Procedure – N-type Spin On or Paint On Dopant Diffusion @ 9500C
The N-type dopant which was previously spun or painted on the wafer is diffused into the
silicon crystal at 9500C. Depth of the diffusion is determined by time alone since the
temperature is fixed at 9500C.
1. Furnace #6 is used for N-type dopants (phosphorus)
2. Verify furnace #6 is available for use
Furnace #6 for phosphorus doping
only.
Wafer tweezers for Furnace #6 only
3. Verify the center zone of furnace is 9500C +/- 50C. Temperature controller is under gas panels.
4. Adjust temperature if needed.
Verify or set center zone for 9500C
Do not adjust front and rear zones
File: - Procedure – N-Type Spin-on or Paint-on dopant diffusion @ 9500C
11-28-2012
Procedure – N-type Spin On or Paint On Dopant Diffusion @ 9500C
5. Using the high temperature gloves, carefully remove the end cap and place on the lowest loader area.
High Temperature
Gloves
6. Using only the tweezers designated for phosphorus diffusion load the wafers into the quartz boat.
Wafer tweezers for phosphorus
doping ONLY
File: - Procedure – N-Type Spin-on or Paint-on dopant diffusion @ 9500C
11-28-2012
Procedure – N-type Spin On or Paint On Dopant Diffusion @ 9500C
7. With the robot load in the manual mode, switch to “load” and the wafers should begin to enter the furnace
Switch in manual mode
Load/unload switch
8. Allow the loader to load the wafers into the furnace tube. The loader will stop automatically in the center
zone of the furnace.
9. Once the wafers have stopped moving start the oxygen flow. The oxygen gas flow meter is located in the
back of the furnace. Set to 100 using the stainless steel ball.
Furnace #6 gas flow meters. Set the
oxygen to 100 as read using the
stainless steel ball
File: - Procedure – N-Type Spin-on or Paint-on dopant diffusion @ 9500C
11-28-2012
Procedure – N-type Spin On or Paint On Dopant Diffusion @ 9500C
10. At the end of the diffusion time specified on the traveler, turn off oxygen
11. Change the load/unload switch on the Robot Load to unload and allow the wafers to come out of the
furnace
12. Allow the wafer to cool.
13. Once cool, unload the wafers with the phosphorus tweezers. Do not touch or remove the quartz boat from
the robot load arm.
File: - Procedure – N-Type Spin-on or Paint-on dopant diffusion @ 9500C
11-28-2012