Full list of supervisors
IME - Institute of Microelectronics
Surname
Given
Names
Department
Research Interests
Email Contact
Cai
Hong
Sensors Actuators &
Microsystems
Program
caih@ime.astar.edu.sg
Campanella
Pineda
Humberto
Sensors Actuators &
Microsystems
Program
Chai
Tshun
Chuan,
Kevin
Integrated Circuits
& Systems
Laboratory - Analog
& Mixed Signal IC
Cheam
Daw Don
MEMS Program
1. Nano-opto-mechanical-systems
(NOMS) development, which is
based on the core technologies of
nanomechanics and nanophotonics.
It can be exploited for actuating
optomechanical devices, including
sensors, accelerometers, gyro, nanooptical switches and array, and
nano-actuators etc. It will be
technological impact for revolutions
traditional micro-silicon-devices
through the light-and-motion
connection.
2. Nano-Photonics research area,
focusing on silicon photonics devices
development. Including CMOS
platform-based silicon micro- and
nano-fabrication process
development, photonic devices with
applications in high-speed optical
interconnects development.
Microelectromechanical Systems
(MEMS), Microelectronics, Micro
and Nano Fabrication Technologies,
Bulk Acoustic Wave Devices (BAW,
FBAR) for Mobile Telecomm.
Systems and Sensor
• Analog mixed signal design;
• Readout interface for sensors
applications in biomedical areas
such as cellomics, genomics and
proteomics;
• interface readout for MEMS
sensors using capacitive,
piezoelectric, piezoresistive,
resonance etc.
MEMS / MEMSEN
Chen
Yu
Postgraduate
Research
1. Microdevice and system for point
of care diagnosis application
2. Microdevice and system for cell
based assay
3. Microdevice and system for high
throughput drug screening (
molecular and cell based)
4. Microfludic system, micro reactor,
micro separator or micro extractor
for molecular or cell based sample
chenyu@ime.astar.edu.sg
campanellaph@ime.astar.edu.sg
chaitc@ime.astar.edu.sg
cheamdd@ime.astar.edu.sg
Full list of supervisors
Chen
Bangtao
MEMS Program
CHENG
Ming-Yuan
Miniaturized
Medical Devices
Cheong
Jia Hao
Integrated Circuits
& Systems
CHIDAMBARA
M
NACHIAPPAN
Vivek
TD-AdvPkg-Bonding
Ding
Liang
TSV Taskforce
Fernando
Sanchitha
Nirodha
Sensors Actuators &
Microsystems
Program
Gao
Yuan
Integrated circuits
and system design
He
Cairan
Je
preparation and enrichment
5. Biosensors and chemical sensors
for molecular, specific cells or cell
secretion detection
MEMS integration and packaging,
vacuum packaging
chenb@ime.astar.edu.sg
Implantable miniaturized medical
devices, 3D neural probe array
system, sensorized guide wire
system, bio-packaging,
microassembly for medical device,
and flexible tactile sensing arrays.
Low power ASIC design for
implantable wirelessly powered
blood flow monitoring system
Materials characterization, reliability
testing, failure analysis, wafer level
and die-level bonding optimization,
MEMS hermetic and vacuum
packaging
TSV 3DIC integration
TSV interposer
Thin wafer handling
Si photonics
Inertial MEMS – accelerometers,
gyroscopes;
MEMS Vacuum sensors – Pirani
Gauges, resonators
RF/analog integrated circuit design
chengmy@ime.astar.edu.sg
Miniaturized
Medical Devices
Implanted and Embedded Sensor for
Biomedical applications
hec@ime.a-star.edu.sg
Minkyu
Integrated Circuits
& Systems Lab
jemk@ime.astar.edu.sg
KEE
Jack Sheng
Bio-Electronics
Program
1. Wireless implantable sensor ASIC
for medical devices
2. Circuits and systems for
neurodevices
3. Sensor node SoCs for wireless
health monitoring
4. Nano-scale biosensor interface
ASIC for diagnostics
5. MEMS sensor and actuator
interface circuits for consumer and
industrial applications
6. Analog & mixed-signal ICs and
wireless ICs
7. High temperature circuits and
systems for oil & gas industry
Biophotonics, Nanoplasmonic, Labon-chip
Kwong
Dim-Lee
Director's Office
1. 3D IC and TSV
2. Advanced Optical Interconnect
technology
3. Si-based Biosensors
kwongdl@ime.astar.edu.sg
cheongjh@ime.astar.edu.sg
nachiappanvc@ime.astar.edu.sg
dingl@ime.astar.edu.sg
fernandosn@ime.astar.edu.sg
gaoy@ime.astar.edu.sg
keejs@ime.astar.edu.sg
Full list of supervisors
Li
Hong Yu
TSV Program
Lim
Eu-Jin,
Andy
Nano Photonics
Program
Liow
TsungYang Jason
NanoPhotonics
Program
Liu
Xin
Lo
Guo-Qiang
Patrick
Integrated Circuits
& Systems
Laboratory - Digital
IC
Nano Electronics &
Photonics; TSV
Taskforce; Gallium
Nitrade (GaN)
Program
Luo
Xianshu
Nano Photonics
Program
Ng
Sheung
Yan Simon
Integrated Circuits
& Systems
Park
Mi Kyoung
Bioelectronics
program
4. Miniaturized medical devices
5. MEMS-CMOS integrated
Microsystems
1. 3D IC and 3D packaging process
integration by TSV technology.
2. Fine pitch Cu to Cu bonding.
3. 3D interconnect reliability.
1, Semiconductor process
integration and device physics
(Silicon, III-V)
2. Advanced gate stack technology in
particular metal gates, high-k
dielectrics, interface engineering for
CMOS applications
3. Silicon photonics devices or
optoelectronic devices
4. Thin film chemical vapour
deposition process technology for
e.g. Ge, Si, SiC, SiGe epitaxial films
and superlattice structure
Silicon Photonics
lihy@ime.a-star.edu.sg
limej@ime.astar.edu.sg
liowty@ime.astar.edu.sg
Digital signal processing; VLSI circuit
design; Wireless communication
liux@ime.a-star.edu.sg
1. Si-Based Light-Emitting Devices
and white solid-state lighting
2. 3D Optical-Interconnects
3. Low-Loss Passive Waveguide -Process and Modeling
4. Ultra-High Speed Si-based
Modulator
5. Ultra-High Speed Si-based
Photodetector
6. GaN Power Devices and
Technology
7. 3D IC – for High Bandwidth
Electrical and Optical Interconnect
8. 3D IC with Thermal management
Solution
1. Silicon photonics for on-chip
optical interconnects
2. Hybrid Optoelectronics IC for
Next-Generation Optical
Communications
3. Microwave photonics by using
silicon photonics platform
Lower power CMOS sensor interface
and high resolution data converter
design
Development of label-free
immunosensors - silicon photonics
sensor, SPR sensor, and
logq@ime.astar.edu.sg
luox@ime.astar.edu.sg
ngsys@ime.astar.edu.sg
parkmk@ime.astar.edu.sg
Full list of supervisors
Randles
Andrew
Benson
Sensors Actuators &
Microsystems
Program
IPP-Packaging
Materials
RHEE
Minwoo
SELVARAJ
Susai
Lawrence
GaN
Singh
Navab
Singh
electrochemical sensor; Cancer
Diagnostics, Surface Chemistry for
bio-conjugation
SAW Temperature compensation,
cMUT design and fabrication
randlesab@ime.astar.edu.sg
Advanced packaging material and
simulation. Power electronics /
Rugged Electronics Packaging.
GaN device process, integration and
characterization.
rheem@ime.astar.edu.sg
MEMS Program
MEMS/NEMS devices and
technology
navab@ime.astar.edu.sg
Ravinder
Pal
Integrated Circuits
& Systems
Power Management IC design
ravinderps@ime.astar.edu.sg
Song
Junfeng
Nano Photonics
Program
songjf@ime.astar.edu.sg
Sun
Winston
Miniaturized
Medical Devices
Sun
Cheng
Liang
Sensors Actuators &
Microsystems
Program
Tu
Xiaoguang
Nano Photonics
Program
Silicon photonic
III-V on SOI
Silicon Plasmonics
Radio on SOI
Silicon photonics biosensor
MEMS components design,
packaging, assembly, and system
integration.
Research Area: Piezoelectric MEMS
sensors and actuators
Projects:
RF-MEMS Resonator
Energy harvester
Silicon Photonics Device and
Integration
Wang
Jian
MEMS Program
wangj@ime.astar.edu.sg
Wang
Xinpeng
Nano Electronics
Program
WONG
Chee
Chung
Bio-Electronics
Program
MEMS devices, thin film
encapsulation schemes, micro
mirror devices
Advanced architectures and
materials for nanoscaled CMOS
technology; Emerging NVMs and
their application, including metaloxide based ReRAMs, chalcogenide
phase-change memories etc;
Semiconductor based biosensor
Electromechanical sensors
Yao
Lei
Integrated Circuits
& Systems
yaol@ime.astar.edu.sg
YU
Hongbin
Miniaturized
Medical Devices
Mixed signal VLSI design,
biomedical circuit and system,
neural stimulation and recording
circuits, data conversion circuits
Development of MEMS devices and
system as well as their applications
Yu
Mingbin
TSV Taskforce
mingbin@ime.astar.edu.sg
Zhang
Qingxin
MEMS Program
1. Silicon Nano photonics
2. TSV process technology
development
Si based MEMS device design and
fabrication, Intergation of MEMS
selvarajsl@ime.astar.edu.sg
sunw@ime.astar.edu.sg
sunc@ime.astar.edu.sg
tux@ime.a-star.edu.sg
wangxin@ime.astar.edu.sg
wongcc@ime.astar.edu.sg
yuh@ime.astar.edu.sg
qingxin@ime.astar.edu.sg
Full list of supervisors
Zhang
Xiaowu
Interconnection &
Advanced Packaging
Program
Zhou
Jun
Integrated Circuits
& Systems
ZHU
Shiyang
NanoP
and CMOS technology, Wafer
transfer technology and its
application on RF/Bio technology
1.3D IC integration with TSV
technology
2.TSV interposer technology
3.Micro-stress sensor design,
fabrication and testing
1. energy-efficient digital signal
processor design
2. Low voltage circuit and system
design
3. Variation-tolerant circuit and
system design
4. 3DIC design
Silicon photonics and plasmonics for
telecom communication and sensing
xiaowu@ime.astar.edu.sg
zhouj@ime.astar.edu.sg
zhusy@ime.astar.edu.sg