SC-MICRO-1006-14 Agenda (Draft)

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Author: Norman Zhou

Delegation Canada

SC-MICRO-1006-14

SC-MICRO: S

ELECT

C

OMMITTEE ON

R

ESEARCH DEVELOPMENTS AND

APPLICATIONS IN MICRO

-

AND NANO

-

JOINING TECHNOLOGIES

Agenda for the 67

th

Annual Assembly and International Conference

Sheraton Grande Walkerhill, Seoul, Soth Korea, 15-16 July 2014

Tuesday July 15, , 8:00-12:00

1.

Opening (8:00), Norman Zhou

Welcome and Introduction

Approval of the draft agenda (SC-MICRO-1006-14)

Approval of the minutes of the meeting held in Essen, Germany,

September 13-14, 2013 (SC-MICOR-1005-13)

2.

Microjoining and Nanojoining Workshop (8:10)

Session I

Reference Title

SC-MICRO-

2037-14

Cu Filling in Through-silicon-via and Its Extrusion

Property for Three-dimensional Packaging

Active Brazing of CNT Yarns by AgCuTi Filler Metal SC-MICRO-

2038-14

SC-MICRO-

2039-14

Interfacial Design of Nano-structured Brazing Filler

Materials

SC-MICRO-

2040-14

SC-MICRO-

2041-14

The Influence of High Melting Point Elements in the

Reliability of High Temperature Lead-free Solder during

Thermal Shock

Effect of Static Contact Resistance on Nugget

Development during Small-scale Resistance Spot

Welding of Aluminum Thin Sheet

Coffee break 9:50-10:20

Session II

Presenter

Jae-Pil Jung

(S. Korea)

Lei Liu

(China)

Lars Jeurgens

(Switzerland)

Ying Zhong

(China)

Shinji

Fukumoto

(Japan)

SC-MICROInterfacial Microstructure of Cu/Cu Joints using MicroHiroshi

International Institute of Welding – Paris Nord 2 - 90 rue des Vanesses - Villepinte

BP 51362 - 95942 Roissy Ch. De Gaulle Cedex – France

Phone : + 33 1 49 90 36 08/36 79/36 15/51 59 – Fax : + 33 1 49 90 36 80 – iiw@iiwelding.org – www.iiwelding.org

SIRET : 422 335 901 00019 - APE 524R - TVA : FR20422335901

Time

8:10-8:30

8:30-8:50

8:50-9:10

9:10-9:30

9:30-9:50

10:20-10:40

SC-MICRO-1002-12 2/2

2042-14

SC-MICRO-

2043-14

Special

SC-MICRO-

2044-14

SC-MICRO-

2045-14 sized Ag Particle Paste

Low-temperature and Pressureless Joining of Dense

Copper-to-copper Bonds using Low-organic Silver-

Nanoparticle Pastes

IIW Presentation

Low-current Resistance Spot Welding of Pure Copper using Silver Oxide Paste

3D Printing of Metal Components with Micro

Functional Structures through Diameter Variable Laser

Stereolithography and Precursor Sintering Heat

Treatments

Nishikawa

(Japan)

Tobias

Röhrich

10:40-11:00

(Germany)

Cécile Mayer

Tomo Ogura

(Japan)

11:00-11:20

11:20-11:40 Soshu

Kirihara

(Japan)

Saturday September 14, Room M/N, CCE South, 8:00-12:00

Session III

SC-MICRO-

2046-14

SC-MICRO-

2047-14

Light Induced Nanojoining of Silver Nanowires

Micro/nano Joining Induced by Femtosecond Laser

SC-MICRO-

2048-14

SC-MICRO-

2049-14

Investigations on NiTi-Ta Mixed Compounds Joined by

Modulated Pulsed Laser Welding

Femtosecond Laser Peening for Strengthening of

Nano/micro-weld Joints and Its

Dynamics

Coffee break 9:20-10:20

Session IV

SC-MICRO-

2050-14

SC-MICRO-

2051-14

Inspection of Micro Defects using Bacterial Cells

Joining of Metallic Nanoparticles with Femtosecond

Laser Irradiation

Yanhong Tian

(China)

Guisheng

Zou

(China)

Tobias

Röhrich

(Germany)

Tomokazu

Sano

(Japan)

Luisa Quintino

(Portugal)

Peng He

(China)

8:00-8:20

8:20-8:40

8:40-9:00

9:00-9:20

10:20-10:40

10:40-11:00

3.

International Conferences on Nanojoining and Microjoining (NMJ), 11:00-11:10

NMJ2014, Dec. 7-10, 2014, Zurich, Switzerland (Lars Jeurgens)

4.

Discussions and Closing Remarks (11:10-11:40), Norman Zhou

Presentation submissions: PDF documents

Committee Chair and Co-chair (2015-17)

Discussion of SC-MICRO Work Program (SC-MICRO-1003-13)

Other issues

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