Physics 5830: Condensed Matter Physics [3 s.h.]
Spring 2006 Syllabus
Course Code #2536 (M, W, F 11:00-11:50, Room 2010) Catalogue #5830
Instructor: Dr. Tom N. Oder
Contacts: Office – Ward Beecher Hall Room 1016; Phone (330) 941-7111
E-Mail: tnoder@ysu.edu, website: http://www.ysu.edu/physics/tnoder
Office Hours: M, W, F 2:00 pm to 3:00 pm.
Class web site: http://www.ysu.edu/physics/tnoder/S06-PHYS5830/index.html
Prerequisite: Phys. 3704 Modern Physics. [May be waived by instructor].
Required materials: Text: (1) R.F. Pierret, Semiconductor Fundamentals, (Second Edition) - Modular
Series on Solid-State Devices, Volume I, Addison-Wesley, 1988. (2) R. C. Jeager, Introduction to
Microelectronics Fabrication (Second Edition) - Modular Series on Solid-State Devices, Volume V,
Addison-Wesley.
Supplemental reference materials will come from archival journal papers selected by the instructor.
Course Structure: Lecture sessions and hands-on laboratory activities.
Course Objectives:
1. To develop a background knowledge of semiconductor theory sufficient to understand modern
semiconductor devices.
2. To provide students with practical experience in cutting-edge technology related to electronic device
fabrication including lithography, thin film deposition and electrical characterization.
This is an upper division course in Condensed Matter Physics that will cover selected topics in
semiconductor physics and microelectronic fabrication processes. The structure of the course will be
lectures and hands on laboratory experience in semiconductor processing. At the end of the course, the
student will have basic knowledge of semiconductor theory sufficient to understand modern
microelectronic and optoelectronic devices. The student will also gain practical experience in modern
technology related to semiconductor device processing.
Regular and punctual class attendance is strongly advised and sometimes may be rewarded. You will be
responsible for everything discussed in class during lectures. It is the student’s responsibility to be
prepared for each class by reading related text and doing the assigned homework.
Since laboratory activities will be part of this course, each student will be required to adhere to given
instructions for safe handling of processing tools and chemicals. Failure to follow instructions on safe
handling may result in equipment damage or bodily harm and any student who carelessly handles
equipments and chemicals will be expelled from the class as well as meet the cost of repair/replacement
of a damaged equipment.
In accordance with University procedures, if you have a documented disability and require
accommodation to obtain equal access in this course, please contact me privately to discuss your specific
needs. You must be registered with the Disability Services Office at Wick House (corner of Wick Avenue
and the Access Road) and provide a letter of accommodation to verify your eligibility. You can reach the
Disability Service Office at (330) 941-1372.
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Grading Policy:
 Homework/Quizzes 20%.
 Midterm Exam (1) 20%.
 Laboratory Project 20%.
 Final exam 40%.
Homework problems will be assigned throughout the semester to reinforce the class material.
Final Grade:
90% - 100% = A
80% - 89% = B
70% - 79% = C
60% - 69% = D
0% - 59% = F
Cell Phones: Cell phones must be turned off during class and exam sessions.
Academic Honesty:
Plagiarism, cheating and other forms of academic dishonesty constitute a serious violation of University
conduct regulations and may be punished by failure in the exam, paper or project; failure in the course;
and/or additional sanctions. For more information refer to the “Academic Misconduct” page 40 of the
YSU Undergraduate Bulletin, 2005-2006.
Topics:
Semiconductor Physics
1. Crystals: Structure and Growth.
2. Energy Bands
3. Carriers in Semiconductors
4. Phonon Spectra and Optical Properties of Semiconductors
5. Basic Equations for Semiconductor Device Operation
Device Physics
1. P-N Junction Diodes
2. Light Emitting Diodes
3. Photodetectors
4. Schottky Diodes
5. Field Effect Transistors
Device Processing and Characterization
1. Laboratory Safety
2. Surface Preparation
3. Lithography
4. Thin Film Deposition
5. Metal Contacts
6. Electrical Characterization
7. Optical Characterization
8. Physical Characterizations
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