HF Electromagnetics 2014
Technology Review
Sean Kim
Technical manager
1
© 2011 ANSYS, Inc.
May 14, 2014
Agenda
• R15 Product update and Installation
• Product update
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SIwave update
HFSS update
Q3D (TPA) update
Designer update
• ANSYS Korea Service introduction
– SDPD Consulting
2
© 2011 ANSYS, Inc.
May 14, 2014
ANSYS Electromagnetics Suite 15.0
One-stop installation
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ANSYS Designer 2014
ANSYS HFSS 2014
ANSYS Maxwell Circuit Editor 2014
ANSYS Maxwell 2014
ANSYS Q3D Extractor 2014
ANSYS Simplorer 2014
ANSYS SIwave 2014
 All Ansoft tools are now located in “ANSYS
Electromagnetics” and “ANSYS
Electromagnetics Suite 15.0” folder.
 Ansoft Links is now part of SIwave
Support OS
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3
© 2011 ANSYS, Inc.
May 14, 2014
Windows XP, 32-bit and 64-bit
Windows 7, 32-bit and 64-bit
Windows 8, 32-bit and 64-bit
Windows server 2012 64-bit
Linux RHEL5.3 and above, 64-bit
Linux SLES 11 SP1 above, 64-bit
15.0 updates and enhancement
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HFSS 3D Layout in Designer
S-parameter data blocks solved natively in
Desinger SOD
3D Component Library
Import External Near-Field Data
Faster field post-processing
GUP support in HFSS Transient
Imporve HPC performance
Add Network Data Explorer utility
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–
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SYZ speed up with HPC distribute methode
SYZ accuracy improved with 3D solve
SYZ accuracy improved with DC point
Q3D solver included and support TPA fuction
in free of charge
HFSS ECAD function, automatic usage of
HFSS Phi mesher
Direct import of Cadence and ODB++ file
Import DXF and GDSII
© 2011 ANSYS, Inc.
May 14, 2014
Designer 2014
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64-bit GUI support
Improved 3D layout funtionalities
Support IBIS-AMI repeaters and redrivers
IBIS 5.1 supported
DDR3 Virtual compliance toolkit
Agilent X-parameter support
Q3D 2014
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SIwave 2014
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4
•
HFSS 2014
Cable design and transmission line design
toolkit support
New Districuited CG solver
Add Non-conducting magnetic core solver
Add Network Data Explorer utility
3D Component Library
Faster field post-processing
Ansoft link, Siwave included
E-CAD translator 8.0
What’s New In This Release
• All products have a PDF in the help menu highlighting the
most important enhancements for the release
5
© 2011 ANSYS, Inc.
May 14, 2014
Siwave update
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© 2011 ANSYS, Inc.
May 14, 2014
SIwave 2014 Highlights
1.
Created SIwave – DC product
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2.
Added Q3D Extractor solves to SIwave GUI
3.
Improved automation for ODB++ & Cadence
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4.
5.
Perform non-graphical import, setup, and DCIR solves
Perform non-graphical import, setup, and SYZ solves
SIwave SYZ speed up using HPC
–
Benchmarked PCB designs that show greater than a 60x speed up versus a single core
Direct import of Cadence Allegro, APD, & SiP
–
7
Includes ECAD translation & SIwave DCIR solver
Specialized product that solves I2R (DC) power distribution problems
For example: File-> Import .brd, .mcm, .sip or drop & drag into SIwave GUI
6.
Added translation support for .DXF & .GDS within SIwave
7.
Improved accuracy by using Adaptively Meshed DC point with AC SYZ
8.
Scheduler support for Windows HPC & Linux LSF clusters
© 2011 ANSYS, Inc.
May 14, 2014
PowerArtist
RedHawk
Totem
Sentinel-TI
RTL
SoC
Analog/IP
Thermal
AC SYZ
DC
ALinks for EDA:
ECAD Translation
Loop Inductance
Plane Resonance
Near/Far Field
Frequency Sweep
Signal Net Analyzer:
Fight Time Calculations
PI Advisor: Decoupling Optimization
8
© 2011 ANSYS, Inc.
May 14, 2014
DesignerSI Circuit:
IBIS, IBIS-AMI, Transient
APDS / SIwave Function Table
Functionality
SIwave – DC
SIwave – PI
SIwave
APDS Basic
APDS-EMI
1. ECAD Import
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2. DC Analysis
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3. Resonance Analysis
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4. PI Advisor
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5. SYZ Analysis
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6. Frequency Sweep Analysis
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7. Near-Field Analysis
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8. Far-Field Analysis
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9. Signal Net Analyzer
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10. SI Circuit & Analysis
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11. Statiscal Eye Analysis
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12. IBIS-AMI Equalizer Analysis
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13. HPC
14. Full 3D EMI analysis
9
© 2011 ANSYS, Inc.
May 14, 2014

ANSYS SIwave v2014.0.2
Siwave-DC
SIwave-PI
SIwave
SIwave
SIwave-PI
SIwave-PI +
User Interface
Translators
DC Analysis
PI Advisor
Signal Net Analyzer
Plane Resonance Analysis
Transient/IBIS Circuit Analysis
HSPICE Schematic integration
IBIS-AMI
S-, Y-, Z- Analysis
HSPICE integration
Near/Far-Field
al4allegro
al4ansoft
al4apd
al4boardstation
al4encore
al4expedition
al4generic
al4powerpcb
al4virtuoso
siwave_level1
al4zuken
al4cadvance
al4cds
al4gem
al4first
al4odb++
DC Solver
SYZ Solver
Plane Resonance Solver
Frequency Sweep Solver
siwave_level2
siwave_pi_adv
Near Field Solver
Far Field Solver
Signal Net Analyzer
10
© 2011 ANSYS, Inc.
May 14, 2014
siwave_level3
Siwave GUI update
11
© 2011 ANSYS, Inc.
May 14, 2014
SIwave with ALinks Desktop
• SIwave with ALinks Desktop
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Modeler Window
• Each window can be Floating or Docking
© 2011 ANSYS, Inc.
May 14, 2014
Supported ECAD Translations
•
Cadence
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Mentor Graphics
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Allegro
APD
SiP Digital/RF
Virtuoso
Expedition
Boardstation
Boardstation XE
PADS
Zuken
– CR5000
– CR5000
– CR8000
•
ODB++
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•
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Altium Designer
Mentor Expedition
Mentor PADS
Zuken Cadstar
Cadence OrCAD
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16.0, 16.1, 16.2, 16.3, 16.5, & 16.6
16.0, 16.1, 16.2, 16.3, 16.5, & 16.6
16.0, 16.1, 16.2, 16.3, 16.5, & 16.6
5.10, 6.14, 6.15, & 6.16 (Linux only)
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v2005, v2007.1 thru EE7.9 (uses HKP design flow)
8.x (uses HKP design flow)
v2007, v2007.1, v2007.2, v2007.3 and v2007.7 (uses HKP design flow)
PowerPCB v5.2a, v2005 and v2007 (ASCII Flow)
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9.x and lower
10 and higher (Zuken translator for .anf & .cmp)
2013 and higher (Zuken translator for .anf & .cmp)
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R10 and greater
EE7.9.1 and greater
9.4 and greater
12.1 and greater
12.1 and greater
DXF & GDS Import capabilities
© 2011 ANSYS, Inc.
May 14, 2014
Siwave with Alinks GUI Controls – Desktop
• 3D Export
1. Identify Power and Ground nets
2. Select Nets you wish to simulate
3. Define Plane Extents
• Automatic
– Simple
– Precise
• Manual
– Draw Polygon
– Draw Rectangle
4. Go to 3D Export -> Preview Clipped PWR/GND
5. Export to HFSS, Q3D Extractor, Designer or
ANSYS Workbench
14
© 2011 ANSYS, Inc.
May 14, 2014
CAD file direct import
Newly added
• DXF
• GDSII
• mcm
• Brd
– When Cadence
PCB direct import :
Cadence CAD
tool(SPB) preinstalled in same
machine.
• ODB++
15
© 2011 ANSYS, Inc.
May 14, 2014
Siwave Solver and accuracy
16
© 2011 ANSYS, Inc.
May 14, 2014
Full-wave Package/Board Positioning
Fast 3D
Hybrid
Arbitrary 3D Electromagnetics
Package
Board + Package
HFSS for ECAD
Sentinel PSI
SIwave
Arbitrary 3D
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Golden Accuracy Simulator
Solves Any 3D geometry
Powerful for Critical Nets
Layout Front-end for HFSS
Any Geometry
Gold Standard Accuracy
17
© 2011 ANSYS, Inc.
May 14, 2014
SPEED
• FAST Hybrid method for PKG/BRD
• Fast FEM using prism elements
• Handles many, but not all 3D effects
• Tailored for PI package analysis
• Complements SIwave for those p
roblems with arbitrary 3D effects
IC Packages
Good Trade-off of Spe
ed With 3D Accuracy
Fast
SI, PI, and EMI hybrid solution
HFSS Solves integration in SIwave
18
© 2011 ANSYS, Inc.
May 14, 2014
Q3D solver integration in Siwave
Can use TPA(Turbo Package Analysis)
function free of chagre
TPA(Turbo Package
Analysis) was
replaced in Siwave
Q3D solver function.
19
© 2011 ANSYS, Inc.
May 14, 2014
3D DDM （Domain Decomposition Module）
• Identify unique 3D regions: Discontinuity of a differential signal
analyzed using the Q3D solver
Q3D CG, DCRL, ACRL Solvers
Cutout boundaries
Region I
Area
1
2 unique regions
to be solved in Q3D
Q3D CG, DCRL, ACRL
Solvers
20
© 2011 ANSYS, Inc.
Region II Region III
May 14, 2014
Are
a2
Q3D CG, DCRL, ACRL
Solvers
Siwave original solver, 3D DDM Explained
Improved AC SYZ Accuracy
• Advanced 3D DDM solver improves accuracy for
– Traces routed across splits, unreferenced traces, poorly
referenced ports, vias & large antipads
HFSS
SIwave DDM Option
Without SIwave DDM
self ind S Plot 1
Ansoft LLC
plane hole 4hfss
0.00
-2.50
S Parameter in db
-5.00
-7.50
-10.00
Unreferenced Traces
Curve Info
-12.50
dB(S(P1,P2))
self ind
dB(S(STRIPLINE_SYMMETRIC_PERFORATED_PLANE_A_0_T1,STRIPLINE_SYMMETRIC_PERFORATED_PLANE_A_0_T2))
Import1
db(S(P1,P2))_1
Imported
-15.00
0.00
10.00
20.00
30.00
Freq [GHz]
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© 2011 ANSYS, Inc.
May 14, 2014
40.00
50.00
Siwave original solver,
Combined AC and DC simulation results
Merging DC point with frequency-swept AC results
SYZ
100
10
10
1
1
0.1
0.01
0.001
0.001
1E-06
0.001
1
Frequency in GHz
10
1
0.1
0.01
0.0001
1E-09
DC IR + SYZ
100
1/Ohm
100
1/Ohm
1/Ohm
DC IR
0.0001
1E-09
0.1
0.01
0.001
1E-06
0.001
Frequency in GHz
1
0.0001
1E-09
1E-06
0.001
Frequency in GHz
Improved accuracy over the entire frequency bandwidth
22
© 2011 ANSYS, Inc.
May 14, 2014
1
Siwave HPC & Etc.
23
© 2011 ANSYS, Inc.
May 14, 2014
Easy SDM (Distributed Frequency Point) Setup
• Different operating modes
– Local machine mode
– Distributed workgroup mode (without scheduler)
– Distributed cluster mode (with scheduler)
• LSF scheduler support
• Windows HPC scheduler support
• Automated Load Sharing to Maximize Speed for
Available Cores &Frequency points
– Distributed frequency points first
– Distribute cores second
– Dynamically adjust based on the load at runtime
2GHz 3GHz 4GHz
1GHz
5GHz 6GHz 7GHz
8GHz 9GHz 10GHz
© 2013 ANSYS, Inc.
24
SIwave HPC Acceleration
Distributed Discrete S-Parameter Sweeps
• Shared and distributed memory operation
Speed up
8
scalability > 90%
6
4
2
0
0
Cores Configuration
Runtime
92hr 39 min
1
1 node
16
1 node
16hr 18min
2
4
6
Number of nodes
8
Speed Up
1x
6x
32
2 nodes
5hr 28min
17x
64
4 nodes,
2hr 50min
33x
128
8 nodes
1hr 31min
61x
© 2013 ANSYS, Inc.
25
Signal net analyzer,
Impedance & Flight Time Calculations
U7.(pin)60
Receiver IC
Driver IC
Void A
Void B
on return current path
on return current path
U1.(pin)25
A digital signal
SNA provides:
1. Zo Profile & Delay
for all paths of a signal.
2. Reflection Noise
through transient analysis.
Zo@ void A
Zo@ void B
Characteristic
Impedance
Characteristic Impedance
Voltage waveform at receiver IC
© 2013 ANSYS, Inc.
26
PI advisor, Investigate Decoupling Capacitors
Capacitor Library Browser
1.
2.
3.
4.
5.
More than 20,000 Cap & Inductor models included
Enables viewing multiple capacitor impedances curves
Calculates parallel impedance of multiple Caps
Enables creation of Customer Defined Libraries
Allows user defined filtering to narrow down capacitor
selection
© 2013 ANSYS, Inc.
27
Create & Solve Circuit Schematics
© 2013 ANSYS, Inc.
28
Siwave Multiphysics
29
© 2011 ANSYS, Inc.
May 14, 2014
DC Results & Analysis
Path Resistance
Initial Mesh
Time & RAM
Path Resistance
Adaptive Passes
Time &
RAM
Voltage Source to
U1 (path)
17.236 mΩ
1 - Pass
11 Seconds
6.7 MB
18.278 mΩ
3 – Adaptive Passes
17 Seconds
8.1 MB
Voltage Source to
U2 (path)
16.850 mΩ
1 - Pass
10 Seconds
6.7 MB
17.870 mΩ
3 – Adaptive Passes
16 Seconds
8.1 MB
Initial
Pass
3 Passes
U1 U2
Vs
© 2013 ANSYS, Inc.
30
Thermal Solutions @ DC with Icepak
Impact of SIwave
&
Icepak Link
DC Power
Consumption
Without Joule Heating
69.3 Watts
With Joule Heating
75.7 Watts
PCI Graphics card …
PCI express spec:
• Max power not to exceed 75 W
‒ Includes dissipation from IC
dies and PCB Joule heating
… card with components
Add Reference
© 2013 ANSYS, Inc.
31
HFSS update
32
© 2011 ANSYS, Inc.
May 14, 2014
HFSS 3D Layout: HFSS 15.0.3
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•
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Layout interface: 3D full-wave electromagnetics with HFSS Included!
Layout interface: Integrated Optimetrics Included!
Layout interface: Integrated Full-Wave Spice Included!
Layout Interface: Integrated Planar EM Solver Included!
Layout Interface: DC S-parameters from Q3D Included!
© 2011 ANSYS, Inc.
May 14, 2014
V2014 HFSS
HFSS
34
High Frequency Structure Simulator for 3D Electromagenetics
HFSS is a platform that includes multiple simulation technologies for component or system design. The
base HFSS offering includes 3D and Layout interfaces, 2.5D Method of Moments, Eigenmode, and
Linear circuit simulation (LNA)
HFSS-IE
3D Integral Equation Solver for HFSS
HFSS-IE is a specialized solver offering IE, Hybrid, and Finite-Element Boundary Integral simulation.
Includes curve-linear mesh elements and supports HPC for solving Electrically Large structures
HFSS-TR
3D Transient Solver for HFSS
A general purpose Finite Element Time-Domain Solver. HFSS-TR offers adaptive meshing, local
time-stepping, arbitrary input signals, Time-Domain Reflectrometry (TDR), and Time-Domain fields.
GPU acceleration with HPC
SI Option
HFSS-TR and Transient Circuit Simulation for HFSS
3D HFSS Transient Solver (HFSS-TR)
Transient circuit simulator, offering Time-Domain, Statistical Eye (QuickEye/VerifEye), and IBIS simulation
Includes HSPICE Integration support.
RF Option
Non-Linear and Transient Circuit Simulation for HFSS
Circuit simulator, offering DC, AC, S-Parameter, Time Domain and Harmonic Balance simulation.
Includes Envelope, Load-pull, Oscillator, and Agilient X-Parameter support.
© 2011 ANSYS, Inc.
May 14, 2014
HFSS Overview
Design Flow Automation
HFSS 3D Layout
External Near Field Data Support
3D Component Library
Network Data Explorer
Advancements in Numerical
Solver Technologies
•
•
•
•
Distributed Direct Matrix Solver
Advanced Meshing for Layout
GPU Support for HFSS Transient
Advanced modeling techniques
High Performance Computing
• Hierarchical HPC
• Distributed solving improvements for
IE/Method of Moments
35
© 2011 ANSYS, Inc.
May 14, 2014
10000
1000
100
10
CPU time in secons
•
•
•
•
Param
1
1
10000
100000
Param
3
Num Tets Phi Mesher
1000000
Param 2
10000000
100000000
HFSS GUI
36
© 2011 ANSYS, Inc.
May 14, 2014
HFSS Accuracy from Layout
• Features for HFSS 3D Layout
– Parametric Layout Editor
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–
37
Stackup – Etch Factor/Layer Offset
Padstacks
Trace parameters
Finite Dielectrics
Hierarchy
Solver
Integrated HFSS solver
Integrated PlanarEM - 2.5D MoM
DC S-parameter from Q3D
Embedded RLC and/or S-Parameters for HFSS
Post-Processing
Network Data Explorer and Full-Wave SPICE
Integration with industry CAD
Cadence, Zuken, Mentor and Altium
© 2011 ANSYS, Inc.
May 14, 2014
HFSS for ECAD. What is it?
•
•
An alternative interface or skin for HFSS
Highly automated for in layout design environment
– Design primitives = traces, pads, bondwires, vias
• Significantly reduce engineering time interacting with software
• Lightweight, easy to use interface for package, PCB or IC designs
created in layout tools
38
© 2011 ANSYS, Inc.
May 14, 2014
Advanced Features in HFSS 3D Layout
•
•
•
•
Embedded Components
DC data point for S-parameters with Q3D solver
Lumped line ports
N port s-parameter blocks
An HFSS Sparse Matrix
39
© 2011 ANSYS, Inc.
May 14, 2014
New Phi Mesher in HFSS 3D Layout
70
60
50
40
30
20
10
0
20-40x faster than classic
1000
10000
100000
1000000
10000
10000000
Number of tets, NlogN scaling
Classic Mesh Size (Num Tets)
1 million tets in 2 minutes
10 million tets is 20 minutes
1000
100
10
40
© 2011 ANSYS, Inc.
May 14, 2014
CPU time in secons
Speed Up
Extremely fast meshing for layered designs
1
10000
100000
1000000
10000000
100000000
Distributed IE with IE Regions
• “IE regions” is the ability to solve a mix of finite elements with
method of moments
FEM solution around body
and cell phone
IE solution on car body
using IE-Regions
• In HFSS 15 all domains (FEM and MoM) could be solved in parallel
– FEM volume could be further divided into sub domains
• In HFSS 2014 MoM domains may be subdivided as well
Total RAM (GB)
Elapsed Time (hours)
– Further parallelization andSolution
speedType
41
© 2011 ANSYS, Inc.
May 14, 2014
FEM w/ DDM
160G
8
Hybrid Solution
11
2.7
Distributed IE with IE Regions, Cont.
151 FEM Domain
60 GB Distributed across 13 IE Domain
Total Ram for all Domain: 288 GB
Simulation done in 4h12mn
- - -16-
36.7M Matrix Unknowns
42
© 2011 ANSYS, Inc.
May 14, 2014
Low Frequency Performance
• HFSS 12: Extended precision
elements for port solution.
Allows lower frequencies to
be solved
• HFSS 13: Surface impedance
at lower frequency. Accounts
for finite size of conductor
• HFSS 14: Logarithmic data at
low frequencies. Also
passivity enforcement for
interpolating sweeps
• HFSS 15: Introduction of
causal basis vectors for
interpolating sweeps data
43
© 2011 ANSYS, Inc.
May 14, 2014
Q3D dashed
HFSS solid
DC region
HF region
Q3D to solve DC point in HFSS for ECAD
•
•
DC point solved by Q3D allows discrete simulations starting at DC point.
HFSS simulations with Q3D DC point can be solved now within Designer.
Q3D to solve DC point
Enforce causality an
d passivity
44
© 2011 ANSYS, Inc.
May 14, 2014
HFSS Simulation can be run
directly from DesignerSI
External Field Data as Source
• Use measured E and/or H field data as radiation source
– Also use fields from other simulations where the IP needs to be
protected
• A ‘near field’ model of the device analogous to a touchstone sparameter model.
Near fields around
PCB with associated
far field radiation
pattern
45
© 2011 ANSYS, Inc.
May 14, 2014
3D Component Library
• 3D Simulation
Components
– User Defined
– Save and reuse
– Share with
partners and
colleagues
• Created from 3D
modeler
• Self-contained
– Geometries
– Material
properties
– Boundary
conditions
– Excitations
46
© 2011 ANSYS, Inc.
May 14, 2014
HFSS HPC
47
© 2011 ANSYS, Inc.
May 14, 2014
V2014 ANSYS Electronics HPC
HFSS
Unified HPC Setup
Enhanced use of multiple cores for 3D Modeling and Fields Post Processing
HPC
High Performance Computing for HFSS
Multi-Threaded Solvers (Enhanced in 2014.0)
Distributed Frequency Solver (Spectral Domain Method)
Multi-Level HPC Setup
Domain Decomposition for Electrically Large Solves
Distributed Direct Matrix Solver
Distributed Excitations for Iterative and Domain Methods
GPU support for HFSS-TR
Optimetrics
Distributed S
olve Option
48
© 2011 ANSYS, Inc.
Integrated Parametric/Optimization Analysis
Includes 2 Distributed Solve Option Tasks
Expand Robust Design capabilities with DesignXplorer
Add-on to Optimetrics
Accelerates Robust Design by running variations in parallel
Supports HPC
May 14, 2014
Distributed Memory Direct Matrix Solver
• Direct Matrix Solver:
– Greatest accuracy with best efficiency for many ports/excitations
• Distributed now provides access to more memory and cores
– Only with ANSYS Electronics HPC
• Example: Trunk Mounted Antenna
–
–
–
–
49
Matrix size: 12M
Memory: 714 GB
Machines: 6 (128 GB)
Time: 3 hours
© 2011 ANSYS, Inc.
May 14, 2014
GPU Support for HFSS Transient
• DGTD (HFSS Transient) and FDTD lend themselves to a
high degree of parallelization
• Now HFSS Transient can leverage GPUs for faster
simulations
Intel X5675 GPU vs. 8
PROJECT
PROJECT
Dipole
small
Dipole large
small
Landmine
Dipole large
Leadframe
Landmine Connector small
Leadfram
LeadframeConnector
Connectorlarge
small
FlipChip
LeadframPackage
Connector large
GSM
Antenna
mixed order
FlipChip
Package
GSM Antenna 1st
order
mixed
order
GSM Antenna 1st order
50
© 2011 ANSYS, Inc.
# Tets Tesla K20c 8Intel
cores
X5675 core
GPU CPU
vs. 8
# Tets Tesla0:03:45
K20c 8 cores
21K
0:08:00 core CPU
1.83
51K
0:08:07
0:19:51
2.42
21K
0:03:45
0:08:00
1.83
32K
0:02:37
0:05:50
2.22
51K
0:08:07
0:19:51
2.42
36K
0:04:43
0:04:31
0.95
32K
0:02:37
0:05:50
2.22
108K
0:03:17
0:07:18
2.22
36K
0:04:43
0:04:31
0.95
39K
0:02:40
0:00:44
0.275
108K
0:03:17
0:07:18
2.22
75K
0:59:43
2:58:41
2.95
39K
0:02:40
0:00:44
0.275
133K
6:34:08
34:18:55
5.21
75K
0:59:43
2:58:41
2.95
133K
6:34:08
34:18:55
5.21
May 14, 2014
Multi-level HPC for Speed and Scale
Level 1
Distributed
Variations
Level 2
Distributed
Memory
51
© 2011 ANSYS, Inc.
May 14, 2014
Hierarchical HPC: Multi-level
• 32 core DDM per variation
•
Helicopter
Launch
from
Ship
Time for
8 variations,
serial:
14:52:57
• 128 core ‘two level’
– Run four variations in parallel
– 3:39:38
• ~4X faster
128 co
res
52
© 2011 ANSYS, Inc.
May 14, 2014
32 cores each
Solving Faster and Bigger HFSS problems with HPC
•HPC products, Electromagnetics HPC and DSO, enable:
Spectral and Domain
Decomposition Method w
HPC
Multi-processing w HPC
Differential S-parameters
Ansoft Corporation
Robust Design w DSO
Curve
Info
Nexxim1
0.00
-10.00
DDM
-20.00
Y1
-30.00
-40.00
-50.00
-60.00
-70.00
-80.00
0.00
53
2.00
4.00
6.00
8.00
10.00
F [GHz]
© 2011 ANSYS, Inc.
12.00
14.00
16.00
18.00
20.00
May 14, 2014
*Distributed Solve Option is a separate license and is not included with HPC
From Release to Release
• Progressive improvements: ~5X speed-up from v12 to v15
• Model: 20 terminal backplane connector, DC to 20 GHz
• 80 core (8X10), matrix multiprocessing plus distributed frequency
points
From v12 to v15
4.6X from
v12 to v15
5.50
5.00
4.50
4.00
3.50
Total Speed
Adaptive Mesh Speed
3.00
Sweep Speed
2.50
2.00
1.50
1.00
12
54
© 2011 ANSYS, Inc.
13
May 14, 2014
14
15
Broadband Sweeps
• Improvements in single
frequency point extraction
• Improvements in parallel
frequency point extraction
• Model: Package on Board.
Large model with complex
frequency response
55
HFSS 14
HFSS 15
Tetrahedra
867,629 (~0.01)
992,171 (~0.007)
Memory
28.7 GB
38.5 GB
8X1 (HPC 8)
72:50:53 (1X)
74:28:25 (0.98, 1)
8X4 (HPC 32)
25:04:40 (2.9X)
19:41:21 (3.7, 3.8)
8X16 (HPC 128)
8:50:08 (8X)
5:47:03 (12.6x, 12.9x)
© 2011 ANSYS, Inc.
May 14, 2014
From days to ho
urs with ANSYS
HPC
HPC vs. MP performance
• Studied a range of models to determine average performance
with HPC
• Faster and more scalable with HPC
56
© 2011 ANSYS, Inc.
May 14, 2014
Large Model Support
• Improved handling of large and
complex geometries
• Multiprocessing in modeler
–
–
–
–
Entity check
Object intersection check
Net identification
Boundary validation 10x to 100x
faster
– Faceting and rendering
Validation Times
6 cores
Faceting times
6 cores
5.5X
3X
3X
2.5X
2X
57
© 2011 ANSYS, Inc.
May 14, 2014
HFSS Network Data Explorer
58
© 2011 ANSYS, Inc.
May 14, 2014
Network Data Explorer (NdE)
Browse…
Macro modeling (Broadband
Export)
Tools > Network
Data Explorer
Parameter
type
SYZ Data [Export]:
• Touchstone Format (*.s*p)• Renormalizations
• S-parameter
• Touchstone Format (*.s*p)
• Overlays and ease of use improvements
• Touchstone2 Format (*.ts) • State space• fitting
• Y-parameter
Neutral
Format
(*.nmf)
algorithm
improvement
• Quick comparison of S,Y Z-parameters,
port
• Citifile (*.cit)
• Z-parameter
• Data
Table
(*.tab)
₋
Tsuk-White
Algorithm
(TWA)
impedance and Gamma
• Neutral Format (*.nmf)
• Port impedance
• MATLAB (*.m)
• Gamma
• Citifile (*.cit)
Matrix entries
• Average
• Minimum
• Maximum
• Standard
Deviation
• Passivity
Format
• Magnitude
• Phase(deg)
• dB
Comparisons
of Fitted Models
• Real
&
• Imaginary
Causality
Checking and Plotting
All parametric
combinations
59
© 2011 ANSYS, Inc.
May 14, 2014
Network Data Explorer
HFSS, Q3D Extractor, & Designer
– Causality & Passivity testing
– Causality & Passivity enforcement
Passivity Testing
When the Curve Magnitude is
≤1 the Model is Passive
Causality Testing
Green = Causal
Red = Non-Causal
Yellow = Inconclusive test (add more frequency points & retest)
60
© 2011 ANSYS, Inc.
May 14, 2014
HFSS Multiphysics
61
© 2011 ANSYS, Inc.
May 14, 2014
Bi-directional Multiphysics:
Thermal to Stress to Electromagnetics
• High performance RF/microwave design often
requires consideration of operating in a multiphysics environment.
• Understanding coupled physics interaction is
essential for an accurate analysis.
• ANSYS offers a comprehensive solution capable
of bi-directional coupled analysis including EM,
thermal, structural mechanics and fluid flow.
62
© 2011 ANSYS, Inc.
May 14, 2014
Q3D update
63
© 2011 ANSYS, Inc.
May 14, 2014
Q3D Performance & Accuracy
Inductance Delta %
Convergence (Delta % vs Pass)
10
9
8
7
6
5
4
3
2
1
0
Release to Release
Improvements
1
2
3
4
5
6
7
8
9
Pass
Q3D
CG
DCRL
ACRL
Q3D
CG
DCRL
ACRL
Q3D
CG
ACRL
v9
7min
16min
4hr 7min
v9
21min
8min
12min
v9
156min
Unsolvable
v2014
3min
11min
10min
v2014
4min
4min
2min
v2014
28min
8hr 45min
© 2013 ANSYS, Inc.
64
Q3D Speed Up with HPC
Q3D Extractor HPC Options
•
RSM
–
–
–
–
•
Windows HPC, LSF, SGE, & PBS
ANSYS Electronics HPC
–
Enables distributing the ACRL, DCRL, & CG
solvers across threads, cores, processors,
and machines
Enables distributing CG nets solvers across
threads, cores, processors, and machines
Enables multi-threading of the ACRL, DCRL
and CG solver per core
ANSYS DSO
–
–
RSM
Drives the HPC and DSO solutions
Supports external schedulers
•
•
Q3D Extractor HPC Flow Chart
DSO
HPC
Distributive
Solvers
Distribute
CG Nets
CG
Distribute
CG Nets
DCRL
Distribute
CG Nets
MT by Core
Sweeps
Design
Variations
ACRL
Enables distributing parametric design
variations across threads, cores,
processors, and machines
Enables distributing frequency sweeps
across threads, cores, processors, and
machines
•
Interpolating and discrete sweeps
© 2013 ANSYS, Inc.
65
Q3D Performance & Accuracy
SiP Package Test Case
Local Serial Solve
CPU Available
Solve Time (hr:min)
1CPU
8:36
2CPU
4:42
4CPU
2:56
8CPU
2:08
12 CPU
1:49
Distributed Solve
CPU Available
Solve Time (hr:min)
6CPU
1:18
8CPU
1:11
12CPU
53 min
HPC distributes different solutions
to networked processors and memory
CG solution
DC solution
AC solution
© 2013 ANSYS, Inc.
66
Distributed CG Solver
• Simulate faster with distributed computing!
– Solve nets in parallel across clusters
– Use multiple CPUs on each cluster node
Speed Up
Capacitive behavior with and without touch for different touch screen configurations
4
3
2
1
1
2
3
4
Number of Nodes
Local: 1 Processor
(HR:MIN:SEC)
MPI + Distributed
(HR:MIN:SEC)
MPI Setup
(Intel or Platform)
Total Cores
TouchPanel A 21
0:21:44
0:08:18
MPI: 10, Dist:2
20
~100,000 0.52
2.6x
TouchPanel B 28
1:08:44
0:16:14
MPI: 6, Dist:4
24
~240,000 2.27
4.2x
TouchPanel C 63
4:37:47
0:44:22
MPI: 15, Dist:4
60
~275,000 3.45
6.3x
TouchPanel D 49
20:15:50
1:05:34
MPI: 24, Dist:4
96
~330,000 5.68
18.5x
TouchPanel Nets
Mesh Size RAM
Speed Up
(Triangles) (GB)
© 2013 ANSYS, Inc.
67
Q3D: Thin Conductor Modeling
• Improve robustness and performance for CG and RL solvers in touch panel
applications, thin 3D conductors can be modeled as sheet 2D objects using
“Thin Conductors” boundary
• Average speed up reported by field testers is 8x
Release
v11
v12
Thickness
1um(3D)
0.03um(2D)
Passes
11
17
11
14
Mesh
145529
37792
54112
12591
Cm
1.4289
1.377
1.3933
1.3798
Time
0:54:48
0:13:19
0:06:04
0:00:35
Speed_up
22.8x
9.0x
© 2013 ANSYS, Inc.
68
Faster Pre-processing
Reduced simulation time for
large package designs!
– Enhance algorithms and
multi-processing technology
– 10x speed up in boundary
validation
– 3x speed up in net
identification
Large Package Designs
Boundary validation time
Model Name
R14.5 Time
R15 Time with
6 threads
Speed up
Model1
>2hrs
13 min
9x
Model2
1hr
5 min
11x
Model3
3 min
12 sec
15x
Net identification time
Model Name
R14.5 Time
R15 Time
Speed up
Model4
15mins
6mins
2.5x
Model5
> 3 hrs
1 hr 15 mins
> 2.4x
Model6
1 min
10 sec
6x
© 2013 ANSYS, Inc.
69
2D Extractor Transmission Line Toolkit
© 2013 ANSYS, Inc.
70
Designer SI update
71
© 2011 ANSYS, Inc.
May 14, 2014
Designer Circuit and Schematic
•
•
•
•
•
•
•
•
•
64-bit GUI Support for Windows and Linux
ANSYS ECAD Database
– Brd, mcm, ODB++, GDSII....
NDE causality plots
Bus Support for Easy Schematic Creation
Support for Agilent X-parameter Models
Limit line support for Pass & Fail reporting
IBIS-AMI repeaters support
Added support for PSP 103.1 and 102.3
models
Installation now includes RF vendor libraries
•
•
24K Spice and 400 State-space components
DDR3 Virtual Compliance
Click to edit Master text styles
– 20+ additional calculations, including
Command/Address support
© 2013 ANSYS, Inc.
72
New IBIS Components
•
•
•
Now it is easier to run IBIS components in DesignerSI
Now one single component is able to run both IBIS and IBIS-AMI files
Analog part has been added
Old IBIS compo
nents
New IBIS comp
onents
© 2013 ANSYS, Inc.
73
Post Processing with Non-Ideal Clock
Eye diagram with ideal clock
External triggered Eye diagram
Click to edit Master text styles
Limit Lines for XY Plots
© 2013 ANSYS, Inc.
74
DDR3 & LPDDR2 Virtual Compliance
Virtual Compliance Reporting
Right click Results > Create User Defined Solution > UserLib > DDR
• Compliance Calculations
– LPDDR2
• AC Data Timing Calculations (tDS, tDH, derate, tDQSQ…)
– DDR3
• AC Data Timing Calculations (tDS, tDH, derate, tDQSQ…)
– DDR3L
• AC Data Timing Calculations (tDS, tDH, derate, tDQSQ…)
• Overshoot/Undershoot
© 2013 ANSYS, Inc.
75
Virtual Compliance Reporting
Right click on eye diagram > Trace Characteristics
All characteristics of the eye diagram
Click to edit Master text styles
X-axis scrollbar to zoom in
a preferred time section
© 2013 ANSYS, Inc.
76
Post Layout Simulation (1066Mbps)
Data group signals
- Write Operation / with ODT 120/60/40 Ohm
ODT_disabled
at DDR3
SDRAM
ODT_120
DDR3
SDRAM
ODT_60Ohm
atatDDR3
SDRAM
ODT 40Ohm at DDR3 SDRAM
VDD(Q)
240Ohm
VDD(Q)
120Ohm
80Ohm
240Ohm
120Ohm
80Ohm
Negative Setup Margin
Negative Setup Margin!
For all data signals, setup margin with derating value is positive.
All positive hold margin!
Hold margin with derating value is also positive.
Hold margin with derating value is also positive.
© 2013 ANSYS, Inc.
77
ANSYS SDPD Consulting
- Design Process Improvement
© 2013 ANSYS, Inc.
78
ANSYS Offers a Simulation Driven Product Development Assessment Service to Companies Worldwide
•Services project to assess and recommend
further improvements to your Product
Development Process
• The SDPD Assessment is an opportunity to:
• Understand your product development
process and how simulation is being
deployed today
• Compare your deployment of engineering
simulation with the Best-in-Class
• Recommend how simulation can be more
effectively utilized
• Train & Implement process changes
• Continued professional services with
industry experts for success
© 2013 ANSYS, Inc.
79
We are Open to Share this Knowledge with
You, and to Customize it to Your Company
We can Assess Your Deployment of Simulation and
Compare it with Best in Class.
A 3 Steps Process:
1. Preliminary Investigation
• Preliminary survey to get the o
verall picture
• Creation of a company-specific
questionnaire to guide the on-s
ite assessment
2. On-Site Assessment
• Interview leaders, managers a
nd users by ANSYS experts
• Compare engineering simulati
on company practices with be
st practices
3. Report
• Comprehensive report on ob
servations
• Concrete recommendations t
o make simulation more impa
ctful on your business
© 2013 ANSYS, Inc.
80
We Help You Prioritize Areas for
Improvement And Implement Solutions
1
2
Compare with Best in Class
Centralized SW License
Management
Comprehensive Solution
4
Education & Certification
Program
Evaluate the gap to world class level,
Prioritize areas for Improvement
2.5
3
Smart Access to
Computational Power
2
2
Parametric AND Direct
Modeling
Gap Analysis
1.5
1
1
Robust Design Optimization
0
Early Reliability Prediction &
Simulation
0.5
Systematic use of simulation
early
0
Modeling from Component
to Systems
Collaborative Simulation
Environment
Integrated Reduced Order
Model
Process
Maturity Level
Software Hardware
Interaction
Best in Class
Average
4
3
Jointly develop a program to help you pro
gress to the next maturity level
Level 4
3
Level 3
2
$$
Value
Level 2
1
Level 1
Different levels of maturity are
step by step achieved for each best practice.
© 2013 ANSYS, Inc.
81
Recommendations include stage wise ado
ption roadmap
4
Robust Design Optim
ization
Advanced: Increase Depth
•Entire preprocessing and set up is driven by automation scripts
•Many parametric simulations performed against well defined success criteria
•Automation scripts exchange data between physics at predefined intervals
•…
Intermediate: Increase reach
•Scripts drive some of the manual repetitive tasks
•Adoption of higher-level physics, 1-way multi-physics
•Limited scenarios simulation for select parametric variations
• Data is shared manually between different physics simulations
•…
3
2
1
Leader: Collaborative Simulation Environment
•Entire simulation process from pre to post is driven by automation scripts
•Comprehensive optimization study using DOE, Six Sigma techniques
•Coupled physics simulations driven by common collaboration platform
•…
Beginner: Adoption
•Repetitive tasks are performed manually
•No optimization done
•Different simple physics simulations are performed in isolation
•…
Level 4
Level 3
Level 2
Level 1
• Advanced
• Intermediate
• World Class
$$
Value
• Beginner
Source: Best Practices documented from cumulative 40 years of knowledge at ANSYS
© 2013 ANSYS, Inc.
82
Services & Support engagements to help move to
higher levels of simulation maturity
Vertical Applications
Level 3
Models & Systems
Tools Integration
Level 2
Automation
Customization
Level 1
Engineering Analysis
SUPPORT:
TRAINING: Introductory
Standard
Jump start
Premium
Advanced
SDPD Assessment
Impact on company
business
Level 4
Onto edit
siteMaster text styles
Click
Specialized
Time
Maturity level
© 2013 ANSYS, Inc.
83
R16 preview2 New GUI for HFSS
Click to edit Master text styles
© 2013 ANSYS, Inc.
84