XMC Introduction:
XMC is China's recognized leading 300MM semiconductor manufacturing
company. It was founded in 2006 in Wuhan, China and first began
production in 2008. XMC focuses on developing deep partnerships by
delivering tailored solutions to drive innovation in the market. Among its
key area of expertise are memory, 3D IC, sensor and 55nm Logic
manufacturing solutions.
Talents Requirement of Oversea
Tech. & Manufacturing Group
Required Background
#01
Litho Specialist (including OPC, Immersion and
Double Patenting)
#02
WET Specialist
#03
Bonder Specialist
#04
#05
#06
#07
#08
Etch Specialist and Project Management
CMP Specialist
PVD Specialist
CVD Specialist
CIM Specialist
#09
YE Specialist
#10
PIE Specialist
Micro Electronics, Physics,
Material
Micro Electronics, Physics,
Material
Micro Electronics, Physics,
Material
Chemistry, Physics,
Chemistry, Physics,
Chemistry, Physics,
Chemistry, Physics,
Software Engineering
Micro Electronics, Physics,
Material
Micro Electronics, Physics,
Material
Flash Group
Required Background
#01
Process Integration Leader
#02
Senior Engineer for Core Array Integration
#03
Senior Engineer for Periphery and BEOL Integration
Micro Electronics
Micro Electronics, Physics,
Material
Micro Electronics, Physics,
Material
#01
#02
Core Project
Required Background
Process Integration Leader
Process Integration Engineer for FEOL or BEOL ,
Micro Electronics
Micro Electronics
Required
Experience
Department
>15 years
Litho
>15 years
DIFF
>15 years
DIFF
>15 years
>15 years
>15 years
>15 years
>15 years
Etch
TF
TF
TF
MFG
>15 years
PIE
>15 years
PIE
Required
Experience
>10 years
Department
JD
>5 years
JD
>5 years
JD
Required
Experience
>10 years
>10 years
Department
JD
JD
NAND Flash experience is prefered
TO & OPC
#01
Senior Engineer for tape out
#02
Senior Engineer for OPC model setup
Device & Model
Required Background
Computer, Micro
Electronics, Physics, Material
Optics, Micro Electronics,
Physics
Required Background
#01
Senior Engineer for reliability modeling
#02
#03
Senior Engineer for novel material modeling
Senior Engineer for parameter extraction
Physics, Material,Micro
Electronics
Micro Electronics,Material
Micro Electronics
Product & RE
Required Background
Snr/Principal Engineer for FEOL reliability failure
mode understanding & test methodology setup
Snr/Principal Engineer for BEOL reliability failure
mode understanding & test methodology setup
Snr/Principal Engineer for Electrical & physical
failure analysis
Manager for Memory cell & overall reliability failure
mode understanding
Manager for Electrical & physical failure analysis
technical development
Technical Manager for TEM theory & material
analysis
Senior Manager for Reliability failure mode
understanding & failure analysis technical
development
Micro Electronics, Physics,
Material
Micro Electronics, Physics,
Material
Micro Electronics, Physics,
Material
Micro Electronics, Physics,
Material
Micro Electronics, Physics,
Material
Micro Electronics, Physics,
Material
#01
#02
#03
#04
#05
#06
#07
#08
#09
#10
#11
Director for Reliability & FA
Snr/Principal Engineer for core array product level
analysis
Snr/Principal Engineer for periphery product level
analysis
Manager for physical failure analysis technical
development
#12
Manager for test program development
#13
Director for product engineering and testing
Micro Electronics, Physics,
Material
Micro Electronics, Physics,
Material
Micro Electronics, Physics,
Material
Micro Electronics, Physics,
Material
Micro Electronics, Physics,
Material
Micro Electronics,
Computer
Micro Electronics, Physics,
Material
Required
Experience
Department
>5 years
TO
>5 years
TO
Required
Experience
Department
>5 years
DT
>5 years
>5 years
Required Experie
nce
DT
DT
Department
>5 years
RE&AL
> 5 years
RE&AL
> 5 years
RE&AL
> 10 years
RE&AL
> 10 years
RE&AL
> 10 years
RE&AL
> 12 years
RE&AL
>15 years
RE&AL
> 5 years
Product
> 5 years
Product
> 10 years
Product
> 10 years
Product
>15 years
Product