CE 3100
Electrically Conductive Adhesive For Solder Replacement
With Superior Contact Resistance
Key Feature
Stable electrical
conductivity
Screen or stencil
print
Cures through solder
reflow
Lead free
Benefit
Reliable SMD
assemblies on all
traditional printed
circuit board metal
finishes
Fine-pitch printing
capability
Compatible with
existing SMT
assembly lines
No lead, lead
reclamation, or flux
residue cleaning
required
Product Description :
CE 3100 is a one component, thermosetting,
electrically conductive adhesive that is a lead-free
alternative to solder for surface mount device (SMD)
interconnect formation. CE 3100 will cure completely
following a typical eutectic solder reflow cycle, with
no postcure required. CE 3100 can run on existing
SMT lines – no new equipment is needed.
CE 3100 uses new, propriatary oxide-reducing
technology to provide breakthrough electrical junction
stability and reliability on all common metal
solderable surface finishes. CE 3100 also provides
fine-pitch capability using standard SMT solder-paste
screen and stencil print equipment. This material’s
lower surface tension versus solder means no
bridging on fine-pitch assembly patterns. CE 3100
cures completely in a typical solder eutectic reflow
cycle, with no postcure needed. As a result, CE 3100
is highly compatible with existing SMT assembly
processes.
This breakthrough product allows for an
environmentally favourable and simplified SMT
process by eliminating lead, lead reclamation, solder
paste residues, flux residue cleaning, and high
temperature reflow cycles.
CE 3100 is intrinsically clean. This means no
significant VOC’s, no residuals and high SIR. The
low Coefficient of Thermal Expansion (CTE) of CE
3100 results in exceptional thermomechanical
junction reliability versus solder.
Applications :
CE 3100 adhesive is capable of fine pitch resolution
(500 µm) when printed using either a stainless steel
mesh screen or a metal mask stencil. It is also
syringe dispensable. This exceptionally stable
adhesive may be used with thick film and all
traditional printed circuit board metallisations.
Instructions For Use :
Thoroughly read the information concerning health
and safety contained in this bulletin before using.
Observe all precautionary statements that appear on
the product label and/or contained in individual
Material Safety Data Sheets (MSDS).
.
When CE 3100 is stored at low temperatures, it must
be allowed to return to room temperature before use.
Please refer to the “Cure Schedule” below.
Technical Data
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CE 3100
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Properties Of Uncured Material :
Property
Chemistry
Appearance
Brookfield Cone and Plate Viscosity
Test Method
Unit
Visual
5 rpm # CP-51
Shear Thinning
Pa.s
NA
Typical Value
Epoxy
Silver paste
30 – 75
2,5
Cure Schedule :
CE 3100 may be cured in a reflow oven, with a
typical reflow cycle or lower temperature modified
cycle. Alternatively, it may also be cured in a
convection oven. Because the CE 3100 solder
alternative material cures completely during a typical
reflow cycle, no postcure operation is required.
Recommended
Cure Condition
Cure Condition
Cure Option 1
Cure Option 2
Cure
Temperature (°C)
150
130
150
Cure Time
(min)
Oven
3
6
10
Reflow
Reflow
Convection
Properties Of Material After Application :
Property
Glass Transition Temperature (Tg)
Coefficient Of Linear Thermal Expansion (CTE)
Below Tg
Above Tg
Volume Resistivity At 25°C
Modulus
At 25°C
At 150°C
Extractable Ionic Content
Chloride
Sodium
Potassium
Tensile Lap Shear Strength
Europe
Nijverheidsstraat 7
B-2260 Westerlo
Belgium
% +(32)-(0) 14 57 56 11
Fax: +(32)-(0) 14 58 55 30
Test Method
TMA
(10°C / min)
TMA
(10°C / min)
ASTM-D-257
DMA
(3°C / min ;
1 Hz Frequency ;
40 µ Amplitude)
TP-91
ASTM-D-1002
North America
46 Manning Road
Billerica, MA 01821
% 800-832-4929
% (978) 436-9700
Fax: (978) 436-9701
Unit
Typical Value
°C
69
ppm
ppm
Ohm.cm
51
148
0,0001
GPa
GPa
6,3
0,2
ppm
ppm
ppm
MPa
79,0
<1
none detected
7
Asia-Pacific
100 Kaneda, Atsugi-shi
Kanagawa-ken, 243-0807
Japan
% (81) 462-258-880
Fax: (81) 462-221-347
NATIONAL STARCH MAKES NO REPRESENTATIONS OR WARRANTIES, EXPRESS OR IMPLIED, CONCERNING THE SUITABILITY OF THESE MATERIALS FOR USE IN IMPLANTATION IN THE HUMAN BODY, OR FOR ANY
OTHER USE. These materials are not designed or manufactured for use in implantation in the human body. National Starch has not performed clinical testing of these materials for implantation. National Starch has neither sought,
nor received, approval from the FDA for the use of these materials in implantation in the human body. No representative of ours has any authority to waive or change the foregoing provisions but, subject to such provisions, our
engineers are available to assist purchasers in adapting our products to their needs and to the circumstances prevailing in their business. Nothing contained herein shall be construed to imply the non-existence of any relevant
patents or to constitute a permission, inducement or recommendation to practice any invention covered by any patent, without authority from the owner of this patent. We also expect purchasers to use our products in accordance
with the guiding principles of the Chemical Manufacturers Association’s Responsible Care program.
© 2000 National Starch & Chemical Company
CE 3100
Electrically Conductive Adhesive For Solder Replacement
With Superior Contact Resistance
Performance And Reliability Data :
Property
Contact Resistance On :
Tin/Lead
Initial And After
85% RH/85°C
Contact Resistance On :
OSP Coated Copper
Initial And After
85% RH/85°C
Contact Resistance On :
Tin
Test Method
Unit
Typical Value
6 Mil Print On Daisy Chain
Pattern Without Resistors
Ohm
Initial : 0,1261 Chain average
0,0063 Individual pad
% Change From Initial
Reading
Ohm
@ 500 h : -5
@ 1000 h : 6
Initial : 0,0708 Chain average
0,0035 Individual pad
% Change From Initial
Reading
Ohm
@ 500 h : -11
@ 1000 h : -4
Initial : 1,0324 Chain average
0,0516 Individual pad
% Change From Initial
Reading
@ 500 h : -64
@ 1000 h : -78
6 Mil Print On Daisy Chain
Pattern Without Resistors
6 Mil Print On Daisy Chain
Pattern Without Resistors
Initial And After
85% RH/85°C
Storage And Handling :
The shelf life of CE 3100 is 12 months at –40°C or 6
months at –10°C. For best results, store in original,
tightly covered containers. Storage in a cool, clean
and dry area is recommended. Usable shelf life may
vary depending on method of application and storage
conditions.
Storage Temperature
(°C)
-10
-40
Usable Shelf Life
(months)
6
12
Health & Safety :
Attention Specification Writers :
It is recommended to consult the Emerson & Cuming
product literature, including material safety data
sheets, prior to using Emerson & Cuming products.
These may be obtained from your local sales office.
The technical information contained herein is
consistent with the properties of this material but
should not be used in the preparation of
specifications, as it is intended for reference only.
For assistance in preparing specifications, please
contact your local Emerson & Cuming office for
details. Please contact Emerson & Cuming Quality
Assurance for test method details.
(CE 3100 was formerly called AMICON CE 3100)
(AMICON is a registered trademark of The Millipore Corporation)
E08/06/2000-GL
Technical Data
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