MSP430 Hardware Tools User's Guide Literature Number: SLAU278K May 2009 – Revised October 2012 Contents ....................................................................................................................................... 7 Get Started Now! ............................................................................................................... 12 1.1 Flash Emulation Tool (FET) Overview .................................................................................. 13 1.2 Kit Contents, MSP-FET430PIF .......................................................................................... 14 1.3 Kit Contents, eZ430-F2013 .............................................................................................. 14 1.4 Kit Contents, eZ430-T2012 .............................................................................................. 14 1.5 Kit Contents, eZ430-RF2500 ............................................................................................ 14 1.6 Kit Contents, eZ430-RF2500T ........................................................................................... 14 1.7 Kit Contents, eZ430-RF2500-SEH ...................................................................................... 14 1.8 Kit Contents, eZ430-Chronos-xxx ....................................................................................... 15 1.9 Kit Contents, MSP-FET430UIF .......................................................................................... 15 1.10 Kit Contents, MSP-FET430xx ............................................................................................ 15 1.11 Kit Contents, FET430F6137RF900 ..................................................................................... 16 1.12 Kit Contents, Sub-1 GHz RF Spectrum Analyzer Tool (MSP-SA430-SUB1GHZ) ................................ 16 1.13 Kit Contents, MSP-TS430xx ............................................................................................. 17 1.14 Kit Contents, EM430Fx1x7RF900 ....................................................................................... 18 1.15 Hardware Installation, MSP-FET430PIF ............................................................................... 18 1.16 Hardware Installation, MSP-FET430UIF ............................................................................... 19 1.17 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529 ......... 19 1.18 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900, EM430Fx137RF900 ...... 19 1.19 Important MSP430 Documents on the Web ........................................................................... 19 Design Considerations for In-Circuit Programming ............................................................... 20 2.1 Signal Connections for In-System Programming and Debugging ................................................... 21 2.2 External Power ............................................................................................................. 25 2.3 Bootstrap Loader (BSL) .................................................................................................. 25 Frequently Asked Questions and Known Issues ................................................................... 26 A.1 Hardware FAQs ............................................................................................................ 27 A.2 Known Issues .............................................................................................................. 29 Hardware .......................................................................................................................... 30 B.1 MSP-TS430D8 ............................................................................................................. 32 B.2 MSP-TS430PW14 ......................................................................................................... 35 B.3 MSP-TS430L092 .......................................................................................................... 38 B.4 MSP-TS430L092 Active Cable .......................................................................................... 41 B.5 MSP-TS430PW24 ......................................................................................................... 44 B.6 MSP-TS430DW28 ......................................................................................................... 47 B.7 MSP-TS430PW28 ......................................................................................................... 50 B.8 MSP-TS430PW28A ....................................................................................................... 53 B.9 MSP-TS430DA38 .......................................................................................................... 56 B.10 MSP-TS430QFN23x0 ..................................................................................................... 59 B.11 MSP-TS430RSB40 ........................................................................................................ 62 B.12 MSP-TS430RHA40A ...................................................................................................... 65 B.13 MSP-TS430DL48 .......................................................................................................... 68 B.14 MSP-TS430RGZ48B ...................................................................................................... 71 B.15 MSP-TS430RGZ48C ...................................................................................................... 74 Preface 1 2 A B 2 Contents SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated www.ti.com B.16 B.17 B.18 B.19 B.20 B.21 B.22 B.23 B.24 B.25 B.26 B.27 B.28 B.29 B.30 B.31 B.32 B.33 B.34 B.35 MSP-TS430PM64 ......................................................................................................... 77 MSP-TS430PM64A ....................................................................................................... 80 MSP-TS430RGC64B ..................................................................................................... 83 MSP-TS430RGC64C ..................................................................................................... 86 MSP-TS430RGC64USB .................................................................................................. 89 MSP-TS430PN80 .......................................................................................................... 93 MSP-TS430PN80A ........................................................................................................ 96 MSP-TS430PN80USB .................................................................................................... 99 MSP-TS430PZ100 ....................................................................................................... 103 MSP-TS430PZ100A ..................................................................................................... 106 MSP-TS430PZ100B ..................................................................................................... 109 MSP-TS430PZ100C ..................................................................................................... 112 MSP-TS430PZ5x100 .................................................................................................... 116 MSP-TS430PZ100USB ................................................................................................. 119 MSP-TS430PEU128 ..................................................................................................... 123 EM430F5137RF900 ..................................................................................................... 126 EM430F6137RF900 ..................................................................................................... 130 EM430F6147RF900 ..................................................................................................... 134 MSP-FET430PIF ......................................................................................................... 138 MSP-FET430UIF ......................................................................................................... 140 B.35.1 MSP-FET430UIF Revision History .......................................................................... 145 .............................................................................................. 146 .................................................................................................... 147 Document Revision History ........................................................................................................ 152 C Hardware Installation Guide C.1 Hardware Installation SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Contents 3 www.ti.com List of Figures 2-1. Signal Connections for 4-Wire JTAG Communication ................................................................ 22 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx, MSP430G2xx and MSP430F4xx Devices .............................................................................. 23 2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F5xx and MSP430F6xx Devices .................................................................................................... 24 B-1. MSP-TS430D8 Target Socket Module, Schematic 32 B-2. MSP-TS430D8 Target Socket Module, PCB 33 B-3. B-4. B-5. B-6. B-7. B-8. B-9. B-10. B-11. B-12. B-13. B-14. B-15. B-16. B-17. B-18. B-19. B-20. B-21. B-22. B-23. B-24. B-25. B-26. B-27. B-28. B-29. B-30. B-31. B-32. B-33. B-34. B-35. B-36. B-37. B-38. B-39. B-40. B-41. B-42. B-43. 4 ................................................................... .......................................................................... MSP-TS430PW14 Target Socket Module, Schematic ............................................................... MSP-TS430PW14 Target Socket Module, PCB ...................................................................... MSP-TS430L092 Target Socket Module, Schematic ................................................................. MSP-TS430L092 Target Socket Module, PCB ........................................................................ MSP-TS430L092 Active Cable Target Socket Module, Schematic ................................................. MSP-TS430L092 Active Cable Target Socket Module, PCB ........................................................ MSP-TS430PW24 Target Socket Module, Schematic ............................................................... MSP-TS430PW24 Target Socket Module, PCB ...................................................................... MSP-TS430DW28 Target Socket Module, Schematic ............................................................... MSP-TS430DW28 Target Socket Module, PCB ...................................................................... MSP-TS430PW28 Target Socket Module, Schematic ............................................................... MSP-TS430PW28 Target Socket Module, PCB ...................................................................... MSP-TS430PW28A Target Socket Module, Schematic .............................................................. MSP-TS430PW28A Target Socket Module, PCB (Red) ............................................................. MSP-TS430DA38 Target Socket Module, Schematic ................................................................ MSP-TS430DA38 Target Socket Module, PCB ....................................................................... MSP-TS430QFN23x0 Target Socket Module, Schematic ........................................................... MSP-TS430QFN23x0 Target Socket Module, PCB .................................................................. MSP-TS430RSB40 Target Socket Module, Schematic .............................................................. MSP-TS430RSB40 Target Socket Module, PCB ..................................................................... MSP-TS430RHA40A Target Socket Module, Schematic ............................................................ MSP-TS430RHA40A Target Socket Module, PCB ................................................................... MSP-TS430DL48 Target Socket Module, Schematic ................................................................ MSP-TS430DL48 Target Socket Module, PCB ....................................................................... MSP-TS430RGZ48B Target Socket Module, Schematic ............................................................ MSP-TS430RGZ48B Target Socket Module, PCB ................................................................... MSP-TS430RGZ48C Target Socket Module, Schematic ............................................................ MSP-TS430RGZ48C Target Socket Module, PCB ................................................................... MSP-TS430PM64 Target Socket Module, Schematic ................................................................ MSP-TS430PM64 Target Socket Module, PCB ....................................................................... MSP-TS430PM64A Target Socket Module, Schematic .............................................................. MSP-TS430PM64A Target Socket Module, PCB ..................................................................... MSP-TS430RGC64B Target Socket Module, Schematic ............................................................ MSP-TS430RGC64B Target Socket Module, PCB ................................................................... MSP-TS430RGC64C Target Socket Module, Schematic ............................................................ MSP-TS430RGC64C Target Socket Module, PCB ................................................................... MSP-TS430RGC64USB Target Socket Module, Schematic ........................................................ MSP-TS430RGC64USB Target Socket Module, PCB ............................................................... MSP-TS430PN80 Target Socket Module, Schematic ................................................................ MSP-TS430PN80 Target Socket Module, PCB ....................................................................... MSP-TS430PN80A Target Socket Module, Schematic .............................................................. List of Figures 35 36 38 39 41 42 44 45 47 48 50 51 53 54 56 57 59 60 62 63 65 66 68 69 71 72 74 75 77 78 80 81 83 84 86 87 89 90 93 94 96 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated www.ti.com B-44. MSP-TS430PN80A Target Socket Module, PCB ..................................................................... 97 B-45. MSP-TS430PN80USB Target Socket Module, Schematic .......................................................... 99 B-46. MSP-TS430PN80USB Target Socket Module, PCB ................................................................ 100 ............................................................. MSP-TS430PZ100 Target Socket Module, PCB .................................................................... MSP-TS430PZ100A Target Socket Module, Schematic............................................................ MSP-TS430PZ100A Target Socket Module, PCB ................................................................... MSP-TS430PZ100B Target Socket Module, Schematic............................................................ MSP-TS430PZ100B Target Socket Module, PCB ................................................................... MSP-TS430PZ100C Target Socket Module, Schematic ........................................................... MSP-TS430PZ100C Target Socket Module, PCB .................................................................. MSP-TS430PZ5x100 Target Socket Module, Schematic .......................................................... MSP-TS430PZ5x100 Target Socket Module, PCB.................................................................. MSP-TS430PZ100USB Target Socket Module, Schematic ........................................................ MSP-TS430PZ100USB Target Socket Module, PCB ............................................................... MSP-TS430PEU128 Target Socket Module, Schematic ........................................................... MSP-TS430PEU128 Target Socket Module, PCB .................................................................. EM430F5137RF900 Target board, Schematic ....................................................................... EM430F5137RF900 Target board, PCB .............................................................................. EM430F6137RF900 Target board, Schematic ....................................................................... EM430F6137RF900 Target board, PCB .............................................................................. EM430F6147RF900 Target Board, Schematic ...................................................................... EM430F6147RF900 Target Board, PCB ............................................................................. MSP-FET430PIF FET Interface Module, Schematic ................................................................ MSP-FET430PIF FET Interface Module, PCB ....................................................................... MSP-FET430UIF USB Interface, Schematic (1 of 4) ............................................................... MSP-FET430UIF USB Interface, Schematic (2 of 4) ............................................................... MSP-FET430UIF USB Interface, Schematic (3 of 4) ............................................................... MSP-FET430UIF USB Interface, Schematic (4 of 4) ............................................................... MSP-FET430UIF USB Interface, PCB ................................................................................ Windows XP Hardware Wizard ........................................................................................ Windows XP Driver Location Selection Folder ....................................................................... Device Manager Using USB Debug Interface using VID/PID 0x2047/0x0010................................... Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF430 .................................... Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF432 .................................... B-47. MSP-TS430PZ100 Target Socket Module, Schematic 103 B-48. 104 B-49. B-50. B-51. B-52. B-53. B-54. B-55. B-56. B-57. B-58. B-59. B-60. B-61. B-62. B-63. B-64. B-65. B-66. B-67. B-68. B-69. B-70. B-71. B-72. B-73. C-1. C-2. C-3. C-4. C-5. SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated List of Figures 106 107 109 110 112 113 116 117 119 120 123 124 126 127 130 131 134 135 138 139 140 141 142 143 144 147 148 149 150 151 5 www.ti.com List of Tables 1-1. Flash Emulation Tool (FET) Features and Device Compatibility .................................................... 13 1-2. Individual Kit Contents, MSP-TS430xx ................................................................................. 17 B-1. MSP-TS430D8 Bill of Materials .......................................................................................... 34 B-2. MSP-TS430PW14 Bill of Materials ...................................................................................... 37 B-3. MSP-TS430L092 Bill of Materials ....................................................................................... 40 B-4. MSP-TS430L092 JP1 Settings .......................................................................................... 42 B-5. MSP-TS430L092 Active Cable Bill of Materials ....................................................................... 43 B-6. MSP-TS430PW24 Bill of Materials ...................................................................................... 46 B-7. MSP-TS430DW28 Bill of Materials...................................................................................... 49 B-8. ..................................................................................... MSP-TS430PW28A Bill of Materials .................................................................................... MSP-TS430DA38 Bill of Materials ...................................................................................... MSP-TS430QFN23x0 Bill of Materials.................................................................................. MSP-TS430RSB40 Bill of Materials .................................................................................... MSP-TS430RHA40A Bill of Materials................................................................................... MSP-TS430DL48 Bill of Materials ....................................................................................... MSP-TS430RGZ48B Bill of Materials................................................................................... MSP-TS430RGZ48C Revision History ................................................................................. MSP-TS430RGZ48C Bill of Materials .................................................................................. MSP-TS430PM64 Bill of Materials ...................................................................................... MSP-TS430PM64A Bill of Materials .................................................................................... MSP-TS430RGC64B Bill of Materials .................................................................................. MSP-TS430RGC64C Bill of Materials .................................................................................. MSP-TS430RGC64USB Bill of Materials............................................................................... MSP-TS430PN80 Bill of Materials ...................................................................................... MSP-TS430PN80A Bill of Materials .................................................................................... MSP-TS430PN80USB Bill of Materials ............................................................................... MSP-TS430PZ100 Bill of Materials .................................................................................... MSP-TS430PZ100A Bill of Materials .................................................................................. MSP-TS430PZ100B Bill of Materials .................................................................................. MSP-TS430PZ100C Bill of Materials .................................................................................. MSP-TS430PZ5x100 Bill of Materials ................................................................................. MSP-TS430PZ100USB Bill of Materials .............................................................................. MSP-TS430PEU128 Bill of Materials ................................................................................. EM430F5137RF900 Bill of Materials .................................................................................. EM430F6137RF900 Bill of Materials .................................................................................. EM430F6147RF900 Bill of Materials .................................................................................. USB VIDs and PIDs Used in MSP430 Tools ......................................................................... B-9. B-10. B-11. B-12. B-13. B-14. B-15. B-16. B-17. B-18. B-19. B-20. B-21. B-22. B-23. B-24. B-25. B-26. B-27. B-28. B-29. B-30. B-31. B-32. B-33. B-34. B-35. C-1. 6 MSP-TS430PW28 Bill of Materials List of Tables 52 55 58 61 64 67 70 73 75 76 79 82 85 88 91 95 98 101 105 108 111 114 118 121 125 128 132 136 147 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Preface SLAU278K – May 2009 – Revised October 2012 Read This First About This Manual This manual describes the hardware of the Texas Instruments MSP-FET430 Flash Emulation Tool (FET). The FET is the program development tool for the MSP430 ultralow-power microcontroller. Both available interface types, the parallel port interface and the USB interface, are described. How to Use This Manual Read and follow the instructions in Chapter 1. This chapter lists the contents of the FET, provides instructions on installing the hardware and according software drivers. After you see how quick and easy it is to use the development tools, TI recommends that you read all of this manual. This manual describes the setup and operation of the FET but does not fully describe the MSP430™ microcontrollers or the development software systems. For details of these items, see the appropriate TI documents listed in Section 1.19. This manual applies to the following tools (and devices): • MSP-FET430PIF (debug interface with parallel port connection, for all MSP430 flash-based devices) • MSP-FET430UIF (debug interface with USB connection, for all MSP430 flash-based devices) • eZ430-F2013 (USB stick form factor interface with attached MSP430F2013 target, for all MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21, and MSP430G2x31 devices) • eZ430-T2012 (three MSP430F2012 based target boards) • eZ430-RF2500 (USB stick form factor interface with attached MSP430F2274 and CC2500 target, for all MSP430F20xx, MSP430F21x2, MSP430F22xx, MSP430G2x01, MSP430G2x11, MSP430G2x21, and MSP430G2x31 devices) • eZ430-RF2500T (one MSP430F2274 and CC2500 target board including battery pack) • eZ430-RF2500-SEH (USB stick form factor interface with attached MSP430F2274 and CC2500 target and solar energy harvesting module) • eZ430-Chronos-xxx (USB stick form factor interface with CC430F6137 based development system contained in a watch. Includes <1 GHz RF USB access point) The following tools contain the USB debug interface (MSP-FET430UIF) and the respective target socket module: • MSP-FET430U8 (for MSP430G2210 and MSP430G2230 devices in 8-pin D packages) (green PCB) • MSP-FET430U14 (for MSP430F20xx, MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21, and MSP430G2x31 devices in 14-pin PW packages) (green PCB) • • • • • • • • • • MSP-FET430U092 (for MSP430FL092 devices in 14-pin PW packages) (green PCB) MSP-FET430U24 (for MSP430AFE2xx devices in 24-pin PW packages) (green PCB) MSP-FET430U28 (for MSP430F11xx(A) devices in 20- and 28-pin DW or PW packages) MSP-FET430U28A (for MSP430F20xx and MSP430G2xxx devices in 14-, 20-, and 28-pin PW) MSP-FET430U38 (for MSP430F22x2 and MSP430F22x4 devices in 38-pin DA packages) MSP-FET430U23x0 (for MSP430F23x0 devices in 40-pin RHA packages) MSP-FET430U40 (for MSP430F51x1, MSP430F51x2 devices in 40-pin RSB packages) MSP-FET430U40A (for MSP430FR572x, MSP430FR573x devices in 40-pin RHA packages) MSP-FET430U48 (for MSP430F22x2 and MSP430F22x4 devices in 48-pin DL packages) MSP-FET430U48B (for MSP430F534x devices in 48-pin RGZ packages) SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Read This First 7 How to Use This Manual • • • • • • • • • • • • • • • • • • www.ti.com MSP-FET430U48C (for MSP430FR58xx and MSP430FR59xx devices in 48-pin RGZ packages) MSP-FET430U64 (for MSP430F13x, MSP430F14x, MSP430F14x1, MSP430F15x, MSP430F16x(1), MSP430F23x, MSP430F24x, MSP430F24xx, MSP430F261x, MSP430F41x, MSP430F42x(A), MSP430FE42x(A), MSP430FE42x2, and MSP430FW42x devices in 64-pin PM packages) MSP-FET430U64A (for MSP430F41x2 devices in 64-pin PM packages) (red PCB) MSP-FET430U64B (for MSP430F530x devices in 64-pin RGC packages) (blue PCB) MSP-FET430U64C (for MSP430F522x and MSP430F521x devices in 64-pin RGC packages) (black PCB) MSP-FET430U64USB (for MSP430F550x, MSP430F551x, MSP430552x, devices in 64-pin RGC packages) MSP-FET430U80 (for MSP430F241x, MSP430F261x, MSP430F43x, MSP430F43x1, MSP430FG43x, MSP430F47x, and MSP430FG47x devices in 80-pin PN packages) MSP-FET430U80A (for MSP430F532x devices in 80-pin PN packages) MSP-FET430U80USB (for MSP430F552x devices with USB peripheral in 80-pin PN packages) MSP-FET430U100 (for MSP430F43x, MSP430F43x1, MSP430F44x, MSP430FG461x, and MSP430F47xx devices in 100-pin PZ packages) MSP-FET430U100A (for MSP430F471xx devices in 100-pin PZ packages) (red PCB) MSP-FET430U100B (for MSP430F67xx devices in 100-pin PZ packages) (blue PCB) MSP-FET430U100C (for MSP430F643x and MSP430F533x devices in 100-pin PZ packages) (black PCB) MSP-FET430U5x100 (for MSP430F54xx(A) devices and MSP430BT5190 in 100-pin PZ packages) (green PCB) MSP-FET430U100USB (for MSP430F663x and MSP430F563x devices in 100-pin PZ packages) (green PCB) MSP-FET430U128 (for MSP430F67xx and MSP430F67xx1 devices in 128-pin PEU packages) (green PCB) FET430F5137RF900 (for CC430F513x devices in 48-pin RGZ packages) (green PCB) FET430F6137RF900 (for CC430F612x and CC430F613x devices in 64-pin RGC packages) (green PCB) Stand-alone target-socket modules (without debug interface): • MSP-TS430D8 (for MSP430G2210 and MSP430G2230 devices in 8-pin D packages) (green PCB) • MSP-TS430PW14 (for MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21 and MSP430G2x31 devices in 14-pin PW packages) (green PCB) • MSP-TS430L092 (for MSP430FL092 devices in 14-pin PW packages) (green PCB) • MSP-TS430PW24 (for MSP430AFE2xx devices in 24-pin PW packages) (green PCB) • MSP-TS430DW28 (for MSP430F11xx(A) devices in 28-pin DW packages) (green PCB) • MSP-TS430PW28 (for MSP430F11xx(A) devices in 28-pin PW packages) (green PCB) • MSP-TS430PW28A (for MSP430F20xx and MSP430G2xxx devices in 14, 20, and 28-pin PW) (red PCB) • MSP-TS430DA38 (for MSP430F22x2 and MSP430F22x4 devices in 38-pin DA packages) (green PCB) • MSP-TS430QFN23x0 / MSP-TS430QFN40 (for MSP430F23x0 devices in 40-pin RHA packages) (green PCB) • MSP-TS430RSB40 (for MSP430F51x1, MSP430F51x2 devices in 40-pin RSB packages) (green PCB) • MSP-TS430RHA40A (for MSP430FR572x, MSP430FR573x devices in 40-pin RHA packages) (red PCB) • MSP-TS430DL48 (for MSP430F22x2 and MSP430F22x4 devices in 48-pin DL packages) (green PCB) • MSP-TS430RGZ48B (for MSP430F534x devices in 48-pin RGZ packages) (blue PCB) • MSP-TS430RGZ48C (for MSP430FR58xx and MSP430FR59xx devices in 48-pin RGZ packages) (black PCB) 8 Read This First SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated How to Use This Manual www.ti.com • • • • • • • • • • • • • • • • • • MSP-TS430PM64 (for MSP430F13x, MSP430F14x, MSP430F14x1, MSP430F15x, MSP430F16x(1), MSP430F23x, MSP430F24x, MSP430F24xx, MSP430F261x, MSP430F41x, MSP430F42x(A), MSP430FE42x(A), MSP430FE42x2, and MSP430FW42x devices in 64-pin PM packages) (green PCB) MSP-TS430PM64A (for MSP430F41x2 devices in 64-pin PM packages) (red PCB) MSP-TS430RGC64B (for MSP430F530x devices in 64-pin RGC packages) (blue PCB) MSP-TS430RGC64C (for MSP430F522x and MSP430F521x devices in 64-pin RGC packages) (black PCB) MSP-TS430RGC64USB (for MSP430F550x, MSP430F551x, MSP430F552x, devices in 64-pin RGC packages) (green PCB) MSP-TS430PN80 (for MSP430F241x, MSP430F261x, MSP430F43x, MSP430F43x1, MSP430FG43x, MSP430F47x, and MSP430FG47x devices in 80-pin PN packages) (green PCB) MSP-TS430PN80A (for MSP430F532x devices in 80-pin PN packages) (red PCB) MSP-TS430PN80USB (for MSP430F551x and MSP430F552x devices with USB peripheral in 80-pin PN packages) (green PCB) MSP-TS430PZ100 (for MSP430F43x, MSP430F43x1, MSP430F44x, MSP430FG461x, and MSP430F47xx devices in 100-pin PZ packages) (green PCB) MSP-TS430PZ100A (for MSP430F471xx devices in 100-pin PZ packages) (red PCB) MSP-FET430PZ100B (for MSP430F67xx devices in 100-pin PZ packages) (blue PCB) MSP-TS430PZ100C (for MSP430F643x and MSP430F533x devices in 100-pin PZ packages) (black PCB) MSP-TS430PZ5x100 (for MSP430F54xx(A) and the MSP430BT5190 devices in 100-pin PZ packages) (green PCB) MSP-TS430PZ100USB (for MSP430F663x and MSP430F563x devices in 100-pin PZ packages) (green PCB) MSP-TS430PEU128 (for MSP430F67xx and MSP430F67xx1 devices in 128-pin PEU packages) (green PCB) EM430F5137RF900 (with integrated CC430F5137 IC in a 48-pin RGZ package) (green PCB) EM430F6137RF900 (with integrated CC430F6137 IC in a 64-pin RGC package) (green PCB) EM430F6147RF900 (with integrated CC430F6147 IC in a 64-pin RGC package) (red PCB) These tools contain the most up-to-date materials available at the time of packaging. For the latest materials (data sheets, user's guides, software, application information, etc.), visit the TI MSP430 web site at www.ti.com/msp430 or contact your local TI sales office. SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Read This First 9 Information About Cautions and Warnings www.ti.com Information About Cautions and Warnings This document may contain cautions and warnings. CAUTION This is an example of a caution statement. A caution statement describes a situation that could potentially damage your software or equipment. WARNING This is an example of a warning statement. A warning statement describes a situation that could potentially cause harm to you. The information in a caution or a warning is provided for your protection. Read each caution and warning carefully. Related Documentation From Texas Instruments MSP430 development tools documentation: CCS for MSP430 User's Guide (literature number SLAU157) Code Composer Studio v5.x Core Edition (CCS Mediawiki) IAR for MSP430 User's Guide (literature number SLAU138) IAR Embedded Workbench KickStart (literature number SLAC050) eZ430-F2013 Development Tool User's Guide (literature number SLAU176) eZ430-RF2480 User's Guide (literature number SWRA176) eZ430-RF2500 Development Tool User's Guide (literature number SLAU227) eZ430-RF2500-SEH Development Tool User's Guide (literature number SLAU273) eZ430-Chronos Development Tool User's Guide (literature number SLAU292) Sub-1 GHz RF Spectrum Analyzer Tool (literature number SLAU371) MSP430F5529 USB Experimenter’s Board, MSP-EXP430F5529 (literature number SLAU330) MSP430F5438 Experimenter Board, MSP-EXP430F5438 (literature number SLAU263) MSP430 LaunchPad Value Line Development kit, MSP-EXP430G2 (literature number SLAU318) MSP430 device user's guides: MSP430x1xx Family User's Guide (literature number SLAU049) MSP430x2xx Family User's Guide (literature number SLAU144) MSP430x3xx Family User's Guide (literature number SLAU012) MSP430x4xx Family User's Guide (literature number SLAU056) MSP430x5xx and MSP430x6xx Family User's Guide (literature number SLAU208) CC430 Family User's Guide (literature number SLAU259) MSP430FR57xx Family User's Guide (literature number SLAU272) MSP430FR58xx and MSP430FR59xx Family User's Guide (literature number SLAU367) 10 Read This First SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated If You Need Assistance www.ti.com If You Need Assistance Support for the MSP430 devices and the FET development tools is provided by the Texas Instruments Product Information Center (PIC). Contact information for the PIC can be found on the TI web site at www.ti.com/support. The Texas Instruments E2E Community support forums for the MSP430 provide open interaction with peer engineers, TI engineers, and other experts. Additional device-specific information can be found on the MSP430 web site. SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Read This First 11 Chapter 1 SLAU278K – May 2009 – Revised October 2012 Get Started Now! This chapter lists the contents of the FET and provides instruction on installing the hardware. Topic 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 1.10 1.11 1.12 1.13 1.14 1.15 1.16 1.17 1.18 1.19 12 ........................................................................................................................... Flash Emulation Tool (FET) Overview .................................................................. Kit Contents, MSP-FET430PIF ............................................................................. Kit Contents, eZ430-F2013 .................................................................................. Kit Contents, eZ430-T2012 .................................................................................. Kit Contents, eZ430-RF2500 ................................................................................ Kit Contents, eZ430-RF2500T .............................................................................. Kit Contents, eZ430-RF2500-SEH ........................................................................ Kit Contents, eZ430-Chronos-xxx ........................................................................ Kit Contents, MSP-FET430UIF ............................................................................. Kit Contents, MSP-FET430xx .............................................................................. Kit Contents, FET430F6137RF900 ........................................................................ Kit Contents, Sub-1 GHz RF Spectrum Analyzer Tool (MSP-SA430-SUB1GHZ) ......... Kit Contents, MSP-TS430xx ................................................................................ Kit Contents, EM430Fx1x7RF900 ......................................................................... Hardware Installation, MSP-FET430PIF ................................................................ Hardware Installation, MSP-FET430UIF ................................................................ Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSPEXP430F5529 .................................................................................................... Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900, EM430Fx137RF900 ............................................................................................ Important MSP430 Documents on the Web ........................................................... Get Started Now! Page 13 14 14 14 14 14 14 15 15 15 16 16 17 18 18 19 19 19 19 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Flash Emulation Tool (FET) Overview www.ti.com 1.1 Flash Emulation Tool (FET) Overview TI offers several flash emulation tools according to different requirements. Supports only F20xx, G2x01, G2x11, G2x21, G2x31 x Supports MSP430F20xx, F21x2, F22xx, G2x01, G2x11, G2x21, G2x31, G2x53 x Supports MSP430F20xx, F21x2, F22xx, G2x01, G2x11, G2x21, G2x31 x x Supports F5438, F5438A x Supports BT5190, F5438A x Supports only F552x x Supports FR57xx, F5638, F6638 x Supports only CC430F613x x Allows fuse blow x Adjustable target supply voltage x Fixed 2.8-V target supply voltage x Fixed 3.6-V target supply voltage x x x x x x 4-wire JTAG x 2-wire JTAG (2) x Application UART Supported by CCS for Windows x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x Supported by IAR (2) x x x Supported by CCS for Linux (1) MSP-EXP430F5529 x MSP-EXP430FR5739 x LaunchPad (MSP-EXP430G2) MSP-FET430UIF Supports all MSP430 and CC430 flashbased devices (F1xx, F2xx, F4xx, F5xx, F6xx, G2xx, L092, FR57xx) MSP-FET430PIF eZ430-Chronos MSP-WDSxx Metawatch eZ430-RF2560 eZ430-RF2480 eZ430-RF2500 eZ430-F2013 Table 1-1. Flash Emulation Tool (FET) Features and Device Compatibility (1) x x x x x x x x The MSP-FET430PIF is for legacy device support only. This emulation tool will not support any new devices released after 2011. The 2-wire JTAG debug interface is also referred to as Spy-Bi-Wire (SBW) interface. SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Get Started Now! 13 Kit Contents, MSP-FET430PIF 1.2 www.ti.com Kit Contents, MSP-FET430PIF • • • • One One One One READ ME FIRST document MSP-FET430PIF interface module 25-conductor cable 14-conductor cable NOTE: This part is obsolete and is not recommended to use in new design. 1.3 Kit Contents, eZ430-F2013 • • 1.4 Kit Contents, eZ430-T2012 • 1.5 QUICK START GUIDE document eZ430-RF2500 CD-ROM eZ430-RF2500 development tool including one MSP430F2274 and CC2500 target board eZ430-RF2500T target board AAA battery pack with expansion board (batteries included) One eZ430-RF2500T target board One AAA battery pack with expansion board (batteries included) Kit Contents, eZ430-RF2500-SEH • • • • • 14 One One One One One Kit Contents, eZ430-RF2500T • • 1.7 Three MSP430F2012-based target boards Kit Contents, eZ430-RF2500 • • • • • 1.6 One QUICK START GUIDE document One eZ430-F2013 development tool including one MSP430F2013 target board One MSP430 development tool CD containing documentation and development software One eZ430-RF USB debugging interface Two eZ430-RF2500T wireless target boards One SEH-01 solar energy harvester board One AAA battery pack with expansion board (batteries included) Get Started Now! SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Kit Contents, eZ430-Chronos-xxx www.ti.com 1.8 Kit Contents, eZ430-Chronos-xxx '433, '868, '915 • One QUICK START GUIDE document • One ez430-Chronos emulator • One screwdriver • Two spare screws eZ430-Chronos-433: – One 433-MHz eZ430-Chronos watch (battery included) – One 433-MHz eZ430-Chronos access point eZ430-Chronos-868: – One 868-MHz eZ430-Chronos watch (battery included) – One 868-MHz eZ430-Chronos access point eZ430-Chronos-915: – One 915-MHz eZ430-Chronos watch (battery included) – One 915-MHz eZ430-Chronos access point 1.9 Kit Contents, MSP-FET430UIF • • • • One One One One READ ME FIRST document MSP-FET430UIF interface module USB cable 14-conductor cable 1.10 Kit Contents, MSP-FET430xx 'U8, 'U14, 'U092, 'U24, 'U28, 'U28A, 'U38, 'U23x0, 'U40, 'U40A, 'U48, 'U48B, 'U64, 'U64A, 'U64B, 'U64C, 'U64USB, 'U80, 'U80USB, 'U100, 'U100A, 'U100B, 'U100C, 'U5x100, 'U100USB, 'U128 • One READ ME FIRST document • One MSP-FET430UIF USB interface module. This is the unit that has a USB B-connector on one end of the case, and a 2×7-pin male connector on the other end of the case. • One USB cable • One 32.768-kHz crystal from Micro Crystal (except MSP-FET430U24) • A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092) • One 14-Pin JTAG conductor cable • One small box containing two MSP430 device samples (See table for Sample Type) • One target socket module. To check the devices used for each board and a summary of the board, see Table 1-2. MSP-TS430xx below is the target socket module for each MSP-FET430Uxx kit. MSP-FET430U8: One MSP-TS430D8 target socket module. MSP-FET430U14: One MSP-TS430PW14 target socket module. MSP-FET430U092: One MSP-TS430L092 target socket module with Active Cable. MSP-FET430U24: One MSP-TS430PW24 target socket module. MSP-FET430U28: One MSP-TS430PW28 target socket module. MSP-FET430U28A: One MSP-TS430PW28A target socket module. MSP-FET430U38: One MSP-TS430DA38 target socket module.. MSP-FET430U23x0: One MSP-TS430QFN23x0 (former name MSP-TS430QFN40) target socket module. MSP-FET430U40: One MSP-TS430RSB40 target socket module. MSP-FET430U48: One MSP-TS430DL48 target socket module. SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Get Started Now! 15 Kit Contents, FET430F6137RF900 www.ti.com MSP-FET430U48B: One MSP-TS430RGZ48B target socket module. MSP-FET430U48C: One MSP-TS430RGZ48C target socket module. MSP-FET430U64: One MSP-TS430PM64 target socket module. MSP-FET430U64A: One MSP-TS430PM64A target socket module. MSP-FET430U64B: One MSP-TS430RGC64B target socket module. MSP-FET430U64C: One MSP-TS430RGC64C target socket module. MSP-FET430U64USB: One MSP-TS430RGC64USB target socket module. MSP-FET430U80: One MSP-TS430PN80 target socket module. MSP-FET430U80A: One MSP-TS430PN80A target socket module. MSP-FET430U80USB: One MSP-TS430PN80USB target socket module. MSP-FET430U100: One MSP-TS430PZ100 target socket module. MSP-FET430U100A: One MSP-TS430PZ100A target socket module. MSP-FET430U100B: One MSP-TS430PZ100B target socket module. MSP-FET430U100C: One MSP-TS430PZ100C target socket module. MSP-FET430U5x100: One MSP-TS430PZ5x100 target socket module. MSP-FET430U100USB: One MSP-TS430PZ100USB target socket module. MSP-FET430U128: One MSP-TS430PEU128 target socket module. Consult the device data sheets for device specifications. Device errata can be found in the respective device product folder on the web provided as a PDF document. Depending on the device, errata may also be found in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi. 1.11 Kit Contents, FET430F6137RF900 • • • • • • • • • • • One READ ME FIRST document One legal notice One MSP-FET430UIF interface module Two EM430F6137RF900 target socket modules. This is the PCB on which is soldered a CC430F6137 device in a 64-pin RGC package. A 2×7-pin male connector is also present on the PCB Two CC430EM battery packs Four AAA batteries Two 868-MHz or 915-MHz antennas Two 32.768-kHz crystals 18 PCB 2x4-pin headers One USB cable One 14-pin JTAG conductor cable 1.12 Kit Contents, Sub-1 GHz RF Spectrum Analyzer Tool (MSP-SA430-SUB1GHZ) • • • • • 16 MSP-SA430-SUB1GHZ Spectrum Analyzer Antenna USB cable CD with a Microsoft Windows Graphical User Interface (GUI) and documentation Quick start guide Get Started Now! SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Kit Contents, MSP-TS430xx www.ti.com 1.13 Kit Contents, MSP-TS430xx 'D8, 'PW14, 'L092, 'PW24, 'DW28, 'PW28, 'PW28A, 'DA38, 'QFN32x0, 'RSB40, 'DL48, 'RGZ48B, 'RGZ48C, 'PM64, 'PM64A, 'RGC64B, 'RGC64C, 'RGC64USB, 'PN80, 'PN80A, 'PN80USB, 'PZ100, 'PZ100A, 'PZ100B, 'PZ100C, 'PZ5x100, 'PZ100USB, 'PEU128 • One READ ME FIRST document • One 32.768-kHz crystal from Micro Crystal (except MSP-TS430PW24) • One target socket module • A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092) • One small box containing two MSP430 device samples (see Table 1-2 for sample type) Table 1-2. Individual Kit Contents, MSP-TS430xx Target Socket Module Socket Type MSP-TS430D8 8-pin D (TSSOP ZIF) MSP-TS430PW14 14-pin PW (TSSOP ZIF) Supported Devices Included Devices Headers and Comment MSP430G2210, G2230 1 x MSP430G2210 and 1 x MSP430G2230 Two PCB 1×4-pin headers (two male and two female) MSP430F20xx, G2x01, G2x11, G2x21, G2x31 2 x MSP430F2013IPW Four PCB 1×7-pin headers (two male and two female) MSP-TS430L092 14-pin PW (TSSOP ZIF) MSP-TS430L092 2 x MSP430L092IPW Four PCB 1×7-pin headers (two male and two female). A "Micro-MaTch" 10-pin female connector is also present on the PCB which connects the kit with an 'Active Cable' PCB; this 'Active Cable' PCB is connected by 14 pin JTAG cable with the FET430UIF MSP-TS430PW24 24-pin PW (TSSOP ZIF) MSP430AFE2xx 2 x MSP430AFE253IPW Four PCB 1×12-pin headers (two male and two female) MSP-TS430DW28 28-pin DW (SSOP ZIF) MSP-TS430PW28 28-pin PW (TSSOP ZIF) MSP430F11x1, F11x2, F12x, F12x2, F21xx MSP-TS430PW28A 28-pin PW (TSSOP ZIF) MSP430F20xx, MSP430G2xxx in 14-, 20-, and 28-pin PW packages MSP-TS430DA38 38-pin DA (TSSOP ZIF) MSP-TS430QFN23x0 MSP430F11x1, F11x2, F12x F12x2 F21xx. 2 x MSP430F123IDW Supports devices in 20- and 28-pin DA packages Four PCB 1×12-pin headers (two male and two female) 2 x MSP430F2132IPW Four PCB 1×12-pin headers (two male and two female) 2 x MSP430G2452IPW20 Four PCB 1×12-pin headers (two male and two female) MSP430F22xx 2 x MSP430F2274IDA Four PCB 1×19-pin headers (two male and two female) 40-pin RHA (QFN ZIF) MSP430F23x0 2 x MSP430F2370IRHA Eight PCB 1×10-pin headers (four male and four female) MSP-TS430RSB40 40-pin RSB (QFN ZIF) MSP430F51x1, F51x2 2 x MSP430F5172IRSB Eight PCB 1×10-pin headers (four male and four female) MSP-TS430RHA40A 40-pin RHA (QFN ZIF) MSP430FR572x, FR573x 2 x MSP430FR5739IRHA Eight PCB 1×10-pin headers (four male and four female) MSP-TS430DL48 48-pin DL (TSSOP ZIF) MSP430F42x0 2 x MSP430F4270IDL Four PCB 2×12-pin headers (two male and two female) MSP-TS430RGZ48B 48-pin RGZ (QFN ZIF) MSP430F534x 2 x MSP430F5342IRGZ Eight PCB 1×12-pin headers (four male and four female) MSP-TS430RGZ48C 48-pin RGZ (QFN ZIF) MSP430FR58xx and MSP430FR59xx 2 x MSP430FR5969IRGZ Eight PCB 1×12-pin headers (four male and four female) MSP-TS430PM64 64-pin PM (QFP ZIF) MSP430F13x, F14x, F14x1, F15x, F16x(1), F23x, F24x, F24xx, F261x, F41x, F42x(A), FE42x(A), FE42x2, FW42x TS Kit: 2 x MSP430F2618IPM; FET Kit: 2 x MSP430F417IPM and 2 x MSP430F169IPM Eight PCB 1×16-pin headers (four male and four female) MSP-TS430PM64A 64-pin PM (QFP ZIF) MSP430F41x2 2 x MSP430F4152IPM Eight PCB 1×16-pin headers (four male and four female) MSP-TS430RGC64B 64-pin RGC (QFN ZIF) MSP430F530x 2 x MSP430F5310IRGC Eight PCB 1×16-pin headers (four male and four female) MSP-TS430RGC64C 64-pin RGC (QFN ZIF) MSP430F522x, F521x 2 x MSP430F5229IRGC Eight PCB 1×16-pin headers (four male and four female) MSP-TS430RGC64USB 64-pin RGC (QFN ZIF) MSP430F550x, F551x, F552x 2 x MSP430F5510IRGC or 2 x MSP430F5528IRGC Eight PCB 1×16-pin headers (four male and four female) MSP-TS430PN80 80-pin PN (QFP ZIF) MSP430F241x, F261x, F43x, F43x1, FG43x, F47x, FG47x 2 x MSP430FG439IPN Eight PCB 1×20-pin headers (four male and four female) SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Get Started Now! 17 Kit Contents, EM430Fx1x7RF900 www.ti.com Table 1-2. Individual Kit Contents, MSP-TS430xx (continued) Target Socket Module Socket Type MSP-TS430PN80A 80-pin PN (QFP ZIF) Supported Devices Included Devices MSP430F532x 2 x MSP430F5329IPN Eight PCB 1×20-pin headers (four male and four female) MSP-TS430PN80USB 80-pin PN (QFP ZIF) MSP430F552x, F551x 2 x MSP430F5529IPN Eight PCB 1×20-pin headers (four male and four female) MSP-TS430PZ100 100-pin PZ (QFP ZIF) MSP-TS430PZ100A 100-pin PZ (QFP ZIF) MSP430F471xx 2 x MSP430F47197IPZ Eight PCB 1×25-pin headers (four male and four female) MSP-TS430PZ100B 100-pin PZ (QFP ZIF) MSP430F67xx 2 x MSP430F6733IPZ Eight PCB 1×25-pin headers (four male and four female) MSP-TS430PZ100C 100-pin PZ (QFP ZIF) MSP430F645x, F643x, F535x, F533x 2 x MSP430F6438IPZ Eight PCB 1×25-pin headers (four male and four female) MSP-TS430PZ5x100 100-pin PZ (QFP ZIF) MSP430F543x, MSP430BT5190, MSP430SL5438A 2 x MSP430F5438IPZ Eight PCB 1×25-pin headers (four male and four female) MSP-TS430PZ100USB 100-pin PZ (QFP ZIF) MSP430F665x, F663x, F563x 2 x MSP430F6638IPZ Eight PCB 1×25-pin headers (four male and four female) MSP-TS430PEU128 128-pin PEU (QFP ZIF) MSP430F677x, F676x, F674x, F677x1, F676x1, F674x1 2 x MSP430F67791IPEU Four PCB 1x26-pin headers (two male and two female) and four PCB 1x38-pin headers (two male and two female) MSP430F43x, F43x1, F44x, 2 x MSP430FG4619IPZ FG461x, F47xx Headers and Comment Eight PCB 1×25-pin headers (four male and four female) See the device data sheets for device specifications. Device errata can be found in the respective device product folder on the web provided as a PDF document. Depending on the device, errata may also be found in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi. 1.14 Kit Contents, EM430Fx1x7RF900 • • • • • • • • One READ ME FIRST document One legal notice Two target socket module MSP-EM430F5137RF900: Two EM430F5137RF900 target socket modules. This is the PCB on which is soldered a CC430F5137 device in a 48-pin RGZ package. A 2×7-pin male connector is also present on the PCB MSP-EM430F6137RF900: Two EM430F6137RF900 target socket modules. This is the PCB on which is soldered a CC430F6137 device in a 64-pin RGC package. A 2×7-pin male connector is also present on the PCB MSP-EM430F6147RF900: Two EM430F6147RF900 target socket modules. This is the PCB on which is soldered a CC430F6147 device in a 64-pin RGC package. A 2×7-pin male connector is also present on the PCB Two CC430EM battery packs Four AAA batteries Two 868- or 915-MHz antennas Two 32.768-kHz crystals 18 PCB 2×4-pin headers 1.15 Hardware Installation, MSP-FET430PIF Follow these steps to install the hardware for the MSP-FET430PIF tools: 1. Use the 25-conductor cable to connect the FET interface module to the parallel port of the PC. The necessary driver for accessing the PC parallel port is installed automatically during CCS or IAR Embedded Workbench installation. Note that a restart is required after the CCS or IAR Embedded Workbench installation for the driver to become active. 2. Use the 14-conductor cable to connect the parallel-port debug interface module to a target board, such as an MSP-TS430xxx target socket module. Module schematics and PCBs are shown in Appendix B. 18 Get Started Now! SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware Installation, MSP-FET430UIF www.ti.com 1.16 Hardware Installation, MSP-FET430UIF Follow these steps to install the hardware for the MSP-FET430UIF tool: 1. Install the IDE (CCS or IAR) you plan to use before connecting USB-FET interface to PC. The IDE installation installs drivers automatically. 2. Use the USB cable to connect the USB-FET interface module to a USB port on the PC. The USB FET should be recognized, as the USB device driver is installed automatically. If the driver has not been installed yet, the install wizard starts. Follow the prompts and point the wizard to the driver files. The default location for CCS is c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_CDC or c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_FET_XP_XX, depending of firmware version of the tool. The default location for IAR Embedded Workbench is <Installation Root>\Embedded Workbench x.x\ 430\drivers\TIUSBFET\eZ430-UART or <Installation Root>\Embedded Workbench x.x\ 430\drivers\<Win_OS>, depending of firmware version of the tool. The USB driver is installed automatically. Detailed driver installation instructions can be found in Appendix C. 3. After connecting to a PC, the USB FET performs a self-test during which the red LED may flash for approximately two seconds. If the self-test passes successfully, the green LED stays on. 4. Use the 14-conductor cable to connect the USB-FET interface module to a target board, such as an MSP-TS430xxx target socket module. 5. Ensure that the MSP430 device is securely seated in the socket, and that its pin 1 (indicated with a circular indentation on the top surface) aligns with the "1" mark on the PCB. 6. Compared to the parallel-port debug interface, the USB FET has additional features including JTAG security fuse blow and adjustable target VCC (1.8 V to 3.6 V). Supply the module with up to 60 mA. 1.17 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSPEXP430F5529 To install eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529 tools follow instructions 1 and 2 of Section 1.16 1.18 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900, EM430Fx137RF900 Follow these steps to install the hardware for the MSP-FET430Uxx and MSP-TS430xxx tools: 1. Follow instructions 1 and 2 of Section 1.16 2. Connect the MSP-FET430PIF or MSP-FET430UIF debug interface to the appropriate port of the PC. Use the 14-conductor cable to connect the FET interface module to the supplied target socket module. 3. Ensure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with a circular indentation on the top surface) aligns with the "1" mark on the PCB. 4. Ensure that the two jumpers (LED and VCC) near the 2×7-pin male connector are in place. Illustrations of the target socket modules and their parts are found in Appendix B. 1.19 Important MSP430 Documents on the Web The primary sources of MSP430 information are the device-specific data sheet and user's guide. The MSP430 web site (www.ti.com/msp430) contains the most recent version of these documents. PDF documents describing the CCS tools (CCS IDE, the assembler, the C compiler, the linker, and the librarian) are in the msp430\documentation folder. A Code Composer Studio specific Wiki page (FAQ) is available, and the Texas Instruments E2E Community support forums for the MSP430 and Code Composer Studio v5 provide additional help besides the product help and Welcome page. PDF documents describing the IAR tools (Workbench C-SPY, the assembler, the C compiler, the linker, and the librarian) are in the common\doc and 430\doc folders. Supplements to the documents (that is, the latest information) are available in HTML format in the same directories. A IAR specific Wiki Page is also available. SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Get Started Now! 19 Chapter 2 SLAU278K – May 2009 – Revised October 2012 Design Considerations for In-Circuit Programming This chapter presents signal requirements for in-circuit programming of the MSP430. Topic 2.1 2.2 2.3 20 ........................................................................................................................... Page Signal Connections for In-System Programming and Debugging ............................ 21 External Power .................................................................................................. 25 Bootstrap Loader (BSL) ..................................................................................... 25 Design Considerations for In-Circuit Programming SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Signal Connections for In-System Programming and Debugging www.ti.com 2.1 Signal Connections for In-System Programming and Debugging MSP-FET430PIF, MSP-FET430UIF, MSP-GANG, MSP-GANG430, MSP-PRGS430 With the proper connections, the debugger and an FET hardware JTAG interface (such as the MSPFET430PIF and MSP-FET430UIF) can be used to program and debug code on the target board. In addition, the connections also support the MSP-GANG430 or MSP-PRGS430 production programmers, thus providing an easy way to program prototype boards, if desired. Figure 2-1 shows the connections between the 14-pin FET interface module connector and the target device required to support in-system programming and debugging for 4-wire JTAG communication. Figure 2-2 shows the connections for 2-wire JTAG mode (Spy-Bi-Wire). The 4-wire JTAG mode is supported on most MSP430 devices except of small pin count devices e.g. MSP430G2230. The 2-wire JTAG mode is available on selected devices only. See the CCS User's Guide for MSP430 (SLAU157) or IAR for MSP430 User's Guide (SLAU138) for information on which interface method can be used on which device. The connections for the FET interface module and the MSP-GANG, MSP-GANG430 or MSP-PRGS430 are identical. Both the FET interface module and MSP-GANG430 can supply VCC to the target board (via pin 2). In addition, the FET interface module, MSP-GANG and MSP-GANG430 have a VCC-sense feature that, if used, requires an alternate connection (pin 4 instead of pin 2). The VCC-sense feature senses the local VCC present on the target board (that is, a battery or other local power supply) and adjusts the output signals accordingly. If the target board is to be powered by a local VCC, then the connection to pin 4 on the JTAG should be made, and not the connection to pin 2. This utilizes the VCC-sense feature and prevents any contention that might occur if the local on-board VCC were connected to the VCC supplied from the FET interface module, MSP-GANG or the MSP-GANG430. If the VCC-sense feature is not necessary (that is, if the target board is to be powered from the FET interface module, MSP-GANG or MSP-GANG430), the VCC connection is made to pin 2 on the JTAG header and no connection is made to pin 4. Figure 2-1 and Figure 2-2 show a jumper block that supports both scenarios of supplying VCC to the target board. If this flexibility is not required, the desired VCC connections may be hard-wired eliminating the jumper block. Pins 2 and 4 must not be connected simultaneously. Note that in 4-wire JTAG communication mode (see Figure 2-1), the connection of the target RST signal to the JTAG connector is optional when using devices that support only 4-wire JTAG communication mode. However, when using devices that support 2-wire JTAG communication mode in 4-wire JTAG mode, the RST connection must be made. The MSP430 development tools and device programmers perform a target reset by issuing a JTAG command to gain control over the device. However, if this is unsuccessful, the RST signal of the JTAG connector may be used by the development tool or device programmer as an additional way to assert a device reset. SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Design Considerations for In-Circuit Programming Copyright © 2009–2012, Texas Instruments Incorporated 21 Signal Connections for In-System Programming and Debugging www.ti.com VCC J1 (see Note A) VCC/AVCC/DVCC J2 (see Note A) R1 47 kW (see Note B) C2 10 µF C3 0.1 µF MSP430Fxxx JTAG VCC TOOL VCC TARGET TEST/VPP RST/NMI 2 1 4 3 6 5 8 7 10 9 12 11 14 13 TDO/TDI TDO/TDI TDI/VPP TDI/VPP TMS TMS TCK TCK GND RST (see Note D) TEST/VPP (see Note C) C1 10 nF/2.2 nF (see Notes B and E) VSS/AVSS/DVSS A If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used, make connection J2. B The configuration of R1 and C1 for the RST/NMI pin depends on the device family. See the respective MSP430 family user's guide for the recommended configuration. C The TEST pin is available only on MSP430 family members with multiplexed JTAG pins. See the device-specific data sheet to determine if this pin is available. D The connection to the JTAG connector RST pin is optional when using 4-wire JTAG communication mode capableonly devices and not required for device programming or debugging. However, this connection is required when using 2-wire JTAG communication mode capable devices in 4-wire JTAG mode. E When using 2-wire JTAG communication capable devices in 4-wire JTAG mode, the upper limit for C1 should not exceed 2.2 nF. This applies to both TI FET interface modules (LPT and USB FET). Figure 2-1. Signal Connections for 4-Wire JTAG Communication 22 Design Considerations for In-Circuit Programming SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Signal Connections for In-System Programming and Debugging www.ti.com VCC J1 (see Note A) VCC / AV CC / DVCC J2 (see Note A) R1 47kΩ See Note B C2 10μF C3 0.1μF MSP430Fxxx JTAG VCC TOOL VCC TARGET TEST/VPP 2 1 4 3 6 5 8 7 10 9 12 11 14 13 TDO/TDI RST/NMI/SBWTDIO TCK GND R2 330Ω TEST/SBWTCK C1 2.2 nF See Note B VSS / AV SS / DVSS A If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used, make connection J2. B The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during JTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection with the device. The upper limit for C1 is 2.2 nF when using current TI tools. C R2 protects the JTAG debug interface TCK signal from the JTAG security fuse blow voltage that is supplied by the TEST/VPP pin during the fuse blow process. If fuse blow functionality is not needed, R2 is not required (populate 0 Ω) and do not connect TEST/VPP to TEST/SBWTCK. Figure 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx, MSP430G2xx and MSP430F4xx Devices SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Design Considerations for In-Circuit Programming Copyright © 2009–2012, Texas Instruments Incorporated 23 Signal Connections for In-System Programming and Debugging www.ti.com VCC J1 (see Note A) VCC / AV CC / DVCC J2 (see Note A) R1 47kΩ See Note B C2 10µF C3 0.1μF MSP430Fxxx JTAG VCC TOOL VCC TARGET 2 1 4 3 6 5 8 7 10 9 12 11 14 13 TDO/TDI RST/NMI/SBWTDIO TCK GND TEST/SBWTCK C1 2.2 nF See Note B VSS / AV SS / DVSS A Make connection J1 if a local target power supply is used, or make connection J2 if the target is powered from the debug or programming adapter. B The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during JTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection with the device. The upper limit for C1 is 2.2 nF when using current TI tools. Figure 2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F5xx and MSP430F6xx Devices 24 Design Considerations for In-Circuit Programming SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated External Power www.ti.com 2.2 External Power The MSP-FET430UIF can supply targets with up to 60 mA through pin 2 of the 14-pin connector. Please note that the target should not consume more than 60 mA, even as a peak current, as it may violate the USB specification. E.g., if the target board has a capacitor on VCC more than 10 µF, it may cause inrush current during capacitor charging that may exceed 60 mA. In this case the current should be limited by the design of the target board, or an external power supply should be used. The VCC for the target can be selected between 1.8 V and 3.6 V in steps of 0.1 V. Alternatively, the target can be supplied externally. In this case, the external voltage should be connected to pin 4 of the 14-pin connector. The MSP-FET430UIF then adjusts the level of the JTAG signals to external VCC automatically. Only pin 2 (MSP-FET430UIF supplies target) or pin 4 (target is externally supplied) must be connected; not both at the same time. When a target socket module is powered from an external supply, the external supply powers the device on the target socket module and any user circuitry connected to the target socket module, and the FET interface module continues to be powered from the PC via the parallel port. If the externally supplied voltage differs from that of the FET interface module, the target socket module must be modified so that the externally supplied voltage is routed to the FET interface module (so that it may adjust its output voltage levels accordingly). See the target socket module schematics in Appendix B. The PC parallel port can source a limited amount of current. Because of the ultralow-power requirement of the MSP430, a standalone FET does not exceed the available current. However, if additional circuitry is added to the tool, this current limit could be exceeded. In this case, external power can be supplied to the tool via connections provided on the target socket modules. See the schematics and pictorials of the target socket modules in Appendix B to locate the external power connectors. Note that the MSPFET430PIF is not recommended for new design. 2.3 Bootstrap Loader (BSL) The JTAG pins provide access to the flash memory of the MSP430Fxxx devices. On some devices, these pins are shared with the device port pins, and this sharing of pins can complicate a design (or sharing may not be possible). As an alternative to using the JTAG pins, most MSP430Fxxx devices contain a program (a "bootstrap loader") that permits the flash memory to be erased and programmed using a reduced set of signals. The MSP430 Programming Via the Bootstrap Loader User's Guide (SLAU319) describes this interface. See the MSP430 web site for the application reports and a list of MSP430 BSL tool developers. TI suggests that MSP430Fxxx customers design their circuits with the BSL in mind (that is, TI suggests providing access to these signals by, for example, a header). See FAQ Hardware #10 for a second alternative to sharing the JTAG and port pins. SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Design Considerations for In-Circuit Programming Copyright © 2009–2012, Texas Instruments Incorporated 25 Appendix A SLAU278K – May 2009 – Revised October 2012 Frequently Asked Questions and Known Issues This appendix presents solutions to frequently asked questions regarding the MSP-FET430 hardware. Topic A.1 A.2 26 ........................................................................................................................... Page Hardware FAQs ................................................................................................. 27 Known Issues ................................................................................................... 29 Frequently Asked Questions and Known Issues SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware FAQs www.ti.com A.1 Hardware FAQs 1. MSP430F22xx Target Socket Module (MSP-TS430DA38) – Important Information Due to the large capacitive coupling introduced by the device socket between the adjacent signals XIN/P2.6 (socket pin 6) and RST/SBWTDIO (socket pin 7), in-system debugging can disturb the LFXT1 low-frequency crystal oscillator operation (ACLK). This behavior applies only to the Spy-Bi-Wire (2-wire) JTAG configuration and only to the period while a debug session is active. Workarounds: • Use the 4-wire JTAG mode debug configuration instead of the Spy-Bi-Wire (2-wire) JTAG configuration. This can be achieved by placing jumpers JP4 through JP9 accordingly. • Use the debugger option "Run Free" that can be selected from the Advanced Run drop-down menu (at top of Debug View). This prevents the debugger from accessing the MSP430 while the application is running. Note that, in this mode, a manual halt is required to see if a breakpoint was hit. See the IDE documentation for more information on this feature. • Use an external clock source to drive XIN directly. 2. With current interface hardware and software, there is a weakness when adapting target boards that are powered externally. This leads to an accidental fuse check in the MSP430. This is valid for PIF and UIF but is mainly seen on UIF. A solution is being developed. Workarounds: • Connect RST/NMI pin to JTAG header (pin 11), LPT and USB tools are able to pull the RST line, which also resets the device internal fuse logic. • Use the debugger option "Release JTAG On Go" that can be selected from the IDE drop-down menu. This prevents the debugger from accessing the MSP430 while the application is running. Note that in this mode, a manual halt is required to see if a breakpoint was hit. See the IDE documentation for more information on this feature. • Use an external clock source to drive XIN directly. 3. The 14-conductor cable connecting the FET interface module and the target socket module must not exceed 8 inches (20 centimeters) in length. 4. The signal assignment on the 14-conductor cable is identical for the parallel port interface and the USB FET. 5. To utilize the on-chip ADC voltage references, the capacitor must be installed on the target socket module. See schematic of the target socket module to populate the capacitor according to the data sheet of the device. 6. To utilize the charge pump on the devices with LCD+ Module, the capacitor must be installed on the target socket module. See schematic of the target socket module to populate the capacitor according to the data sheet of the device. 7. Crystals or resonators Q1 and Q2 (if applicable) are not provided on the target socket module. For MSP430 devices that contain user-selectable loading capacitors, see device and crystal data sheets for the value of capacitance. 8. Crystals or resonators have no effect upon the operation of the tool and the CCS debugger or C-SPY (as any required clocking and timing is derived from the internal DCO and FLL). 9. On devices with multiplexed port or JTAG pins, to use these pin in their port capability: For CCS: "Run Free" (in Run pulldown menu at top of Debug View) must be selected. For C-SPY: "Release JTAG On Go" must be selected. 10. As an alternative to sharing the JTAG and port pins (on low pin count devices), consider using an MSP430 device that is a "superset" of the smaller device. A very powerful feature of the MSP430 is that the family members are code and architecturally compatible, so code developed on one device (for example, one without shared JTAG and port pins) ports effortlessly to another (assuming an equivalent set of peripherals). SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Frequently Asked Questions and Known Issues Copyright © 2009–2012, Texas Instruments Incorporated 27 Hardware FAQs www.ti.com 11. Information memory may not be blank (erased to 0xFF) when the device is delivered from TI. Customers should erase the information memory before its first use. Main memory of packaged devices is blank when the device is delivered from TI. 12. The device current is higher then expected. The device current measurement may not be accurate with the debugger connected to the device. For accurate measurement, disconnect the debugger. 13. The following ZIF sockets are used in the FET tools and target socket modules: • 8-pin device (D package): Yamaichi IC369-0082 • 14-pin device (PW package): Enplas OTS-14-065-01 • 14-pin package for 'L092 (PW package): Yamaichi IC189-0142-146 • 24-pin package (PW package): Enplas OTS-24(28)-0.65-02 • 28-pin device (DW package): Wells-CTI 652 D028 • 28-pin device (PW package): Enplas OTS-28-0.65-01 • 38-pin device (DA package): Yamaichi IC189-0382-037 • 40-pin device (RHA package): Enplas QFN-40B-0.5-01 • 40-pin device (RSB package): Enplas QFN-40B-0.4 • 48-pin device (RGZ package): Yamaichi QFN11T048-008 A101121-001 • 48-pin device (DL package): Yamaichi IC51-0482-1163 • 64-pin device (PM package): Yamaichi IC51-0644-807 • 64-pin device (RGC package): Yamaichi QFN11T064-006 • 80-pin device (PN package): Yamaichi IC201-0804-014 • 100-pin device (PZ package): Yamaichi IC201-1004-008 • 128-pin device (PEU package): Yamaichi IC500-1284-009P Enplas: www.enplas.com Wells-CTI: www.wellscti.com Yamaichi: www.yamaichi.us 28 Frequently Asked Questions and Known Issues SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Known Issues www.ti.com A.2 Known Issues MSP-FET430UIF Current detection algorithm of the UIF firmware Problem Description If high current is detected, the ICC monitor algorithm stays in a loop of frequently switching on and off the target power supply. This power switching puts some MSP430 devices such as the MSP430F5438 in a state that requires a power cycle to return the device to JTAG control. A side issue is that if the UIF firmware has entered this switch on and switch off loop, it is not possible to turn off the power supply to the target by calling MSP430_VCC(0). A power cycle is required to remove the device from this state. Solution IAR KickStart and Code Composer Essentials that have the MSP430.dll version 2.04.00.003 and higher do not show this problem. Update the software development tool to this version or higher to update the MSP-FET430UIF firmware. MSP-FET430PIF Some PCs do not supply 5 V through the parallel port Problem Description Device identification problems with modern PCs, because the parallel port often does not deliver 5 V as was common with earlier hardware. 1. When connected to a laptop, the test signal is clamped to 2.5 V. 2. When the external VCC becomes less than 3 V, up to 10 mA is flowing in the adapter via pin 4 (sense). Solution Measure the voltage level of the parallel port. If it is too low, provide external 5 V to the VCC pads of the interface. The jumper on a the target socket must be switched to external power. SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Frequently Asked Questions and Known Issues Copyright © 2009–2012, Texas Instruments Incorporated 29 Appendix B SLAU278K – May 2009 – Revised October 2012 Hardware This appendix contains information relating to the FET hardware, including schematics, PCB pictorials, and bills of materials. All other tools, such as the eZ430 series, are described in separate product-specific user's guides. 30 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Appendix B www.ti.com Topic ........................................................................................................................... B.1 B.2 B.3 B.4 B.5 B.6 B.7 B.8 B.9 B.10 B.11 B.12 B.13 B.14 B.15 B.16 B.17 B.18 B.19 B.20 B.21 B.22 B.23 B.24 B.25 B.26 B.27 B.28 B.29 B.30 B.31 B.32 B.33 B.34 B.35 Page MSP-TS430D8 ................................................................................................... 32 MSP-TS430PW14 ............................................................................................... 35 MSP-TS430L092 ................................................................................................ 38 MSP-TS430L092 Active Cable ............................................................................. 41 MSP-TS430PW24 ............................................................................................... 44 MSP-TS430DW28 ............................................................................................... 47 MSP-TS430PW28 ............................................................................................... 50 MSP-TS430PW28A ............................................................................................. 53 MSP-TS430DA38 ............................................................................................... 56 MSP-TS430QFN23x0 .......................................................................................... 59 MSP-TS430RSB40 ............................................................................................. 62 MSP-TS430RHA40A ........................................................................................... 65 MSP-TS430DL48 ................................................................................................ 68 MSP-TS430RGZ48B ........................................................................................... 71 MSP-TS430RGZ48C ........................................................................................... 74 MSP-TS430PM64 ............................................................................................... 77 MSP-TS430PM64A ............................................................................................. 80 MSP-TS430RGC64B ........................................................................................... 83 MSP-TS430RGC64C ........................................................................................... 86 MSP-TS430RGC64USB ....................................................................................... 89 MSP-TS430PN80 ............................................................................................... 93 MSP-TS430PN80A ............................................................................................. 96 MSP-TS430PN80USB ......................................................................................... 99 MSP-TS430PZ100 ............................................................................................ 103 MSP-TS430PZ100A .......................................................................................... 106 MSP-TS430PZ100B .......................................................................................... 109 MSP-TS430PZ100C .......................................................................................... 112 MSP-TS430PZ5x100 ......................................................................................... 116 MSP-TS430PZ100USB ...................................................................................... 119 MSP-TS430PEU128 .......................................................................................... 123 EM430F5137RF900 ........................................................................................... 126 EM430F6137RF900 ........................................................................................... 130 EM430F6147RF900 ........................................................................................... 134 MSP-FET430PIF ............................................................................................... 138 MSP-FET430UIF ............................................................................................... 140 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 31 Vcc J5 3 2 1 14 12 10 8 6 4 2 SBW 2 1 C7 13 11 9 7 5 3 1 GND 330R R3 C5 100nF SBWTCK J4 R2 330R 1 2 3 4 TST/SBWTCK FE4L J1 VCC430 P1.2 P1.5 P1.6 U1 RST/SBWTDIO R5 47K MSP-TS430D8 DVCC P1.2/TA1/A2 P1.5/TA0/A5/SCLK P1.6/TA1/A6/SDO/SCL DNP GND C8 2.2nF 1 2 3 4 Socket: YA MAICHI Type: IC369-0082 DVSS TST/SBWTCK RST/SBWTDIO P1.7/A7/SDI/SDA 8 7 6 5 GND GND TST/SBWTCK RST/SBWTDIO P1.7 J2 FE4H 8 7 6 5 VCC J3 Ext_PWR REV: 1.0 GND 1 2 3 Sheet: /11 Copyright © 2009–2012, Texas Instruments Incorporated RST/SBWTDIO TST/SBWTCK to measure supply current J6 10uF/10V D1 green 2 1 ext int + GND MSP-TS430D8 MSP-TS430D8 Ta rget Socket Board TITLE: Document Number: Date: 28.07.201 1 11:03:35 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Hardware 32 MSP-TS430D8 B.1 www.ti.com MSP-TS430D8 Figure B-1. MSP-TS430D8 Target Socket Module, Schematic MSP-TS430D8 www.ti.com 14 pin connector for debugging only in Spy-Bi-Wire mode (4 Wire JTAG not available) D1 LED connected to P1.2 Connector J5 External power connector Jumper JP3 to "ext" Jumper JP2 Open to disconnect LED Orient Pin 1 of MSP430 device Figure B-2. MSP-TS430D8 Target Socket Module, PCB SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 33 MSP-TS430D8 www.ti.com Table B-1. MSP-TS430D8 Bill of Materials Position 34 No. per Board Ref Des Description DigiKey Part No. Comment 1 J4, J6 2 2-pin header, male, TH SAM1035-02-ND place jumper on header 2 J5 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2 3 SBW 1 10-pin connector, male, TH HRP10H-ND 4 J3 1 3-pin header, male, TH SAM1035-03-ND 5 C8 1 2.2nF, CSMD0805 Buerklin 53 D 292 6 C7 1 10uF, 10V, 1210ELKO 478-3875-1-ND 7 R5 1 47K, 0805 541-47000ATR-ND 8 C5 1 100nF, CSMD0805 311-1245-2-ND 9 R2, R3 2 330R, 0805 541-330ATR-ND 10 J1, J2 2 4-pin header, TH SAM1029-04-ND DNP: headers enclosed with kit. Keep vias free of solder. 10,1 J1, J2 1 4-pin socket, TH SAM1029-04-ND DNP: receptacles enclosed with kit. 11 U1 1 SO8 Socket: Type IC369-0082 12 D1 1 red, LED 0603 13 MSP430 2 MSP430x 14 PCB 1 50,0mmx44,5mm Hardware Manuf.: Yamaichi "DNP: enclosed with kit. Is supplied by TI" MSP-TS430D8 Rev. 1.0 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PW14 B.2 MSP-TS430PW14 www.ti.com Vcc J5 3 2 1 14 12 10 8 6 4 2 JTAG 13 11 9 7 5 3 1 GND RST/NMI SBWTCK TMS TDI TDO/SBWTDIO J7 3 2 1 TEST/SBWTCK JTAG -> SBW -> XIN XOUT to measure supply current J6 Q1 DNP J4 R2 330R 1 2 3 4 5 6 7 TEST/SBWTCK J1 J8 3 2 1 C8 2.2nF 1 2 3 4 5 6 7 J9 3 2 1 P1.7/TDO 3 2 1 J10 GND XIN XOUT TEST/SBWTCK RST/SBWTDIO P1.7/TDO P1.6/TDI Socket: ENPLAS Type: OTS-14-065 14 13 12 11 10 9 8 P1.6/TDI 14 13 12 11 10 9 8 J2 3 2 1 J11 VCC P1.5/TMS 3 2 1 J12 2-wire "SpyBiWire": Set jumpers J7 to J12 to position 2-1 4-wire JTAG: Set jumpers J7 to J12 to position 2-3 JTAG-Mode selection: RST/SBWTDIO R5 47K DNP GND VCC430 P1.0 P1.1 P1.2 P1.3 P1.4/TCK P1.5/TMS C3 100nF DNP GND MSP-TS430PW14 Ext_PWR J3 GND P1.4/TCK REV: 2.0 Sheet: 1/1 MSP-TS430PW14 Target Socket Board TITLE: Document Number: Date: 7/16/2007 8:22:36 AM Copyright © 2009–2012, Texas Instruments Incorporated 1 2 3 35 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback ext int 2 1 12pF C2 DNP 330R R3 12pF C1 DNP D1 green 2 1 C5 C7 100nF 10uF/10V GND + Figure B-3. MSP-TS430PW14 Target Socket Module, Schematic MSP-TS430PW14 www.ti.com Connector J3 External power connector Jumper J5 to 'ext' LED connected to P1.0 Jumpers J7 to J12 Close 1-2 to debug in Spy-Bi-Wire Mode. Close 2-3 to debug in 4-wire JTAG mode. Jumper J4 Open to disconnect LED Orient Pin 1 of MSP430 device Jumper J6 Open to measure current Figure B-4. MSP-TS430PW14 Target Socket Module, PCB 36 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PW14 www.ti.com Table B-2. MSP-TS430PW14 Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 511-1463-2-ND 478-3351-2-ND Description 2 C7 1 10uF, 10V, Tantal Size B 3 C3, C5 1 100nF, SMD0805 4 C8 0 2.2nF, SMD0805 5 D1 1 green LED, SMD0603 6 J1, J2 0 DigiKey Part No. Comment DNP DNP: C3 DNP 475-1056-2-ND DNP: Headers and receptacles enclosed with kit. Keep vias free of solder 7-pin header, TH SAM1029-07-ND : Header SAM1213-07-ND : Receptacle 7 J3, J5, J7, J8, J9, J10, J11, J12 8 3-pin header, male, TH SAM1035-03-ND Place jumpers on headers J5, J7, J8, J9, J10, J11, J12; Pos 1-2 8 J4, J6 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 9 Jumper 15-38-1024-ND Place on: J5, J7-J12; Pos 1-2 HRP14H-ND 9 10 JTAG 1 14-pin connector, male, TH 12 Q1 0 Crystal Micro Crystal MS1V-T1K 32.768kHz, C(Load) = DNP: keep vias free of solder 12.5pF 13 R2, R3 2 330 Ω, SMD0805 541-330ATR-ND 15 R5 1 47k Ω, SMD0805 541-47000ATR-ND 16 U1 1 Socket: OTS-14-0.65-01 17 PCB 1 56 x 53 mm 18 Adhesive plastic feet 4 Approximately 6mm width, 2mm height 19 MSP430 2 MSP430F2013IPW Manuf.: Enplas 2 layers For example, 3M Bumpons Part No. SJ5302 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Apply to corners at bottom side DNP: enclosed with kit, supplied by TI Hardware 37 MSP-TS430L092 B.3 www.ti.com MSP-TS430L092 Figure B-5. MSP-TS430L092 Target Socket Module, Schematic 38 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430L092 www.ti.com Settings of the MSP-TS430L092 Target Socket Figure B-6 shows the PCB layout of the MSP-TS430L092 target socket. The following pinning is recommended: • JP1 is write enable for the EPROM. If this is not set, the EPROM can only be read. • JP2 and JP3 connect device supply with boost converter. They can be opened to measure device current consumption. For default operation, they should be closed. Figure B-6. MSP-TS430L092 Target Socket Module, PCB SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 39 MSP-TS430L092 www.ti.com Table B-3. MSP-TS430L092 Bill of Materials Pos. Ref Des No. No. Per Board 1 C1, C2 2 330nF, SMD0603 2 C5 1 100n, SMD0603 3 C6 1 10u, SMD0805 4 C10 1 100n, SMD0603 5 EEPROM1 1 M95512 SO08 (SO8) 7 40 J1, J2 2 Description DigiKey Part No. ST Micro M95160R Comment Digikey: 497-8688-1-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 7-pin header, TH SAM1213-07-ND : Header SAM1035-07-ND : Receptacle 8 J3 1 3-pin header, male, TH SAM1035-03-ND 9 J4, J5 2 FE4L, FE4H 4 pol. Stiftreihe 11 J13 1 MICRO_STECKV_10 12 JP1, JP2,JP3 3 2-pin header, male, TH SAM1035-02-ND place jumper on header 15 L1 1 33uH, SMD0806 LQH2MCN330K02L Farnell: 151-5557 16 LED1, LED4 2 LEDCHIPLED_0603 17 Q2 1 BC817-16LT1SMD 18 R0, R6, R7 3 2K7, SMD0603 19 R1 1 1k, SMD0603 20 R2 1 47k, SMD0603 21 R4,R5, R8, R10, RC, RD 6 10k, SMD0603 22 RA 1 3.9k, SMD0603 23 RB 1 6.8k, SMD0603 24 U1 1 14 Pin Socket - IC189-0142146 Manuf. Yamaichi 22 MSP430 2 MSP430L092PWR DNP: Enclosed with kit. Is supplied by TI. Hardware DNP; Keep vias free of solder. Reichelt: MicroMaTchConnector: MM FL 10G Farnell: 1686065 BC817-16LT1SMD SOT23-BEC SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430L092 Active Cable www.ti.com B.4 MSP-TS430L092 Active Cable Figure B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 41 MSP-TS430L092 Active Cable www.ti.com Figure B-8 shows the PCB layout for the Active Cable. The following pinning is possible: • JP1 has two jumpers (Jumper 1 and Jumper 2) that can be set as shown in Table B-4. Table B-4. MSP-TS430L092 JP1 Settings • Jumper 1 Jumper 2 Description Off Off The active cable has no power and does not function. Off On The active cable receives power from target socket. For this option, the target socket must have its own power supply. On Off The active cable receives power from the JTAG connector. On On The JTAG connector powers the active cable and the target socket. For this option, the target socket must not have its own power source, as this would cause a not defined state. JP2 is for reset. For the standard MSP-TS430L092, this jumper must be set. It sets the reset pin to high and can also control it. Without this jumper on the MSP-TS430L092, reset is set to zero. Figure B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB 42 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430L092 Active Cable www.ti.com Table B-5. MSP-TS430L092 Active Cable Bill of Materials Pos. Ref Des No. Per Board 1 C1, C3, C5, C6 4 100nF, SMD0603 2 C2, C4 2 1uF, SMD0805 3 R1, R10 2 10K, SMD0603 4 R2 1 4K7, SMD0603 5 R5, R6, R7, R9 4 100, SMD0603 6 R8 1 680k, SMD0603 7 R11, R15 2 1K, SMD0603 8 R12 0 SMD0603 DNP 9 R13 0 SMD0603 DNP 10 R14 1 0, SMD0603 11 IC1 1 SN74AUC1G04DBVR 12 IC2, IC3, IC4 3 SN74AUC2G125DCTR Description DigiKey Part No. Comment Manu: TI Manu: TI 13 J2 1 MICRO_STECKV_10 Reichelt: MicroMaTchConnector: MM FL 10G 14 JP1 1 2x2 Header JP2Q Put jumper on Position 1 and 2. Do not mix direction. 15 JP2 1 2-pin header, male, TH SAM1035-02-ND place jumper on header 16 JTAG 1 14-pin connector, male, TH HRP14H-ND 17 Q1 1 BC817-25LT1SMD, SOT23BEC Digi-Key: BC81725LT1GOSCT-ND 18 U1, U2 2 TLVH431IDBVR SOT23-5 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Manu: TI Hardware 43 MSP-TS430PW24 B.5 www.ti.com MSP-TS430PW24 Figure B-9. MSP-TS430PW24 Target Socket Module, Schematic 44 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PW24 www.ti.com Connector J5 External power connector Jumper JP1 to "ext" Jumper JP2 Open to measure current Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Orient Pin 1 of MSP430 device D1 LED connected to P1.0 Jumper JP3 Open to disconnect LED Figure B-10. MSP-TS430PW24 Target Socket Module, PCB SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 45 MSP-TS430PW24 www.ti.com Table B-6. MSP-TS430PW24 Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C5 1 2.2nF, SMD0805 3 C3, C7 2 10uF, 10V, SMD0805 4 C4, C6, C8 3 100nF, SMD0805 478-3351-2-ND 5 D1 1 green LED, SMD0805 P516TR-ND 6 J1, J2 0 12-pin header, TH "SAM1029-07NDSAM1213-07-ND" DNP: Headers and receptacles enclosed with kit. Keep vias free of solder. (Header & Receptacle) 7 J5, JP1, JP4, JP5, JP6, JP7, JP8, JP9 8 3-pin header, male, TH SAM1035-03-ND Place jumper on 1-2 of JP4-JP9 Place on 1-2 on JP1 8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 9 Jumper 15-38-1024-ND see Pos 7 an 8 HRP14H-ND 9 46 Description DigiKey Part No. Comment DNP 10 JTAG 1 14-pin connector, male, TH 11 Q1 0 Crystal 12 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND 13 R5, R6, R8, R9, 2 0 Ohm, SMD0805 541-000ATR-ND 14 R4 1 47k Ohm, SMD0805 541-47000ATR-ND Manuf.: Enplas 2 layers 15 U1 1 Socket: OTS 24(28)065-02-00 16 PCB 1 68.5 x 61 mm 17 Adhesive plastic feet 4 Approximately 6mm width, 2mm height 18 MSP430 2 MSP430AFE2xx Hardware DNP: keep vias free of solder DNP R5, R6 for example, 3M Bumpons Part No. SJ5302 Apply to corners at bottom side DNP: enclosed with kit, supplied by TI SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430DW28 B.6 MSP-TS430DW28 www.ti.com If external supply voltage: - R9 GND C2 R8 0R R2 0R 2 Q1 560R R3 R1 - 12pF C1 12pF LED3 D1 14 12 10 8 6 4 2 JTAG ML14 13 11 9 7 5 3 1 J5 JP1Q 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 C8 TDO TDI TMS TCK P1.3 P1.2 P1.1 P1.0 P2.4 P2.3 P3.7 P3.6 P3.5 P3.4 10nF RST/NMI C5 C7 100nF 10uF/10V J4 JP1Q SMD-Footprint F123 TST/VPP 1 VCC430 2 3 P2.5 4 GND 5 XOUT 6 XIN RST/NMI 7 8 P2.0 9 P2.1 10 P2.2 11 P3.0 12 P3.1 13 P3.2 14 P3.3 P1.7 P1.6 P1.5 P1.4 P1.3 P1.2 P1.1 P1.0 P2.4 P2.3 P3.7 P3.6 P3.5 P3.4 U2 TST VCC P2.5 VSS XOUT XIN RST P2.0 P2.1 P2.2 P3.0 P3.1 P3.2 P3.3 R5 50K TST/VPP VCC TCK TMS TDI TDO U1 28 27 26 25 24 23 22 21 20 19 18 17 16 15 SOCK28DW 1 2 3 4 5 6 7 8 9 10 11 12 13 14 TDO TDI TMS TCK P1.3 P1.2 P1.1 P1.0 P2.4 P2.3 P3.7 P3.6 P3.5 P3.4 Socket: Yamaichi Type: IC189-0282-042 TST/VPP VCC430 P2.5 GND XOUT XIN RST/NMI P2.0 P2.1 P2.2 P3.0 P3.1 P3.2 P3.3 RST/NMI 1 2 3 4 5 6 7 8 9 10 11 12 13 14 FE14L J1 J2 FE14H 28 27 26 25 24 23 22 21 20 19 18 17 16 15 R7 0R R6 0R TITLE: J3 Ext_PWR MSP-TS430DW28 Document Number: R10 - R11 0R Sheet: 1/1 REV: 2.0 If external supply voltage: remove R11 and add R10 (0 Ohm) 10 8 6 4 RST/NMI 2 ML10 not assembled 9 7 5 3 1 BOOTST GND 1 2 3 MSP-TS430DW28 Target Socket DW28 GND Date: 11/14/2006 1:26:04 PM Copyright © 2009–2012, Texas Instruments Incorporated 47 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback remove R8 and add R9 (0 Ohm) R1, C1, C2 not assembled GND 2 1 + QUARZ3 Figure B-11. MSP-TS430DW28 Target Socket Module, Schematic MSP-TS430DW28 www.ti.com LED connected to P1.0 Jumper J5 Open to measure current Jumper J4 Open to disconnect LED Connector J3 External power connector Remove R8 and jumper R9 Orient Pin 1 of MSP430 device Figure B-12. MSP-TS430DW28 Target Socket Module, PCB 48 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430DW28 www.ti.com Table B-7. MSP-TS430DW28 Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C5 1 100nF, SMD0805 3 C7 1 10uF, 10V Tantal Elko B 4 C8 1 10nF SMD0805 5 D1 1 LED3 T1 3mm yellow RS: 228-4991 6 Q1 0 QUARZ, Crystal Micro Crystal MS1V-T1K 32.768kHz, C(Load) = DNP: Cover holes while soldering 12.5pF 7 J1, J2 Description 2 DigiKey Part No. Comment DNP: C1, C2, Cover holes while soldering DNP: Headers and receptacles enclosed with kit. Keep vias free of solder. 14-pin header, TH male : Header : Receptacle 7.1 DNP: Headers and receptacles enclosed with kit. Keep vias free of solder. 14-pin header, TH female 2 : Header : Receptacle 8 J3 1 3-Pin Connector, male 9 J4, J5 2 2-Pin Connector, male 10 BOOTST 0 ML10, 10-Pin Conn., m RS: 482-115 With jumper 11 JTAG 1 ML14, 14-Pin Conn., m RS: 482-121 12 R1, R2, R6, R7, R8,R9, R10, R11 4 0R, SMD0805 13 R3 1 560R, SMD0805 14 R5 1 47K, SMD0805 15 U1 1 SOP28DW socket 16 U2 0 TSSOP DNP, Cover holes while soldering DNP: R1, R2, R9, R10 Yamaichi: IC189-0282042 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated DNP Hardware 49 Vcc int ext 3 2 1 C4 14 12 10 8 6 4 2 JTAG 13 11 9 7 5 3 1 VCC P1.0 GND JTAG -> SBW -> XOUT/P2.7 R6 0R DNP TEST/SBWTCK 100nF R5 0R XIN/P2.6 JP3 R4 47k TST VCC P2.5 VSS XOUT XIN RST P2.0 P2.1 P2.2 P3.0 P3.1 P3.2 P3.3 U1 P1.7 P1.6 P1.5 P1.4 P1.3 P1.2 P1.1 P1.0 P2.4 P2.3 P3.7 P3.6 P3.5 P3.4 14 13 12 11 10 9 8 7 6 5 4 3 2 1 J2 JP6 GND J5 - DNP R3 0R R2 DNP Ext_PWR 3 2 P1.4/TCK 1 JP9 10 8 6 4 2 DNP GND If external supply voltage: remove R11 and add R10 (0 Ohm) 9 7 5 3 1 BOOTST 3 2 P1.5/TMS 1 JP8 RST/SBWTDIO P1.1 TEST/SBWTCK 3 2 P1.6/TDI 1 JP7 3 2 P1.7/TDO 1 JTAG-Mode selection: 4-wire JTAG: Set jumpers JP4 to JP9 to position 2-3 2-wire "SpyBiWire": Set jumpers JP4 to JP9 to position 1-2 RST/SBWTDIO C5 GND P1.7/TDO P1.6/TDI P1.5/TMS P1.4/TCK P1.3 P1.2 P1.1 P1.0 P2.4 P2.3 P3.7 P3.6 P3.5 P3.4 DNP 2.2nF 28 27 26 25 24 23 22 21 20 19 18 17 16 15 P2.2 3 2 1 RST/NMI TCK/SBWTCK TMS TDI TDO/SBWTDIO 3 2 1 R7 330R JP5 TEST/SBWTCK1 VCC430 2 3 P2.5 4 GND XOUT/P2.75 XIN/P2.6 6 RST/SBWTDIO7 8 P2.0 9 P2.1 10 P2.2 11 P3.0 12 P3.1 13 P3.2 14 P3.3 TEST/SBWTCK 3 2 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 MSP430F12xx JP4 J1 Socket: Enplas OTS-28-0.65-01 MSP-TS430PW28: Target Socket Board for MSP430's in PW28 package 3.1 Copyright © 2009–2012, Texas Instruments Incorporated JP1 2 1 VCC430 C2 12pF DNP DNP Q1 R1 330R DNP XTLGND C1 12pF D1 green 2 1 JP2 C3 10uF/10V GND + GND 2 1 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Hardware 50 MSP-TS430PW28 B.7 www.ti.com MSP-TS430PW28 Figure B-13. MSP-TS430PW28 Target Socket Module, Schematic MSP-TS430PW28 www.ti.com Jumper JP4 to JP9: Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External Power Supply Jumper JP2 Open to measure current Orient Pin 1 of Device Jumper JP3 Open to disconnect LED LED D1 connected to P5.1 Figure B-14. MSP-TS430PW28 Target Socket Module, PCB SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 51 MSP-TS430PW28 www.ti.com Table B-8. MSP-TS430PW28 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C3 1 10uF, 10V Tantal Elko B 3 C4 1 100nF, SMD0805 4 C5 0 2.2nF, SMD0805 5 D1 1 LED green SMD0603 6 Q1 0 QUARZ, Crystal 7 J1, J2 2 Description (1) DigiKey Part No. Comment DNP: C1, C2 , Cover holes while soldering DNP Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF DNP: Cover holes and neighboring holes while soldering DNP: Headers and receptacles enclosed with kit.Keep vias free of solder. 14-pin header, TH male : Header : Receptacle 7.1 2 DNP: headers and receptacles enclosed with kit.Keep vias free of solder. 14-pin header, TH female : Header : Receptacle (1) 52 8 J5, IP1 1 3-Pin Connector , male 8a JP1, JP4, JP5, JP6, JP7, JP8, JP9 7 3-Pin Connector , male Jumper on Pos 1-2 9 JP2, JP3 2 2-Pin Connector , male with Jumper 10 BOOTST 0 ML10, 10-Pin Conn. , m RS: 482-115 11 JTAG 1 ML14, 14-Pin Conn. , m RS: 482-121 12 R1, R7 2 330R, SMD0805 12 R2, R3, R5, R6 0 0R, SMD0805 14 R4 1 47K, SMD0805 15 U1 1 SOP28PW socket DNP: Cover holes while soldering DNP Enplas: OTS-28-0.65-01 PCB 66 x 79 mm, two layers; Rubber stand off, four pieces Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PW28A www.ti.com B.8 MSP-TS430PW28A Figure B-15. MSP-TS430PW28A Target Socket Module, Schematic SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 53 MSP-TS430PW28A www.ti.com Jumper JP2 Open to measure current Orient Pin 1 of MSP430 device Connector J5 External power connector Jumper JP1 to "ext" Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Jumper JP3 Open to disconnect LED D1 LED connected to P1.0 Figure B-16. MSP-TS430PW28A Target Socket Module, PCB (Red) 54 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PW28A www.ti.com Table B-9. MSP-TS430PW28A Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C5 1 2.2nF, SMD0805 3 C3 1 10uF, 10V, SMD0805 4 C4, C6, 2 100nF, SMD0805 478-3351-2-ND 5 D1 1 green LED, SMD0805 P516TR-ND 6 J1, J2 0 14-pin header, TH 7 J5, JP1, JP4, JP5, JP6, JP7, JP8, JP9 8 3-pin header, male, TH SAM1035-03-ND Place jumper on 1-2 of JP4-JP9 Place on 1-2 on JP1 8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 9 Jumper 15-38-1024-ND see Pos 7 an 8 14-pin connector, male, TH HRP14H-ND 9 Description DigiKey Part No. Comment DNP DNP: Headers and receptacles enclosed with kit. Keep vias free of solder: (Header & Receptacle) 10 JTAG 1 11 BOOTST 0 12 Q1 0 Crystal Micro Crystal MS3V 32.768kHz, C(Load) = 12.5pF 13 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND 14 R2, R3,R5, R6, 0 0 Ohm, SMD0805 541-000ATR-ND 15 R4 1 47k Ω, SMD0805 541-47000ATR-ND 16 U1 1 Socket: OTS-28-0.65-01 17 PCB 1 63.5 x 64.8 mm DNP Keep vias free of solder 18 Adhesive plastic feet 4 Approximately 6mm width, 2mm height 19 MSP430 2 MSP430G2553IPW28 DNP: keep vias free of solder DNP R2, R3,R5, R6 Manuf.: Enplas 2 layers for example, 3M Bumpons Part No. SJ5302 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Apply to corners at bottom side DNP: enclosed with kit, supplied by TI Hardware 55 Vcc int ext 3 2 1 14 12 10 8 6 4 2 JTAG VCC430 C2 12pF DNP 13 11 9 7 5 3 1 C5 100nF GND RST/NMI TCK/SBWTCK TMS TDI TDO/SBWTDIO VCC 3 2 1 JP4 J1 TEST/SBWTCK JTAG -> SBW -> P1.0 P2.7/XOUT Q1 DNP P2.6/XIN R3 560R R1 330R 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 P1.7/TDO 38 P1.6/TDI 37 P1.5/TMS 36 P1.4/TCK 35 34 P1.3 33 P1.2 32 P1.1 31 P1.0 30 P2.4 29 P2.3 28 P3.7 27 P3.6 26 P3.5 25 P3.4 24 P4.7 23 P4.6 22 P4.5 21 P4.4 20 P4.3 JP6 3 2 P1.7/TDO 1 3 2 1 JP8 3 2 1 J2 P2.2 3 2 1 JP9 DNP GND J3 DNP R11 0R R10 - DNP Ext_PWR P1.4/TCK 10 8 6 4 2 BOOTST 9 7 5 3 1 REV: 1.3 GND If external supply voltage: remove R11 and add R10 (0 Ohm) P1.5/TMS RST/SBWTDIO P1.1 TEST/SBWTCK JP7 P1.6/TDI JTAG-Mode selection: 4-wire JTAG: Set jumpers JP4 to JP9 to position 2-3 2-wire "SpyBiWire":Set jumpers JP4 to JP9 to position 2-1 DNP GND R5 47k C8 10nF U1 TEST/SBWTCK P1.7/TDO DVCC P1.6/TDI P2.5 P1.5/TMS DVSS P1.4/TCK P2.7 P1.3 P2.6 P1.2 RST/SBWDAT P1.1 P2.0 P1.0 P2.1 P2.4 P2.2 P2.3 P3.0 P3.7 P3.1 P3.6 P3.2 P3.5 P3.3 P3.4 AVSS P4.7 AVCC P4.6 P4.0 Socket: P4.5 P4.1 Yamaichi P4.4 P4.2 IC189-0382-037P4.3 MSP430F2274IDA RST/SBWTDIO TEST/SBWTCK1 2 VCC430 3 P2.5 4 GND 5 P2.7/XOUT 6 P2.6/XIN RST/SBWTDIO7 8 P2.0 9 P2.1 10 P2.2 11 P3.0 12 P3.1 13 P3.2 14 P3.3 15 GND 16 VCC430 17 P4.0 18 P4.1 19 P4.2 JP5 3 TEST/SBWTCK 2 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 3 2 1 Sheet: 1/1 Copyright © 2009–2012, Texas Instruments Incorporated JP1 2 1 JP2 C7 10uF/10V GND C1 12pF DNP D1 yellow JP3 2 1 + GND MSP-TS430DA38: MSP-TS430DA38 Target Socket Board for MSP430F2247IDA TITLE: Document Number: Date: 6/18/2008 11:04:56 AM SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Hardware 56 MSP-TS430DA38 B.9 www.ti.com MSP-TS430DA38 Figure B-17. MSP-TS430DA38 Target Socket Module, Schematic MSP-TS430DA38 www.ti.com Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire Mode, Close 2-3 to debug in 4-wire JTAG Mode LED connected to P1.0 Jumper JP3 Open to disconnect LED Orient pin 1 of MSP430 device Jumper JP2 Open to measure current Connector J3 External power connector Jumper JP1 to 'ext' Figure B-18. MSP-TS430DA38 Target Socket Module, PCB SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 57 MSP-TS430DA38 www.ti.com Table B-10. MSP-TS430DA38 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 0 2.2nF, SMD0805 5 D1 1 green LED, SMD0603 6 J1, J2 DigiKey Part No. Comment DNP DNP 475-1056-2-ND DNP: headers and receptacles enclosed with kit.Keep vias free of solder. 19-pin header, TH SAM1029-19-ND : Header SAM1213-19-ND : Receptacle 7 "J3, JP1, JP4, JP5, JP6, JP7, JP8, JP9" 8 3-pin header, male, TH SAM1035-03-ND Place jumpers on headers JP1, JP4,JP5, JP6, JP7, JP8, JP9; Pos 1-2 8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 9 Jumper 15-38-1024-ND Place on: JP1 - JP9; Pos 12 HRP14H-ND 9 58 0 Description 10 JTAG 1 14-pin connector, male, TH 11 BOOTST 0 10-pin connector, male, TH 12 Q1 0 Crystal Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 13 R1, R3 2 330 Ω, SMD0805 541-330ATR-ND 14 R10, R11 0 0 Ω, SMD0805 541-000ATR-ND 15 R5 1 47k Ω, SMD0805 541-47000ATR-ND 16 U1 1 Socket: IC189-0382--037 17 PCB 1 67 x 66 mm 18 Adhesive Plastic feet 4 ~6mm width, 2mm height 19 MSP430 2 MSP430F2274IDA Hardware DNP: Keep vias free of solder DNP: Keep vias free of solder DNP Manuf.: Yamaichi 2 layers for example, 3M Bumpons Part No. SJ-5302 Apply to corners at bottom side DNP: enclosed with kit supplied by TI SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430QFN23x0 www.ti.com B.10 MSP-TS430QFN23x0 Figure B-19. MSP-TS430QFN23x0 Target Socket Module, Schematic SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 59 MSP-TS430QFN23x0 www.ti.com Connector J5 External power connector Jumper JP1 to 'ext' Jumper JP2 Open to measure current Jumper JP3 Open to disconnect LED LED connected to P1.0 Figure B-20. MSP-TS430QFN23x0 Target Socket Module, PCB 60 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430QFN23x0 www.ti.com Table B-11. MSP-TS430QFN23x0 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C3 1 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C4 1 100nF, SMD0805 478-3351-2-ND 4 C5 1 10nF, SMD0805 478-1383-2-ND 5 D1 1 green LED, SMD0603 475-1056-2-ND 6 J1, J2, J3, J4 0 Description DigiKey Part No. Comment DNP DNP: headers and receptacles enclosed with kit.Keep vias free of solder. 10-pin header, TH SAM1034-10-ND : Header SAM1212-10-ND : Receptacle 7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND Place jumper on header JP1; Pos 1-2. 8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header Place on: JP1, JP2, JP3 3 Jumper 15-38-1024-ND 10 9 JTAG 1 14-pin connector, male, TH HRP14H-ND 11 BOOTST 0 10-pin connector, male, TH 12 Q1 0 Crystal Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 13 R1 1 330 Ω, SMD0805 541-330ATR-ND 14 R2, R3 0 0 Ω, SMD0805 541-000ATR-ND 15 R4 1 47k Ω, SMD0805 541-47000ATR-ND 16 U1 1 Socket: QFN-40B-0.5-01 17 PCB 1 79 x 66 mm 18 Adhesive Plastic feet 4 ~6mm width, 2mm height 19 MSP430 2 MSP430F2370IRHA DNP: Keep vias free of solder DNP: Keep vias free of solder DNP Manuf.: Enplas 2 layers for example, 3M Bumpons Part No. SJ-5302 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Apply to corners at bottom side DNP: enclosed with kit supplied by TI Hardware 61 MSP-TS430RSB40 www.ti.com B.11 MSP-TS430RSB40 Figure B-21. MSP-TS430RSB40 Target Socket Module, Schematic 62 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430RSB40 www.ti.com Connector J5 External power connector Jumper JP1 to "ext" Jumper JP2 Open to measure current Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Orient Pin 1 of MSP430 device Jumper JP3 Open to disconnect LED D1 LED connected to P1.0 Figure B-22. MSP-TS430RSB40 Target Socket Module, PCB SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 63 MSP-TS430RSB40 www.ti.com Table B-12. MSP-TS430RSB40 Bill of Materials Ref Des No. Per Board Description 1 C1, C2 0 12pF, SMD0805 2 C3, C7, C10, C12 3 10uF, 10V, SMD 0805 445-1371-1-ND DNP C12 3 C4, C6, C8, C11 3 100nF, SMD0805 311-1245-2-ND DNP C11 4 C5 1 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 6 D1 1 green LED, SMD0805 Pos. 7 J1, J2, J3, J4 4 DigiKey Part No. Comment DNP: C1, C2 P516TR-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 10-pin header, TH : Header : Receptacle 7.1 4 DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 10-pin header, TH : Header : Receptacle 8 JP1, JP4,JP5, JP6, JP7, JP8, JP9, J5, JP10 9 3-pin header, male, TH SAM1035-03-ND Jumper: 1-2 on JP1, JP10; 23 on JP4-JP9 9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header 10 JTAG 1 14-pin connector, male, TH HRP14H-ND 11 BOOTST 0 10-pin connector, male, TH 12 U1 1 QFN-40B-0.4_ ENPLAS_SOCKET Enplas 13 Q1 0 Crystal Micro Crystal MS3V-T1R 32.768kHz, C(Load) = 12.5pF DNP: Q1. Keep vias free of solder 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP10 15 64 16 R1,R7 2 330R SMD0805 17 R2, R3, R5, R6, R8, R9, R10 3 0R SMD0805 18 R4 1 47k SMD0805 19 MSP430 2 MSP430F5132 20 Rubber stand off 4 Hardware DNP. Keep vias free of solder DNP R2, R3, R5, R6 DNP: enclosed with kit. Is supplied by TI select appropriate; for example, Buerklin: 20H1724 apply to corners at bottom side SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430RHA40A www.ti.com B.12 MSP-TS430RHA40A Figure B-23. MSP-TS430RHA40A Target Socket Module, Schematic SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 65 MSP-TS430RHA40A www.ti.com Connector J5 External power connector Jumper JP1 to "ext" Jumper JP2 Open to measure current Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode D1 LED connected to P1.0 Jumper JP3 Open to disconnect LED Orient Pin 1 of MSP430 device Figure B-24. MSP-TS430RHA40A Target Socket Module, PCB 66 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430RHA40A www.ti.com Table B-13. MSP-TS430RHA40A Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP: C1, C2 2 C5 0 2.2nF, SMD0805 DNP C12 3 C3, C7 2 10uF, 10V, SMD0805 5 4 C4, C6 2 100nF, SMD0805 5 C9 1 470nF, SMD0805 6 D1 1 green LED, SMD0805 7 J1, J2, J3, J4 Description 4 DigiKey Part No. Comment DNP C11 478-3351-2-ND P516TR-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 10-pin header, TH : Header : Receptacle 7.1 4 DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 10-pin header, TH : Header : Receptacle 8 J5, JP1, JP4, JP5, JP6, JP7, JP8, JP9 8 3-pin header, male, TH SAM1035-03-ND Place jumper on 1-2 of JP4-JP9; Place on 1-2 on JP1 9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header 9 Jumper 15-38-1024-ND HRP14H-ND 10 see Pos 8 an 9 11 JTAG 1 14-pin connector, male, TH 12 BOOTST 0 10-pin connector, male, TH DNP. Keep vias free of solder 13 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas 14 Q1 0 Crystal 15 R1,R7 2 330R SMD0805 541-330ATR-ND 16 R2, R3, R5, R6, R8, R9, 2 0 Ohm, SMD0805 541-000ATR-ND 17 R4 1 47k SMD0805 18 PCB 1 79 x 66 mm 19 Rubber stand off 4 20 MSP430 2 Micro Crystal MS3V-T1R 32.768kHz, C(Load) = DNP: Q1. Keep vias free of solder 12.5pF DNP:R2, R3, R5, R6 2 layers select appropriate; for example, Buerklin: 20H1724 MSP430N5736IRHA SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated apply to corners at bottom side DNP: enclosed with kit. Is supplied by TI Hardware 67 ext int 3 2 1 JP1 C7 10uF/10V 12pF C2 560R R3 12pF C1 2 1 + 2 14 12 10 8 6 4 2 13 11 9 7 5 3 1 C8 10nF TCK TMS TDI TDO GND 1 3 5 7 9 11 13 15 17 19 21 23 2 4 6 8 10 12 14 16 18 20 22 24 R5 47K R4 0R J1 RST/NMI R12 0R VCC C3 100nF C4 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 P1.0 27 26 25 IC51-1387.KS-15186 P5.4 P5.3 P5.2 COM0 P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 S5 P5.7 P5.6 P5.5 P5.0 P5.1 LCDCAP LCDREF P1.0 P1.1 P1.2 P1.3 1 3 5 7 9 11 13 15 17 19 21 23 10uF/10V J3 J2 GND 2 4 6 8 10 12 14 16 18 20 22 24 Ext_PWR BSL_TX 0R R7 0R R6 MSP-TS430DL48 ML10 10 8 6 4 2 BOOTST 9 7 5 3 1 BSL_RX Vcc ext int JP2 RST/NMI TCK REV: 1.3 Sheet: 1/1 Copyright © 2009–2012, Texas Instruments Incorporated JTAG ML14 J5 JP1Q P1.0 XOUT C5 100nF Q1 XIN 1 JP1Q J4 TDO/TDI TDI/TCLK TMS TCK RST/NMI DVCC DVSS XIN XOUT AVSS AVCC VREF+ P6.0 P6.1 P6.2 P6.3 P6.4 P6.5 P6.6 P6.7 P1.7 P1.6 P1.5 P1.4 GND GND 1 2 3 MSP-TS430DL48 Target Socket DL48 TITLE: Document Number: 1 2 3 GND D1 LED3 QUARZ3 Vcc Q1, C1, C2 not assembled GND TDO 1 2 TDI TMS 3 TCK 4 RST/NMI 5 6 GND 7 8 XIN XOUT 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 U1 + Date: 11/14/2006 1:24:44 PM SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Hardware 68 www.ti.com MSP-TS430DL48 B.13 MSP-TS430DL48 Figure B-25. MSP-TS430DL48 Target Socket Module, Schematic MSP-TS430DL48 www.ti.com Jumper J5 Open to measure current LED connected to P1.0 Connector J3 External power connector Jumper JP1 to ‘ext’ Jumper J4 Open to disconnect LED Orient pin 1 of MSP430 device Figure B-26. MSP-TS430DL48 Target Socket Module, PCB SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 69 MSP-TS430DL48 www.ti.com Table B-14. MSP-TS430DL48 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C4, C7 2 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C3, C5 2 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND 6 J1, J2 DigiKey Part No. Comment DNP DNP: Headers and receptacles enclosed with kit.Keep vias free of solder. 24-pin header, TH SAM1034-12-ND : Header SAM1212-12-ND : Receptacle 7 J3, JP1, JP2 2 3-pin header, male, TH SAM1035-03-ND Place jumper on header JP1; Pos 1-2. DNP: JP2 8 J4, J5 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header Place on: JP1, J4, J5 9 70 0 Description 3 Jumper 15-38-1024-ND 10 JTAG 1 14-pin connector, male, TH HRP14H-ND 11 BOOTST 0 10-pin connector, male, TH 12 Q1 0 Crystal Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 13 R3 1 560 Ω, SMD0805 541-560ATR-ND 14 R4, R6, R7, R12 2 0 Ω, SMD0805 541-000ATR-ND 15 R5 1 47k Ω, SMD0805 541-47000ATR-ND 16 U1 1 Socket: IC51-1387 KS15186 Manuf.: Yamaichi 17 PCB 1 58 x 66 mm 2 layers 18 Adhesive Plastic feet 4 ~6mm width, 2mm height 19 MSP430 2 MSP430F4270IDL Hardware DNP: Keep vias free of solder for example, 3M Bumpons Part No. SJ-5302 DNP: Keep vias free of solder DNP: R6, R7 Apply to corners at bottom side DNP: Enclosed with kit supplied by TI SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430RGZ48B www.ti.com B.14 MSP-TS430RGZ48B Figure B-27. MSP-TS430RGZ48B Target Socket Module, Schematic SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 71 MSP-TS430RGZ48B www.ti.com Connector J5 External power connector Jumper JP1 to "ext" Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Jumper JP1 Open to measure current Orient Pin 1 of MSP430 device Jumper JP2 Open to disconnect LED D1 LED connected to P1.0 Figure B-28. MSP-TS430RGZ48B Target Socket Module, PCB 72 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430RGZ48B www.ti.com Table B-15. MSP-TS430RGZ48B Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C3, C4 0 47pF, SMD0805 DNP 3 C6, C7, C12 3 10uF, 6.3V, SMD0805 4 C5, C11, C13, C14 4 100nF, SMD0805 5 C8 1 2.2nF, SMD0805 6 C9 1 470nF, SMD0805 478-1403-2-ND 7 D1 1 green LED, SMD0805 P516TR-ND 8 J1, J2, J3, J4 0 12-pin header, TH SAM1029-12-ND (Header) SAM1213-12ND (Receptacle) DNP: Headers and receptacles enclosed with kit. Keep vias free of solder: 9 J5 1 3-pin header, male, TH 10 JP3, JP5, JP6, JP7, JP8, JP9, JP10 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 on JP5, JP6, JP7, JP8, JP9, JP10 place jumpers on pins 1-2 on JP3, 11 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 9 Jumper 15-38-1024-ND See Pos. 10and Pos. 11 HRP14H-ND 12 Description DigiKey Part No. Comment 311-1245-2-ND 13 JTAG 1 14-pin connector, male, TH 14 BOOTST 0 10-pin connector, male, TH 15 Q1 0 Crystal Micro Crystal MS3V-T1R 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder 12.5pF 16 Q2 0 Crystal Q2: 4MHz Buerklin: 78D134 17 Insulating disk to Q2 0 Insulating disk to Q2 http://www.ettinger.de/Ar t_Detail.cfm?ART_ART NUM=70.08.121 18 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND 19 R1, R2, R4, R6, R8, R9,R10, R11, R12 3 0 Ohm, SMD0805 541-000ATR-ND 20 R5 1 47k Ω, SMD0805 541-47000ATR-ND 21 U1 1 Socket: QFN11T048008_A101121_RGZ48 22 PCB 1 81 x 76 mm 23 Adhesive plastic feet 4 Approximately 6mm width, 2mm height 24 MSP430 2 MSP430F5342IRGZ "DNP Keep vias free of solder" DNP: Q2 Keep vias free of solder DNP: R6, R8, R9, R10, R11,R12 Manuf.: Yamaichi 2 layers for example, 3M Bumpons Part No. SJ5302 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Apply to corners at bottom side DNP: enclosed with kit, supplied by TI Hardware 73 Vcc ext int J1 3 2 1 VCC 14 12 10 8 6 4 2 JTAG 13 11 9 7 5 3 1 GND TEST/SBWTCK1 R7 0R TEST/SBWTCK JP4 3 2 1 DNP GND EVQ11 JP5 3 2 PJ.0/TDO 1 DNP DVSS 12 P4.6 11 P4.5 10 P4.4 9 P1.7 8 P1.6 7 P3.7 6 P3.6 5 P3.5 4 P3.4 3 P2.2 2 P2.1 1 DNP C9 JP7 GND 9 7 5 3 1 JP8 GND J2 Ext_PWR 3 2 PJ.3/TCK 1 100nF C6 DVCC 1uF/10V DNP C7 GND 10 8 6 4 2 DNP If external supply voltage: remove R3 and add R2 (0 Ohm) DNP BOOTST 3 2 PJ.2/TMS 1 HFGND RST/SBWTDIO P2.0 TEST/SBWTCK P2.1 DNP C8 DNP JP6 SV2 3 2 PJ.1/TDI 1 JTAG-Mode selection: 4-wire JTAG: Set jumpers JP3 to JP8 to position 2-3 2-wire "SpyBiWire": Set jumpers JP3 to JP8 to position 1-2 SW1 1.1nF C5 RST/SBWTDIO 47k R4 HFXOUT HFXIN 36 35 34 33 32 31 30 29 28 27 26 25 3 2 1 RST/NMI JP3 3 2 1 TCK/SBWTCK TMS TDI TDO/SBWTDIO JTAG -> U1 36_DVSS 35_P4.6 34_P4.5 33_P4.4 32_P1.7 31_P1.6 30_P3.7 29_P3.6 28_P3.5 27_P3.4 26_P2.2 25_P2.1 Target Socket Board for MSP430FR58xx, FR59xx IRGZ MSP-TS430RGZ48C 1.3 Copyright © 2009–2012, Texas Instruments Incorporated SBW -> C2 DNP LFXIN LFXOUT SV1 1_P1.0 2_P1.1 3_P1.2 4_P3.0 5_P3.1 6_P3.2 7_P3.3 8_P4.7 9_P1.3 10_P1.4 11_P1.5 12_PJ.0_TDO QUARZ5 Q2 2 1 C4 DNP 1 P1.0 2 P1.1 3 P1.2 4 P3.0 5 P3.1 6 P3.2 7 P3.3 8 P4.7 9 P1.3 10 P1.4 11 P1.5 PJ.0/TDO 12 R8 0R R9 0R DVCC AVCC 100nF 1 2 3 4 5 6 7 8 9 10 11 12 12 11 10 9 8 7 6 5 4 3 2 1 2 1 1uF/10V C3 SV4 Q1 LFGND QUARZ5 DNP C1 DNP P1.3 P1.2 P1.1 P1.0 0R R6 0R R5 JP1 JP2 GND DVCC connection by via AVSS JP11 JP10 JP9 R2 - R3 0R 0R R12 DVSS DNP SW2 0R R13 R14DNP R11 DNP D3 red (DNP) R10DNP R1 330R D2 yellow (DNP) D1 green GND SV3 TP1TP2 48 AVCC 47 AVSS 46 45 44 AVSS 43 42 41 AVSS 40 P2.4 39 P2.3 38 P2.7 37 DVCC 48_AVCC 47_AVSS 46_LFXOUT 45_LFXIN 44_AVSS 43_HFXOUT 42_HFXIN 41_AVSS 40_P2.4 39_P2.3 38_P2.7 37_DVCC 13_PJ.1_TDI 14_PJ.2_TMS 15_PJ.3/TCK 16_P4.0 17_P4.1 18_P4.2 19_P4.3 20_P2.5 21_P2.6 22_TEST/SBWTCK 23_RST/SBWTDIO 24_P2.0 1 PJ.1/TDI 13 2 PJ.2/TMS 14 3 PJ.3/TCK 15 4 P4.0 16 17 5 P4.1 18 6 P4.2 19 7 P4.3 20 8 P2.5 21 9 P2.6 10 TEST/SBWTCK22 11 RST/SBWTDIO23 24 12 P2.0 2 1 2 1 2 1 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Hardware 74 www.ti.com MSP-TS430RGZ48C B.15 MSP-TS430RGZ48C Figure B-29. MSP-TS430RGZ48C Target Socket Module, Schematic MSP-TS430RGZ48C www.ti.com Figure B-30. MSP-TS430RGZ48C Target Socket Module, PCB Table B-16. MSP-TS430RGZ48C Revision History Revision Comments 1.2 Initial release 1.3 LFOSC pins swapped at SV1 (9-10). HFOSC pins swapped at SV1 (6-7). BOOTST pin 4 now directly connected to the device RST/SBWTDIO pin. SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 75 MSP-TS430RGZ48C www.ti.com Table B-17. MSP-TS430RGZ48C Bill of Materials Pos 1 Ref Des SV1, SV2, SV3, SV4 Number Per Board 4 Description DigiKey Part Number 12-pin header, TH Comment DNP: headers and receptacles enclosed with kit. Keep vias free of solder. SAM1029-12-ND : Header : Receptacle 1.1 SV1, SV2, SV3, SV4 4 12-pin receptable, TH DNP: headers and receptacles enclosed with kit. Keep vias free of solder. : Header 76 SAM1213-12-ND : Receptacle 2 JP1, JP2, JP9 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header 3 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP 4 J1, JP3, JP4, JP5, JP6, JP7, JP8 7 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3 5 J2 1 3-pin header, male, TH SAM1035-03-ND 6 JP1, JP2, JP9, J1, JP3, JP4, JP5, JP6, JP7, JP8 10 Jumper 15-38-1024-ND 7 R2, R3, R5, R6, R8, R9, R10, R11, R14 9 DNP, 0805 8 R12, R13, R7 3 0R, 0805 541-000ATR-ND 9 C5 1 1.1nF, CSMD0805 490-1623-2-ND 10 C3, C7 2 1uF, 10V, CSMD0805 490-1702-2-ND 11 R4 1 47k, 0805 541-47000ATR-ND 12 C4, C6 2 100nF, CSMD0805 311-1245-2-ND 13 R1 1 330R, 0805 541-330ATR-ND 14 C1, C2, C8, C9 4 DNP, CSMD0805 15 SW1, SW2 2 EVQ-11L05R P8079STB-ND DNP, Lacon: 1251459 16 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder 17 JTAG 1 14-pin connector, male, TH HRP14H-ND 18 Q1 1 DNP: MS3V-TR1 (32768kHz, 20ppm, 12.5pF) depends on application Micro Crystal, DNP, enclosed in kit, keep vias free of solder 19 Q2 1 DNP, Christal depends on application DNP, keep vias free of solder 20 U1 1 Socket: QFN11T048-008 A101121-001 Manuf.: Yamaichi 20.1 U1 1 MSP430 DNP: enclosed with kit. Is supplied by TI. 21 D1 1 green LED, DIODE0805 22 D3 1 red (DNP), DIODE0805 DNP 23 D2 1 yellow (DNP), DIODE0805 DNP 24 TP1, TP2 2 Testpoint 25 Rubber stand off 4 26 PCB 1 Hardware 79.6 x 91.0 mm Place on: JP1, JP2, JP9, J1, JP3, JP4, JP5, JP6, JP7, JP8 DNP DNP P516TR-ND DNP, keep pads free of solder Buerklin: 20H1724 apply to corners at bottom side MSP-TS430RGZ48C Rev. 1.2 2 layers, black solder mask SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PM64 www.ti.com B.16 MSP-TS430PM64 12pF C2 not assembled R9 12pF C1 R3 R4 2 14 12 10 8 6 4 2 1 13 11 9 7 5 3 1 J1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 100nF 1 0R R2 DVCC 2 3 4 5 6 7 XIN XOUT 10 11 12 13 14 15 16 VCC TCK TMS TDI TDO C8 R5 U2 MSP64PM Socket: Yamaichi IC51-0644-807 RST/NMI 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 C3 12pF not assembled C4 12pF 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 J3 10 8 6 4 2 BOOTST 9 7 5 3 1 ML10 not assembled J5 TITLE: MSP-TS430PM64 Document Number: PWR3 GND 1 2 3 For BSL usage add: R11 0R R6 R7 R13 R14 MSP430F14x : 0 0 open open MSP430F41x : open open 0 0 If external supply voltage: remove R11 and add R10 (0 Ohm) R10 - REV: 1.2 Sheet: 1/1 MSP-TS430PM64 Target Socket PM64 for F14x and F41x FE16-1-3 GND Date: 3/14/2006 10:46:30 AM Copyright © 2009–2012, Texas Instruments Incorporated 10nF 47K 77 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback JTAG ML14 J6 JP1Q Open J6 if LCD is connected 560R 2 remove R8 and add R9 (0 Ohm) If external supply voltage: GND C5 FE16-1-1 0R 0R 0R R14 0R R7 R13 R6 FE16-1-4 XTCLK J2 C7 + R1 0R 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 AVCC DVSS AVSS 61 60 59 RST TCK TMS TDI TDO 53 52 51 50 49 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 10uF/10V 10uF/6,3V + C6 JP1Q not assembled J7 1 J4 FE16-1-2 - LFXTCLK 0R R12 Q1 - R8 reserved for future enhancement LED3 D1 NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be made. Figure B-31. MSP-TS430PM64 Target Socket Module, Schematic MSP-TS430PM64 www.ti.com Connector J5 External power connection Remove R8 and jumper R9 LED connected to pin 12 Jumper J7 Open to measure current Jumper J6 Open to disconnect LED Orient Pin 1 of MSP430 device Figure B-32. MSP-TS430PM64 Target Socket Module, PCB 78 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PM64 www.ti.com Table B-18. MSP-TS430PM64 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 1.1 C3, C4 0 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec. 2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 Description 0 DigiKey Part No. Comment DNP: C6 DNP: Headers and receptacles enclosed with kit.Keep vias free of solder. 16-pin header, TH SAM1029-16-ND : Header SAM1213-16-ND : Receptacle 8 J5 1 3-pin header, male, TH SAM1035-03-ND 9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 2 Jumper 15-38-1024-ND Place on: J6, J7 HRP14H-ND 11 12 JTAG 1 14-pin connector, male, TH 13 BOOTST 0 10-pin connector, male, TH 14 Q1, Q2 0 Crystal Q1: Micro Crystal MS1V-T1K DNP: Keep vias free of 32.768kHz, C(Load) = solder 12.5pF 15 R3 1 330 Ω, SMD0805 541-330ATR-ND 16 R1, R2, R4, R6, R7, R8, R9, R10, R11, R12, R13, R14 3 0 Ω, SMD0805 541-000ATR-ND 17 R5 1 47k Ω, SMD0805 541-47000ATR-ND 18 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi 19 PCB 1 78 x 75 mm 2 layers 20 Rubber standoff 4 21 MSP430 22 DNP: Keep vias free of solder select appropriate MSP430F2619IPM MSP430F417IPM SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated DNP: R4, R6, R7, R9, R10, R11, R12, R13, R14 Apply to corners at bottom side DNP: Enclosed with kit supplied by TI Hardware 79 Vcc 3 2 ext 1 int JP3 2 1 JP2 14 12 10 8 6 4 2 R2 0R JTAG C5 100nF 13 11 9 7 5 3 1 DNP GND J4 R6 330R 3 TEST/SBWTCK 2 A 1 JP5 RST/NMI VCC TCK/SBWTCK TMS TDI TDO/SBWTDIO 3 2 1 JP4 AVCC AVSS Socket: Yamaichi IC51-0644-807 DNP GND R4 47k C3 2.2nF VCC430 RST/SBWTDIO B P1.0 P1.1 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 3 2 P7.0/TDO 1 C JP6 J3 3 2 1 JP7 P7.1/TDI D DNP R13 0R TEST/SBWTCK A ADD LCD-CAP! P5.1 3 2 P7.2/TMS 1 E JP8 DNP 9 7 5 3 1 DNP R11 0R DNP RST/SBWTDIO B DNP R10 0R PWR3 GND 1 2 3 3 2 P7.3/TCK 1 F JP9 10 8 6 4 2 R14 0R BOOTST GND J5 Sheet: 1/1 REV: 1.1 If supplied by interface: populate R11 (0R), remove R10 If supplied locally: populate R10 (0R), remove R11 MSP-TS430PM64A MSP-TS430PM64A Target Socket for F4152 TITLE: Document Number: Date: 3/29/2011 3:07:02 PM Copyright © 2009–2012, Texas Instruments Incorporated JTAG -> 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 SBW -> AVCC J1 VCC430 AVSS C4 100nF 0R R7 XIN Q1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 GND J2 A B F E D C VCC430 C6 10uF/6.3V R1 0R DNP 12pF C2 DNP R5 0R XOUT DNP R3 P5.1 330R JP1 Open JP1 if LCD is connected DNP 12pF C1 XTLGND GND D1 2 1 + GND 1 2 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Hardware 80 www.ti.com MSP-TS430PM64A B.17 MSP-TS430PM64A Figure B-33. MSP-TS430PM64A Target Socket Module, Schematic MSP-TS430PM64A www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External Power Supply Jumper JP4 to JP9: Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Jumper JP2 Open to measure current Orient Pin 1 of Device Jumper JP1 Open to disconnect LED LED D1 connected to P5.1 Figure B-34. MSP-TS430PM64A Target Socket Module, PCB SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 81 MSP-TS430PM64A www.ti.com Table B-19. MSP-TS430PM64A Bill of Materials Pos. Ref Des No. per Board 1 C1, C2, 0 12pF, SMD0805 DNP 2 C3 0 2.2nF, SMD0805 DNP 3 C6, 1 10uF, 10V, Tantal Size B 511-1463-2-ND 4 C4, C5 2 100nF, SMD0805 478-3351-2-ND 5 D1 1 green LED, SMD0805 P516TR-ND 6 J1, J2, J3, J4 DigiKey Part No. Comment DNP: Headers and receptacles enclosed with kit. Keep vias free of solder. 16-pin header, TH SAM1029-16-ND : Header SAM1213-16-ND : Receptacle 7 J5, JP3, JP4, JP5, JP6, JP7, JP8, JP9 8 3-pin header, male, TH SAM1035-03-ND 8 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 2 Jumper 15-38-1024-ND Place on: J6, J7 HRP14H-ND 9 82 0 Description 10 JTAG 1 14-pin connector, male, TH 11 BOOTST 0 10-pin connector, male, TH 12 Q1 0 Crystal Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 13 R3, R6 2 330 Ω, SMD0805 541-330ATR-ND 14 R1, R2, R5, R7, R9, R10, R11, R13, R14 2 0 Ω, SMD0805 541-000ATR-ND 15 R4 1 47k Ω, SMD0805 541-47000ATR-ND 16 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi 17 PCB 1 78 x 75 mm 4 layers 18 Rubber stand off 4 19 MSP430 2 Hardware DNP: Keep vias free of solder select appropriate DNP: Keep vias free of solder DNP: R5, R7, R9, R10, R11, R13, R14 Apply to corners at bottom side DNP: Enclosed with kit supplied by TI MSP430F4152IPM SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430RGC64B www.ti.com B.18 MSP-TS430RGC64B Figure B-35. MSP-TS430RGC64B Target Socket Module, Schematic SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 83 MSP-TS430RGC64B www.ti.com Connector J5 External power connector Jumper JP3 to "ext" Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode If the system should be supplied via LDOI (J6), close JP4 and set JP3 to external Orient Pin 1 of MSP430 device D1 LED connected to P1.0 Jumper JP2 Open to disconnect LED Figure B-36. MSP-TS430RGC64B Target Socket Module, PCB 84 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430RGC64B www.ti.com Table B-20. MSP-TS430RGC64B Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C3, C4 0 47pF, SMD0805 DNP 3 C6, C7, C10 3 10uF, 6.3V, SMD0805 4 C5, C11, C13, C14, C15 5 100nF, SMD0805 5 C8 1 2.2nF, SMD0805 6 C9 1 470nF, SMD0805 7 C16 1 4.7uF, SMD0805 8 C17 1 220nF, SMD0805 9 D1 1 green LED, SMD0805 P516TR-ND 10 J1, J2, J3, J4 0 16-pin header, TH SAM1029-16-ND (Header) SAM1213-16ND (Receptacle) DNP: Headers and receptacles enclosed with kit. Keep vias free of solder: 11 J5 , J6 2 3-pin header, male, TH 12 JP3, JP5, JP6, JP7, JP8, JP9, JP10 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 on JP5, JP6, JP7, JP8, JP9, JP10 place jumpers on pins 1-2 on JP3, 13 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13 HRP14H-ND 14 Description DigiKey Part No. Comment 311-1245-2-ND 478-1403-2-ND 15 JTAG 1 14-pin connector, male, TH 16 BOOTST 0 10-pin connector, male, TH 17 Q1 0 Crystal Micro Crystal MS3V-T1R 32.768kHz, C(Load) = 12.5pF DNP: Q1 Keep vias free of solder 18 Q2 0 Crystal Q2: 4MHz Buerklin: 78D134 DNP: Q2 Keep vias free of solder 19 Insulating disk to Q2 0 Insulating disk to Q2 http://www.ettinger.de/Art _Detail.cfm?ART_ARTNU M=70.08.121 20 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND 21 R1, R2, R4, R6, R8, R9,R10, R11, R12 3 0 Ohm, SMD0805 541-000ATR-ND 22 R5 1 47k Ω, SMD0805 541-47000ATR-ND 23 U1 1 Socket: QFN11T064-006N-HSP 24 PCB 1 85 x 76 mm 25 Adhesive plastic feet 26 D3,D4 27 MSP430 4 Approximately 6mm width, 2mm height 2 MSP430F5310 RGC "DNP Keep vias free of solder" DNP: R6, R8, R9, R10, R11,R12 Manuf.: Yamaichi 2 layers for example, 3M Bumpons Part No. SJ5302 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Apply to corners at bottom side DNP: enclosed with kit, supplied by TI Hardware 85 A 13 11 9 7 5 3 1 RST/NMI GND TCK TMS TDI TDO TCK 2 3 1 2 3 JP8 4 THERMAL_4 tbd C4 5 S.G. 9 7 5 3 1 J6 1 2 3 6 J5 0R DVCC 1 2 Size: 0R 1.1 MSP430 Tools TI Friesing Revision: Mentor Pads Logic V9 6 R11 PINHEAD_1X2 JP4 PINHEAD_1X3 GND GND BSL CN-ML10 0 1 8 6 4 2 BOOTST C16 GND C15 4.7uF 1 MSP-TS430RGC64C 100nF GND Comment: PINHEAD_1X3 3 2 1 DVIO Power Circle P1.2/TA0.1 P1.1/TA0.0 TEST/SBWTCK GND Name: SHORTCUT2 J3 12/14/10 Date: 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 tbd C3 XTLGND2 JP9 JP10 1 1 <-- SBW 2 2 I O 3 3 <-- JTAG TDI TDO PINHEAD_1X3 PINHEAD_1X3 GND Design: of Title of Schematic 1 Appr.: Page: Drawing#: 5 MSP-TS430RGC64C.sch Rev.: File: R12 PINHEAD_1X3 Q2 THERMAL_8 JP5 JP6 JP7 1 1 1 TDO 2 2 2 RSTDVCC_SBWTDIO C M 3 3 3 TCK TMS RST/NMI PINHEAD_1X3 PINHEAD_1X3 PINHEAD_1X3 DVCC QUARZ_4PIN THERMAL_7 R7 330R TEST/SBWTCK THERMAL_6 1 14 12 10 8 6 4 2 P3.3/UCA0TXD/UCA0SIMO P3.2/UCB0CLK/UCA0STE P3.1/UCB0SOMI/UCB0SCL P3.0/UCB0SIMO/UCB0SDA 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 26MHz/ASX53 THERMAL_5 R9 0R DVSS DVIO P4.0/PM_UCB1STE P4.1/PM_UCB1SIMO P4.2/PM_UCB1SOMI P4.3/PM_UCB1CLK P4.4/PM_UCA1TXD P4.5/PM_UCA1RXD P4.6/PM_NONE P4.7/PM_NONE J4 P2.7/UCB0STE/UCA0CLK 4 A B C D Copyright © 2009–2012, Texas Instruments Incorporated R10 0R P7.2/TB0.2 JTAG P7.3/TB0.3 C8 P2.3/TA2.0 P3.4/UCA0RXD/UCA0SOMI P7.4/TB0.4 3 ext 2 VCC 1 int JP3 U1 MSP430F5229 P2.2/TA2CLK/SMCLK 47K PJ.1/TDI/TCLK 2.2nF PJ.2/TMS R5 RSTDVCC_SBWTDIO AVCC P5.4/XIN PJ.3/TCK P1.1/TA0.0 JP1 R2 0R P6.0/CB0/A0 P6.3/CB3/A3 P6.2/CB2/A2 P6.1/CB1/A1 P6.4/CB4/A4 P6.5/CB5/A5 P6.6/CB6/A6 P6.7/CB7/A7 P5.0/A8/VEREF+ P5.1/A9/VEREF- AVSS 0R R4 P5.5/XOUT DVSS DVCC P1.0/TA0CLK/ACLK 1 2 10uF AVSS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 DVCC 15 16 P7.5/TB0.5 P2.1/TA1.2 C5 J1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 BSLEN P2.0/TA1.1 10uF C10 100nF C14 C13 R8 0R 100nF R6 0R C7 PJ.0/TDO P1.3/TA0.2 C6 100nF DVCC 10uF GND RST/NMI P1.7/TA1.0 R1 0R 12pF D1 Q1 2 R3 330R P5.2/XT2IN P1.6/TA1CLK/CBOUT PINHEAD_1X2 C1 12pF XTLGND C2 1 ??? THERMAL_3 C M I O P1.2/TA0.1 P7.0/TB0.0 P2.6/RTCCLK/DMAE0 P5.3/XT2OUT P1.5/TA0.4 P7.1/TB0.1 P2.5/TA2.2 TEST/SBWTCK P1.4/TA0.3 SHC1 GND 470nF C9 GND 3 THERMAL_1 65 66 67 68 69 70 71 72 THERMAL_2 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 P2.4/TA2.1 B C D JP2 2 1 2 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 RSTDVCC/SBWTDIO VCORE VCORE 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 P1.1/TA0.0 P1.2/TA0.1 1 2 3 4 5 6 7 DVCC 8 9 10 11 12 13 14 15 16 D3 1 J2 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Hardware 86 www.ti.com MSP-TS430RGC64C B.19 MSP-TS430RGC64C Figure B-37. MSP-TS430RGC64C Target Socket Module, Schematic MSP-TS430RGC64C www.ti.com Connector J6 External power connector to supply DVIO Jumper JP4 Close if only one power supply is used for VCC and DVIO, and if VCC is not higher then 1.98 V. Otherwise supply DVIO over J6. IMPORTANT NOTE: Do not close if VCC > 1.98 V, as it may damage the chip. Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode. Close 2-3 to debug in 4-wire JTAG mode. Orient Pin 1 of MSP430 device Connector J5 External power connector for DVCC. Set jumper JP3 to "ext". IMPORTANT NOTE: Rev1.0 of the board does not have connection from pin 4 of BOOTST to pin 64 of MCU. To use BSL, these pins should be connected by a wire. D1 LED connected to P1.0 Jumper JP2 Open to disconnect LED. Figure B-38. MSP-TS430RGC64C Target Socket Module, PCB SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 87 MSP-TS430RGC64C www.ti.com Table B-21. MSP-TS430RGC64C Bill of Materials Item Qty Reference 1 0 C1, C2 12pF CAP, SMD, Ceramic, 0805 DNP C1 C2 2 0 C3, C4 tbd CAP, SMD, Ceramic, 0805 DNP C3 C4 4 3 C5, C7, C10 10uF CAP, SMD, Ceramic, 0805 5 5 C8 C6 C13-15 100nF CAP, SMD, Ceramic, 0805 5 5 C8 2.2nF CAP, SMD, Ceramic, 0805 6 1 C9 470nF CAP, SMD, Ceramic, 0805 7 1 C16 4.7uF CAP, SMD, Ceramic, 0805 8 1 D1 Green LED LED, SMD, 0805 9 10 4 2 11 16-pin header Description Pinheader 1x16: Grid: 100mil (2.54 mm) Comment Supplier No. DigiKey: 311-1245-2-ND DigiKey: 478-1403-2-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder. : Header : Receptacle SAM1029-16-ND SAM1213-16-ND 3-pin header, male, TH Pinheader 1x3: Grid: 100mil (2.54 mm) JP5, JP6, JP7, 3-pin header, male, TH JP8, JP9, JP10 Pinheader 1x3: Grid: 100mil (2.54 mm) place jumpers on pins 2-3 SAM1035-03-ND J5, J6 SAM1035-03-ND 12 JP3 3-pin header, male, TH Pinheader 1x3: Grid: 100mil (2.54 mm) place jumper on pins 1-2 SAM1035-03-ND 13 JP1, JP2, JP4 2-pin header, male, TH Pinheader 1x2; Grid: 100mil (2.54 mm) place jumper on header SAM1035-02-ND Place on: JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP10 15-38-1024-ND 14 10 15 1 JTAG 2x7Pin,Wanne Header, THD, Male 2x7 Pin, Wanne, 100mil spacing HRP14H-ND 16 0 BOOTST 2x5Pin,Wanne Header, THD, Male 2x5 Pin, Wanne, 100mil spacing DNP 17 1 Q1 26MHz/ASX53 CRYSTAL, SMD, 5x3MM, 26MHz Only Kit. 18 0 Q2 26MHz/ASX53 CRYSTAL, SMD, 5x3MM, 26MHz 300-8219-1-ND 19 1 D3 LL103A DIODE, SMD, SOD123, Schottky Buerklin: 24S3406 20 2 R3, R7 330 Ohm, SMD0805 21 1 R5 47k Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% Jumper 0 Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% DNP: R6, R8, R9, R10, R11,R12 Socket: QFN11T064-006-NHSP Manuf.: Yamaichi R1, R2, R4, R6, R8, R9, R10, R11, R12 22 88 J1-J4 Value 23 1 U1 24 2 MSP430 25 4 Rubber stand off 26 1 PCB Hardware MSP430F5229IRGCR 541-330ATR-ND 541-000ATR-ND IC, MCU, SMD, 9.15x9.15mm Thermal Pad with Socket apply to corners at bottom Buerklin: 20H1724 side Rubber stand off 84 x 76 mm 541-47000ATR-ND 84 x 76 mm SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430RGC64USB www.ti.com B.20 MSP-TS430RGC64USB Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately 0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, to run the MCU at 3.0 V, set it to 3.3 V. Figure B-39. MSP-TS430RGC64USB Target Socket Module, Schematic SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 89 MSP-TS430RGC64USB www.ti.com Figure B-40. MSP-TS430RGC64USB Target Socket Module, PCB 90 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430RGC64USB www.ti.com Table B-22. MSP-TS430RGC64USB Bill of Materials Pos. Ref Des No. Per Board 1 C1, C2 0 12pF, SMD0805 1.1 C3, C4 2 47pF, SMD0805 2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND 3 C5, C11, C13, C14 4 100nF, SMD0805 311-1245-2-ND 3.1 C10, C12 0 10uF, SMD0805 4 C8 1 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 Description 4 DigiKey Part No. Comment DNP: C1, C2 DNP: C10, C12 DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 16-pin header, TH SAM1029-16-ND : Header SAM1213-16-ND : Receptacle 8 J5 1 3-pin header, male, TH SAM1035-03-ND 9 JP5, JP6, JP7, JP8, JP9, JP10 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 10 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header 11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP10 12 13 JTAG 1 14-pin connector, male, TH HRP14H-ND 14 Q1 0 Crystal Q1: Micro Crystal MS1V-T1K DNP: Q1 32.768kHz, C(Load) = Keep vias free of solder" 12.5pF 15 Q2 1 Crystal Q2: 4MHz Buerklin: 78D134 16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND 17 R1, R2, R4, R6, R8, R9, R12 2 0 Ω, SMD0805 541-000ATR-ND 18 R10 1 100 Ω, SMD0805 Buerklin: 07E500 18 R11 1 1M Ω, SMD0805 18 R5 1 47k Ω, SMD0805 19 U1 1 Socket: QFN11T064-006 Manuf.: Yamaichi 20 PCB 1 79 x 77 mm 2 layers 21 Rubber stand off 4 22 MSP430 2 MSP430F5509 RGC 23 Insulating disk to Q2 1 Insulating disk to Q2 http://www.ettinger.de/Art_De tail.cfm?ART_ARTNUM=70.0 8.121 27 C33 1 220n SMD0603 Buerklin: 53D2074 28 C35 1 10p SMD0603 Buerklin: 56D102 29 C36 1 10p SMD0603 Buerklin: 56D102 30 C38 1 220n SMD0603 Buerklin: 53D2074 31 C39 1 4u7 SMD0603 Buerklin: 53D2086 32 C40 1 0.1u SMD0603 Buerklin: 53D2068 33 D2, D3, D4 3 LL103A Buerklin: 24S3406 DNP: R4, R6, R8, R9, R12 541-47000ATR-ND Buerklin: 20H1724 apply to corners at bottom side DNP: enclosed with kit. Is supplied by TI SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 91 MSP-TS430RGC64USB www.ti.com Table B-22. MSP-TS430RGC64USB Bill of Materials (continued) Ref Des No. Per Board 34 IC7 1 TPD4E004 36 LED 0 JP3QE SAM1032-03-ND DNP 37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP 38 LED2 0 LEDCHIPLED_0603 FARNELL: 852-9868 DNP 39 LED3 0 LEDCHIPLED_0603 FARNELL: 852-9841 DNP 40 R13, R15, R16 0 470R Buerklin: 07E564 DNP 41 R33 1 1k4 / 1k5 Buerklin: 07E612 42 R34 1 27R Buerklin: 07E444 43 R35 1 27R Buerklin: 07E444 44 R36 1 33k Buerklin: 07E740 45 S1 0 PB P12225STB-ND DNP 46 S2 0 PB P12225STB-ND DNP 46 S3 1 PB P12225STB-ND 47 USB1 1 USB_RECEPTACLE FARNELL: 117-7885 Pos. 92 Hardware Description DigiKey Part No. Comment Manu: TI SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PN80 www.ti.com B.21 MSP-TS430PN80 NOTE: For MSP430F(G)47x devices: Connect pins 7 and 10 (GND) externally to DVSS (see data sheet). Connect load capacitance on Vref pin 60 when SD16 is used (see data sheet). Figure B-41. MSP-TS430PN80 Target Socket Module, Schematic SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 93 MSP-TS430PN80 www.ti.com LED connected to pin 12 Connector J5 External power connection Remove R8 and jumper R9 Jumper J6 Open to disconnect LED Orient Pin 1 of MSP430 device Figure B-42. MSP-TS430PN80 Target Socket Module, PCB 94 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PN80 www.ti.com Table B-23. MSP-TS430PN80 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP: C1, C2 1.1 C3, C4 0 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec. 2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 D1 1 green LED, SMD0603 475-1056-2-ND 6 J1, J2, J3, J4 Description 0 DigiKey Part No. Comment DNP: Headers and receptacles enclosed with kit.Keep vias free of solder. 25-pin header, TH SAM1029-20-ND : Header SAM1213-20-ND : Receptacle 7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND 8 J6, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 3 Jumper 15-38-1024-ND Place on: J6, JP2, JP1/Pos12 HRP14H-ND 9 10 JTAG 1 14-pin connector, male, TH 11 BOOTST 0 10-pin connector, male, TH 12 Q1, Q2 0 Crystal Q1: Micro Crystal MS1V-T1K DNP: Keep vias free of 32.768kHz, C(Load) = solder 12.5pF 13 R3 1 560 Ω, SMD0805 541-560ATR-ND 14 R1, R2, R4, R6, R7, R10, R11, R12 2 0 Ω, SMD0805 541-000ATR-ND 15 R5 1 47k Ω, SMD0805 541-47000ATR-ND 16 U1 1 Socket: IC201-0804-014 17 PCB 1 77 x 77 mm 18 Adhesive Plastic feet 4 ~6mm width, 2mm height 19 MSP430 2 MSP430FG439IPN DNP: Keep vias free of solder DNP: R4, R6, R7, R10, R11, R12 Manuf.: Yamaichi 2 layers for example, 3M Bumpons Part No. SJ-5302 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Apply to corners at bottom side DNP: Enclosed with kit supplied by TI Hardware 95 MSP-TS430PN80A www.ti.com B.22 MSP-TS430PN80A Figure B-43. MSP-TS430PN80A Target Socket Module, Schematic 96 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PN80A www.ti.com Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Connector J5 External power connector Jumper JP3 to "ext" Orient Pin 1 of MSP430 device If the system should be supplied via LDOI (J6), close JP4 and set JP3 to external Jumper JP2 Open to disconnect LED D1 LED connected to P1.0 Figure B-44. MSP-TS430PN80A Target Socket Module, PCB SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 97 MSP-TS430PN80A www.ti.com Table B-24. MSP-TS430PN80A Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C3, C4 0 47pF, SMD0805 DNP 3 C6, C7, C10, C12 3 10uF, 6.3V, SMD0805 DNP C10 4 C5, C11, C13, C14, C15 5 100nF, SMD0805 5 C8 1 2.2nF, SMD0805 6 C9 1 470nF, SMD0805 7 C16 1 4.7uF, SMD0805 8 C17 1 220nF, SMD0805 9 D1 1 green LED, SMD0805 P516TR-ND 10 J1, J2, J3, J4 0 20-pin header, TH SAM1029-20-ND (Header) SAM1213-20ND (Receptacle) DNP: Headers and receptacles enclosed with kit. Keep vias free of solder: 11 J5 , J6 2 3-pin header, male, TH 12 JP3, JP5, JP6, JP7, JP8, JP9, JP10 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 on JP5, JP6, JP7, JP8, JP9, JP10 place jumpers on pins 1-2 on JP3, 13 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13 HRP14H-ND 14 98 Description DigiKey Part No. Comment 311-1245-2-ND 478-1403-2-ND 15 JTAG 1 14-pin connector, male, TH 16 BOOTST 0 10-pin connector, male, TH 17 Q1 0 Crystal Micro Crystal MS3V-T1R 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder 12.5pF 18 Q2 0 Crystal Q2: 4MHz Buerklin: 78D134 19 Insulating disk to Q2 0 Insulating disk to Q2 http://www.ettinger.de/Ar t_Detail.cfm?ART_ART NUM=70.08.121 20 D3,D4 2 LL103A Buerklin: 24S3406 21 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND 22 R1, R2, R4, R6, R8, R9,R10, R11, R12 3 0 Ohm, SMD0805 541-000ATR-ND 23 R5 1 47k Ω, SMD0805 541-47000ATR-ND 24 U1 1 Socket:IC201-0804-014 25 PCB 1 77 x 91 mm 26 Adhesive plastic feet 4 Approximately 6mm width, 2mm height 27 MSP430 2 MSP430F5329IPN Hardware "DNP Keep vias free of solder" DNP: Q2 Keep vias free of solder DNP: R6, R8, R9, R10, R11,R12 Manuf.: Yamaichi 2 layers for example, 3M Bumpons Part No. SJ5302 Apply to corners at bottom side DNP: enclosed with kit, supplied by TI SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PN80USB www.ti.com B.23 MSP-TS430PN80USB Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately 0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, to run the MCU at 3.0 V, set it to 3.3 V. NOTE: R11 should be populated. Figure B-45. MSP-TS430PN80USB Target Socket Module, Schematic SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 99 MSP-TS430PN80USB www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG debug interface 2-3 (ext): External power supply USB Connector Connector J5 External power connector Jumper JP3 to ‘ext’ Jumper JP1 Open to measure current Jumper JP4 Close for USB bus powered device Jumper JP5 to JP10 Close 1-2 to debug in Spy-BiWire mode. Close 2-3 to debug in 4-wire JTAG mode. BSL invoke button S3 LED connected to P1.0 Jumper JP2 Open to disconnect LED Figure B-46. MSP-TS430PN80USB Target Socket Module, PCB 100 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PN80USB www.ti.com Table B-25. MSP-TS430PN80USB Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 1.1 C3, C4 2 47pF, SMD0805 2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND 3 C5, C11, C13, C14 4 100nF, SMD0805 311-1245-2-ND 3.1 C10, C12 0 10uF, SMD0805 311-1245-2-ND 4 C8 1 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 4 20-pin header, TH SAM1029-20-ND 7.1 4 Description DigiKey Part No. Comment DNP: C1, C2 DNP: C10, C12 DNP: headers and receptacles enclosed with kit. Keep vias free of solder. DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 20-pin header, TH SAM1213-20-ND : Header : Receptacle 8 J5 1 3-pin header, male, TH SAM1035-03-ND 9 JP5, JP6, JP7, JP8,JP9, JP10 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3 10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header JP4 1 SAM1035-02-ND Place jumper only on one pin JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP10 11 12 13 JTAG 1 14-pin connector, male, TH HRP14H-ND 14 Q1 0 Crystal Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 15 Q2 1 Crystal "Q2: 4MHzBuerklin: 78D134" 16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND 17 R1, R2, R4, R6, R8, R9, R12 2 0 Ω, SMD0805 541-000ATR-ND 18 R10 1 100 Ω, SMD0805 Buerklin: 07E500 18 R11 0 1M Ω, SMD0805 18 R5 1 47k Ω, SMD0805 19 U1 1 Socket:IC201-0804-014 Manuf.: Yamaichi 20 PCB 1 79 x 77 mm 2 layers 21 Rubber standoff 4 22 MSP430 2 MSP430F5529 23 Insulating disk to Q2 1 Insulating disk to Q2 http://www.ettinger.de/Art_ Detail.cfm?ART_ARTNUM =70.08.121 27 C33 1 220n Buerklin: 53D2074 DNP: Q1 Keep vias free of solder DNP: R4, R6, R8, R9, R12 DNP 541-47000ATR-ND Buerklin: 20H1724 Apply to corners at bottom side DNP: Enclosed with kit supplied by TI SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 101 MSP-TS430PN80USB www.ti.com Table B-25. MSP-TS430PN80USB Bill of Materials (continued) 102 Pos. Ref Des No. per Board 28 C35 1 10p Buerklin: 56D102 29 C36 1 10p Buerklin: 56D102 30 C38 1 220n Buerklin: 53D2074 31 C39 1 4u7 Buerklin: 53D2086 32 C40 1 0.1u Buerklin: 53D2068 33 D2, D3, D4 3 LL103A Buerklin: 24S3406 34 IC7 1 TPD4E004 36 LED 0 JP3QE SAM1032-03-ND DNP 37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP 38 LED2 0 LEDCHIPLED_0603 FARNELL: 852-9868 DNP 39 LED3 0 LEDCHIPLED_0603 FARNELL: 852-9841 DNP 40 R13, R15, R16 0 470R Buerklin: 07E564 DNP 41 R33 1 1k4 Buerklin: 07E612 42 R34 1 27R Buerklin: 07E444 43 R35 1 27R Buerklin: 07E444 44 R36 1 33k Buerklin: 07E740 45 S1 0 PB P12225STB-ND DNP 46 S2 0 PB P12225STB-ND DNP 46 S3 1 PB P12225STB-ND 47 USB1 1 USB_RECEPTACLE FARNELL: 117-7885 Hardware Description DigiKey Part No. Comment Manu: TI SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PZ100 www.ti.com B.24 MSP-TS430PZ100 NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be made. Figure B-47. MSP-TS430PZ100 Target Socket Module, Schematic SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 103 MSP-TS430PZ100 www.ti.com Jumper J7 Open to measure current Jumper J6 Open to disconnect LED LED connected to pin 12 Connector J5 External power connection Remove R8 and jumper R9 Orient Pin 1 of MSP430 device Figure B-48. MSP-TS430PZ100 Target Socket Module, PCB 104 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PZ100 www.ti.com Table B-26. MSP-TS430PZ100 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 1b C3, C4 0 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec. 2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND Description DigiKey Part No. Comment DNP: C6 DNP: Headers and receptacles enclosed with kit.Keep vias free of solder. J1, J2, J3, J4 0 8 J5 1 3-pin header, male, TH SAM1035-03-ND 9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND place jumper on header Place on: J6, J7 7 10 25-pin header, TH SAM1029-25-ND : Header SAM1213-25-ND : Receptacle 2 Jumper 15-38-1024-ND 11 JTAG 1 14-pin connector, male, TH HRP14H-ND 12 BOOTST 0 10-pin connector, male, TH 13 Q1, Q2 0 Crystal Q1: Micro Crystal MS1VT1K 32.768kHz, C(Load) = 12.5pF 14 R3 1 330 Ω, SMD0805 541-330ATR-ND 15 R1, R2, R4, R8, R9, R10, R11, R12 3 0 Ω, SMD0805 541-000ATR-ND 16 R5 1 47k Ω, SMD0805 541-47000ATR-ND Manuf.: Yamaichi 2 layers 17 U1 1 Socket: IC201-1004-008 or IC357-1004-53N 18 PCB 1 82 x 90 mm 19 Adhesive Plastic feet 4 ~6mm width, 2mm height 20 MSP430 2 MSP430FG4619IPZ DNP: Keep vias free of solder for example, 3M Bumpons Part No. SJ-5302 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated DNP: Keep vias free of solder DNP: R4, R9, R10, R12 Apply to corners at bottom side DNP: enclosed with kit supplied by TI Hardware 105 MSP-TS430PZ100A www.ti.com B.25 MSP-TS430PZ100A Figure B-49. MSP-TS430PZ100A Target Socket Module, Schematic 106 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PZ100A www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External Power Supply Jumper JP1 Open to measure current Jumper JP2 Open to disconnect LED LED D1 connected to P5.1 Orient Pin 1 of Device Figure B-50. MSP-TS430PZ100A Target Socket Module, PCB SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 107 MSP-TS430PZ100A www.ti.com Table B-27. MSP-TS430PZ100A Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 1b C3, C4 0 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec. 2 C7, C9 2 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C5, C11, C14 3 100nF, SMD0805 311-1245-2-ND 4 C8 1 10nF, SMD0805 478-1358-1-ND 5 C6 0 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 67-1553-1-ND 7 J1, J2, J3, J4 DigiKey Part No. Comment DNP DNP: Headers and receptacles enclosed with kit.Keep vias free of solder. 25-pin header, TH SAM1029-25-ND : Header SAM1213-25-ND : Receptacle 8 J5 1 3-pin header, male, TH SAM1035-03-ND 10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND pPlace jumper on header 11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3 HRP14H-ND 12 108 0 Description 13 JTAG 1 14-pin connector, male, TH 14 BOOTST 0 10-pin connector, male, TH 15 Q1, Q2 0 Crystal Q1: Micro Crystal MS1VT1K 32.768kHz, C(Load) = 12.5pF 16 R3 1 330 Ω, SMD0805 541-330ATR-ND 17 R1, R2, R4, R6, R7, R8, R9, R10, R11, R12 2 0 Ω, SMD0805 541-000ATR-ND 18 R5 1 47k Ω, SMD0805 541-47000ATR-ND 19 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi 20 PCB 1 90 x 82 mm 4 layers 21 Rubber standoff 4 22 MSP430 2 Hardware DNP: Keep vias free of solder Select appropriate DNP: Keep vias free of solder DNP: R4, R6, R7, R8, R9, R10, R11, R12 Apply to corners at bottom side DNP: Enclosed with kit supplied by TI MSP430F5438IPZ SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PZ100B www.ti.com B.26 MSP-TS430PZ100B Figure B-51. MSP-TS430PZ100B Target Socket Module, Schematic SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 109 MSP-TS430PZ100B www.ti.com Connector J5 External power connector Jumper JP1 to "ext" Jumper JP1 Open to measure current Orient Pin 1 of MSP430 device JP11, JP12, JP13 Connect 1-2 to connect AUXVCCx with DVCC or drive AUXVCCx externally Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode D1 LED connected to P1.0 Jumper JP2 Open to disconnect LED Figure B-52. MSP-TS430PZ100B Target Socket Module, PCB 110 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PZ100B www.ti.com Table B-28. MSP-TS430PZ100B Bill of Materials Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C4, C5, C6 , C7, C8, C9 6 100nF, SMD0805 311-1245-2-ND 3 C10, C26 2 470 nF, SMD0805 478-1403-2-ND 4 C11, C12 1 10 uF / 6.3 V SMD0805 5 C13, C14, C16, C18, C19, C29 6 4.7 uF SMD0805 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 0 25-pin header, TH SAM1029-25-ND (Header) SAM1213-25ND (Receptacle) DNP: Headers and receptacles enclosed with kit. Keep vias free of solder: 8 J5 1 3-pin header, male, TH 9 JP3, JP5, JP6, JP7, JP8, JP9, JP10 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 on JP5, JP6, JP7, JP8, JP9, JP10 place jumpers on pins 1-2 on JP3, 10 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header 11 JP11, JP12, JP13 3 4-pin header, male, TH 13 Jumper 15-38-1024-ND HRP14H-ND Position 12 Description DigiKey Part No. Comment DNP C12 DNP place jumper on header 1-2 See Pos. 9 and Pos. 10 and Pos. 11 15 JTAG 1 14-pin connector, male, TH 16 BOOTST 0 10-pin connector, male, TH "DNP Keep vias free of solder" 17 Q1 0 Crystal DNP: Q1 Keep vias free of solder 21 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND 22 R1, R2, R4, R6, R8, R10, R11 2 0 Ohm, SMD0805 541-000ATR-ND 23 R5 1 47k Ω, SMD0805 541-47000ATR-ND 24 U1 1 Socket: IC357-1004-53N 25 PCB 1 90 x 82 mm 26 Adhesive plastic feet 4 Approximately 6mm width, 2mm height 27 MSP430 2 MSP430F6733IPZ DNP: R4, R6, R8, R10, R11 Manuf.: Yamaichi 2 layers for example, 3M Bumpons Part No. SJ5302 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Apply to corners at bottom side DNP: enclosed with kit, supplied by TI Hardware 111 BOOTST 10 8 6 4 2 R10 R11 JTAG DNP DNP 13 11 9 7 5 3 1 0R 0R LDOO C18 100nF C19 100nF GND 1 JP5 2 3 DNP GND JP6 R9 XT2IN R12 XT2OUT TDO 1 RST 2 RST/NMI 3 1 JP4 2 LDOI/LDOO Interface GND R7 330R VCC GND TEST/SBWTCK TCK 1 J6 2 3 Note: If the system should be supplied via LDOI (J6) close JP4 and set JP3 to external LDOI GND RST/NMI TCK TMS TDI TDO RST R5 47K TEST/SBWTCK 2.2nF C8 DVCC1 GND U1 QFP100PZ 0R C TCK 0R D1 1 JP7 2 3 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 M TMS HCTC_XTL_4 DNP Q2G$1 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 P8.2 60 P8.1 59 P8.0 58 57 56 55 54 53 52 51 1 JP8 2 3 C3 DNP I TDI 47pF 47pF DNP C4 J3 DVCC1 1 JP9 2 3 GND O TDO C11 100nF C10 100nF DNP GND 4 3 2 1 VBAT DVCC1 GND 1 JP10<- SBW 2 3 <- JTAG JP11 1 2 3 GND PWR3 MSP430: Ta rget-Socket MSP-TS430PZ100C 1.1 Copyright © 2009–2012, Texas Instruments Incorporated 9 7 5 14 12 10 8 6 4 2 R1 0R R6 0R R8 0R R3 330R XTLGND2 VCC D4 Socket: Yamaichi IC201-1004-008 P1.0 3 Q2G$2 TEST/SBWTCK DNP D3 C17 DNP 100nF XIN XOUT 470nF GND P516TR-ND HCTC_XTL_4 LL103A 220nF C21 GND 4 BSL-Rx3 BSL-Tx 1 2 1 LL103A R2 0R AVCC DNP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 C16 P1.2 P1.1 DNP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 AVSS 16 17 18 19 20 21 22 23 24 25 DNP VBAT C15 BSL Interface GND JP3 int GND C5 100nF DVCC1 1 JP1 2 DNP C2 12pF 12pF + C7 4.7uF C12 100nF C9 1 2 ext 3 Vcc C1 J1 C13 100nF 0R R4 J2 RST GND XTLGND1 VCC + C6 AVSS 10uF/6.3V 4.7n 2 1 4 J4 GND JP2 LFXTCLK C14 100nF 10uF/6.3V HCTC_XTL_4 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 HCTC_XTL_4 100 99 98 97 96 C 95 M 94 93 I O 92 91 GND 90 DVCC1 89 88 VBAT 87 VBAK 86 85 84 AVSS 83 82 LDOO 81 LDOI 80 79 PU.1 78 77 PU.0 GND 76 26 27 28 29 30 31 32 33 34 35 P1.1 36 P1.2 37 38 39 40 P1.6 41 P1.7 42 43 44 45 46 47 48 49 50 Q1G$2 3 2 Q1G$1 1 100nF C20 DVCC1 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Hardware 112 www.ti.com MSP-TS430PZ100C B.27 MSP-TS430PZ100C J5 Figure B-53. MSP-TS430PZ100C Target Socket Module, Schematic MSP-TS430PZ100C www.ti.com JP11 JP3 14 10 1 2 3 1 2 4 BOOTST J5 VCC LDOI/LDOO J6 C15 C20 1 2 3 75 1 95 90 85 80 76 R12 R9 Q2 5 If the system should be supplied via LDOI (J6), close JP4 and set JP3 to external 70 C10 C11 C16 1 Orient Pin 1 of MSP430 device C4 C3 100 Connector J5 External power connector Jumper JP3 to "ext" GND GND JP4 D4 C21 3 C5 C7 R11 R10 JP1 2 GND SBW JTAG 1 123 123 123 123 R5 C8 123 + 1 int ext R7 JP6 R2 JP7 J4 2 VBAT DVCC 3 D3 JP5 JP10 JP9 JP8 JTAG Jumpers JP5 to JP10 Close 1-2 to debug in Spy -Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Vcc 1 2 C18 C19 Q1 10 65 R8 C1 C2 R6 J3 1 C14 C12 C13 C17 + 60 R1 C6 5 U1 55 C9 R4 2 D1 LED connected to P1.0 26 30 3540 45 51 25 J2 J1 0 Jumper JP2 Open to disconnect LED 50 D1 R3 JP2 Figure B-54. MSP-TS430PZ100C Target Socket Module, PCB SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 113 MSP-TS430PZ100C www.ti.com Table B-29. MSP-TS430PZ100C Bill of Materials Pos. Ref Des Number Per Board 1 C1, C2 0 12pF, SMD0805 DNP: C1, C2 1.1 C3, C4 2 47pF, SMD0805 DNP: C3, C4 2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND 3 C5, C11, C13, C14, C19, C20 6 100nF, SMD0805 311-1245-2-ND 3.1 C10, C12, C18,17 0 100nF, SMD0805 311-1245-2-ND 4 C8 1 2.2nF, SMD0805 Buerklin 53 D 292 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 4 25-pin header, TH SAM1213-25-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 7.1 Description Digi-Key Part No. Comment DNP: C10, C12,C18, C17 8 J5, J6 2 3-pin header, male, TH SAM1035-03-ND 9 JP5, JP6, JP7, JP8,JP9, JP10 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND place jumper on header 10.1 JP4 1 2-pin header, male, TH SAM1035-02-ND place jumper on header 11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP10 12 13 JTAG 1 14-pin connector, male, TH HRP14H-ND 14 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder 15 Q1 0 Crystal DNP: Q1 Keep vias free of solder 16 Q2 1 Crystal 17 R3, R7 2 330 Ohm, SMD0805 541-330ATR-ND 18 R1, R2, R4, R6, R8, R9, R10, R11, R12 3 0 Ohm, SMD0805 541-000ATR-ND 19 R5 1 47k Ohm, SMD0805 541-47000ATR-ND 20 U1 1 Socket: IC357-1004-53N DNP: R6, R8, R9, R10, R11, R12 Manuf.: Yamaichi MSP-TS430PZ100C Rev 1.0 2 layers Buerklin: 20H1724 apply to corners at bottom side 21 PCB 1 22 Rubber stand off 4 23 MSP430 2 MSP430F643x 24 C16 1 4.7 nF SMD0603 Buerklin 53 D 2042 26 D3, D4 2 LL103A Buerklin: 24S3406 27 JP11 1 4-pin header, male, TH SAM1035-04-ND 28 C15 1 4.7 uF, SMD0805 Buerklin 53 D 2430 29 C21 1 220nF, SMD0805 Buerklin 53 D 2381 114 Hardware 79.5 x 99.5 mm DNP: Q2 Keep vias free of solder DNP: enclosed with kit. Is supplied by TI. Place jumper on Pin 1 and Pin 2 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PZ100C www.ti.com SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 115 MSP-TS430PZ5x100 www.ti.com B.28 MSP-TS430PZ5x100 Figure B-55. MSP-TS430PZ5x100 Target Socket Module, Schematic 116 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PZ5x100 www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG debug interface 2-3 (ext): External power supply Connector J5 External power connector Jumper J3 to ‘ext’ Jumper JP1 Open to measure current Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode. Close 2-3 to debug in 4-wire JTAG mode. LED connected to P1.0 Jumper JP2 Open to disconnect LED Figure B-56. MSP-TS430PZ5x100 Target Socket Module, PCB SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 117 MSP-TS430PZ5x100 www.ti.com Table B-30. MSP-TS430PZ5x100 Bill of Materials Pos. Ref Des No. Per Board 1 C1, C2 0 1b C3, C4 DigiKey Part No. DNP 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec. C6, C7 2 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C5, C10, C11, C12, C13, C14 4 100nF, SMD0805 311-1245-2-ND 4 C8 0 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 67-1553-1-ND J1, J2, J3, J4 0 Comment 12pF, SMD0805 2 7 DNP: C12, C14 DNP DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 25-pin header, TH SAM1029-25-ND : Header SAM1213-25-ND : Receptacle 8 J5 1 3-pin header, male, TH SAM1035-03-ND 9 JP5, JP6, JP7, JP8, JP9, JP10 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3 10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2 9 Jumper 15-38-1024-ND Place on JP1, JP2, JP3, JP5, JP6, JP7, JP8, JP9, JP10 HRP14H-ND 12 118 Description 13 JTAG 1 14-pin connector, male, TH 14 BOOTST 0 10-pin connector, male, TH 15 Q1, Q2 0 Crystal Q1: Micro Crystal MS1V-T1K DNP: Keep vias free of 32.768kHz, C(Load) = solder 12.5pF 16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND 17 R1, R2, R4, R6, R8, R9, R10, R11, R12 3 0 Ω, SMD0805 541-000ATR-ND 18 R5 1 47k Ω, SMD0805 541-47000ATR-ND 19 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi 20 PCB 1 90 x 82 mm 2 layers 21 Rubber standoff 4 22 MSP430 2 Hardware DNP: Keep vias free of solder Select appropriate DNP: R6, R8, R9, R10, R11, R12 Apply to corners at bottom side DNP: Enclosed with kit supplied by TI MSP430F5438IPZ SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PZ100USB www.ti.com B.29 MSP-TS430PZ100USB Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately 0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, to run the MCU at 3.0 V, set it to 3.3 V. Figure B-57. MSP-TS430PZ100USB Target Socket Module, Schematic SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 119 MSP-TS430PZ100USB www.ti.com Figure B-58. MSP-TS430PZ100USB Target Socket Module, PCB 120 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PZ100USB www.ti.com Table B-31. MSP-TS430PZ100USB Bill of Materials Pos. Ref Des No. Per Board 1 C1, C2 0 12pF, SMD0805 1.1 C3, C4 2 47pF, SMD0805 2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND 3 C5, C11, C13, C14, C19 5 100nF, SMD0805 311-1245-2-ND 3.1 C10, C12, C18, C17 0 100nF, SMD0805 311-1245-2-ND 4 C8 1 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 7.1 Description 4 25-pin header, TH DigiKey Part No. Comment DNP: C1, C2 DNP: C10, C12,C18, C17 SAM1029-25-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder. : Header : Receptacle DNP: headers and receptacles enclosed with kit. Keep vias free of solder. : Header : Receptacle 4 25-pin header, TH SAM1213-25-ND 8 J5 1 3-pin header, male, TH SAM1035-03-ND 9 JP5, JP6, JP7, JP8, JP9, JP10 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 10 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header 11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP10 12 13 JTAG 1 14-pin connector, male, TH HRP14H-ND 14 Q1 0 Crystal Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 15 Q2 1 Crystal Q2: 4MHz, Buerklin: 78D134 16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND 17 R1, R2, R4, R6, R8, R9, R12 3 0 Ω, SMD0805 541-000ATR-ND 18 R10 1 100 Ω, SMD0805 Buerklin: 07E500 18 R11 1 1M Ω, SMD0603 18 R5 1 47k Ω, SMD0805 19 U1 1 Socket:IC201-1004-008 Manuf.: Yamaichi 20 PCB 1 79 x 77 mm 2 layers 21 Rubber stand off 4 22 MSP430 2 MSP430F5529 23 Insulating disk to Q2 1 Insulating disk to Q2 24 C16 1 4.7 nF SMD0603 27 C33 1 220n SMD0603 Buerklin: 53D2074 28 C35, C36 2 10p SMD0603 Buerklin: 56D102 DNP: Q1. Keep vias free of solder DNP: R6, R8, R9, R12 not existing in Rev 1.0 541-47000ATR-ND Buerklin: 20H1724 apply to corners at bottom side DNP: enclosed with kit. Is supplied by TI http://www.ettinger.de/Art_De tail.cfm?ART_ARTNUM=70.0 8.121 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 121 MSP-TS430PZ100USB www.ti.com Table B-31. MSP-TS430PZ100USB Bill of Materials (continued) 122 Pos. Ref Des No. Per Board 30 C38 1 220n SMD0603 Buerklin: 53D2074 31 C39 1 4u7 SMD0603 Buerklin: 53D2086 32 C40 1 0.1u SMD0603 Buerklin: 53D2068 33 D2, D3, D4 3 LL103A Buerklin: 24S3406 34 IC7 1 TPD4E004 35 LED 0 JP3QE SAM1032-03-ND DNP 36 LED1, LED2, LED3 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP 37 R13, R15, R16 0 470R SMD0603 Buerklin: 07E564 DNP 38 R33 1 1k4 / 1k5 SMD0603 Buerklin: 07E612 39 R34 1 27R SMD0603 Buerklin: 07E444 40 R35 1 27R SMD0603 Buerklin: 07E444 41 R36 1 33k SMD0603 Buerklin: 07E740 42 S1, S2, S3 1 PB P12225STB-ND 43 USB1 1 USB_RECEPTACLE FARNELL: 117-7885 44 JP11 1 4-pin header, male, TH SAM1035-04-ND Hardware Description DigiKey Part No. Comment Manu: TI DNP S1 and S2. (Only S3) place jumper only on Pin 1 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PEU128 www.ti.com B.30 MSP-TS430PEU128 VCC RST/NMI TCK TMS TDI TDO TEST/SBWTCK C JP11 1 2 3 4 TCK R7 330R GND 4.7uF C18 AUXVCC2 GND 4.7uF C19 AUXVCC1 TEST/SBWTCK VCC1 VCC1 GND JP12 1 2 3 4 GND D 1 JP5 2 3 TDO 1 RST 2 RST/NMI 3 VREF GND 470nF C10 GND JP6 PJ.3 TCK E 1 JP7 2 3 VASYS1/2 GND XIN XOUT AUXVCC3 RTCCAP1 RTCCAP0 P1.5/SMCLK/CB0/A5 P1.4/MCLK/SDCLK/CB1/A4 P1.3/ADC10CLK/TACLK/RTCCLK/A3 P1.2/ACLK/TA3.1/A2 P1.1/TA2.1/VEREF+/A1 P1.0/TA1.1/TA0.0/VEREF-/A0 P2.4/PM_TA2.0 P2.5/PM_UCB0SOMI/PM_UCB0SCL P2.6/PM_USB0SIMO/PM_UCB0SDA P2.7/PM_UCB0CLK P3.0/PM_UCA0RXD/PM_UCA0SOMI P3.1/PM_UCA0TXD/PM_UCA0SIMO P3.2/PM_UCA0CLK P3.3/PM_UCA1CLK P3.4/PM_UCA1RXD/PM_UCA1SOMI P3.5/PM_UCA1TXD/PM_UCA1SIMO COM0 COM1 P1.6/COM2 P1.7/COM3 P5.0/COM4 P5.1/COM5 P5.2/COM6 P5.3/COM7 LCDCAP/R33 P5.4/SDCLK/R23 P5.5/SD0DIO/LCDREF/R13 P5.6/SD1DIO/R03 P5.7/SD2DIO/CB2 P6.0/SD3DIO P3.6/PM_UCA2RXD/PM_UCA2SOMI P3.7/PM_UCA2TXD/PM_UCA2SIMO P4.0/PM_UCA2CLK E PJ.2 TMS IC1 1 JP8 2 3 PJ.1 TDI VASYS1/2 GND MSP430F677XIPEU# F 1 JP9 2 3 PJ.0 TDO JP10 1 2 3 ~RST/NMI/SBWTDIO PJ.3/TCK PJ.2/TMS PJ.1/TDI/TCLK PJ.0/TDO TEST/SBWTCK P2.3/PM_TA1.0 P2.2/PM_TA0.2 P2.1/PM_TA0.1 P2.0/PM_TA0.0 P11.5/TACLK/RTCCLK P11.4/CBOUT P11.3/TA2.1 P11.2/TA1.1 P11.1/TA3.1/CB3 P11.0/S0 P10.7/S1 P10.6/S2 P10.5/S3 P10.4/S4 P10.3/S5 P10.2/S6 P10.1/S7 P10.0/S8 P9.7/S9 P9.6/S10 P9.5/S11 P9.4/S12 P9.3/S13 P9.2/S14 P9.1/S15 P9.0/S16 DVSS2 DVSYS P8.7/S17 P8.6/S18 P8.5/S19 P8.4/S20 F <- SBW GND DVDSYS P2.1 P2.0 G RST PJ.3 PJ.2 PJ.1 PJ.0 TEST/SBWTCK <- JTAG 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 J3 H GND DNP BOOTST TP1 TP2 C14 RST R10 0R DNP 10 8 6 4 2 Rev.: DNP R11 0R VCC 1.1 I GND PWR3 I Seite 1/1 Bearb.: Petersen Dok: 1080/1/001/01.1 DNP C9 100nF 4.7uF 100nF GND 9 TEST/SBWTCK 7 5 3 1 P2.1 P2.0 DVDSYS C6 GND H Titel: MSP430: Target-Socket MSP-TS430PEU128 for F6779 MSP-TS430PEU128 File: Datum: 22.05.2012 09:37:33 G 1 2 3 B JTAG 13 11 9 7 5 3 1 XIN XOUT VEREF+ C16 14 12 10 8 6 4 2 DVDSYS DNP DNP 12pF C2 LFXTCLK 12pFDNP C1 AUXVCC3 10uF/6,3V 1 0R R6 2 0R R8 AUXVCC33 4 5 6 7 8 9 10 VEREF+ 11 P1.0 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 LCDCAP 31 32 33 34 35 36 37 38 C4 4.7uF Vcc JP3 1 JP1 2 RST R5 47K DNP GND C3 2.2nF AVCC C13 GND VCC1 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 100nF 4 3 2 1 FE04-1 R2 C8 4.7uF AVSS 100nF 0R 0R JP13 1 2 3 4 P1.0 DNP J1 D A3 6 5 4 3 2 1 Copyright © 2009–2012, Texas Instruments Incorporated C17 123 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback J5 VCC C15 4.7uF A int DVCC C11 10uF/6,3V R1 2 1 GND C12 AVSS LCDCAP C29 4.7uF GND C J4 DVDSYS ext VCC1 JP4 C5 100nF GND JP2 GND B J2 100nF C7 100nF 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 0R 6 5 4 3 2 1 A DNP R4 VCORE GND DVCC DVDSYS AUXVCC1 AUXVCC2 VASYS1/2 AVCC AVSS SD6N0 SD6P0 SD5N0 SD5P0 SD4N0 SD4P0 VREF AVSS VASYS1/2 SD3N0 SD3P0 SD2N0 SD2P0 SD1N0 SD1P0 SD0N0 SD0P0 P4.1/PM_UCA3RXD/PM_UCA3SOMI P4.2/PM_UCA3TXD/PM_UCA3SIMO P4.3/PM_UCA3CLK P4.4/PM_UCB1SOMI/PM_UCB1SCL P4.5/PM_UCB1SIMO/PM_UCB1SDA P4.6/PM_UCB1CLK P4.7/PM_TA3.0 P6.1/SD4DIO/S39 P6.2/SD5DIO/S38 P6.3/SD6DIO/S37 P6.4/S36 P6.5/S35 P6.6/S34 P6.7/S33 P7.0/S32 P7.1/S31 P7.2/S30 P7.3/S29 P7.4/S28 P7.5/S27 P7.6/S26 P7.7/S25 P8.0/S24 P8.1/S23 P8.2/S22 P8.3/S21 Q1 QUARZ5 VCC1 GND 470nF C26 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 R3 VCORE DVSS1 DVCC VDSYS AUXVCC1 AUXVCC2 VASYS1 AVCC AVSS1 SD6N0 SD6P0 SD5N0 SD5P0 SD4N0 SD4P0 VREF AVSS2 VASYS2 SD3N0 SD3P0 SD2N0 SD2P0 SD1N0 SD1P0 SD0N0 SD0P0 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 330R D1 1 2 Figure B-59. MSP-TS430PEU128 Target Socket Module, Schematic MSP-TS430PEU128 JP4 110 RST/NMI TCK TMS TDI TDO TEST/SBWTCK 2 1 3 2 1 3 2 1 3 2 1 3 2 1 3 2 1 JTAG 95 C7 C4 C16 1234 DVCC 3 JP6 JP7 JP8 JP9 JP5 AUXVCC C13 C8 1 C19 1234 C26 C10 C15 C17 C5 C11 C18 C6 C9 JP2 R3 D1 10 P1.0 2 3 5 4 GND J5 R5 C3 105 JP10 R7 115 100 120 AUXVCC1 JP11 125 AUXVCC3 JP13 C12 AUXVCC2 JP12 1 R4 128 J1 SBW J4 GND VCC GND GND R1 R2 TP1 JP1 www.ti.com 14 10 25 C14 80 R11 R10 20 2 1 JTAG C2 R6 85 15 90 IC1 1 R8 C1 75 2 1 C29 1 30 BOOTST int 70 MSP-TS430PEU128 RoHS Rev. 1.1 ext DVDSYS 65 35 JP3 TP2 40 45 50 55 60 64 J3 GND J2 Figure B-60. MSP-TS430PEU128 Target Socket Module, PCB 124 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-TS430PEU128 www.ti.com Table B-32. MSP-TS430PEU128 Bill of Materials Pos. Ref Des No. Per Board 1 PCB 1 2 D1 3 JP1, JP2, JP4 4 JP5, JP6, JP7, JP8, JP9, JP10 6 5 JP11, JP12, JP13 6 JP3 7 JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP10, JP11, JP12, JP13 13 8 R1, R2, R4, R6, R8 9 R10, R11 10 C3 11 C13, C14, C16, C17, C18, C19, C29 7 12 C11 13 C12 14 Description DigiKey Part No. Comment 94x119.4mm, 4 layers MSP-TS430PEU128 4 layers, green solder mask Rev. 1.1 1 green LED, DIODE0805 516-1434-1-ND 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 1-2 (SBW) 3 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2 (AVCC=VCC) 1 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2 Jumper WM4592-ND 5 0R, 0805 541-0.0ATR-ND 2 0R, 0805 541-0.0ATR-ND DNP 1 2.2nF, CSMD0805 490-1628-2-ND DNP 4.7uF, 6.3V, CSMD0805 587-1302-2-ND 1 10uF, 6.3V, CSMD0805 445-1372-2-ND 1 10uF, 6.3V, CSMD0805 445-1372-2-ND DNP C1, C2 2 12pF, CSMD0805 490-5531-2-ND DNP 15 R5 1 47K, 0805 311-47KARTR-ND 16 C4, C5, C6, C7, C8, C15 6 100nF, CSMD0805 311-1245-2-ND 17 C9 1 100nF, CSMD0805 311-1245-2-ND 18 R3, R7 2 330R, 0805 541-330ATR-ND 19 C10, C26 2 470nF, CSMD0805 587-1282-2-ND 20 BOOTST 1 10-pin connector, male, TH HRP10H-ND 21 JTAG 1 14-pin connector, male, TH HRP14H-ND 22 IC1 Socket 1 Socket: IC500-1284-009P 23 IC1 2 MSP430F67791IPEU 24 J5 1 3-pin header, male, TH 25 Q1 1 Crystal: MS3V-T1R 32.768kHz 12.5pF ±20ppm DNP: Crystal enclosed with kit. Keep vias free of solder 26 TP1, TP2 2 Test point DNP, keep vias free of solder 27 J2,J4 2 28 J2,J4 2 29 J1, J3 2 30 J1, J3 2 31 Rubber feet 4 DNP DNP, keep vias free of solder Manuf. Yamaichi DNP: enclosed with kit. Is supplied by TI SAM1035-03-ND 26-pin header, TH SAM1029-26-ND DNP: Headers enclosed with kit. Keep vias free of solder. 26-pin receptable, TH SAM1213-26-ND DNP: Receptacles enclosed with kit. Keep vias free of solder. 38-pin header, TH SAM1029-38-ND DNP: Headers enclosed with kit. Keep vias free of solder. 38-pin receptable, TH SAM1213-38-ND DNP: Receptacles enclosed with kit. Keep vias free of solder. Rubber feet Buerklin: 20H1724 apply to bottom side corners SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 125 (May be addedclose to therespective pins to reduce emissions at 5GHz tole vel required byETSI) Power Management VCC01 = external VCC = DVCC = AVDD_RF / AVCC_RF = AVCC Copyright © 2009–2012, Texas Instruments Incorporated Vdd Vdda1 Vdda2 Port connectors CON1 .. CON3 = Port1 .. Port3 of cc430 CON4 = spare CON5 = 1: XIN 2: XOUT CON6 = Vdd, GND, Vcore, COM0, LCDCAP CON7 = Vdda1, Vdda2, GND, AGND CON8 = JTAG_BASE (JTAG Port) CON9 = Vdd, GND, AGND SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Hardware 126 www.ti.com EM430F5137RF900 B.31 EM430F5137RF900 Figure B-61. EM430F5137RF900 Target board, Schematic EM430F5137RF900 www.ti.com JTAG connector Jumper JP2 Close EXT for external supply Close INT for JTAG supply Open to measure current jumper JP3 External power connector CON12 Jumper JP1 Spy-Bi-Wire mode VCC GND GND Jumper JP1 Close JTAG position to debug in JTAG mode Open to disconnect LEDs jumper JP5/JP10 LED D2 (red) connected to P3.6 via JP10 Close SBW position to debug in Spy-Bi-Wire mode Push-button S2 connected to P1.7 LED D1 (green) connected to P1.0 via JP5 Footprint for 32kHz crystal Use 0Ω resistor for R431/R441 to make XIN/XOUT available on connector port5 RF - Crystal Q1 26 MHz Reset button S1 RF - Signal SMA Figure B-62. EM430F5137RF900 Target board, PCB The battery pack that is included with the EM430F5137RF900 kit may be connected to CON12. Ensure correct battery insertion regarding the polarity as indicated in battery holder. SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 127 EM430F5137RF900 www.ti.com Table B-33. EM430F5137RF900 Bill of Materials Item Reference No. per Board 1 Q1 1 ( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P, 26MHz 26M 2 C1-C5, C082, C222, C271, C281, C311, C321, C341, C412, C452 14 CAPACITOR, SMT, 0402, CER, 16V, 10%, 0.1uF 3 C071 1 CAPACITOR, SMT, 0603, CERAMIC, 0.47uF, 16V, 10%, X5R 4 R401 1 RES0402, 47.0K 5 CON11 1 HEADER, THU, MALE, 14P, 2X7, 25.4x9.2x9.45mm 09 18 514 6323 HARTING 6 CON10 0 HEADER, THU, MALE, 10P, 2X5, 20.32x9.2x9.45mm 09 18 510 6323 HARTING 7 D1 1 LED, SMT, 0603, GREEN, 2.1V active APT1608MGC KINGBRIGHT 8 D2 1 LED, SMT, 0603, RED, 2.0V active APT1608EC KINGBRIGHT MS1V-T1K (UN) MICRO CRYSTAL 22-03-5035 MOLEX Description Value Manufacturer's Part Number Manufacturer ASX-531(CS) AKER ELECTRONIC 0.1uF 0402YC104KAT2A AVX 0.47uF 0603YD474KAT2A AVX 47kΩ CRCW04024702F10 DALE 0 9 Q3 0 UNINSTALLED CRYSTAL, SMT, 3P, MS1V (Customer Supply) 10 CON12 1 HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm 11 C251, C261 2 50V, 5%, 27pF 27pF GRM36COG270J50 MURATA 12 L341 1 FERRITE, SMT, 0402, 1.0kΩ, 250mA 1kΩ BLM15HG102SN1D MURATA 32.768k 13 C293 1 CAPACITOR, SMT, 0402, CERAMIC, 100pF, 50V, 0.25pF, C0G(NP0) 14 L304 1 INDUCTOR, SMT, 0402, 2.2nH, 0.1nH, 220mA, 500MHz 0.0022uH LQP15MN2N2B02 MURATA 15 L303, L305 2 INDUCTOR, SMT, 0402, 15nH, 2%, 450mA, 250MHz 0.015uH LQW15AN15NG00 MURATA 16 L292, L302 2 INDUCTOR, SMT, 0402, 18nH, 2%, 370mA, 250MHz 0.018uH LQW15AN18NG00 MURATA 17 C291 1 CAPACITOR, SMT, 0402, CERAMIC, 1pF, 50V, 0.05pF, C0G(NP0) 1pF GRM1555C1H1R0W MURATA Z01 18 C303 1 CAPACITOR, SMT, 0402, CERAMIC, 8.2pF, 50V, 0.05pF, C0G(NP0) 8.2pF GRM1555C1H8R2W MURATA Z01 19 C292, C301C302, C304 4 CAPACITOR, SMT, 0402, CERAMIC, 1.5pF, 50V, 0.05pF, C0G(NP0) 1.5pF GRM1555C1H1R5W MURATA Z01 20 L291, L301 2 INDUCTOR, SMT, 0402, 12nH, 2%, 500mA, 250MHz 21 C282, C312, C351, C361, C371 5 22 L1 23 100pF DNP DNP GRM1555C1H101JZ MURATA 01 0.012uH LQW15AN12NG00 MURATA CAPACITOR, SMT, 0402, CERAMIC, 2pF, 50V, 0.1pF, C0G 2.0pF GRM1555C1H2R0B Z01 Murata 1 INDUCTOR, SMT, 0402, 6.2nH, 0.1nH, 130mA, 500MHz 6.2nH LQP15MN6N2B02 Murata S1-S2 2 ULTRA-SMALL TACTILE SWITCH, SMT, 2P, SPST-NO, 1.2x3x2.5mm, 0.05A, 12V B3U-1000P OMRON 24 R4-R5, R051, R061, R431, R441 0 UNINSTALLED RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%, 1/16W 0Ω ERJ-2GE0R00X PANASONIC 24a R7 1 RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%, 1/16W 0Ω ERJ-2GE0R00X PANASONIC 25 R2-R3, R6 3 RESISTOR, SMT, 0402, THICK FILM, 5%, 1/16W, 330 330Ω ERJ-2GEJ331 PANASONIC 26 C431, C441 0 CAPACITOR, SMT, 0402, CER, 12pF, 50V, 5%, NPO 12pF ECJ-0EC1H120J PANASONIC 27 C401 1 CAPACITOR, SMT, 0402, CER, 2200pF, 50V, 10%, X7R 0.0022uF ECJ-0EB1H222K PANASONIC 28 R331 1 RESISTOR, SMT, THICK FILM, 56K, 1/16W, 5% 56kΩ ERJ-2GEJ563 PANASONIC 29 C081, C221, C411, C451 4 CAPACITOR, SMT, 0603, CERAMIC, 10uF, 6.3V, 20%, X5R 10uF ECJ-1VB0J106M PANASONIC 128 Hardware Comment DNP SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated EM430F5137RF900 www.ti.com Table B-33. EM430F5137RF900 Bill of Materials (continued) Item Reference No. per Board 30 R1 1 RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%, 1/16W 0Ω ERJ-2GE0R00X PANASONIC 31 C041 0 UNINSTALLED CAP CERAMIC 4.7UF 6.3V X5R 0603 4.7uF ECJ-1VB0J475K Panasonic 32 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER 33 Q2 0 Crystal, SMT, 32.768 kHz MS3V-T1R Micro Crystal U1 1 DUT, SMT, PQFP, RGZ-48, 0.5mmLS, 7.15x7.15x1mm, THRM.PAD CC430F52x1 TI 35 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH 36 CON1-CON9 0 Pin Connector 2x4pin 61300821121 WUERTH 37 JP2 1 Pin Connector 1x3pin 61300311121 WUERTH 38 JP3, JP5, JP10 3 Pin Connector 1x2pin 61300211121 WUERTH 38a JP7, CON13 0 Pin Connector 1x2pin 61300211121 WUERTH DNP 39 JP4 1 Pin Connector 2x2pin 61300421121 WUERTH DNP 40 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH 34 Description Value 32.768k Manufacturer's Part Number SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Manufacturer Comment DNP DNP DNP Hardware 129 (May beaddedclose to therespective pins to reduce emissions at 5GHz to el vel required by ETSI) Power Management VCC01 = external VCC = AVCC = AVDD_RF / AVCC_RF = DVCC Vdda1 Copyright © 2009–2012, Texas Instruments Incorporated Vdd Vdda2 Port connectors CON1 .. CON5 = Port1 .. Port5 of cc430 CON6 = Vdd, GND, Vcore, COM0, LCDCAP CON7 = Vdda1, Vdda2, GND, AGND CON8 = JTAG_BASE (JTAG Port) CON9 = Vdd, GND, AGND SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Hardware 130 www.ti.com EM430F6137RF900 B.32 EM430F6137RF900 Figure B-63. EM430F6137RF900 Target board, Schematic EM430F6137RF900 www.ti.com JTAG connector Jumper JP2 Close EXT for external supply Close INT for JTAG supply Open to measure current jumper JP3 External power connector CON12 Jumper JP1 Spy-Bi-Wire mode VCC GND GND Jumper JP1 Close JTAG position to debug in JTAG mode Open to disconnect LEDs jumper JP5/JP10 LED D2 (red) connected to P3.6 via JP10 Close SBW position to debug in Spy-Bi-Wire mode Push-button S2 connected to P1.7 LED D1 (green) connected to P1.0 via JP5 Footprint for 32kHz crystal Use 0Ω resistor for R541/R551 to makeP5.0/P5.1 available on connector port5 RF - Crystal Q1 26 MHz Reset button S1 C392 C422 L451 RF - Signal SMA Figure B-64. EM430F6137RF900 Target board, PCB The battery pack that is included with the EM430F6137RF900 kit may be connected to CON12. Ensure correct battery insertion regarding the polarity as indicated in battery holder. SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 131 EM430F6137RF900 www.ti.com Table B-34. EM430F6137RF900 Bill of Materials Pos. Ref Des No. per Board 1 Q1 1 ( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P, 26MHz ASX-531(CS) AKER ELECTRONIC 2 C1-C5, C112, C252, C381, C391, C421, C431, C451, C522, C562 14 CAPACITOR, SMT, 0402, CER, 16V, 10%, 0.1uF 0402YC104KAT2A AVX 3 C101 1 CAPACITOR, SMT, 0603, CERAMIC, 0.47uF, 0603YD474KAT2A 16V, 10%, X5R AVX 4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE 09 18 514 6323 HARTING Description Part No. Manufacturer 5 CON11 1 HEADER, THU, MALE, 14P, 2X7, 25.4x9.2x9.45mm, 90deg 7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT 8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT 22-03-5035 MOLEX 10 CON12 1 HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm 11 C361, C371 2 50V, ±5%, 27pF GRM36COG270J50 MURATA 12 L451 1 FERRITE, SMT, 0402, 1.0kΩ, 250mA BLM15HG102SN1D MURATA GRM1555C1H101JZ01 MURATA 13 C403 1 CAPACITOR, SMT, 0402, CERAMIC, 100pF, 50V, ±0.25pF, C0G(NP0) 14 L414 1 INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH, 1000mA, 250MHz LQW15AN2N2C10 MURATA 15 L413, L415 2 INDUCTOR, SMT, 0402, 15nH, ±5%, 460mA, LQW15AN15NJ00 250MHz MURATA 16 L402, L412 2 INDUCTOR, SMT, 0402, 18nH, ±5%, 370mA, LQW15AN18NJ00 250MHz MURATA 17 C401 1 CAPACITOR, SMT, 0402, CER, 1pF, 50V, ±0.25pF, NP0 GJM1555C1H1R0CB01D MURATA 18 C413 1 CAPACITOR, SMT, 0402, CERAMIC, 8.2pF, 50V, ±0.25pF, C0G(NP0) GRM1555C1H8R2CZ01 MURATA 19 C402, C411C412, C414 4 CAPACITOR, SMT, 0402, CERAMIC, 1.5pF, 50V, ±0.25pF, C0G(NP0) GRM1555C1H1R5CZ01 MURATA 20 L401, L411 2 INDUCTOR, SMT, 0402, 12nH, ±5%, 500mA, LQW15AN12NJ00 250MHz MURATA 21 C46-C48, C392, C422 5 CAPACITOR, SMT, 0402, CERAMIC, 2.0pF, 50V, ±0.25pF, C0G(NP0) GRM1555C1H2R0CZ01 Murata 22 L1 1 INDUCTOR, SMT, 0402, 6.2nH, ±0.1nH, 700mA, 250MHz LQW15AN6N2D00 Murata 23 S1-S2 2 ULTRA-SMALL TACTILE SWITCH, SMT, 2P, SPST-NO, 1.2x3x2.5mm, 0.05A, 12V B3U-1000P OMRON 24 R7 1 RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%, 1/16W ERJ-2GE0R00X (UN) PANASONIC 25 R2-R3, R6 3 RESISTOR, SMT, 0402, THICK FILM, 5%, 1/16W, 330 ERJ-2GEJ331 PANASONIC 27 C511 1 CAPACITOR, SMT, 0402, CER, 2200pF, 50V, 10%, X7R ECJ-0EB1H222K PANASONIC 28 C111, C251, C521, C561 4 CAPACITOR, SMT, 0603, CERAMIC, 10uF, 6.3V, 20%, X5R ECJ-1VB0J106M PANASONIC 28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 ECJ-1VB0J475M PANASONIC 29 R441 1 RESISTOR, SMT, THICK FILM, 56K, 1/16W, 1% ERJ-2RKF5602 PANASONIC 30 R1 1 RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%, 1/16W ERJ-2GE0R00X PANASONIC 31 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER 132 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated EM430F6137RF900 www.ti.com Table B-34. EM430F6137RF900 Bill of Materials (continued) Pos. Ref Des No. per Board 33 U1 1 DUT, SMT, PQFP, RGC-64, 0.5mmLS, 9.15x9.15x1mm, THRM.PAD CC430F6137 TI 34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH Description Part No. Manufacturer 35 JP2 1 Pin Connector 1x3pin 61300311121 WUERTH 36a JP3, JP5, JP10 3 Pin Connector 1x2pin 61300211121 WUERTH 38 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 133 EM430F6147RF900 www.ti.com B.33 EM430F6147RF900 Figure B-65. EM430F6147RF900 Target Board, Schematic 134 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated EM430F6147RF900 www.ti.com Figure B-66. EM430F6147RF900 Target Board, PCB The battery pack which comes with the EM430F6147RF900 kit may be connected to CON12. Ensure correct battery insertion regarding the polarity as indicated in battery holder. SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 135 EM430F6147RF900 www.ti.com Table B-35. EM430F6147RF900 Bill of Materials Pos. Ref Des No. per Board 1 Q1 1 ( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P, 26MHz ASX-531(CS) AKER ELECTRONIC 2 C1-5 C112 C252 C381 C391 C421 C431 C451 C522 C562 14 CAPACITOR, SMT, 0402, CER, 16V, 10%, 0.1uF 0402YC104KAT2A AVX 3 C101 1 CAPACITOR, SMT, 0603, CERAMIC, 0.47uF, 0603YD474KAT2A 16V, 10%, X5R AVX 4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE 09 18 514 6323 HARTING Description Part No. Manufacturer 5 CON11 1 HEADER, THU, MALE, 14P, 2X7, 25.4x9.2x9.45mm, 90deg 7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT 8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT 22-03-5035 MOLEX 10 CON12 1 HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm 11 C361, C371 2 50V, ±5%, 27pF GRM36COG270J50 MURATA 12 L451 1 Inductor, SMD, 0402, 12nH, 5%, 370mA LQW15AN12NJ00 MURATA GRM1555C1H101JZ01 MURATA 13 C403 1 CAPACITOR, SMT, 0402, CERAMIC, 100pF, 50V, ±0.25pF, C0G(NP0) 14 L414 1 INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH, 1000mA, 250MHz LQW15AN2N2C10 MURATA 15 L413 1 Inductor, SMD, 0402, 15nH, 5%, 370mA, 250MHz LQW15AN15NJ00 MURATA 15 L415 1 INDUCTOR,SMT,0402,15nH,±5%,460mA,250 LQW15AN15NJ00 MHz MURATA 16 L402, L412 2 Inductor, SMD, 0402, 18nH, 5%, 460mA, 250MHz LQW15AN18NJ00 MURATA 17 C401 1 CAPACITOR, SMT, 0402, CER, 1pF, 50V, ±0.25pF, NP0 GJM1555C1H1R0CB01D MURATA 18 C413 1 CAPACITOR, SMT, 0402, CERAMIC, 8.2pF, 50V, ±0.25pF, C0G(NP0) GRM1555C1H8R2CZ01 MURATA 19 C402, C411C412, C414 4 CAPACITOR, SMT, 0402, CERAMIC, 1.5pF, 50V, ±0.25pF, C0G(NP0) GRM1555C1H1R5CZ01 MURATA 20 L1, L401, L411 3 INDUCTOR, SMT, 0402, 12nH, ±5%, 500mA, LQW15AN12NJ00 250MHz MURATA 21 C46-C48, C392 4 CAPACITOR, SMT, 0402, CERAMIC, 2.0pF, 50V, ±0.25pF, C0G(NP0) GRM1555C1H2R0CZ01 MURATA 22 L2 1 Inductor, SMD, 0805, 2.2uH, 20%, 600mA, 50MHz LQM21PN2R2MC0 MURATA 23 S1-S2 2 ULTRA-SMALL TACTILE SWITCH, SMT, 2P, SPST-NO, 1.2x3x2.5mm, 0.05A, 12V B3U-1000P OMRON 24 R1, R7, R551, R554 4 RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%, 1/16W ERJ-2GE0R00X (UN) PANASONIC 25 R2-R3, R6 3 RESISTOR, SMT, 0402, THICK FILM, 5%, 1/16W, 330 ERJ-2GEJ331 PANASONIC 27 C511 1 CAPACITOR, SMT, 0402, CER, 2200pF, 50V, 10%, X7R ECJ-0EB1H222K PANASONIC 28 C111, C251, C521, C561 4 CAPACITOR, SMT, 0603, CERAMIC, 1uF, 6.3V, 20%, X5R ECJ-1VB0J105K PANASONIC 28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 ECJ-1VB0J475M PANASONIC ERJ-2RKF5602 PANASONIC 32K10A-40ML5 ROSENBERGER 29 R441 1 RESISTOR, SMT, THICK FILM, 56K, 1/16W, 1% 30 X1 1 SMA STRIGHT JACK, SMT 136 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated EM430F6147RF900 www.ti.com Table B-35. EM430F6147RF900 Bill of Materials (continued) Pos. Ref Des No. per Board 31 U1 1 DUT, SMT, PQFP, RGC-64, 0.5mmLS, 9.15x9.15x1mm, THRM.PAD CC430F6147 TI 33 U2 1 IC, Step Down Converter with Bypass Mode for Low Power Wireless TPS62370 TI 34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH 35 JP2, JP6, JP8 3 Pin Connector 1x3pin 61300311121 WUERTH 36a JP3, JP5, JP9, JP10 4 Pin Connector 1x2pin 61300211121 WUERTH 38 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH 38 C7 1 Capacitor, Ceramic, 1206, 16V, X5R, 20% GRM31CR61C226ME15L MURATA 38 C8-9 2 CAP, SMD, Ceramic, 0402, 2.2uF, X5R GRM155R60J225ME15D MURATA 1 CAP, SMD, Ceramic, 0603, 4.7uF, 16V, 10%, X5R 38 C041 Description Part No. SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Manufacturer MURATA Hardware 137 MSP-FET430PIF www.ti.com B.34 MSP-FET430PIF Figure B-67. MSP-FET430PIF FET Interface Module, Schematic 138 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-FET430PIF www.ti.com Figure B-68. MSP-FET430PIF FET Interface Module, PCB SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 139 MSP-FET430UIF www.ti.com B.35 MSP-FET430UIF Figure B-69. MSP-FET430UIF USB Interface, Schematic (1 of 4) 140 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-FET430UIF www.ti.com Figure B-70. MSP-FET430UIF USB Interface, Schematic (2 of 4) SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 141 MSP-FET430UIF www.ti.com Figure B-71. MSP-FET430UIF USB Interface, Schematic (3 of 4) 142 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-FET430UIF www.ti.com Figure B-72. MSP-FET430UIF USB Interface, Schematic (4 of 4) SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 143 MSP-FET430UIF www.ti.com Figure B-73. MSP-FET430UIF USB Interface, PCB 144 Hardware SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated MSP-FET430UIF www.ti.com B.35.1 MSP-FET430UIF Revision History Revision 1.3 • Initial released hardware version Assembly change on 1.3 (May 2005) • R29, R51, R42, R21, R22, R74: value changed from 330R to 100R Changes 1.3 to 1.4 (Aug 2005) • J5: VBUS and RESET additionally connected • R29, R51, R42, R21, R22, R74: value changed from 330R to 100R • U1, U7: F1612 can reset TUSB3410; R44 = 0R added • TARGET-CON.: pins 6, 10, 12, 13, 14 disconnected from GND • Firmware-upgrade option through BSL: R49, R52, R53, R54 added; R49, R52 are currently DNP • Pullups on TCK and TMS: R78, R79 added • U2: Changed from SN74LVC1G125DBV to SN74LVC1G07DBV NOTE: Using a locally powered target board with hardware revision 1.4 Using an MSP-FET430UIF interface hardware revision 1.4 with populated R62 in conjunction with a locally powered target board is not possible. In this case, the target device RESET signal is pulled down by the FET tool. It is recommended to remove R62 to eliminate this restriction. This component is located close to the 14-pin connector on the MSP-FET430UIF PCB. See the schematic and PCB drawings in this document for the exact location of this component. Assembly change on 1.4 (January 2006) • R62: not populated SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware 145 Appendix C SLAU278K – May 2009 – Revised October 2012 Hardware Installation Guide This section describes the hardware installation process of the following USB debug interfaces on a PC running Windows XP: • MSP-FET430UIF • eZ430-F2013 • eZ430-RF2500 • eZ430-Chronos • eZ430-RF2780 • eZ430-RF2560 • MSP-WDSxx "Metawatch" • LaunchPad (MSP-EXP430G2) • MSP-EXP430FR5739 • MSP-EXP430F5529 The installation procedure for other supported versions of Windows is very similar and, therefore, not shown here. Topic C.1 146 ........................................................................................................................... Hardware Installation Hardware Installation Guide Page ....................................................................................... 147 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware Installation www.ti.com C.1 Hardware Installation Table C-1 shows the USB VIDs and PIDs used in MSP430 tools. Table C-1. USB VIDs and PIDs Used in MSP430 Tools USB VID USB PID INF File Name eZ430-F2013 Tool 0x0451 0xF430 usbuart3410.inf eZ430-RF2500 0x0451 0xF432 430CDC.inf eZ430-RF2780 0x0451 0xF432 430CDC.inf eZ430-RF2560 0x0451 0xF432 430CDC.inf MSP-WDSxx "Metawatch" 0x0451 0xF432 430CDC.inf eZ430-Chronos 0x0451 0xF432 430CDC.inf MSP-FET430UIF (1) 0x2047 0x0010 msp430tools.inf LaunchPad (MSP-EXP430G2) 0x0451 0xF432 430CDC.inf MSP-EXP430FR5739 0x0451 0xF432 430CDC.inf MSP-EXP430F5529 0x0451 0xF432 430CDC.inf (1) The older MSP-FET430UIF used with IAR versions before v5.20.x and CCS versions before v5.1 has VID 0x0451 and PID 0xF430. With the firmware update, it is updated to the 0x2047 and 0x0010, respectively. 1. Before connecting of the USB Debug Interface with a USB cable to a USB port of the PC the one of IDEs (CCS or IAR) should be installed. The IDE installation isntalls also drivers for USB Debug Interfaces without user interaction. After IDE installation the USB Debug Interface can be connected and will be ready to work within few seconds. 2. The driver can be also installed manually. After plug in the USB Debug Interface to USB port of the PC the Hardware Wizard starts automatically and opens the "Found New Hardware Wizard" window. 3. Select "Install from a list or specific location (Advanced)" (see Figure C-1). Figure C-1. Windows XP Hardware Wizard SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware Installation Guide 147 Hardware Installation www.ti.com 4. Browse to the folder where the driver information files are located (see Figure C-2). For CCS, the default folder is: c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_CDC, or c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_FET_XP_XX, or c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_eZ-RF depending of firmware version of the tool. For IAR Embedded Workbench, the default folder is: <Installation Root>\Embedded Workbench x.x\ 430\drivers\TIUSBFET\eZ430-UART, or <Installation Root>\Embedded Workbench x.x\ 430\drivers\<Win_OS>. Figure C-2. Windows XP Driver Location Selection Folder 5. The Wizard generates a message that an appropriate driver has been found. 148 Hardware Installation Guide SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware Installation www.ti.com 6. The wizard installs the driver files. 7. The wizard shows a message that it has finished the installation of the software USB Debug Interface. 8. The USB debug interface is installed and ready to use. The Device Manager lists a new entry as shown in Figure C-3, Figure C-4, or Figure C-5. Figure C-3. Device Manager Using USB Debug Interface using VID/PID 0x2047/0x0010 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware Installation Guide 149 Hardware Installation www.ti.com Figure C-4. Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF430 150 Hardware Installation Guide SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware Installation www.ti.com Figure C-5. Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF432 SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Hardware Installation Guide 151 Document Revision History www.ti.com Document Revision History Version SLAU278 Changes Initial release SLAU278A Updated USB driver installation according to CCE v3.1 SR1 and CCS v4. SLAU278B Added information about MSP-FET430U80USB, MSP-TS430PN80USB, and eZ430-Chronos. SLAU278C Added bills of materials and updated some PCBs in Appendix B. Added information about MSP-TS430DA38, MSP-TS430DL48, MSP-TS430PW14, MSP-TS430PW28. SLAU278D Added information about MSP-TS430L092, MSP-TS430RSB40, MSP-TS430RGC64USB, MSP-TS430PZ100USB, MSPFET430F5137RF900 SLAU278E Added jumper information for MSP-TS430L092 PCBs to Appendix B. Added new supported devices in Chapter 1. SLAU278F Added information about MSP-TS430PW24, MSP-TS430PW28A, MSP-TS430RHA40A, MSP-TS430RGZ48B, MSPTS430RGC64B, MSP-TS430PN80A, and MSP-TS430PZ100B. Updated MSP-TS430RSB40 schematics SLAU278G Added information for MSP-TS430PZ100C SLAU278H Added information for MSP-TS430D8 and MSP-TS430RGC64C SLAU278I Updated Table 1-1. Replaced Figure 2-2. Added Figure 2-3. Replaced Figure B-37 and Figure B-67. Added Table C-1. Editorial changes throughout. SLAU278J Added EM430F6147RF900 Section B.33. SLAU278K Added battery pack connection information to all EM430Fx1x7RF900 kits. Added information for MSP-TS430RGZ48C and MSP-TS430PEU128. Updated Figure B-38. NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 152 Revision History SLAU278K – May 2009 – Revised October 2012 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated RF EMISSION TESTING All MSP-TS430xxx kits and kits listed below have been tested for compliance with Part 15 of the FCC and Canadian ICES-003 rules. See REGULATORY COMPLIANCE INFORMATION for details on compliance with these rules. All other kits described in this document either have not been tested or have the statement in their documentation, which is listed in Related Documentation From Texas Instruments. MSP-FET430UIF EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions: The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES. Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety programs, please visit www.ti.com/esh or contact TI. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. REGULATORY COMPLIANCE INFORMATION As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal Communications Commission (FCC) and Industry Canada (IC) rules. For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference. General Statement for EVMs including a radio User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization. For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant Caution This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. For EVMs annotated as IC – INDUSTRY CANADA Compliant This Class A or B digital apparatus complies with Canadian ICES-003. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Concerning EVMs including radio transmitters This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concerning EVMs including detachable antennas Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada. Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de l'utilisateur pour actionner l'équipement. Concernant les EVMs avec appareils radio Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER 【Important Notice for Users of this Product in Japan】 】 This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product: 1. 2. 3. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this product, or Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan. Texas Instruments Japan Limited (address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan http://www.tij.co.jp 【ご使用にあたっての注】 本開発キットは技術基準適合証明を受けておりません。 本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・インスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル http://www.tij.co.jp SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER EVALUATION BOARD/KIT/MODULE (EVM) WARNINGS, RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end product. Your Sole Responsibility and Risk. You acknowledge, represent and agree that: 1. 2. 3. 4. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees, affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates, contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even if the EVM should fail to perform as described or expected. You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials. Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use these EVMs. Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected. Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. 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