Workshop Program

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Advance Program

5th IEEE International Workshop on Design for Manufacturability & Yield June, 6, 2011

Co-located with Design Automation Conference (DAC 2011)

San Diego Convention Center, San Diego, California, USA

Sponsored by –

TTTC – The IEEE Computer Society Test Technology Technical Council

In Cooperation with –

CEDA – IEEE Council on Electronic Design Automation

MONDAY, JUNE 6, 2011

REGISTRATION , BREAKFAST: 8:30am - 8:50am

WELCOME REMARKS: 8:50am - 9:00am

Session 1: DESIGN-PATTERNING INTERACTIONS

9:00am - 10:30pm

Session Chair: Dr. Swamy Muddu, GlobalFoundries

1.1 <Invited Talk> Patterning Troubles for Standard

Cells

D. Pietromonaco, ARM

1.2 Parametric Hierarchy Recovery in Layout

Extracted Netlists

John Lee, Puneet Gupta and Fedor Pikus

1.3 Design Methodology to Compensate Transistor

Channel Length Litho-Induced Variations

Sergio Gomez, Francesc Moll, Lancelot

García-Leyva and Antonio Rubio

1.4 A Partitioning-Based Litho-Friendly SADP

Decomposition Method

Minoo Mirsaeedi, Andres Torres and Mohab Anis

COFFEE BREAK

10:30am – 10:50am

Session 2: CHARACTERIZATION OF VARIATION

10:50am – 12:00am

Session Chair: Dr. Mohamed Abu-Rahma, Qualcomm

2.1 <invited> System-Level Variability Measurement and Implications

Mani Srivastava, UCLA

2.2 Electrical Monitoring of Gate and Active Area

Mask Misalignment Error

Aditya Bansal, Amith Singhee, Emrah Acar and

Greg Costrini

2.3 A Stress-Parallelized Device Array for Efficient

Bias-Temperature Stability Measurement

Takashi Sato, Tadamichi Koazaki, Takumi Uezono,

Hiroshi Tsutsui and Hiroyuki Ochi

LUNCH AND INVITED TALK:

Transition from Planar MOSFETs to FinFETs and its

Impact on Design and Variability

12:00pm – 1:00pm

Speaker: V. Moroz, Synopsys

Session 3: STATISTICAL TREATMENT OF

VARIATION

1:00pm - 2:10pm

Session Chair: Prof. Costas Spanos, UC Berkley

3.1 <invited> Virtual Probe: A Statistical Framework for Low-Cost Variability Characterization of

Nanoscale Integrated Circuits

Xin Li, CMU

3.2 Techniques to Minimize VCCMIN Induced Yield

Loss in SRAM Arrays

Guru Shamanna, Raja Gaurav and Kshatri Bhunesh

3.3 Investigating the Effect of Adaptive Body

Biasing and Adaptive Voltage Scaling on

Parametric Yield in the Presence of Process and

Statistical Variability

Plamen Asenov, Dave Reid, Campbell Millar, Scott

Roy and Asen Asenov

BREAK AND POSTER SESSION

2:10pm – 3:00pm

P.1 Theory of Logical Partitioning for Yield/Area

Maximization using Redundancy

M. Mirza-Aghatabar, M. Breuer and S. Gupta

P.2 Power-awareness In DC EM Optimization

C.-M. Fu, C.-Y. Yu, P.-H. Yeh, Y.-T. Hou, W.-H.

Chen and T. Quan

P.3 An Integrated Schematic-Based Layout

Verification Flow Environment

S. Srinivasan, F. Pikus, P. Gibson and L. Ling

P.4 Design Margin Tightening Utilizing Local

Cancellation Effects with Stage-based OCV

W.-H. Chen, L.-Y. Du, Y.-T. Hou and T. Quan

P.5 Linear Propagation Methodology in Compact

Variability Modeling

Y. Qiao and C. J. Spanos

Session 4: TEST AND SYNTHESIS FOR YIELD

3:00pm - 4:20pm

Session Chair: Michael Orshansky, Univ. of Texas

4.1 <invited> DFM for Rapid Yield Ramp

Will Conley, Freescale

Variation Delay Defects

Vladimir Zolotov, IBM

4.3 Designing Approximate Circuits for

Error-Tolerant Applications to Improve

Performance Yield

Doochul Shin and Sandeep Gupta

PANEL DISCUSSION

What DFMY problem will you pay to get solved /

Where is the next DFMY startup?

4:20pm - 5:30pm

Organizer: Andrew Kahng

WORKSHOP SCOPE

Designing a SoC for manufacturability and yield must aim at improving the manufacturing process, and consequently its yield, by enhancing communications across the design–manufacturing interface. A wide range of

Design-for-Manufacturability (DFM) and Design-for-Yield

(DFY) methodologies and tools are proposed today. Some of these are leveraged during the back-end design stages, while others have post-design utilization, from lithography up to wafer sort, packaging, final test and failure analysis.

DFM can dramatically impact the business performance of chip manufacturers. It can also significantly affect age-old chip design flows. Using a DFM solution is an investment, and thus choosing the most cost-effective one(s) requires tradeoff analysis. This workshop analyzes key trends and challenges, and gives the opportunity to discuss a range of DFM and DFY solutions for today's SoC designs.

26,

2009

REGISTRATION

All workshop participants require registration. Please register at the following site. https://reg.mpassociates.com/reglive/PromoCode.aspx?c

onfid=122

WORKSHOP COMMITTEE

General Chair: R. Aitken, ARM

Program Chair: P. Gupta, UCLA

Publicity: J. Lu, UCSD

STEERING COMMITTEE

A. B. Kahng, UCSD

A. Singh, Auburn Univ.

Y. Zorian, Virage Logic

PROGRAM COMMITTEE

M. Abu-Rahma, Qualcomm

S. Datla, Texas Instruments

A. Gattiker, IBM

P. Gupta, UCLA

S. Gupta, USC

A. B. Kahng, UCSD

V. Moroz, Synopsys

N. S. Nagaraj, Texas Instruments

M. Orshansky, Univ. of Texas

D. Z. Pan, Univ. of Texas

C.-H. Park, Samsung

J. M. Portal, Univ. of Marseille

T. Quan, TSMC

M. S. Reorda, Politecnico di Torino

P. Sharma, Freescale

T. Shibuya, Fujitsu

A. Singhee, IBM

R. Topaloglu, GlobalFoundries

A. Torres, Mentor Graphics

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