Keynote Speakers personal curriculum vitae (CV)
Wei-En Fu, PhD
Manager and Senior Researcher
National Measurement Laboratory
Center for Measurement Standards
Industrial Technology Research Institute
Email: weienfu@itri.org.tw
EXPERTISE
•
Nanoscale Metrology and Science
•
Thin Film Stress Characterizations
•
•
X-Ray Technology
Micro/Nano-Machining for Advanced Materials
EDUCATION
B.S. Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan. 1990
M.S. Mechanical Engineering, University of Connecticut, Storrs, CT. 1997
Ph.D. Industrial and Manufacturing Engineering, Pennsylvania State University, University
Park, PA. 2003
WORK EXPERIENCE
Senior Researcher: 2010-present
National Measurement Laboratory
Center for Measurement Standards, Industrial Technology Research Institute, Hsinchu,
Taiwan
Manager: 2012-present
Center for Measurement Standards, Industrial Technology Research Institute, Hsinchu,
Taiwan
Researcher: 2004-2010
National Measurement Laboratory of the R.O.C., Hsinchu, Taiwan
Center for Measurement Standards, Industrial Technology Research Institute, Hsinchu,
Taiwan
Guest Researcher: 2007
Polymer Division, Materials and Science Laboratory, National Institute of Standards and
Technology, US.
Production Scheduling Specialist: 2004
Department of Material Planning and Logistics, Manufacturing Division, Ford Lio Ho
Motor Co., LTD., Chung Li, Taiwan.
Publications (since 2010)
Chien, Y.-S., Yang, P.-Y., Lee, I-C., Chu, C.-C., Chou, C.-H., Cheng, H.-C., Fu, W.-E., “Enhanced
efficiency of the dye-sensitized solar cells by excimer laser irradiated carbon
nanotube network counter electrode,” Applied Physics Letters, 104, 5, 051114 051114-4, 2014. (IF:3.79)
Fu, W.-E.*, Chang, Y.-Q., B.-C He, C.-L. Wu, “Determination of Young’s modulus and
Poisson’s ratio of thin films by X-ray methods,” Thin Solid Films, Thin Solid Films, 544,
p. 201-205, 2013. (IF:1.89)
Fu, W.-E.*, B.-C He, Chang, Y.-Q., “Surface Mechanical Property Assessment of Ultra-Thin
HfO2 Films,” Thin Solid Films, 544, p. 212-217, 2013. (IF:1.89)
Stefaniak, A.B., Hackley, V.A., Roebben, G., Ehara, K., Hankin, S., Postek, M.T., Lynch, I., Fu,
W.-E., Linsinger, T.P.J., Thünemann, A.F., “Nanoscale Reference Materials for
Environmental, Health, and Safety Measurements: Needs, Gaps, and Opportunities,”
Nanotoxicology, 7(8), 1325-1337, 2013;. (IF:5.758)
Fu, W.-E., Chang, Y.-Q., Chang, C.-W., Yao, C.-K., Liao*, J.-D, “Mechanical properties of
ultra-thin HfO2 films studied by nano scratches tests,” Thin Solid Films, 529, p.
402-406, 2013. (IF:1.89)
Fu, W.-E.*, Chen, C.-C.A., Huang, K.-W., Chang, Y.-Q., Lin, T.-Y., Chang, C.-S., Chen, J.-S.,
“Nano-scratch evaluations of copper chemical mechanical polishing,” Thin Solid Films,
529, p. 306-311, 2013. (IF:1.89)
Fu, W.-E., Chang, C.-W., Chang, Y.-Q., Yao, C.-K., Liao, J.-D.*, “Reliability assessment of
ultra-thin HfO2 films deposited on silicon wafer,” Applied Surface Science 258, 22, p.
8974-8979, 2012. (IF: 2.103)
Fu, W.-E.*, Chen, C.-C. A., Huang, K.-W., and Chang, Y.-Q., “Material Removal Mechanism
of Cu-CMP Studied by Nano-Scratching under Various Environmental Conditions,”
Wear 278-279, p. 87-93, 2012. (IF: 1.872)
He, B.-C., Fu, W.-E.*, Liou, H.-C., Chang, Y.-Q.E., Pan, S.-P., Lin, H.M., Chen, Y.-F.,
“Deformation of polystyrene nanoparticles under different AFM tapping loads,”
Proceedings of SPIE - The International Society for Optical Engineering 8378, art. no.
83780G, 2012. (EI)
Fu, W.-E.*, Chang, Y.-Q., “Layer structure variations of ultra-thin HfO2 films induced by
post-deposition annealing,” Applied Surface Science, 257, 17, p. 7436-7442, 2011. (IF:
2.103)
Fu, W.-E.*, Chen, C.-C. A., Lin, Y.-D., Chang, Y.-Q., and Huang, Y.-H., “Passivation layer effect
on surface integrity induced by Cu-CMP,” Thin Solid Films, 519, 15, p. 4874-4879 2011.
(IF:1.89)
Liu, C. Y., Fu, W.-E.*, Lin, T-Y., Chang, C.-S., and Chen, J.-S., “Nanoscale surface roughness
characterization by full field polarized light-scattering,” Optics and Lasers in
Engineering 49, p. 145-151, 2011. (IF:1.838)
Liu, C. Y., Liu, Tze-An, and Fu, W.-E.*, “Out-of-plane ellipsometry measurements for
nanoparticles on thin film wafer inspection,” Optics & Laser Technology 42 p. 902-910,
2010. (IF:1.515)
Keynote Speech Abstract
Title: Transmission Small Angle X-ray Scattering
Enhancement for Critical Dimension (CD) Measurements
(tSAXS)
Intensity
Abstract:
The semiconductor industry is moving into 22 nm technology node and beyond, concurrently,
it is also moving away from 2D planar features and heading to 3D ones, for example, FinFET
structures. The ever deceasing feature size and more complex structures redefine the needs
for metrology solutions. Transmission small angle X-ray scattering (tSAXS) has been identified
as a possible metrology solution to address these challenges. However, the major hurdle is its
measurement speed; it is simply too slow for the high volume manufacturing process due to
a lack of high brilliance X-ray sources other than synchrotrons. Here, we describe a novel
ideal and the related measurements which are expected to amplify the X-ray scattering
intensity from a target object under a fixed incident X-ray flux, hence, to increase the
measurement speed. When properly implemented this technique is expected to enhance the
tSAXS intensity of target objects regardless of the type of X-ray source.