clicking on it.

Press the “Select” button to
select the highlighted recipe.
The selected recipe will
appear in the “Current
Master Recipe” box.

Press “OK”.
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
Enter the Operator ID and click OK.

Enter the Run ID and click OK.

The recipe will be downloaded and will begin processing automatically.

Monitor the process to verify that it is operating normally.

When the process had been completed, an alarm will sound and
will be displayed.

Acknowledge the end of process message.

Proceed to Vent and Unload section.
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Vent and Unload
Most recipes will include the cool down of 10 minutes and the Auto Venting Step.
If you need to vent the system use the Chamber Vent button on the Overview Screen.
Push the
button.
1. When vented to Atmosphere, Remove substrate from plate.
Pumping down the chamber
4. Method of pumping down
Auto Sequence button: Push the
button on the Overview Screen and hold the door
closed untill the pump has started to evacuate the
chamber.
You need to stay with the tool to verify that it is pumping down properly , crosses
over to the Cryo Pump and then continues to pump Down.
Log off the Denton Software
Log off CRESS.
Cleanup the area.
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Logging Denton Process Information:

Please fill out as you process.

Date – Date you are using the tool.

User – Your Name

Time IN – When did you start using the tool.

Time OUT – Time when you are done with the tool.

Pump Start – Time after loading sample that you started the Auto Pump Down

Seq# is the order you did depositions or deps and heat cycles

Target/Htr/Bias used – Record what target /bias was used or if heater was used.

Recipe Name of Recipe used.

Purge – Record Ar / N2 /O2 flows used.

Dep Pressure – Record Pressure used for deposition.

Power – Record the power used for the target.

Time – Record the length of the deposition time.
DATE
USER
TIME IN
HH:MM
TIME OUT
HH:MM
PUMP START SEQ TARGET/HTR
HH:MM
#
USED
1
2
3
Recipe
Used
PURGE DEP PRES POWER
Ar /N2/O2
mTorr
Watts
Actual TIME
HH:MM:SS
TIME OUT
HH:MM
PUMP START SEQ TARGET/HTR
HH:MM
#
USED
1
2
3
Recipe
Used
PURGE DEP PRES POWER
Ar /N2/O2
mTorr
Watts
TIME
HH:MM:SS
TIME OUT
HH:MM
PUMP START SEQ TARGET/HTR
HH:MM
#
USED
1
2
3
Recipe
Used
PURGE DEP PRES POWER
Ar /N2/O2
mTorr
Watts
TIME
HH:MM:SS
TIME OUT
HH:MM
PUMP START SEQ TARGET/HTR
HH:MM
#
USED
1
2
3
Recipe
Used
PURGE DEP PRES POWER
Ar /N2/O2
mTorr
Watts
TIME
HH:MM:SS
TIME OUT
HH:MM
PUMP START SEQ TARGET/HTR
HH:MM
#
USED
1
2
3
Recipe
Used
PURGE DEP PRES POWER
Ar /N2/O2
mTorr
Watts
TIME
HH:MM:SS
Target Location
1_______RF 2_______DC Comments:
4_______DC 3_______DC
HTR
BIAS
DATE
USER
TIME IN
HH:MM
Target Location
1_______RF 2_______DC Comments:
4_______DC 3_______DC
HTR
BIAS
DATE
USER
TIME IN
HH:MM
Target Location
1_______RF 2_______DC Comments:
4_______DC 3_______DC
HTR
BIAS
DATE
USER
TIME IN
HH:MM
Target Location
1_______RF 2_______DC Comments:
4_______DC 3_______DC
HTR
BIAS
DATE
USER
TIME IN
HH:MM
Target Location
1_______RF 2_______DC Comments:
4_______DC 3_______DC
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Supplemental Information:
DESCRIPTION OF CONTROLS
Software Overview
Graphic display of the control system is arranged on seven screens:

Login

Overview

Recipe

Alarm View

Open Datalog

PLC Racks

Tolerance Alarms

Trend
Login is the first screen active when power is applied. It gives the operator access to the other screens through
push buttons at the bottom of the screen. Access to the Login software is through this screen.
Overview is the primary operating screen. All current system data is displayed on this screen. The operator can
access all subsystems through this screen. The Auto, Manual, and Service Modes are selected on this screen.
Automatic sequences are Started, Stopped and Reset on this screen.
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Recipe screens are used to develop, store, and download recipes for automated processes.
Alarm View is the screen used to display, acknowledge, and clear system alarms. Alarm View is fully described in
the Alarm section of this SOP.
PLC Racks is a screen that displays the live status of the inputs to and outputs from the PLC.
Tolerance Alarms is a screen that displays the adjustable alarm settings for all of the adjustable alarm setpoints.
Open Datalog provides access to the Datalog files of the operating system. All Datalog files are available in
Microsoft Access.
Trend accesses real time graphs for chamber pressure and chamber temperature.
Symbol Overview
This section will describe the various system symbols found on the Overview screen.
Grey indicates the component is OFF/CLOSED, Green indicates the component is ON/OPEN.
Valves: L/L Vent, L/L Rough, Chamber Vent,
Chamber Rough, Regen, Cryo Purge, Process
Gas
Rough Pump
Cryo Pump
L/L Isolation Valve:
Main Chamber Hi Vac Valve
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RF/DC Cathode
DC Cathode
Power ON, Shutter Open
Heater Table ON
RF Bias ON
Substrate on table (red)
Rotation On (green)
L/L Transfer Motor (Idle)
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