MICROLITHIC™ DOUBLE-BALANCED MIXER
ML1-1850
The ML1-1850 is a Microlithic™ double balanced mixer. As with all
Microlithic™ mixers (patent pending), it features excellent conversion loss,
isolations, and spurious performance across a broad bandwidth and in a
miniaturized form factor. Accurate, nonlinear software models are available
for Microwave Office through the Marki Microwave PDK. The ML1-1850 is
available as a wire bondable chip or in a connectorized package. The ML11850 is an excellent alternative to Marki Microwave M9 mixers packaged in
drop-in carriers such as the ES carrier, and is commonly used for wide IF
bandwidth “tuner” applications (see page 2).
Features






Compact Chip Style Package (0.152” x 0.090” x 0.010”)
CAD Optimized for Superior Isolation and Spurious Response
Broadband Performance
Excellent Unit-to-Unit Repeatability
Fully nonlinear software models available with Marki PDK for Microwave Office
RoHS Compliant
Electrical Specifications - Specifications guaranteed from -55 to +100C, measured in a 50Ω system.
Parameter
LO
RF
IF
(GHz)
(GHz)
(GHz)
18-501
18-48
Conversion Loss (dB)
Isolation (dB)
LO-RF
LO-IF
RF-IF
Min
Typ
Max
Diode Option
LO drive level (dBm)
DC-24
8
14
L (+10 to +13)
I (+15 to +19)
18-50
See
Plots
Input 1 dB Compression (dBm)
18-50
18-48
+3
+9
L (+10 to +13)
I (+15 to +19)
Input Two-Tone Third Order
Intercept Point (dBm)
18-50
+14
L (+10 to +13)
18-48
+18
I (+15 to +19)
1. Operational to 56 GHz for L-Diode. Probe testing is limited to 50 GHz. Contact factory for details.
Part Number Options
Please specify diode level and package style by adding to model number.
Package Styles
Connectorized
Chip
2, 3
1
(RoHS)
Examples
S
CH-2, CH-1
ML1-1850LCH-2, ML1-1850LS
ML1-1850
(Model)
L
(Diode
Option)
CH-2
(Package)
1
Connectorized package consists of chip package wire bonded to a substrate, equivalent to an evaluation board.
Chip package connects to external circuit through wire bondable gold pads.
Note: For -1 and -2 port locations and I/O designations, refer to the drawing on page 4 of this document.
2
3
215 Vineyard Court, Morgan Hill, CA 95037 | Ph: 408.778.4200 | Fax 408.778.4300 | info@markimicrowave.com
11/7/14
MICROLITHIC™ DOUBLE-BALANCED MIXER
ML1-1850
Page 2
LO/RF 18 to 50 GHz
IF DC to 24 GHz
Typical Performance
Tuner Conversion Loss (dB)1-4
-4
-6
-8
-10
-12
-14
-16
-18
-20
0
3
6
9
12
15
18
21
24
IF Input Frequency (GHz)
________________________________________________________________________
Conversion Loss (dB)1-4
-4
Relative IF Response (dB)
0
-6
-2
-8
-4
-10
-6
-12
-8
L-Diode
I-Diode
-14
-10
-16
-12
-18
-20
-14
14
18
22
26
30
34
38
42
46
50
54
58
0
3
6
9
LO to RF Isolation (dB)
0
12
15
18
21
24
27
30
54
58
IF Frequency (GHz)
RF Frequency (GHz)
LO to IF Isolation (dB)
0
-10
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
14
18
22
26
30
34
38
42
LO Frequency (GHz)
46
50
54
58
14
18
22
26
30
34
38
42
46
50
LO Frequency (GHz)
11/7/14
MICROLITHIC™ DOUBLE-BALANCED MIXER
ML1-1850
Page 3
LO/RF 18 to 50 GHz
IF DC to 24 GHz
Typical Performance
RF to IF Isolation (dB)
0
IF Return Loss (dB)
0
-10
-4
-20
-8
-30
-12
-40
-16
-50
-20
-60
14
18
22
26
30
34
38
42
46
50
54
0
58
3
6
9
RF Return Loss (dB)
0
12
15
18
21
24
27
30
54
58
IF Frequency (GHz)
RF Frequency (GHz)
LO Return Loss (dB)
0
-4
-4
-8
-8
-12
-12
-16
-16
-20
-20
14
18
22
26
30
34
38
42
46
50
54
14
58
18
22
26
Input IP3 (dBm) L-Diode
30
30
34
38
42
46
50
LO Frequency (GHz)
RF Frequency (GHz)
Input IP3 (dBm) I-Diode
30
25
25
20
20
15
15
10
10
5
5
0
0
-5
-5
-10
-10
18
22
26
30
34
38
RF Frequency (GHz)
42
46
50
18
22
26
30
34
38
42
46
50
RF Frequency (GHz)
11/7/14
MICROLITHIC™ DOUBLE-BALANCED MIXER
ML1-1850
Page 3
LO/RF 18 to 50 GHz
IF DC to 24 GHz
Typical Performance
2xLO Harmonic to RF Isolation (dB)
0
2xLO Harmonic to IF Isolation (dB)
0
-10
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
32
34
36
38
40
42
44
46
48
32
50
34
36
38
40
42
44
46
48
50
46
48
50
LO Output Frequency (GHz)
LO Output Frequency (GHz)
3xLO Harmonic to RF Isolation (dB)
0
0
-10
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
3xLO Harmonic to IF Isolation (dB)
-80
-80
32
34
36
38
40
42
44
46
48
32
50
34
36
LO Output Frequency (GHz)
2RF x 2LO Spurious Suppression (dBc)
0
38
40
42
44
LO Output Frequency (GHz)
2IF x 1LO Spurious Suppression (dBc)
0
-10
-10
-20
-20
-10 dBm RF Input
-30
L-Diode
I-Diode
-40
-10 dBm IF Input
-30
L-Diode
I-Diode
-40
-50
-50
-60
-60
-70
-70
-80
-80
18
22
26
30
34
38
RF Input Frequency (GHz)
42
46
50
18
22
26
30
34
38
42
46
50
RF Output Frequency (GHz)
11/7/14
MICROLITHIC™ DOUBLE-BALANCED MIXER
ML1-1850
Page 4
LO/RF 18 to 50 GHz
IF DC to 24 GHz
.152
[3.86]
.042
PROJECTION
INCH
[MM]
Ground pad,
6 PL
[1.07]
XXX=±.005
XX=±.02
L
.090
L
I
[2.29]
[1.14]
I
.005 sq. minimum
bonding pad, 3 PL
R
.045
CH-2 Option
.110
R
CH-1 Option
.005 [.13] min
clearance
[2.79]
.010
[.25]
.086
[2.18]
.148
[3.76]
Outline Drawing – CH package
*CH Substrate material is .010 thick Ceramic.
I/O traces and ground plane finish is 2.5 microns Au over .05 microns WTi.
Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature
of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of
ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds
should be as short as possible <0.31 mm (12 mils).
________________________________________________________________________________________________________________
.560
PROJECTION
[14.22]
INCH
[MM]
.240
.042
[1.07]
[6.10]
.160
[4.06]
.260
.520 .436
[6.60]
L ML11850 R
[13.21] [11.07]
D/C
I
Port
LO
RF
IF
.06 [1.5] Rad
4 PL
Connector Type
2.40 mm Female
2.40 mm Female
SMA Female
Ø.067 Thru, 4 PL
Note: S-Package Connectors
are not removeable.
.280
[1.70]
[7.11]
.39
.20
.20
[5.0]
[9.9]
[5.0]
Outline Drawing – SV package
11/7/14
MICROLITHIC™ DOUBLE-BALANCED MIXER
ML1-1850
Page 5
LO/RF 18 to 50 GHz
IF DC to 24 GHz
Downconversion Spurious Suppression
Spurious data is taken by selecting RF and LO frequencies (+mLO+nRF) within the 18 to 50 GHz RF/LO bands, which
create a 100 MHz IF spurious output. The mixer is swept across the full spurious band and the mean is calculated. The
numbers shown in the table below are for a -10 dBm RF input. Spurious suppression is scaled for different RF power levels
by (n-1), where “n” is the RF spur order. For example, the 2RFx2LO spur is 60 dBc for the I-diode version for a -10 dBm
input, so a -20 dBm RF input creates a spur that is (2-1) x (-10 dB) dB lower, or 70 dBc.
Typical Downconversion Spurious Suppression (dBc): I-diode (L-diode)
5
-10 dBm RF Input
0xLO
1xLO
2xLO
3xLO
4xLO
5xLO
1xRF
24 (27)
Reference
34 (45)
17 (15)
43 (44)
17 (21)
2xRF
68 (69)
53 (56)
60 (54)
60 (52)
69 (63)
53 (47)
3xRF
N/A
55 (49)
77 (80)
64 (55)
86 (81)
85 (69)
4xRF
N/A
94 (89)
92 (87)
101 (89)
104 (90)
106 (90)
5xRF
N/A
N/A
115 (113)
104 (93)
120 (110)
111 (92)
Upconversion Spurious Suppression
Spurious data is taken by mixing a 100 MHz IF with LO frequencies (+mLO+nIF), which creates an RF within the 18 to 50
GHz RF band. The mixer is swept across the full spurious output band and the mean is calculated. The numbers shown
in the table below are for a -10 dBm IF input. Spurious suppression is scaled for different IF input power levels by (n-1),
where “n” is the IF spur order. For example, the 2IFx1LO spur is typically 57 for the I-diode version dBc for a -10 dBm
input, so a -20 dBm IF input creates a spur that is (2-1) x (-10 dB) dB lower, or 67 dBc.
Typical Upconversion Spurious Suppression (dBc): I-diode (L-diode)
5
-10 dBm RF Input
0xLO
1xLO
2xLO
3xLO
4xLO
5xLO
1xIF
31 (30)
Reference
26 (39)
14 (12)
52 (48)
N/A
2xIF
60 (56)
57 (53)
50 (44)
56 (50)
56 (57)
57 (58)
3xIF
94 (85)
62 (55)
78 (69)
65 (60)
83 (74)
67 (57)
4xIF
113 (103)
100 (92)
99 (77)
104 (86)
102 (84)
97 (86)
5xIF
123 (120)
108 (96)
116 (101)
119 (101)
122 (116)
108 (87)
11/7/14
MICROLITHIC™ DOUBLE-BALANCED MIXER
ML1-1850
Page 6
LO/RF 18 to 50 GHz
IF DC to 24 GHz
Port
Description
DC Interface Schematic
LO
The LO port is DC short to ground and AC matched to 50 Ohms from
18 GHz to 50 GHz. Blocking capacitor is optional.
LO
RF
The RF port is DC short to ground and AC matched to 50 Ohms from
18 GHz to 50 GHz. Blocking capacitor is optional.
RF
IF
The IF port is DC coupled to the diodes. Blocking capacitor is optional.
IF
Absolute Maximum Ratings
Parameter
Maximum Rating
RF DC Current
1 Amp
LO DC Current
1 Amp
IF DC Current
50 mA
RF Power Handling (RF+LO)
+25 dBm at +25°C, derated
linearly to +20 dBm at +100°C
Operating Temperature
-55ºC to +100ºC
Storage Temperature
-65ºC to +125ºC
DATA SHEET NOTES:
1. Mixer Conversion Loss Plot IF frequency is 100 MHz.
2. Mixer Noise Figure typically measures within 0.5 dB of conversion loss for IF frequencies greater than 5 MHz.
3. Conversion Loss typically degrades less than 0.5 dB for LO drives 2 dB below the lowest and 3 dB above highest nominal LO drive levels.
4. Conversion Loss typically degrades less than 0.5 dB at +100°C and improves less than 0.5 dB at -55°C.
5. Unless otherwise specified L diode data taken with +13 dBm LO drive and I diode data is taken with +17 dBm LO drive.
6. Specifications are subject to change without notice. Contact Marki Microwave for the most recent specifications and data sheets.
7. Catalog mixer circuits are continually improved. Configuration control requires custom mixer model numbers and specifications.
Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice. Marki Microwave makes no
warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Marki Microwave assume any
liability whatsoever arising out of the use or application of any product.
© Marki Microwave, Inc.
215 Vineyard Court, Morgan Hill, CA 95037 | Ph: 408.778.4200 | Fax 408.778.4300 | info@markimicrowave.com
www.markimicrowave.com
11/7/14