Background Statement for SEMI Draft Document 5488A NEW STANDARD: SPECIFICATION FOR 450mm CLUSTER MODULE INTERFACE: MECHANICAL INTERFACE AND TRANSPORT STANDARD Notice: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this Document. Notice: Recipients of this Document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, “patented technology” is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided. Background The following document was created by the International Process Module Physical Interface TF (IPPI TF) to define a minimum set of specifications for the transport module/process module interface in 450mm Cluster tools. This is the second ballot of the Draft Standard Document. Draft Document 5488 was balloted in the fall of 2012. It was failed by the Japan Physical Interface and Carrier Technical Committee in its meeting on December 7, 2012, and returned to the IPPI TF for rework. Primary reason for the document failure was inappropriate tolerance as well as potential confusion by using geometric tolerancing. In this ballot, the TF decided to use coordinate tolerances that were similar to the ones used in the 450mm documents for FOUP and Loadport. Value for each tolerance was reexamined and corrected as appropriate. In addition to those technical changes, the TF tried to improve clarity and readability of the Document in response to negatives and comments on Document 5488. [Development History] At the beginning of the TF activity, two sets of mutually incompatible specifications were proposed as the start point of the development. The TF sought industry inputs in a form of a Survey, but the results were not definite to be used as the guidance for the direction of the development. Being back to square one, the TF agreed to adopt a policy for compromise, which was comprised of; - Standardization of flange pins, clamping feature and seal zone have much value as they are critical for interchangeability, - To define smallest possible flange and minimum dimension of the IF opening that will accommodate possible larger opening (for longer reach or space for wafer-gripping solutions ) with the same seal zone, - To select smaller value for width dimensions in order to realize smaller footprint where it does not trade off with process module design flexibility, and - With the load port height that is defined as the Option A in E154, transport plane height derived from atmospheric automation need may not satisfy needs comes from process 1 chamber design. Therefore two standardized values, “Nominal” and “Alternative” should be defined as the Transport Plane Height Standard. Based on above policies the TF has reached to unified values to form a minimum set of specifications. [Standalone Standard] The TF decided to develop this document as a standalone Standard rather than a Subordinate Standard to SEMI E21. Although the Standard to be developed has some concept and terminology in common with E21, some descriptions of E21 are not exactly applicable to this document. It should be also noted that a Subordinate Standard format is not convenient for the standard users as they need to refer to the Primary Standard to find requirements that are common between the Primary and the Subordinate Standards. If you have any questions, please contact the following TF leaders or SEMI staff: Review and Adjudication Information Task Force Review Group IPPI TF Date Mar. 4, 2013 Time & Time zone Part1 13:30-17:00JST (JA TF) Part2 17:30-19:30JST (JA-EU) Part3 23:00-24:00JST (Global TF) Location SEMI Japan (Part1,2) Telecon/Web Meeting (Part1,2,3) City, State/Country Tokyo/Japan Leaders Supika Mashiro (Tokyo Electron); e-mail: supika.mashiro@tel.com Richard Oeschner (Fraunhofer Institute); Richard.Oechsner@iisb.fraunhofer.de Standard staff Hirofumi Kanno (hkanno@semi.org) 2 Committee Adjudications PI&C Committee Mar. 7, 2013 13:30-17:00 JST SEMI Japan Tokyo/Japan S. Komatsu; shoji_komatsu@acteon.co.jp T. Nagashima; t-nagashima@miraial.co.jp Tsutomu Okabe; tsokabe@jp.tdk.com Hirofumi Kanno (hkanno@semi.org) Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 SEMI Draft Document 5488A NEW STANDARD: SPECIFICATION FOR 450mm CLUSTER MODULE INTERFACE: MECHANICAL INTERFACE AND TRANSPORT STANDARD 1 Purpose 1.1 The purpose of the standard is to ensure minimum necessary level of physical connectivity between the transport module and process modules comprising the cluster tool for 450mm. It is expected that a process module can be connected to the transport module of any cluster tool with least design change provided that both modules meet the requirement of this Standard. 1.1.1 Process modules accept wafers at locations that may vary substantially from one module to another. This places a burden on the capabilities of transport modules to move wafers to and from various process modules in a cluster tool. This specification defines wafer transport planes within modules. This obviates the wafer transport problem to a large extent, but does not unduly restrict process module content. 2 Scope 2.1 The standard defines the interface plane between modules in a cluster tool. It provides the mechanical specifications at the interface between the transport module and process module to be connected together; no requirements are imposed on the module content. 2.2 The standard is applicable only to wafers that are 450 mm in diameter and to the interface between cluster tool modules, with the following exception. The transport module operates across the interface plane; thus, a definition of the wafer transport plane within process modules is required. NOTICE: SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their use. It is the responsibility of the users of the Documents to establish appropriate safety and health practices, and determine the applicability of regulatory or other limitations prior to use. 3 Referenced Standards and Documents 3.1 SEMI Standard SEMI E21 — Cluster Tool Module Interface: Mechanical Interface and Wafer Transport Standard SEMI E21. 1 — Cluster Tool Module Interface 300 mm: Mechanical Interface and Wafer Transport Standard SEMI E154 — Mechanical Interface Specification For 450mm Load Port 3.2 ISO Standard1 ISO 1609-1986 (E) — Vacuum Technology – Flange Dimensions ISO 4287 — Geometrical Product Specifications (GPS) – Surface Texture: Profile Method – Terms, Definitions and Surface Texture Parameters NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions. 4 Terminology 4.1 Definitions 4.1.1 cluster tool — an integrated, environmentally isolated manufacturing system having process and transport modules mechanically linked together. 4.1.2 environmental isolation — separated from the ambient atmospheric environment. [SEMI E21] 1 International Organization for Standardization, ISO Central Secretariat, 1 rue de Varembé, Case postale 56, CH-1211 Geneva 20, Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30; http://www.iso.ch This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 1 Doc. 5488 SEMI LETTER (YELLOW) BALLOT DRAFT Document Number: 5488A Date: 2/9/2016 Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 4.1.3 interface plane — the vertical surface defined by the mating surfaces of two joined modules. [SEMI E21] 4.1.4 interface seal zone — an absolute surface or face reserved for establishing an environmental seal between modules. [SEMI E21] 4.1.5 intratool transport — wafer movement inside a cluster tool. [SEMI E21] 4.1.6 module — an independently-operable unit that is part of a tool or system. [SEMI E21] 4.1.7 passive process module — a process module that has no wafer moving mechanism for wafer handoff 4.1.8 process module — a module that accepts or presents a single wafer inside the module for intratool transport. [SEMI E21] 4.1.9 reach — the distance measured from the interface plane to the wafer centroid within a process module. 4.1.10 transport module — a module that accepts or presents a single wafer outside the module across the interface plane for intratool transport. [SEMI E21] 4.1.11 wafer transport plane — the virtual horizontal plane a wafer traverses between modules. 4.1.12 wafer transport zone — the area of the interface plane free of physical obstructions, reserved for wafer movement between modules. [SEMI E21] 5 Requirements 5.1 Wafer Transport and Placement 5.1.1 Wafer Transport Axis and Reach — The dimensions for wafer placement during wafer transport are specified in Table 1 and referenced from the interface plane in the plan view shown in Figure 1. The transport module is required to present or accept a horizontal wafer outside the module at any point along an axis (see Figure 1) perpendicular to the center of the interface plane to a maximum y100 from the interface plane. Thus, a transport module is required to have the capability to reach y100 beyond its interface plane to a wafer centroid (see § R1-1). However, location of the wafer at a distance less than y100 from the interface plane requires that the transport module be capable of addressing the intermediate location. Similarly, a process module can be designed to accept a horizontal wafer inside the module at any point along an axis perpendicular to the center of its interface plane up to y100 from the interface plane as required by the application. 5.1.2 Vertical Position of Wafer Transport Plane — The elevation of the wafer transport plane is measured from the facility floor as shown in Figure 2. The transport module is required to present or accept a horizontal wafer outside the module at a nominal wafer transport plane height of z100 from the facility floor (see § R1-2). EXCEPTION: Alternative wafer transport height of z101 may be applied for a cluster tool in which process performance related design constraints require a higher wafer transport plane in at least one of the process modules. 5.1.2.1 Vertical Motion —The robot is required to possess a vertical motion capability to a second plane z110 below the wafer transport plane in order to allow wafer handoff to or from passive process modules (see Figure 2 and § R1-3). 5.1.2.2 Reference Plane — The interface plane alignment pins define a reference plane z111 below the wafer transport plane (see Figure 2). 5.2 Interface Plane — The interface plane contains the interface seal zone and the wafer transport zone, which do not overlap, and the location of the interface plane alignment pins (see Figures 3). 5.2.1 Interface Seal Zone — The interface seal zone is rectangular and symmetrically referenced to the interface plane alignment pins. The inside boundary dimension of the interface seal zone is z130 by x120. The outside boundary is z131 by x121. A seal zone is either a seal surface or an O-ring face. All interface seal zones facing toward a transport module are seal surfaces polished to a surface finish less than or equal to Ra100 parallel to the circumference (see § R1-4). All interface seal zones facing toward a process module are O-ring faces equipped with the appropriate capture groove for the sealing method employed (see Figure 3). 5.2.2 Wafer Transport Zone — The wafer transport zone is the area within the interface seal zone reserved for moving the wafer between modules. The wafer transport zone which cannot be compromised by any module is defined as z120 by x110. One horizontal edge of the zone is z121 above the alignment pin centerlines. Its vertical This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 2 Doc. 5488 SEMI LETTER (YELLOW) BALLOT DRAFT Document Number: 5488A Date: 2/9/2016 Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 edges are equally distanced to the left and right of the centerline between the two alignment pins (see Figure 3 and § R1-5). 5.2.3 Interface Plane Alignment Pins — Provisions are made for two d100 locating pins (see Figure 4 and Figure 5) to be used as alignment aids between modules. Under no circumstances should the flanges at the interface plane and the alignment pins be subject to a total load exceeding 500N in shear. The alignment pins have an absolute centerline separation of x100 in the horizontal plane (see Figure 3). The pins reside in the seal surface side (i.e., process module side) of the flange pair, opposite the O-ring, facing toward the transport module. Mild press fit holes are provided in the seal surface flange face. A clearance hole and a slot are provided in the O-ring flange face as shown in Figure 1 and specified in Figure 4 and Figure 5. The center axis of the alignment pin hole shall be located within a circular zone of diameter d120 (0.05mm) whereby the zone is nominally positioned on the alignment pin datum line and x101 (275mm) from the nominal wafer center. Alignment pin height above the flange face is y110 (see § R1-6). 5.2.4 Isolation Valves — The transport module is always equipped with a valve for environmental isolation at each module interface plane. The intratool transport port on a process module may be equipped with an environmental isolation valve (see Figure 1 and § R1-7). 5.3 Flange — A flange for ISO-K flange connection is specified as z140 by x130. One horizontal edge is specified to be z141 from the alignment pins’ centerline (see Figure 4). EXCEPTION: Alternative flange is specified as z150 by x140 in order to allow a direct flange to flange connection by bolts (ISO-F flange connection). One horizontal edge is specified to be z151 from the alignment pins’ centerline (see Figure 5). NOTE 1: It may be appropriate to connect flanges directly by bolts to meet vacuum seal performance requirement for some tools. 5.3.1 Clamping — Clamping grooves as specified in the International Standards Organization document, Vacuum Technology, Flange Dimensions (ISO 1609-1986), Table 2, nominal bores 40 mm to 250 mm are located at the flange perimeter (see groove detail in Figure 4). Clamps for ISO flanges can be used to generate the force necessary to produce an environmental seal (see § R1-9). 5.3.2 Non-Flanged Surfaces — A non-flanged surface may be used to join with a flanged surface. An attachment means to engage the flange must be provided. If a flanged adaptor piece is necessary to join two non-flanged surfaces, then the adaptor piece shall be located on the process side of the interface plane. Table 1 Dimensions of Interface Between transport module and process module Symbol Used Figure Value Specified Datum Measured From Feature Measured To d100 4, 5 10 +0/-0.015 mm The intersection of x100 and z141 Shaft diameter of alignment pin d110 3 10 +0.2/+0.1 mm x100, CL Diameter of alignment pin opening d111 3 10 +0.2/+0.1 mm (x100 and x150), CL Diameter of slot for alignment pin d120 3 r100 3 13 mm Ra100 3 Nominal Intersection of x101 and Boundary of tolerance zone for z111. alignment pin hole center axis placement. N/A Corner radii of the wafer transport zone N/A <0.8 m Roughness(Ra) as defined in ISO 4287 Interface seal zone surface This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 3 Doc. 5488 SEMI LETTER (YELLOW) BALLOT DRAFT Document Number: 5488A Date: 2/9/2016 Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 Figure Value Specified Datum Measured From Feature Measured To s100 4 0.3mm flatness over seal area Interface surface Interface seal zone surface s101 5 0.3mm flatness over seal area Interface surface Interface seal zone surface x100 3 550 mm Center of left alignment pin (symmetric about vertical center line of the opening) Center of right alignment pin (symmetric about vertical center line of the opening) x101 3 275 mm Nominal wafer center Center of left alignment pin (symmetric about vertical center line of the opening) x110 3 490.0 mm Left edge of wafer transport zone Right edge of wafer transport zone (symmetric about vertical center (symmetric about vertical center line of line of the opening) the opening) x120 3 496.0 mm Left inside edge of interface seal zone (symmetric about vertical center line of the opening) Right inside edge of interface seal zone (symmetric about vertical center line of the opening) x121 3 520.0 mm Left outside edge of interface seal zone (symmetric about vertical center line of the opening) Right outside edge of interface seal zone (symmetric about vertical center line of the opening) x130 4 590.0 mm Left edge of flange or valve (ISO- Right edge of flange or valve (ISO-K) K) (symmetric about vertical center line of (symmetric about vertical center the opening) line of the opening) x140 5 625.0 mm Left edge of flange or valve (ISO-F) (symmetric about vertical center line of the opening) Right edge of flange or valve (ISO-F) (symmetric about vertical center line of the opening) x150 3 2 mm Centered at x100 Length of slot for alignment pin y100 1 490.0 mm Interface plane Center of the wafer y110 4, 5 6 mm8 mm Interface plane Tip of the alignment pin y120 4, 5 10 mm O-ring side surface Clearance for alignment pin y121 4, 5 10 mm O-ring side surface Clearance for alignment pin z100 2 1230 mm Floor Wafer Transport Plane : Nominal Value z101 2 1350 mm Floor Wafer Transport Plane : Alternative Value z110 2 12 ± 0.5 mm Wafer Transport Plane End of Vertical Motion Capability z111 2 18.5 ± 0.5 mm Alignment Pin Datum Line Wafer Transport Plane z120 3 56 mm Upper edge of Vertical Slot Opening (symmetric about horizontal center line of the opening) Lower edge of Vertical Slot Opening (symmetric about horizontal center line of the opening) z121 3 28 mm Alignment Pin Datum Line Upper edge of Vertical Slot Opening This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 4 Doc. 5488 SEMI LETTER (YELLOW) BALLOT Symbol Used DRAFT Document Number: 5488A Date: 2/9/2016 Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 Figure Value Specified Datum Measured From Feature Measured To z130 3 60 mm Upper inside edge of interface seal zone (symmetric about horizontal center line of the opening) Lower inside edge of interface seal zone (symmetric about horizontal center line of the opening) z131 3 84 mm Upper outside edge of interface seal zone (symmetric about horizontal center line of the opening) Lower outside edge of interface seal zone (symmetric about horizontal center line of the opening) z140 4 167 mm Upper edge of flange or valve (ISO-K) Lower edge of flange or valve (ISO-K) z141 4 55 mm Alignment Pin Datum Line Upper edge of flange or valve (ISO-K) z150 5 202 mm Upper edge of flange or valve (ISO-F) Lower edge of flange or valve (ISO-F) z151 5 72.5 mm Alignment Pin Datum Line Upper edge of flange or valve (ISO-F) 6 List of Figures 6.1 Figure 1 — Module Interface with Wafer Transport and Placement Detail (Plan View) 6.2 Figure 2 — Wafer Transport Plane Elevation 6.3 Figure 3 — Interface Plane 6.4 Figure 4 — Flange Specification (Double Claw Clamp type) 6.5 Figure 5 — Flange Specification (Bolts Connection type) All Dimensions are in mm Figure 1 Module Interface with Wafer Transport and Placement Detail (Plan View) This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 5 Doc. 5488 SEMI LETTER (YELLOW) BALLOT Symbol Used DRAFT Document Number: 5488A Date: 2/9/2016 Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 All Dimensions are in mm Figure 2 Wafer Transport Plane Elevation All Dimensions are in mm Figure 3 Interface Plane LETTER (YELLOW) BALLOT DRAFT Document Number: 5488A Date: 2/9/2016 This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 6 Doc. 5488 SEMI Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 All Dimensions are in mm Figure 4 Flange Specification (Double Claw Clamp type) All Dimensions are in mm Figure 5 Flange Specification (Bolts Connection type) LETTER (YELLOW) BALLOT DRAFT Document Number: 5488A Date: 2/9/2016 This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 7 Doc. 5488 SEMI Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 RELATED INFORMATION 1 APPLICATION NOTES NOTICE: This Related Information is not an official part of SEMI [designation number] and was derived from the work of the global [committee name] Technical Committee. This Related Information was approved for publication by full letter ballot procedures on [A&R approval date]. R1-1 Transport Maximum Reach R1-1.1 The reach (see ¶ 4.1.9) permits a 450 mm wafer to be placed on a wafer support platform in a process chamber with allowance for the optional isolation valve on the process module and the chamber wall thickness. The substantial clearance between the wafer and the chamber wall is to allow freedom for process-specific design requirements. R1-1.1.1 The maximum reach beyond the interface plane is increased from 300mm Standard (E21.1) by 110 mm (from 380.0 mm to 490 mm); a 75 mm increase in wafer radius (from 150 mm to 225mm) and a 35 mm increase in clearance between the wafer and the chamber walls. R1-1.2 Individual process chamber designs may place the wafer closer to the interface plane than y100 and still conform to the standard. R1-1.3 Wafers are transported individually in a horizontal attitude. Modules may contain any number of wafers. For example, batch processing is allowed. R1-2 Vertical Position of Wafer Transport Plane R1-2.1 The nominal wafer transport plane elevation of z100 is positioned not to exceed the 25th slot of a FOUP placed on 913mm load port (Nominal Height of E154 Load Port option A) to minimize z axis motion for the atmospheric robot. R1-2.2 An exception is allowed to set the alternative transport plane at elevation of z101 to ease process chamber design constraint about chamber height without exceeding atmospheric robot’s z axis motion range that can be realized using conventional automation solutions. It should be noted, however, that process modules that are designed to the nominal transport plane need modification in order to be connected to a cluster tool that is designed to the alternative transport plane and vice versa. R1-3 Vertical Motion R1-3.1 The standard (see ¶ 5.1.2.1) requires that the wafer transfer robot of the transport module be capable of moving in two planes. An ability to move in other planes is optional. R1-3.2 The end effector of the transfer robot of the transport module moves the wafer in the horizontal wafer transport plane (see ¶ 4.1.11). The robot has a vertical motion capability for wafer handoff or pickup. It is assumed that the robot moves its end effector in the lower plane after wafer handoff or prior to wafer pickup. R1-4 Interface Seal Zone R1-4.1 Blank-Off Plates — The location of the o-ring seals on the transport module allows plain blank-off plates to be used for environmental sealing. R1-5 Wafer Transport Zone R1-5.1 The minimum specified height of z120 (see ¶ 5.2.2) provides sufficient clearance for passage of a knuckle joint or pivot point in the transport module end effector (see Figure R1-1 and Figure R1-2) and for z110 of vertical motion. The wafer transport zone may be expanded up to the boundary of the interface seal zone when a module requires a larger opening (see ¶ 5.2.1 and Figure 3). R1-5.2 The standard requires the transfer robot be capable of handing off a wafer to a passive wafer support mechanism such as a shelf by having a vertical motion capability to z110 below the wafer transport plane. This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 8 Doc. 5488 SEMI LETTER (YELLOW) BALLOT DRAFT Document Number: 5488A Date: 2/9/2016 Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 R1-5.3 Wafer Transport Exclusion Zone – Wafer transport exclusion zone for the transfer robot arm, joints and end effector projection should be considered when structures including mechanism for wafer handoff such as wafer pedestal or lift pins inside the process module are designed so that they do not interfere during wafer handoff. An example of wafer transport exclusion zones are shown in Figure R1-1 and Figure R1-2. Figure R1-1 450mm Wafer Transport Plane Exclusion Zone Dimensions (Plan View) All Dimensions are in mm Figure R1-2 450mm Wafer Transport Plane Exclusion Zone Dimensions (Elevation View) R1-6 Interface Plane Alignment Pins R1-6.1 The standard (see ¶ 5.2.3) implies the normal engineering practice of chamfering pin ends and countersinking pin locating holes. Actual dimensions for this have been specified or recommended by other authorities. This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 9 Doc. 5488 SEMI LETTER (YELLOW) BALLOT DRAFT Document Number: 5488A Date: 2/9/2016 Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 R1-6.2 Pins reside in the sealing surface to avoid accidental damage to the surface finish during assembly and disassembly. With centrally placed pins, valves may be mounted in either orientation if this simplifies servicing or accessibility. R1-6.3 A clearance hole and slot arrangement allows use of dissimilar flange materials in a dynamic thermal environment. R1-7 Isolation Valves R1-7.1 The standard (see ¶ 5.2.4) allows the valves to be integral to the modules or discrete separable units. R1-8 Flange to Flange Connection R1-8.1 Two types of flange to flange connection method specified in this Standard and the flange design differs by connection method. R1-8.2 Claw Clamps R1-8.2.1 Claw clamping method realizes minimum flange width, which is x130, is increased from 300mm Standard (E21.1) by 150mm (wafer diameter increase). R1-8.3 Direct connection by bolts R1-8.3.1 To allow direct flange to flange connection by bolts, flange area is extended to x140 to allow placing of washers beneath bolt heads. R1-8.4 Needs of Additional Specification R1-8.4.1 As this standard allows options for various flange connection needs, additional specification (e.g., connection type, bolt’s holes locations and size) may be necessary. R1-9 Clamping R1-9.1 The standard (see¶ 5.3.1) allows a universal clamping scheme to be employed. Claw clamps designed for use with ISO flanges are accommodated by the use of a perimeter groove around the flange. R1-9.2 The clamping scheme provides several benefits: Independence from any hole pattern requirements. Flanges may be connected to flat plates or to other flanges. The number of clamps and the number of sides used to draw the flanges together may be varied as required by the compression forces necessary for the sealing method used. Any type of clamp may be used that accommodates the perimeter groove. NOTICE: Semiconductor Equipment and Materials International (SEMI) makes no warranties or representations as to the suitability of the Standards and Safety Guidelines set forth herein for any particular application. The determination of the suitability of the Standard or Safety Guideline is solely the responsibility of the user. Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant literature, respecting any materials or equipment mentioned herein. Standards and Safety Guidelines are subject to change without notice. By publication of this Standard or Safety Guideline, SEMI takes no position respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this Standard or Safety Guideline. Users of this Standard or Safety Guideline are expressly advised that determination of any such patent rights or copyrights, and the risk of infringement of such rights are entirely their own responsibility. This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 10 Doc. 5488 SEMI LETTER (YELLOW) BALLOT DRAFT Document Number: 5488A Date: 2/9/2016