IMAPS - EUROPE PRAGUE 2000
EUROPEAN MICROELECTRONICS PACKAGING AND INTERCONNECTION SYMPOSIUM WITH TABLE TOP EXHIBITION
Dear Colleague,
In June 18-20th, 2000, the IMAPS - Czech and Slovak Chapter will host IMAPS-EUROPE
PRAGUE 2000, the European Microelectronics Packaging and Interconnection Symposium
with a Table Top Exhibition.
The IMAPS - EUROPE conferences are organized by the authorized European Chapters in
odd years. These events are joined with exhibitions of new materials, technologies and
products. However, it was found that a time space of two years is too long according to a very
dynamic progress in the field of microelectronics packaging and interconnections. Therefore
the biennial cycle of the conferences joined with a large exhibition will be completed with
conferences of a new type, which will be joined with a Table Top Exhibition. These meetings
will be organized by some of the East European IMAPS Chapters in even years.
IMAPS-EUROPE PRAGUE 2000 is the first meeting of this new type.
The Symposium will be held at the Holiday Inn hotel in the capitol of the Czech Republic,
historical town Prague, which has been nominated for the European Town of Culture for the
year 2000.
.
The programme of the Symposium will involve significant lectures and display presentations
on all relevant topics of contemporary microelectronics packaging and interconnections. A
tutorial course focused on predictive modelling of thermal stress in electronic packaging will
also be held if the number of applicants, interested in this topic, is sufficient. The Symposium
will also be completed with a programme for accompanying persons.
Prague, the "Heart of Europe", is the town with significant history, located on both sides of the
river Vltava. The dominance of Prague is the Prague Castle. There are more than four
hundred towers in Prague, which is also called "Stone Dream" or "Golden City". Many visitors
come to admire bridges, churches and historical buildings. I am convinced that you will be
fascinated with the beauty of this town, too. I look forward to welcoming you in Prague. I
believe that you will be satisfied with all the events you meet here, and that you will spend
unforgettable days in Prague.
Pavel Mach
Chairman, Programme Committee
IMAPS-EUROPE PRAGUE 2000
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IMAPS - EUROPE PRAGUE 2000
EUROPEAN MICROELECTRONICS PACKAGING AND INTERCONNECTION SYMPOSIUM WITH TABLE TOP EXHIBITION
SYMPOSIUM STEERING COMMITTEE
Peter G. Barnwell - Heraeus, UK (Honorary Chair), ELC Chairman
Pavel Mach, CTU Prague, Czech Republic (Chair)
George G. Harman - NIST, USA
Vojtech Hermansky - BVK, Czech Republic
Karel Kurzweil - Bull, France
Nihal Sinnadurai - TWI, UK
Milos Somora - Technical University of Kosice, Slovak Republic
Ivan Szendiuch - Technical University of Brno, Entrelec Vemer Group, Czech Republic
TECHNICAL PROGRAMME COMMITEE
Eric Beyne - IMEC, Belgium
Alessandro Gandelli - Politecnico di Milano, Italy
Leszek Golonka - Wroclaw University of Technology, Poland
Gabor Harsanyi - Technical University Budapest, Hungary
Soeren Noerlyng - Micronsult, Denmark
Jean Claude Rames - Matra BAE Dynamics, France
Nihal Sinnadurai - TWI, UK
Ivan Szendiuch - Technical University of Brno, Entrelec Vemer Group, Czech Republic
Peter Wilhelm - IMAPS, Germany
EUROPEAN LIAISON COMMITEE
Selim Achmatowitz - Institute of Electronic Materials Technology, Poland
Peter Barnwell - Heraeus Cermalloy Division, UK
Flavio Cereda - IBM Italy S.p.A., Italy
Paul Collander - Nokia Research Center, Finland
Francis Gys - Energetic Industries Int´l, Belgium
Vojtech Hermansky - BVK Hradec Kralove, Czech Republic
Zsolt Illyefalvi-Vitez - Technical University of Budapest, Hungary
Marija Kosec - Jozef Stefan Institute, Slovenia
Yves Legoff - Thomson-CSF Detexis, France
David Lowrie - Multicore Solders Limited, UK
Soeren Noerlyng - Micronsult, Denmark
Heinz Osterwinter - FHTE Goppingen, Germany
Paul Svasta - Politechnica University of Bucharest, Romania
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IMAPS - EUROPE PRAGUE 2000
EUROPEAN MICROELECTRONICS PACKAGING AND INTERCONNECTION SYMPOSIUM WITH TABLE TOP EXHIBITION
GENERAL INFORMATION
Symposium Venue
All enquiries during the Symposium should be made at the Registration desk.
Holiday Inn
Koulova 15
Prague 6
160 45
Exhibition
The Table top exhibition will be open in the Holiday-Inn during the Symposium.
Monday, June 19, 08:00 -18:30
Tuesday, June 20, 08:00 -18:00
The entrance to the table top exhibition is free of charge for all participants and outside
visitors.
Homepage of the Symposium
http://K313.feld.cvut.cz/micro
Tutorial Course
Tutorial Course will be held on Sunday 18 June 0830 – 1330 in Libuse salon of Holiday-Inn
Hotel.
Social Evenings
The cost is included in the registration fee of a delegate and accompanying person.
Welcome Reception
Venue:
National House in Vinohrady
Date:
Sunday, June 18th, 19:00 - 21:00
formal dress
Meeting point:
Holiday Inn hotel, registration desk, buses leave at 18:15
Note:
Transportation back to the hotel is not arranged. There is a transportation
ticket and travelling suggestions in your Symposium bag. For further
information please ask at the registration desk
Gala Dinner
Venue:
Date:
Meeting point:
Brevnov Monastery,
Monday, June 19th, 20:00 - 22:00
formal dress
Holiday Inn hotel, registration desk, buses leave at 19:15
Transportation back to the hotel will be organised according to the actual
circumstances.
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IMAPS - EUROPE PRAGUE 2000
EUROPEAN MICROELECTRONICS PACKAGING AND INTERCONNECTION SYMPOSIUM WITH TABLE TOP EXHIBITION
ACCOMMODATION
Any changes of hotel reservation should be arranged through the registration desk.
Holiday Inn
Symposium hotel
Koulova 15, Praha 6
Hotel Holiday Inn is situated in one of the most peaceful areas of Prague, close to Prague
Castle and 12 km from Prague-Ruzyne Airport. Each of the 243 rooms is equipped with colour
television with 20 satellites, 4 Pay-TV and 3 radio programmes, direct-dial telephone and
connection to the international data network. Also available are Non-smoking rooms and
Executive bedrooms. In the Harvest Room Restaurant you can enjoy world cuisine. The Lobby
bar offers piano music in the evenings. There is also a fitness centre with sauna and
hairdresser.
The hotel car parking is 24 hours guarded.
Hotel Krystal
J. Martiho 2/407, Praha 6
Hotel Krystal is situated in the same area as hotel Holiday Inn, closer to the Prague Airport.
Residential quarters consist of 810 beds in double rooms each with its own bathroom. A
stylish restaurant and the Lobby bar provide pleasant surroundings for meals and social
contacts. Meals are served in a dinning room with 160 seats.
Reception desk provides the guests not only with exchange services but offers drinks and
souvenirs as well.
Outdoor covered parking facilities are also available.
Student Hostel
Petrska 3, Praha 1
Hostel is situated near the centre. Rooms are equipped with beds, tables and wardrobe. Two
rooms share one bathroom. Radio and TV can be rent for reasonable price at the reception
desk.
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IMAPS - EUROPE PRAGUE 2000
EUROPEAN MICROELECTRONICS PACKAGING AND INTERCONNECTION SYMPOSIUM WITH TABLE TOP EXHIBITION
TUTORIAL COURSE
PREDICTIVE MODELING OF THERMAL STRESS IN ELECTRONIC PACKAGING
(A Four Hour Short Course for Packaging Engineers)
Course Tutor E. Suhir, Bell Laboratories, Lucent Technologies, Inc. USA
Course objectives:
Examine typical thermal stress failures in microelectronics materials and packages, discuss
and demonstrate the role of stress modeling, and present solutions and, when possible, easyto-use formulas indicating the role of the major factors affecting the package reliability.
Indicate how to choose the appropriate material(s) for a particular package design and how to
change, if necessary, the geometrical characteristics of the design for improved reliability.
Why should someone take this course?
To get familiar with typical thermal stress related problems in electronic packaging, and to
learn about the mechanical-and-materials theoretical methods, approaches and techniques,
currently employed to model thermal stress. This will enable those in the field to enhance and
to broaden their knowledge and skills in their profession, and will teach those not in the field
yet how to apply their background in mechanical, materials, structural and reliability
engineering to electronic packaging.
What will the course participants be able to do upon completion of the course?
To better understand the reliability problems in, and mechanical behaviour of, typical
microelectronics packaging materials, assemblies and structures, subjected to thermally
induced loading, as well as to be able to select the most appropriate materials for, and
geometries of, such structures. Some of the design decision could be made based on simple
and easy-to-apply formulas, which will be provided during the course. These formulas indicate
the role of different materials and geometrical factors affecting the mechanical behavior and
reliability of a packaging structure, and can be effectively used prior to, and sometimes even
instead of, experimental investigations or computer-aided modeling.
Professional level::
The course will be taught with the emphasis on the physics of the thermal phenomena and the
mechanical behaviour of a packaging structure. No special knowledge of the mechanical,
materials or structural engineering, or applied mathematics is required.
Major Topics:
• Materials, typical structures and major loading conditions in microelectronics packaging •
Thermal and mechanical stresses in microelectronic packages • Typical thermal stress failures
in microelectronic packages • Thermal stress modeling: what could one gain by using it? •
Thermal stress modeling: its role, merits and shortcomings with respect to experimental
evaluations • Thermal stress modeling: interaction with experiment • Thermal stress modeling:
merits, shortcomings and interaction of analytical and finite-element modeling • Modeling of
thermal stress in die-substrate and other adhesively bonded assemblies • Recommendations
for improved fatigue life of adhesively bonded assemblies • Modeling of thermal stress in
ceramic packages: application of a probabilistic approach • Modeling of thermal stress in thin
film structures: attributes and results • Modeling of thermal stress in solder joints: flip-chip
designs in thermally matched assemblies • Thermal stresses due to “global” and “local”
mismatch • Thermally matched assemblies • Thermal stress induced bow in plastic packages:
nonuniform distribution of temperature, TSOPs, BGA’s • Thermal stress in plastic packages:
role and interaction with moisture induced loading • Thermal stress in Ball-Grid-Array (BGA)
packages: role and effect of the underfill material
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IMAPS - EUROPE PRAGUE 2000
EUROPEAN MICROELECTRONICS PACKAGING AND INTERCONNECTION SYMPOSIUM WITH TABLE TOP EXHIBITION
Tuesday 20 June
1500 - 1900 Registration
NOTE: Authors of displays can attach their posters on the boards on Sunday, June
18th, 1630 - 1800 and on Monday June 19th, 0730 - 0830, in the Main Hall.
Authors with PC projection can prepare their presentation in Speaker´s room
(salon 3, 2nd floor).
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Displays
0730 - 1900 Registration
0800 - 0830 Meeting With Chairman – Session 1, Session 2 (salon 3)
0830 - 0855 Meeting With Chairman – Session 3, Session 4 (salon 3)
0900 - 0915 Opening Ceremony
0920 - 1005 Invited Paper 1
1005 - 1050 Invited Paper 2
1050 - 1130 Coffee Break
1050 - 1120 Meeting With Chairman – Session 5, Session 6 (salon 3)
1130 - 1330 Oral Sessions
S1 - Processing & Fabrications & Reliability 1
S2 - Flip Chip & Packaging 1
1330 - 1430 Lunch
1430 - 1550 Oral Sessions
S3 - Processing & Fabrications & Reliability 2
S4 - Flip Chip & Packaging 2
1550 - 1700 Exhibitors presentation, Coffee Break
1700 - 1840 Oral Sessions
S5 - Thick Film & Ceramics
S6 - Optoelectronics & RF/HF & Wireless 1
2000 - 2200 Gala Dinner
0800 - 1200 Registration
0800 - 0930 Display Presentation
0800 - 0830 Meeting With Chairman – Session 7, Session 8 (salon 3)
0830 - 0900 Meeting With Chairman – Session 9, Session 10 (salon 3)
0900 - 0925 Meeting With Chairman – Session 11, Session 12 (salon 3)
0930 - 1050 Oral Sessions
S7 - Microsystems Sensor Technologies
S8 - Optoelectronics & HF/RF & Wireless 2
1050 - 1130 Coffee Break
1130 - 1310 Oral Sessions
S9 - Reliability & Design & Advanced Packaging
S10 - MCM & Interconnections
1310 - 1440 Lunch
1440 - 1620 Oral Sessions
S11 - PCB & Passives & Soldering
S12 - New Materials & Thermal & Power
1620 - 1640 Closing Plenary
Registration
1900 - 2100 Welcome Party
Table Top Exhibition
Monday 19 June
Sunday 18 June
PROGRAMME TIMETABLE
IMAPS - EUROPE PRAGUE 2000
EUROPEAN MICROELECTRONICS PACKAGING AND INTERCONNECTION SYMPOSIUM WITH TABLE TOP EXHIBITION
Deadline for Technical Programme Timetable was June 6th. Every change after this date will
be announced. See message board at the Registration desk.
INVITED PAPERS
FOREIGN DIRECT INVESTMENT IN THE CZECH ELECTRONICS SECTOR
R. Samek, CzechInvest, Czech Republic
MONDAY, JUNE 19TH, 09:20 - 10:05
FLIP CHIP AND CHIP SCALE PACKAGING TECHONOLOGIES: A RELIABILITY
PERSPECTIVE
H. Quinones, ASYMTEK, USA
MONDAY, JUNE 19TH, 10:05 - 10:50
S1 - PROCESSING & FABRICATIONS & RELIABILITY 1
MONDAY, JUNE 19TH, 11:30 - 13:30
SESSION CHAIRS: David Lowrie - Multicore Solders Limited, UK
Soeren Noerlyng - Micronsult, Denmark
On the Impact of Design Rules to High-Density Substrate Yield
M. Scheffler, D. Cottet, G. Tröster, Electronics Lab., Zurich, Switzerland
Realisation of LC Demonstrators in MCM-L Technology
S. O`Reilly, M. Duffy, P. McCloskey, C. Ó Mathúna, PEI Technologies, Cork, Ireland
P. Forester, A. Godwin, N. Rose, Kam Circuits, Wiltshire, U.K.
The Reliability and Ageing Behaviour of Underfills and Fluxes in Advanced Surface
Mounting Technology
E. Muukkonen, P. Pirttikoski, A. Tuominen, Tampere University of Technology, Pori, Finland
Evolution of Molding Compound Materials During Long-Term Storage
O. Maire, C. Munier, Aerospatiale Matra Corporate Research Center, France
Characterisation of Plasma Enhanced Chemical Vapour Deposited Silicon Nitride for
the Passivation of Integrated Circuis
L.S. Tan, Y.H. Loy, W.K. Choi, A. Pajgrt, L.C. Tan, National University of Singapore, Republic
of Singapore
A New 3D Laser Profilometer for Process Control and Failure Analysis of IC-Packaging
R. Brodmann, M. Grigat, J. Valentin, OM Engineering, Duisburg, Germany
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IMAPS - EUROPE PRAGUE 2000
EUROPEAN MICROELECTRONICS PACKAGING AND INTERCONNECTION SYMPOSIUM WITH TABLE TOP EXHIBITION
S2 - FLIP CHIP & PACKAGING 1
MONDAY, JUNE 19TH, 11:30 - 13:30
SESSION CHAIRS: Jean Claude Rames - Matra BAE Dynamics, France
Paul Collander - Nokia Research Center, Finland
SOP vs. SOC for the Microelectronics Systems of the Future?
R. R. Tummala, Georgia Institute of Technology, Atlanta, Georgia, USA
Flip Clip Redistribution Using Ti/Cu Thin Film and Electroless Ni/Au Tracks
S. Beerten, R. Labie, E. Beyne, R. Vanhoof, M. Honore, IMEC, Leuven, Belgium
Accelerated Reliability Evaluation of Flip-Chip Joints on Ceramic Substrates by Power
Cycling
J. Lenkkeri, T. Jaakola; VTT Electronics, Oulu, Finland
Considering Flip-Chip Interconnection for Chip Size Package Design and Manufacturing
L. Herard, X. Baraton, STM, Grenoble, France, P. Magni, , STM, Agrate, Italy
Reliability Analysis of Flip-Chip Assemblies Mounted on BCB Thin Film Layered
Substrates
D. Degryse, B. Vandevelde, E. Beyne; IMEC, Leuven, Belgium
Mixed Assembly on PCB Using a Novel of Flip-Chip Technology
J. Vanfleteren, S. Stoukatch, B.Vandecasteele, A. Van Calster, IMEC/Intec/TFCG, Gent,
Belgium, S. Criel, G. Willems, P. De Langhe, L. Vandam, K. Allaert, Alcatel, Antwerpen,
Belgium
S3 - PROCESSING & FABRICATIONS & RELIABILITY 2
MONDAY, JUNE 19TH, 14:30 - 15:50
SESSION CHAIRS: Vojtech Hermansky - BVK Hradec Kralove, Czech Republic
Selim Achmatowitz - Institute of Electronic Materials Technology, Poland
Low Cost Wafer Level CSP and Redistribution Technology Using Electroless Plating
T. Teutsch, T. Oppert, E.Zakel, Pac Tech, Nauen, Germany, E. Klusmann, H. Meyer, R.
Schulz, J. Schulze, Atotech, Berlin, Germany
Development of Temperature Resistant Joints - Testing and Influences
M. Nowottnick, W. Scheel, K. Wittke, U. Pape, J. Schulz; Fraunhofer Institute for Reliability
and Microintegration –IZM, Germany
Thermal Stress Failures in Assemblies Comprised of Dissimilar Materials: Prediction
and Prevention
E. Suhir; Bell Laboratories, Lucent, NJ, USA
Laser Micro Welding for Surface Mount Technology: High Quality for Applications in
Harsh Environment
M. Fleckenstein; LFT, University of Erlangen, Germany
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IMAPS - EUROPE PRAGUE 2000
EUROPEAN MICROELECTRONICS PACKAGING AND INTERCONNECTION SYMPOSIUM WITH TABLE TOP EXHIBITION
S4 - FLIP CHIP & PACKAGING 2
MONDAY, JUNE 19TH, 14:30 - 15:50
SESSION CHAIRS: Karel Kurzweil - Bull, France
Leszek Golonka - Wroclaw University of Technology, Poland
Capillary Flow Underfill versus Pre-Deposited Self-Fluxing Underfill Materials for FlipChip Packages
D. Wojciechowski, C. Truzzi, CS2, Zaventem, Belgium
Mechanical Reliability Evaluation of BGA Solder Joints through Cyclic Twisting
D. Perera, Nokia House, Hampshire, U.K.
Reliability of High Density Flip Chip on Flex Interconnection
P. Palm, J. Määttänen, Elcoteq Network Corporation, Lohja, Finland, A. Tuominen, Tampere
University of Technology, Pori, Finland, E. Ristolainen, Tampere University of Technology,
Tampere, Finland
Influence of Flip-Chip Underfills on Electronic Device Characteristics
A. Cordery, N. Suthiwongsunnthorn, Oxford Brookes University, Oxford, England, R. Millea,
Rutherford Appleton Laboratory, Oxford, England
S5 - THICK FILMS & CERAMICS
MONDAY, JUNE 19TH, 17:00 - 19:00
SESSION CHAIRS: Heinz Osterwinter - FHTE Goppingen, Germany
Ivan Szendiuch - Technical University of Brno, Entrelec Vemer Group, Czech Republic
High Density, High Yield Interconnection of ICs with Electronic Modules
J. Cocker, A. F. Niblett, P. O'Callaghan, R. A. Parr, G. Vanrietvelde, M, Watson, R. L.
Keusseyan, M. A. Skurski; DuPont (UK)/DuPont (USA)
The Application of No-Clean Fluxes and Solder Pastes for Soldering of Hybrid Circuits
D. Rocak, Ljubljana. Slovenia, K. Bukat, J. Sitek, Warsaw, Poland, J. F. Plut, D. Belavic,
Sentjernej. Slovenia
Investigation for Miniaturization of Thick Film Resistors by Application of a
Postpatterning Thick Film System
R. Bauer, A. Dziedzic, L. Golonka, K. J. Wolter; Dresden University of Technology,
Germany/Wroclaw University of Technology, Poland
Conduction Behaviour of Filled Polymer Films
E. Sancaktar; The University of Akron, N. Dilsiz, Roketsan, Ankara, Turkey
Enhancing Your Circuits with Polymer Thick Film
E. R. Egloff; The Egloff Associates, Illinois, USA
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IMAPS - EUROPE PRAGUE 2000
EUROPEAN MICROELECTRONICS PACKAGING AND INTERCONNECTION SYMPOSIUM WITH TABLE TOP EXHIBITION
S6 - OPTOELECTRONICS & RF/HF & WIRELESS 1
MONDAY, JUNE 19TH, 17:00 - 19:00
SESSION CHAIRS: Flavio Cereda - IBM Italy S.p.A., Italy
Eric Beyne - IMEC, Belgium
Ruggedization: New Concept of Advanced Packaging for Space Applications
A. Val, Matra Marconi Space, France, O. Lignier, 3D PLUS, France
A 9:4 Satellite Switch MCM at 2.5 GHz
E. Hirt, M. Scheffler, G. Tröster ETH Zurich, G. Bernaers, Art of Technology, Zurich,
Switzerland, W. Wendel; R. Epple, Hirschmann Rheinmetall Elektronik, Neckartenzlingen,
Germany
Low K, Low Loss, Low Fire Tape System for Microwave Applications
A. H. Feingold C. Huang, S. J. Stein, ,; Electro-Science Laboratories, Inc., King of Prussia
High Aspect Ratio RF Coils Fabricated using Laser Processing and Micro-Moulding
Techniques
T. O'Donnell, P. McCloskey, M. Brunet, R. Winfield; PEI Technologies, Ireland, A. Stephen, S.
Metev, BIAS Bremen, Germany
Process Evaluation of Advanced Thick Film Techniques for RF-Applications
G. Klink, , M. Feil; Fraunhofer - Institut IZM, Munich, Germany, H. Richter, Alcatel SEL AG,
Stuttgart, Germany
S7 - MICROSYSTEMS & SENSORS TECHNOLOGIES
TUESDAY, JUNE 20TH, 09:30 - 10:50
SESSION CHAIRS: Paul Collander - Nokia Research Center, Finland
Leszek Golonka - Wroclaw University of Technology, Poland
Thick Film Sensor for Potentiometric Determination of Copper Ions
S. Achmatowicz, M. Jakubowska, E. Zwierkowska; Institute of Electronic Materials
Technology, Poland, R. Koncki, L. Tymecki, University of Warsaw, Poland
Design and Analysis Tool Integration for Microelectronic-Mechatronic Systems Design
L. A. Grout, University of Limerick, Ireland, A.J. Winsby, Lancaster University, U.K.
S. E. Burge; GEC Dunchurch, Warwickshire, U.K.
Some Remarks about "Short" Pulse Behaviour of LTCC Microsystems
A.Dziedzic, L. J. Golonka, J. Kita, H. Roguszczak, T. Zdanovicz, Wroclaw University of
Technology
New Thin Film Materials for Thermal Sensor Application
G. Beensh-Marchwicka, University of Technology of Wroclaw, Poland
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IMAPS - EUROPE PRAGUE 2000
EUROPEAN MICROELECTRONICS PACKAGING AND INTERCONNECTION SYMPOSIUM WITH TABLE TOP EXHIBITION
S8 - OPTOELECTRONICS & RF/HF & WIRELESS 2
TUESDAY, JUNE 20TH, 09:30 - 10:50
SESSION CHAIRS: Soeren Noerlyng - Micronsult, Denmark
Jean Claude Rames - Matra BAE Dynamics
Realisation of RF Band-Pass Filters in an LTCC Module Structure
M. Lahti, V. Lantto; University of Oulu, Finland
Integrated RF Components on Low Cost MCM-D Substrates
D. Cottet, J. Grzyb, B. Oswald, M. Scheffler, G. Troster; Electronics Lab, ETH Zurich,
Switzerland
RF Hybrid Packaging
C. Drevon, P. Monfraix; Alcatel Space Industries, France
Optical Interconnects for Module and PCB Technology
D. Krabe, F. Ebling, N.A. Staufenbiel, S. Bargiel, G. Lang, W. Scheel; Fraunhofer IZM Berlin,
Germany
S9 - RELIABILITY & DESIGN & ADVANCED PACKAGING
TUESDAY, JUNE 20TH, 11:30 - 13:10
SESSION CHAIRS: Flavio Cereda - IBM Italy S.p.A., Italy
Ivan Szendiuch - Technical University of Brno, Entrelec Vemer Group, Czech Republic
CSP Challenges in Contract Assembly
G. Caswell, J. Partidge, XeTel Corporation, Texas, USA
Chip Size Packages for Space Equipment
M. Massenat, Matra Marconi Space, France
Manufacturing Advance Packages Challenges and Solutions
G. Gretchen, A. Cremona, STMicroelectronics, Malta
Hiperprint : a Board Technology for High-Frequency Applications
J. De Baets, M. Vereeken, A. Van Calster, IMEC/TFCG, Gent, Belgium, D. Corlatan, E.
Raedschelders, Alcatel Bell, Belgium, G. Patra, Solectron, U.K., M. Morell, C. Haley, Thomas
Walter, U.K., G. Schols, Alcatel Microelectronics, Oudenaarde, Belgium, A. Ostmann,
Technische Universitat, Berlin, Germany, D. Mathelin, Alcatel, Space Industries, Toulouse,
France
High Temperature / High Current Impact on Au Ball Bond Reliability in Plastic Power
Packages
C. Passagrilli; STMicroelectronics, Italy
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IMAPS - EUROPE PRAGUE 2000
EUROPEAN MICROELECTRONICS PACKAGING AND INTERCONNECTION SYMPOSIUM WITH TABLE TOP EXHIBITION
S10 - MCM & INTERCONNECTIONS
TUESDAY, JUNE 20TH, 11:30 - 13:10
SESSION CHAIRS: Karel Kurzweil - Bull, France
Eric Beyne - IMEC, Belgium
Die Stacking Technology
R. W. Linden, L. Duncan, Kimball Electronics/Elmo Semiconductor, California, USA
Electrical Performances and Manufacturing Cost Comparisons of MCMD and MCMSL
HDI Substrates for a High Performance Telecom Application
V. Costa (Italtel), E. Hernandez (Tecdis), F. Lechleiter (Cimulec), M. Bremond (Bull
Electronics Angers), D. Lamber (Bull SA)t P. Guilbauld ( Bull SA)
Reliability Evaluation of a Silicon-on-Silicon MCM-D
J. Barton, G. McCarthy, R. Doyle, J. Barrett, NMRC, Cork, Ireland
Reliability Evaluation of Low Cost MCM-D Substrates Manufactured on Large Area
Panels
S. Fuchs, K. Delaney, P. Maher, N. O'Mahony, J. Barrett, C., O'Mathuna, NMRC, Cork, Ireland
Reducing Cross-Coupling Noise in LSI RF Circuits by Using a Flip-Chip Interconnected
Multilayer Redistribution Substrate
M. Åberg, A. Rantala, S. Savolainen-Pulli, J. Salonen, J. Salmi, I. Suni, VTT Electronics,
Finland
S11 - PCB & PASSIVES & SOLDERING
TUESDAY, JUNE 20TH, 14:40 - 16:00
SESSION CHAIRS: Heinz Osterwinter - FHTE Goppingen, Germany
David Lowrie - Multicore Solders Limited, UK
Change in Microstructure of Lead Free Solder After Heat Cycle
Y. Nakamura, K. Shimoyashiki, N. Kitazawa, Y. Watanabe, National Defense Academy,
Yokosuka, Japan
Impact on BGA´s, Process and Equipments of Lead-Free Soldering
D. Wojciechowski, C. Truzzi, CS2, Zaventem, Belgium
A Study to Determine a Suitable Replacement for Lead Based Solder for Surface
Finishing of Devices
M. Russell, General Semiconductor Cork, Ireland, J. Barrett, National Microelectronics
Research Centre, Cork, Ireland
Component Temperatures and Thermal Interaction for Embedded Passive Components
D. M. Stubbs, S. H. Pulko, A. J. Wilkinson; University of Hull, U.K., D. Corlatan, Alcatel Bell
N.V., Antwerpen, Belgium
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IMAPS - EUROPE PRAGUE 2000
EUROPEAN MICROELECTRONICS PACKAGING AND INTERCONNECTION SYMPOSIUM WITH TABLE TOP EXHIBITION
S12 - NEW MATERIALS & THERMAL & POWER
TUESDAY, JUNE 20TH, 14:40 - 16:20
SESSION CHAIRS: Selim Achmatowitz - Institute of Electronic Materials Technology, Poland
Vojtech Hermansky - BVK Hradec Kralove, Czech Republic
Reworkable Underfills Development, Processing and Reliability
L. Crane, A. Torres, E. Yaeger, Loctite Corporation, Rocky Hill, W. Johnson, Laboratory for
Advance Electronic Packaging, Auburn University
Properties and Limits of Material Systems for High Density Metallisation
P. Mach, J. Urbanek, V. Papez, Czech Technical University in Prague, FEE, V. Hermansky, R.
Cappalini, BVK Hradec Kralove, J. Bursa, Excellent Lanskroun, A.Hamacek, WBU Pilsen,
Faculty of Electrical Engineering, Pilsen, Czech Republic
Photo Initiated Adhesives - High Performance Adhesives for Microelectronics
R. Möst; DELO Industrieklebstoffe GmbH & Co. KG, Germany
Characterisation of Cost-Effective Eco-Friendly Polymer Technologies
K. Delaney, J. Barrett, S. McNamara, K. Rodgers, P. Tassie, National Microelectronics
Research Centre, Cork, Ireland
Electronic Packaging for Microwave and Millimeter Wave Multichip Modules
A. J. Piloto, Kyocera America, San Diego, California, USA
NOTE:
Authors with PC projection can prepare their presentation in Speaker´s room
(salon 3, 2nd floor)
DISPLAYS
Temperature Characteristic of Thick Film Sensors and Biosensors
M. Adamek, I. Szendiuch, Technical University of Brno, Czech Republic, J. KrejcI, KrejcI
Engineering, Tisnov, Czech Republic
Flip Chip Mounting Technique with Clips
V. Videkov, S. Tzanova, N. Yordanov; Technical University of Sophia, Bulgaria
Solder Replacement with Electrically Conductive Adhesives in Microwave Applications
J. Felba, K. P. Friedel, Wroclaw University of Technology, R. Kisiel, Warsaw University of
Technology, W. Laska, Telecommunications Research Institute Wroclaw, A. Moscicki,
Amepox Lodz, Poland
One Method of Accelerated Testing of Microelectronic Products
A. Andonova, P. Philippov, Technical University of Sofia, Bulgaria
Temperature Field Analysis in a Low Temperature Cofired Ceramics Microsystem
T. Zawada , A. Dziedzic, L.J. Golonka, Wroclaw University of Technology, Wroclaw, Poland,
G. Hanreich, J. Nicolics, Vienna University of Technology, Vienna, AustriaL. Golonka, A.
Dziedzic, T. Zawada, Wroclaw University of Technology, Poland, G. Hanreich, J. Nicolics,
Vienna University of Technology, Austria
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IMAPS - EUROPE PRAGUE 2000
EUROPEAN MICROELECTRONICS PACKAGING AND INTERCONNECTION SYMPOSIUM WITH TABLE TOP EXHIBITION
Microelectrodes made by LTCC
J. Krejci, M. Pandey, Krejci Engineering, Tisnov, Czech Republic
Thin Film Gas Sensors on LTCC
T. Pisarkiewicz, A. Sutor, W. Maziarz; University of Mining and Metallurgy, Krakow, Poland, H.
Thust, T. Thelemann, Technical University of Ilmenau, Germany
The Evolution of the Microstructural Characteristiocs of Thick Film Resistor During
Firing
M. Hrovat, D. Belavic, Z. Samardija, J. Holc, Jozef Stefan Institute, Ljubljana, Slovenia
New Family of Tantalum Capacitors for 150° C Operation
T. ZednIcek, Z. Sita; AVX Czech Republic s.r.o., Lanskroun, Czech Republic
Noise and Non-Linearity of Thick Film Resistors
J. Sikula, V. Sedlakova, J. Pavelka, Brno University of Technology, Brno, Czech republic
D. Rocak, Josef Stefan Institute, Ljubljana, Slovenia, D. Belavic, HIPOT, Sentjernej, Slovenia,
M. Tacano, Meisei University Tokyo, Japan
"MOM" Electromagnetic Simulation Regarding the Radiation of Interconnection
Structures
P. Svasta, N. D. Codreanu, , C. Ionescu, Politehnica University of Bucharest, Rumania
Electroless Ni Plating Bath Composition and Replenishment for Microvia Plating
Processes
S. Stoukatch , S. Zhang , J. Vanfleteren, M. Vereeken, A. Van Calster, B. Vandecasteele,
Ghent University, Belgium
Drop-on-Demand Solder Jet Device and Optimizing the Conditions of the Bump Shape
Formation
M. R. Predtechensky, Y. D. Varlamov, S. N. Ulyankin, A. N. Cherepanov, V. N. Popov, SB
RAS, Novosibirsk, Russia
Mixed-Signal and Mixed-Technology Systems: Multi-Domain Modules or Next
Generation MCMs?
A.P. Malshe, A. Mantooth, S. Ang, F. Barlow, A. Elshabini, K. Olejnicak, G. Salamo, L.
Schaper, R. Ulrich, W. Brown, University of Arcancas, Fayetteville, USA
Investigation of a possible correlation between current noise and long-term
stability of thick-film resistors
D.Belavic, D.Rocak, J.Sikula, M.Hrovat, B.Koktavy, J.Pavelka
Integral Documentation Role Introducing TQM into Small Electrotechnical Companies
T. Pivovar, VEMER Ceska s.r.o., I. Szendiuch, Technical University of Brno, Czech Republic
Analytical Formulas for the Evaluation of Temperature Distribution on PCB´s
W. Zwiefka, Technical University of Gdansk, W. Janke, Technical University of Koszalin,
Poland
New Conductive Polymeric Systems Based on Reticulate Doping and Their Possible
Electronic Applications
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IMAPS - EUROPE PRAGUE 2000
EUROPEAN MICROELECTRONICS PACKAGING AND INTERCONNECTION SYMPOSIUM WITH TABLE TOP EXHIBITION
J. Pollak, S. Nespurek, J. Pfleger, J. Martinek, and G. C. Stevens
Thermo-mechanical Analysis for Plasma Display Panel
M. Lee, LG Electronics, Inc., Korea, J. Lee, LG-Production Research Engineering Center
Integral Thin Film Sensor of Relative Humidity and Temperature
A. N. Shmyryeva, A. N. Scrypachev, M. G. Dushejko, National Technical University of Ukraine,
Kiev, Ukraine
Thin Film Temperature Sensitive Element and Heat Flow Sensor
A. N. Shmyryeva, A. N. Scrypachev, N. Ye. Scrypachev, K. D. Skurtul, National Technical
University of Ukraine, Kiev, Ukraine
Performance Support Tools in Electronics
E. Shoikova, S. Tzanova, D. Kolev, I. Pandiev; Technical University of Sophia, Bulgaria
PCB`s with Blind Vias and Microvias
L. Kowalczyk, G. Koziol, H. Hackiewicz, Tele & Radio Research Institute, Warsaw, Poland
A Comparison of the SIA and JIEP Packaging Roadmaps
J. Jackson; Semiconductor Equipment and Materials International, California, USA
NOTE: Authors of displays can attach their posters on the boards on Sunday, June
18th, 16:30 - 18:00 and on Monday June 19th, 7:30 - 8:30, in the Main Hall.
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IMAPS - EUROPE PRAGUE 2000
EUROPEAN MICROELECTRONICS PACKAGING AND INTERCONNECTION SYMPOSIUM WITH TABLE TOP EXHIBITION
LIST OF EXHIBITORS
Ablestik Laboratories
Agmet Ltd.- ESL Europe, UK
AM - Applied Microelectronics, Denmark
ASICENTRUM, Czech Republic
ASYMTEK, The Netherlands
ATV Technologie GmbH, Germany
IMAPS, France
BVK Hradec Kralove, Czech Republic
C-MAC, UK
Cookson Semiconductor Packaging Materials
Coorstek, UK
Curamik Electronics GmbH, Germany
Demet Deutsche Edelmetall Recycling AG&Co KG, Germany
DuPont iTechnologies, Czech Republic
EKRA, Germany
Elcoteq Network Corp., Finland
Electronics Laboratory ETH Zurich, Switzerland
GSI Lumonics
H.C.M., France
KYOCERA Fineceramics GmbH
MCI Cambridge Ltd, UK
Metech Europe Ltd, UK
Microcircuit International SA, France
Microeletronics International
MOLEX Slovakia
Mozaik Technology Ventures s.r.o., Czech Republic
NMRC, Ireland
Olin Aegis, UK
Osprey Metals Ltd, UK
PBT Roznov p. Radhostem, s.r.o., Czech Republic
Protecal OY, Finland
Sdelovaci technika, Czech Republic
Solid State Equipment Corporation, USA
Unichem Industries (Europe) Ltd., UK
LIST OF SPONSORS
Asymtek
AVX
Steinel
Molex
Asiccentrum
MCI
Tesla Sezam
PBT
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